M353625 八、新型說明： 【新型所屬之技術領域】 本創作係-種導熱管，其特別係關於—種具有一外管以及 凸設於該外管之内管以增加散熱面積、提升散熱效率之導熱管。 【先前技術】M353625 VIII. New description: [New technical field] This is a kind of heat-conducting tube, which is specially designed to have an outer tube and an inner tube protruding from the outer tube to increase the heat dissipation area and improve the heat dissipation efficiency. Heat pipe. [Prior Art]
伴隨著電子元件性能提升的趨勢，高功率化的產品在使用過 程中無可避免地會產生高溫，因而造成產品的可靠度（「e丄i a b 1 1 1 t y)問題’以！ c設計為例’在不斷增加晶片速度 和密度的同時’ “設計者也面臨著各财品的散關題；另外， 就L E D模組應用於電子產品而言，為了維持高功率化的設計， 使得散熱效能的課題亦備受重視。 為了解決散熱問題，過钱採用散熱片_於發熱產品的表 面’以熱傳導方式來散熱，但由於產品的發熱量越來越大，且礙 於產品體積的限制，散熱片的體積不允許隨晶片發熱量的增加而 增大’甚至在機體設計縮小的趨勢下，機内可用空間限縮，更使 散熱片體積不增反減，在可用空間有限又得提升散熱效率的情況 下’因此必須採行導熱管（H e a t P i p e )技術。 目前習用的熱管僅利用單一管體進行散熱的功能，然而，在 電子產品高功率化的趨勢下’單—管體的熱管已不敷使用，其散 =效率里需提升以趕上高功率電子树的散熱需求，倘若能夠增 設熱管的管體而增加熱傳導面積，將有助於其散熱效率之提升； 再者’習用之熱管僅具備散熱功能’若能將熱能回收轉換成電能， M353625 將可達到能源回收再利用的節能效果。 【新型内容】 %> • 本案之創作人，馨於上述習賴管熱傳導及散熱效率不彰的 缺失，因而投注心力研發出本創作之導熱管，以期解決上述問題。 本創作之主要目的在於提供—種導熱f，其特別係關於一種 具有-外管収-凸設於該外管之时以增加散熱面積、提升散 熱效率之導熱管。 • 為制上述目的’摘㈣採取町之技術手好以達成， 其中本創作之導熱管包括有： 外管，其内壁佈設有毛細結構； 内管，其長度大於該外管並穿設於該外管之巾，係具有一位 於該外管内部之下段以及__位於該外管外部之上段，該下段之内 壁與外壁佈設有毛細結構且該下段環設有複數個通孔，該上段内 壁佈設有毛細結構； • 外管封蓋，具有一符合該内管外徑之穿孔，係套設於該内管 並封合於該外管之頂端； 内管封蓋’係封合於該内管之頂端； 底板’係封合於該外管與内管之底端。 - 相較於習用僅具備單一管體之熱管，本創作增設一内管並且 - 在該内管及外管之内壁以及該内管位於外管内部區域之外壁均佈 设有毛細結構以增加熱傳導面積，使得散熱效率得以提升，另外， 該一官體中注入有工作流體，本創作之導熱管受熱後使得工作流 6 M353625 體透過氣相、液相的變化達到散熱的效果，該内管環設的複數個 通孔讓氣態的卫作流體可流通於該二管體之間，亦可增進散熱效 率，故藉由上述之結構，本創作確實可提供_散熱效率更佳之導 熱管。 【實施方式】 請參考第一及第二圖所示，本創作之導熱管（丄）包括： 外管（1 1)，其内壁佈設有毛細結構（丄2); 内管（1 3 )，其長度大於該外管（i i )並穿設於該外管（丄 1)之中’係具有一位於該外管（i丄）内部之下段以及一位於 該外管（1 1 )外部之上段，該下段之内壁與外壁佈設有毛細結 構（1 2 )且該下段環設有複數個通孔（i 4 )，該上段㈣佈設 有毛細結構（1 2); 外管封蓋（1 5 )’具有-符合該内管（1 3 )外徑之穿孔（工 5 0)，係套設於該内管（1 3)並封合於該外管（ι。之頂端； 内管封蓋（1 6 ) ’係封合於該内管（上3 )之頂端. 底板（1 7)，係封合於該外管（1丄）與内管（ι 3)之底 端。 _ 本創作之導歸（i )之組裝係⑽銀合金作為填料並於一 合金焊接裝置中去進行焊接封合的動作，其製作過程係採用本案 申請人於2G04年〇4月14日所中請之台灣發明專利申請第 〇 9 3 1 1 0 3 0 1號之中請案中所揭露之製程，該製程係符人 歐盟「限量使时害物f條款（R Q H s )」之規範，其中該合^ 7 M353625 烊接裝置係包括一加熱單元、一與該加熱單元連接之溶焊單元以 • 及一與該熔焊單元連接之冷卻單元，該導熱管（i)之製作過程 說明如下： 首先’在該底板（17)與該外管（1 1)、内管（13)之 封合處，該外管封蓋（丄5 )與該外管（2丄）、内管（丄3 )之 封合處以及該内管封蓋（i 6)與該内管（丄3)之封合處均填 置銅銀合金填料（1 8)並組合後，送入該加熱單元。 • 其次，在該加熱單元内藉由預熱加溫的方式將該加熱單元内 的氧氣作大部分的燃燒消耗使該底板（17)、外管（11)、内 管（1 3 )、外管封蓋（i 5 )以及内管封蓋（丄6 )表面所附著 的氧化膜、污染物與有機物等雜質隨著氧氣的燃燒而分解脫離， 該導熱管（1 )之各組件在該加熱單元持續加熱後送入該熔焊單 元0 接著，在該熔焊單元内加人惰性氣體（如氮氣）來隔絕剩餘 • 的氧氣以避免各組件氧化’並且同時進行高溫加熱以達到該銅銀 合金填料（18)之炫點，使該銅銀合金填料（丄8)溶化為液 態狀以滲入並填滿該底板（丄7 )與該外管（i丄）、内管（丄3 ) 之封合處，該外管封蓋（1 5 )與該外管（i丄）、内管（工3 ) - 之封合處以及該时封蓋（1 6 )與該内管（i 3 )之封合處， ~ 該導熱管（1 )之各組件在贿焊單元持續加減送人該冷卻單 元。 最後’在該冷卻單元内進行急速之降溫冷卻 ，令填滿於該底 8 M353625 板（17)與該外管（11)、内管（13)之封合處，該外管封 蓋（15)與該外管（11)、内管（13)之封合處以及該内管 封蓋（16)與該内管（13)之封合處的液態銅銀合金填料（丄 8)瞬間冷卻固化，使各組件之間達到緊密封合的效果而獲得該 導熱管（1 )之成品。 藉此方式製成的該導熱管（1)在經過低溫攝氏負8〇度與 高溫攝氏1 5 0度間的冷熱沖擊測試以及歷時7 2小時攝氏3 〇 Φ 〇度的高溫測試後，仍然可維持其真空度的恆定及其熱傳導效率 的穩定，並且當該導熱管（i)接受電子元件的之熱能時，熱傳 導的過程中，熱能會經過該銅銀合金填料（i 8)向外散熱，相 較於使用-般焊料的熱管，其導熱效率更高而有助於其散熱效能 的提升。 此外，該内管（1 3)與該外管（i i )中均注人純水作為 工作流體，當該導熱管（i )以該底板（i 7)接觸電子元件來 _ 吸收因電子元件運轉所產生的大量熱能時，作為工作流體的純水 受熱後迅速氣化，水蒸氣擴散附著於該内管（1 3)與該外管（工 1 )的毛細結構（1 2 )上，待熱能逸親再聽贱態，藉此 液相、氣相之間的循環變化達到散熱的效果，該内管（i 3)朝 '外官（1 1 )外的增設亦增加了毛細結構（1 2)所佈設的面積， •讓水蒸氣可附著的面積更大，並且亦增加了外部散熱的面積，因 而提升散熱效率。 