M353818 八、新型說明： 【新型所屬之技術領域】 本創作係種模具之清模板結構，特別指一種應用在 半導體封裝核具中，用以配合清除模穴及模具面殘膠之清 模板新型創設。 【先前技術】 按’在積體電路封裝的製程中，多係以環氧樹脂等高 •分t材料，注入封膠模具的模穴内，待硬化後將晶片及承 載益等積體電路元件形成一晶片封震體；然而，在經過多 次封膠製程步驟後’該封膠模具的模穴内通常會殘留膠 體為確保接續的封裝製成品的品質及外觀完整度，便需 要針對該些殘膠做適當的清除。 ，在&知清模的技術中’便有—種配合清模餅作為吸膠 ㈣之清模方式’該清模餅（1G)為餘封师料之三聚 氛=樹脂等材料所構成’請參考第1圖之壓餅式清模動作 不思圖’其中顯不至少一適當大小之清模餅（⑻置於上 •模具（11)及下模具（12)的模穴（13)之間，待上、下 模（11、12)進行壓模動作後，會將至少一清模餅（1〇) 壓塑進入模具之模穴（13)内’使整體形成一吸膠塊（14) 並吸附殘存於模& (13)纟面之殘膠，隨著取下吸膠塊後 同時移除殘膠，經重複數次上述動作，便可大致完成清模 動作由於程序簡單技術難度不高，在生產業界已逐漸廣 5 M353818 • 為應用。 惟，該習知利用清模餅清除殘膠的方式仍有其缺點， 乃因清模餅壓塑後所形成的吸膠塊，時有進入上、下模間 之定位塊（15)的情形，該情形恐導致模具定位不良的影 響；此外，若模具設計上為僅上模具設有模穴的情形時， 由於具模穴的模具牽制力大於不具模穴的模具（如下模 具），加上模具所設之頂出桿（16)在清模餅壓塑過程已先 Φ 行頂出，因此吸膠塊（14)經常會附著在上模具（11)上， 尚需配合手工具徒手將吸膠塊（14)敲下，徒手施力不當 的話，更容易造成吸膠塊的碎裂，徒增清理上的困擾。有 鑑於此，如何使清模餅在清模實務上能更方便業者使用， 實值得相關業者加以探討解決。 【新型内容】 為解決以上所述清模餅使用於清模作業時所發生的缺 鲁 失，本創作提供一種清模板結構，令吸膠塊形成在該清模 - 板之範圍内不致進入模具結構内，同時具有壓回頂出桿總 - 成之作用，以祈吸膠塊成型後，於開模時可輕易退模。 為達到上述目的，本創作所提出之技術手段在於提供 一種模具之清模板結構，主要係於上、下模具間之模具面 上設置一清模板，該清模板係形成具有適當厚度之一框主 體，該框主體係相對於模具頂出桿之位置，該框主體侷限 出一壓餅空間，該壓餅空間係涵蓋模具之模穴及模具面的 6 M353818 範圍，相對於模具定位塊之位置則分別形成有開槽。 上述模具之清模板結構，更包含一紙釘架，鋪設於該 /月核板之上方’以防止真空吸孔進料阻塞。 據此，在合模時，上模具的頂出桿受清模板之框主體 壓回，使項出桿總成不致在清模餅壓塑過程受沾附，使吸 •膠塊在開模時可以輕易的整塊自行退模，受壓塑之吸膠塊 馨$不致Μ框域外，且可_清賴穴及模具表面之殘 膠、髒>可，進而大幅簡化清模程序及提高模具清潔度。 【實施方式】 ' 為使本創作之目#、結才冓特徵及其他優點能更被瞭 解’以下兹特舉較佳實施例說明，並配合圖式詳細說明如 后。 請參考第2圖所示，係本創作模具之清模板與上、下 模具之結構關係示思’其中顯不有一上模具（2 〇)，及一相 對於上模具（20)之下模具（30)’該上、下模具（2〇、3〇) ' 於相對位置分別造有對應的複數個模穴（21)，及於上模具 (20)内設有用以頂出晶片封裝體之頂出桿總成（23)，該 頂出桿總成（23)會由上模具（20)延伸出至少一頂出桿 (231)，在上、卞模具合模時被壓回以使頂出桿總成（23) 上移不致於被推出’更在開模時下移以使頂出桿總成（23) 下移頂出晶片封裝體，该上模具（20)與下模具（3〇)合 模後之模具體間分別造有構形相對而可相互嵌合定位之: 7 M353818 位塊（22、31)，一清模板（40)則置於該上、下模具（20、 30)間之模具面上，該清模板（40)主要結構為一由馬口 鐵、銅、鋁等材質所形成具有適當厚度之框主體（41)，係 相對於頂出桿（231)位置之下方，該框主體（41)侷限出 一壓餅空間（42)，該壓餅空間（42)係涵蓋上、下模具（20、 30) 之模穴（21)及模具面的範圍，相對於模具定位塊（22、 31) 之位置則分別形成開槽（43)，以避免干涉定位塊之功 • 能運作。 請再參考第3-a圖所示，藉由上述結構，上、下模具 (2 0、3 0 )在合模壓塑清模餅形成吸膠塊（5 0 )的時候， 上模具（20 )的頂出桿（231 )受清模板（40 )之框主體（41 ) 壓回，使頂出桿總成（23)不致在合模階段便伸出受吸膠 塊（50)沾黏而導致退模困難，另壓塑完成之吸膠塊（50) 也不致溢出清模板（40 )外而進到定位塊（22、31)處； • 因此，如第3-b圖所示，在上、下模具（20、30)開模後， - 所形成的吸膠塊（50)可以很輕易的整塊自動退模，該吸 - 膠塊取出丟棄後，便可馬上進行重複的清模動作，此外， 在壓餅空間（42)範圍内的模穴（21)及模具表面之殘膠、 髒污，都可以受到吸膠塊（50 )的作用，較習用技術更能 提高模具的清潔度，進而大幅簡化清模程序及縮短清模時 間。 請參閱第4圖所示，若下模具（30)係為一具真空吸 8 .M353818 - 引作用之模具設計，則在清模板（40)之上方更可再加覆 一紙釘架（60)，再將清模餅（70)置於該紙釘架（60)上， 以防止壓塑清模餅的過程，吸膠塊進入真空吸孔中導致堵 塞；在開模後紙釘架（60)隨同吸膠塊（50)丟棄，清模 板（40)仍可重複使用以繼續進行清模程序。 綜上所述，本創作模具之清模板結構，已達到預設之 目的，實已符合產業之需求，爰依法提出專利申請，惟， • 本創作雖已以前述較佳之實施例揭示，然其並非用以限定 本創作，任何熟悉此技藝者，在不脫離本創作之精神和範 圍内，當可能加以潤飾或修改，因此本創作之保護範圍當 視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係習知壓餅式清膠動作示意圖。 第2圖係清模板與上、下模具之結構示意圖。 • 第3圖係壓模及開模之動作示意圖。 • 第4圖 係清模板加設紙釘架之結構示意圖。 - 【主要元件符號說明】 10.清模餅 11.上模具 12.下模具 13.模穴 14.吸勝塊 15.定位塊 16.頂出桿 20.上模具 21.模穴 22.定位塊 9 ,.M353818 ' 23.頂出桿總成 30.下模具 40.清模板 42.壓餅空間 50.吸膠塊 70.清模餅 231.頂出桿 31.定位塊 41.框主體 43.開槽 60.紙釘架M353818 VIII. New Description: 【New Technology Fields】 This is a clear template structure for molds, especially one that is used in semiconductor package fixtures to match the clear template of mold cavity and mold surface. . [Prior Art] According to 'in the process of integrated circuit packaging, many materials are filled with epoxy resin, etc., into the cavity of the sealing mold. After hardening, the chip and the load-bearing integrated circuit components are formed. a wafer sealing body; however, after a plurality of sealing process steps, the colloid is usually left in the cavity of the sealing mold to ensure the quality and appearance integrity of the successive packaged products, and it is necessary to target the residual glue. Do the proper removal. In the technology of & knowing the mold, there is a kind of clearing mold that is used as a glue (4). The clear mold cake (1G) is made up of materials such as resin and other materials. 'Please refer to Figure 1 for the press-cake type cleaning action without thinking'. It shows at least one suitable size of the clear mold cake ((8) placed on the upper mold (11) and the lower mold (12) mold cavity (13) Between the upper and lower molds (11, 12), after at least one mold cake (1〇) is compression molded into the mold cavity (13), the whole body forms a rubber block ( 14) Adsorb the residual glue remaining in the mold & (13), and remove the residual glue after removing the suction block. After repeating the above actions several times, the cleaning operation can be roughly completed. The difficulty is not high, and it has been widely used in the production industry. 