再者，該内管（13)所環設的複數個通孔（14)使水蒸 9 M353625 氣得以流通於該内管（1 3 )及外管（1 1 )之間，可更充分地 利用該内管（1 3)及外管（1 1)上的毛細結構（1 2)而將 散熱效率更進一步地提升。 如第二至弟五圖所不，該V熱管（1 )更包含複數個設置於 該外管（1 1 )之外壁及該内管（1 3)上段之外壁的散熱鰭片 (1 9 )，以供週遭氣體迅速吸收該導熱管（1 )傳導的熱能而提 升散熱之效果。在本實施例中係採取縱向對流的型態進行散熱， φ 該散熱鰭片（1 9)係以直立排列的方式環設於該外管（丄丄） 之外壁及該内管（13)上段之外壁，該散熱鰭片（19)俯視 之下係呈一L型片體，並在該L型片體的短邊與該外管（^工） 及内管（1 3 )的接合處之間填置錫填料（i 9 A )，並採取符合 歐盟「限量使用有害物質條款（R〇HS)」規範的錫焊製程將該 散熱鰭片（19)固接於該外管（11)及内管（13)上。 另外，由於該導熱管（1 )之管體部分係以銅銀合金作為填 • 料於一合金焊接裝置中進行組裝封合，其作業溫度介於攝氏6 〇 0度至1〇〇〇度之間，而以錫作為填料進行散熱鰭片（丄9 ) 的悍接係在攝氏1 5 0度至3 5 0度的作業溫度下進行並不會對 焊好的管體組件造成裂痕或脫落的現象，故錫焊接合在本實施例 ' 中係為一較佳的方法以將該散熱鰭片（19)固接於該外管（1 __ 1 )及内管（1 3 )上。 如第六圖所不，說明本創作之另一實施例，其與上述實施例 略同’不同之處僅在於散熱‘鰭片（1 9 )之型式，該複數個散熱 M353625 鰭片（1 9 )設有一符合該外管（丄丄）或内管（丄3)外徑之 . 結合孔，使該複數個散熱鰭片（i 9)係以水平的方式套設於該 . 外“11)及内管（13)上段之外壁’亦即該散熱鰭片（丄 9)係以橫向對流的型態使週遭氣體吸收該導熱管（丄）傳導的 熱能而達到散熱功效。該散熱.鰭片（1 9 )固接於該外管（i工） 及内g ( 1 3)的方式同樣是採取符合歐盟「限量使用有害物質 條款（R ο H S )」規範的錫焊製程將錫填料（工g A )填置於該 • 外管（1 1 )及内管（1 3)與該散熱韓片（1 9)的接合處以 進行錫焊接合。 此外，上述各實施例之導熱管（D並不限定於縱向的設置， 亦可制橫向或其⑽度的設置型態錢行散熱的魏，並且除 了利用自然對流的散熱方式之外，更可辅以風扇的架設，採用強 制對流的方式以提升其散熱效能。 另外，該導熱管（1 )之外營f 7a , r s ( 1 1 )及内管（1 3)係為Along with the trend of improvement in the performance of electronic components, high-powered products inevitably generate high temperatures during use, resulting in product reliability ("e丄iab 1 1 1 ty" problem" with c design as an example 'At the same time as increasing the speed and density of the wafers', the designers are also facing the divergence of various products. In addition, in terms of the application of LED modules to electronic products, in order to maintain a high-powered design, the heat dissipation performance is The subject is also highly valued. In order to solve the heat dissipation problem, the heat sink is used to dissipate heat from the surface of the heat-generating product. However, due to the increasing heat generation of the product and the limitation of the volume of the product, the volume of the heat sink is not allowed to accompany the wafer. The increase in calorific value increases. Even in the trend of shrinking the design of the body, the available space in the machine is limited, and the volume of the heat sink is not increased or decreased. In the case where the available space is limited and the heat dissipation efficiency is improved, it must be adopted. Heat pipe (H eat P ipe ) technology. At present, the conventional heat pipe uses only a single pipe body for heat dissipation. However, in the trend of high power of electronic products, the single-pipe heat pipe is no longer sufficient, and its dispersion = efficiency needs to be upgraded to catch up with high-power electronics. The heat dissipation requirement of the tree, if the heat pipe can be added to increase the heat conduction area, will help to improve its heat dissipation efficiency. Moreover, the conventional heat pipe only has the heat dissipation function. If the heat energy recovery can be converted into electric energy, the M353625 will be able to Achieve energy saving effects of energy recycling. [New Content] %> • The creator of this case, Xin is not lacking in the heat transfer and heat dissipation efficiency of the above-mentioned Xilai tube, so he has invested in the development of the heat pipe of this creation to solve the above problems. The main purpose of this creation is to provide a kind of heat conduction f, which is particularly related to a heat pipe having an outer tube received and protruded from the outer tube to increase the heat dissipation area and improve the heat dissipation efficiency. • The purpose of the above-mentioned purpose is to take the skill of the town. The heat pipe of the present invention includes: an outer tube having a capillary structure on the inner wall; an inner tube having a length larger than the outer tube and being worn on the outer tube The outer tube towel has a lower portion inside the outer tube and a lower portion outside the outer tube, the inner wall and the outer wall of the lower portion are provided with a capillary structure and the lower ring is provided with a plurality of through holes, the upper inner wall The outer tube cover has a perforation conforming to the outer diameter of the inner tube, and is sleeved on the inner tube and sealed on the top end of the outer tube; the inner tube cover is sealed in the inner tube The top end of the tube is sealed to the bottom end of the outer tube and the inner tube. - Compared to the conventional heat pipe with only a single pipe body, the present invention adds an inner pipe and - the inner wall of the inner pipe and the outer pipe and the inner pipe are provided with a capillary structure on the outer wall of the inner pipe to increase heat conduction The area is such that the heat dissipation efficiency is improved. In addition, the working fluid is injected into the body, and the heat pipe of the present invention is heated to make the working fluid 6 M353625 body pass through the gas phase and the liquid phase to achieve the heat dissipation effect. The plurality of through holes are provided for the gaseous fluid to flow between the two tubes, and the heat dissipation efficiency is also improved. Therefore, the above structure can provide a heat pipe with better heat dissipation efficiency. [Embodiment] Please refer to the first and second figures. The heat pipe (丄) of the present invention includes: an outer tube (1 1) having a capillary structure (丄2) on the inner wall and an inner tube (13). The length of the outer tube (ii) is larger than the outer tube (ii) and has a lower portion inside the outer tube (i1) and a lower portion outside the outer tube (1 1 ) The inner wall and the outer wall of the lower section are provided with a capillary structure (12), and the lower ring is provided with a plurality of through holes (i4), the upper section (four) is provided with a capillary structure (1 2); the outer tube cover (15) 'Having a perforation (working 50) conforming to the outer diameter of the inner tube (13), sleeved on the inner tube (13) and sealed to the outer tube (top of the outer tube; inner tube cover ( 1 6) 'The seal is attached to the top end of the inner tube (top 