5 M353818 • For the application. However, the conventional method of using the clear mold cake to remove the residual glue still has its shortcomings, which is due to the suction block formed by the compression molding of the clear mold cake. There is a case where the positioning block (15) between the upper and lower molds is entered, which may cause the influence of poor positioning of the mold; in addition, if the mold is designed In the case where only the upper mold is provided with a cavity, since the mold holding force of the mold cavity is larger than the mold without the mold cavity (the following mold), and the ejector rod (16) provided by the mold is in the mold molding process of the clear mold cake The Φ line is first ejected, so the suction block (14) is often attached to the upper mold (11). It is still necessary to knock the suction block (14) off with the hand tool. If the force is not applied by hand, it is more likely to cause The fragmentation of the suction block has increased the trouble of cleaning up. In view of this, how to make the clear mold cake more convenient for the operator in the practice of clearing the mold is worthy of discussion and solution by the relevant industry. [New content] To solve the above The invention discloses a clear template structure, which provides a clear template structure, so that the glue block is formed in the range of the clear mold-plate without entering the mold structure, and has a pressure return top. The total effect of the rod-forming function is that after the molding of the puncture rubber block, the mold can be easily demolded when the mold is opened. To achieve the above purpose, the technical means proposed by the present invention is to provide a clear template structure of the mold, mainly on the upper part. Mold between the lower mold A clear template is formed on the surface, the clear template is formed into a frame body having a proper thickness, and the frame main body is positioned relative to the mold ejection rod, and the frame body limits a pressing cake space, and the pressing cake space covers the mold The range of 6 M353818 of the mold cavity and the mold surface is respectively formed with a groove relative to the position of the mold positioning block. The clear template structure of the above mold further includes a paper nail frame which is laid above the/month nuclear plate. Preventing the vacuum suction hole from being blocked. According to this, when the mold is closed, the ejector rod of the upper mold is pressed back by the frame body of the clear template, so that the item rod assembly is not adhered during the compression molding process of the clear mold cake, so that The suction and rubber blocks can be easily and completely removed from the mold when the mold is opened. The plasticized rubber block is not allowed to be outside the frame, and can be used to remove the residual glue and dirty surface of the mold surface. Significantly simplify the cleaning process and improve mold cleanliness. [Embodiment] The present invention will be described in more detail with reference to the preferred embodiments of the present invention, and the detailed description will be made in conjunction with the drawings. Please refer to Figure 2, which is a schematic diagram of the relationship between the clear template of the original mold and the upper and lower molds. There is no upper mold (2 〇) and one mold relative to the upper mold (20). 