3). The bottom plate (17) is sealed at the bottom end of the outer tube (1丄) and the inner tube (ι 3). The assembly of (i) is based on the silver alloy as a filler and is welded and sealed in an alloy welding device. The production process is invented by the applicant in Taiwan on April 14th, 2G04. Special Apply for the process disclosed in the case No. 9 3 1 1 0 3 0 1 , which is in compliance with the European Union's “Limited Time Limits (RQH s)”, which includes ^ 7 M353625 The splicing device comprises a heating unit, a soldering unit connected to the heating unit, and a cooling unit connected to the welding unit. The manufacturing process of the heat pipe (i) is as follows: First, 'on the bottom plate (17) at the junction with the outer tube (1 1) and the inner tube (13), the sealing portion of the outer tube cover (丄5) and the outer tube (2丄) and the inner tube (丄3) And the sealing portion of the inner tube cover (i 6) and the inner tube (丄3) are filled with a copper-silver alloy filler (18) and combined, and then sent to the heating unit. • Second, in the heating unit The bottom plate (17), the outer tube (11), the inner tube (13), and the outer tube cover (i 5 ) are used for the majority of the combustion of the oxygen in the heating unit by means of preheating and heating. And the oxide film, contaminants and organic substances attached to the surface of the inner tube cover (丄6) are decomposed and separated by the combustion of oxygen, and the components of the heat transfer tube (1) After the heating unit is continuously heated, it is sent to the welding unit 0. Next, an inert gas (such as nitrogen) is added to the welding unit to insulate the remaining oxygen to prevent the components from oxidizing and simultaneously heating at a high temperature to achieve the The glazing point of the copper-silver alloy filler (18) dissolves the copper-silver alloy filler (丄8) into a liquid state to infiltrate and fill the bottom plate (丄7) with the outer tube (i丄) and the inner tube (丄3) Where the seal of the outer tube cover (15) and the outer tube (i丄), the inner tube (work 3) - and the cover (16) and the inner tube (i) 3) The sealing section, ~ The components of the heat pipe (1) are continuously added and subtracted to the cooling unit in the bribe welding unit. Finally, in the cooling unit, rapid cooling is performed to fill the sealing portion of the bottom 8 M353625 plate (17) and the outer tube (11) and the inner tube (13), and the outer tube cover (15) ) instantaneous cooling with the sealing of the outer tube (11), the inner tube (13) and the liquid copper-silver alloy filler (丄8) at the sealing of the inner tube cover (16) and the inner tube (13) The finished product of the heat pipe (1) is obtained by curing to achieve a tight sealing effect between the components. The heat pipe (1) produced by this method can still be tested after a cold heat shock test between a low temperature of minus 8 degrees Celsius and a high temperature of 150 degrees Celsius and a high temperature test of 7 2 hours Celsius 3 〇 Φ 〇. Maintaining a constant vacuum