30) 'The upper and lower molds (2〇, 3〇)' respectively have a plurality of corresponding mold cavities (21) at opposite positions, and are provided in the upper mold (20) for ejecting the top of the chip package a rod assembly (23), the ejector rod assembly (23) is extended from the upper mold (20) by at least one ejector rod (231), and is pressed back to lift the upper 卞 mold when the mold is closed The rod assembly (23) is not moved up. It is moved down when the mold is opened to move the ejector rod assembly (23) downward to eject the chip package. The upper mold (20) and the lower mold (3〇) After the mold clamping, the mold bodies are respectively configured to be oppositely arranged and can be fitted to each other: 7 M353818 position block (22, 31), and a clear template (40) is placed on the upper and lower molds (20, 30) The mold plate (40) is mainly composed of a frame body (41) having a suitable thickness formed of a material such as tinplate, copper or aluminum, and is located relative to the position of the ejector rod (231). Below, the frame body (41) confines a pressing cake space (42), which covers the cavity (21) of the upper and lower molds (20, 30) and the range of the mold surface, as opposed to The positions of the mold positioning blocks (22, 31) are respectively formed into slots (43) to avoid interference with the function of the positioning block. Please refer to the figure 3-a. With the above structure, the upper and lower molds (20, 30) form the suction mold (50) when the mold is pressed and molded, and the upper mold (20) The ejector rod (231) is pressed back by the frame body (41) of the stencil (40), so that the ejector rod assembly (23) does not stick to the absorbing rubber block (50) during the clamping stage. It is difficult to demould, and the other blocker (50) that is not molded by the plastic is not allowed to overflow into the positioning block (22, 31); • Therefore, as shown in Figure 3-b, After the lower mold (20, 30) is opened, the formed suction block (50) can be easily and automatically removed from the mold. After the suction-adhesive block is taken out and discarded, the repeated cleaning operation can be performed immediately. In addition, the cavity (21) in the range of the pressing cake space (42) and the residual glue and dirt on the surface of the mold can be affected by the suction block (50), which can improve the cleanliness of the mold more than the conventional technology. This greatly simplifies the process of clearing the mold and shortens the time for clearing the mold. Please refer to Figure 4, if the lower mold (30) is a vacuum suction 8. M353818 - lead mold design, then a paper nail holder can be added over the clear template (40) (60) And then placing the clear mold cake (70) on the paper nail holder (60) to prevent the process of compression molding the mold cake, and the suction block enters the vacuum suction hole to cause clogging; after the mold opening (the paper nail holder ( 60) With the suction block (50) discarded, the clear template (40) can still be reused to continue the clearing process. In summary, the clear template structure of the original mold has reached the preset purpose, and has met the needs of the industry. Patent application is filed according to law. However, the present invention has been disclosed in the preferred embodiment described above. It is not intended to limit the creation of this work. Anyone who is familiar with this art may be retouched or modified without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation is subject to the definition of the patent application scope attached. . [Simple description of the drawing] Fig. 1 is a schematic view of the conventional pressing cake type cleaning operation. Figure 2 is a schematic view showing the structure of the stencil and the upper and lower dies. • Figure 3 is a schematic diagram of the action of the stamper and the mold opening. • Figure 4 is a schematic diagram of the structure of the paper template. - [Main component symbol description] 10. Clear mold cake 11. Upper mold 12. Lower mold 13. Mould 14. Susceptible block 15. Positioning block 16. Ejector rod 20. Upper mold 21. Mould 22. Positioning block 9 , .M353818 ' 23. ejector rod assembly 30. Lower mold 40. Clear template 42. Press cake space 50. Suction block 70. Clear mold cake 231. Ejection rod 31. Positioning block 41. Frame body 43. Slot 60. Paper clip frame
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