and stabilizing its heat transfer efficiency, and when the heat pipe (i) receives the heat energy of the electronic component, heat energy is radiated outward through the copper-silver alloy filler (i 8) during heat conduction. Compared with the heat pipe using the solder, the heat conduction efficiency is higher and the heat dissipation performance is improved. In addition, both the inner tube (13) and the outer tube (ii) are filled with pure water as a working fluid, and when the heat conducting tube (i) contacts the electronic component with the bottom plate (i7), the absorption is due to the operation of the electronic component. When a large amount of thermal energy is generated, the pure water as the working fluid is rapidly vaporized after being heated, and the water vapor diffuses and adheres to the capillary structure (1 2 ) of the inner tube (13) and the outer tube (work 1), to be heat-treated. Yiyi listens to the embarrassing state, and the cyclical change between the liquid phase and the gas phase achieves the effect of dissipating heat. The addition of the inner tube (i3) to the outer portion (1 1 ) also increases the capillary structure (1 2 The area that is laid out, • allows the water vapor to adhere to a larger area, and also increases the area of external heat dissipation, thereby improving heat dissipation efficiency. Furthermore, the plurality of through holes (14) provided in the inner tube (13) allow water to flow 9 M353625 gas to flow between the inner tube (13) and the outer tube (1 1 ), which can be more fully The heat dissipation efficiency is further improved by the capillary structure (12) on the inner tube (13) and the outer tube (11). As shown in the second to fifth figures, the V heat pipe (1) further includes a plurality of heat dissipating fins (1 9 ) disposed on the outer wall of the outer tube (1 1 ) and the outer wall of the upper portion of the inner tube (13). Therefore, the surrounding gas rapidly absorbs the heat energy transmitted by the heat pipe (1) to enhance the heat dissipation effect. In this embodiment, the longitudinal convection type is used for heat dissipation, and the heat dissipation fins (19) are arranged in an upright manner on the outer wall of the outer tube and the upper portion of the inner tube (13). The outer wall, the heat dissipating fin (19) is an L-shaped sheet in plan view, and the short side of the L-shaped sheet is joined to the outer tube (1) and the inner tube (13). Fill the tin filler (i 9 A ) and fix the heat sink fin (19) to the outer tube (11) by a soldering process in accordance with the European Union's “Restricted Use of Hazardous Substances (R〇HS)” On the inner tube (13). In addition, since the tube portion of the heat pipe (1) is assembled and sealed with a copper-silver alloy as a filler in an alloy welding device, the operating temperature is between 6 〇 0 and 1 degree Celsius. The splicing of the fins (丄9) with tin as a filler does not cause cracks or peeling of the welded tube assembly at operating temperatures of 150 to 350 degrees Celsius. Therefore, tin soldering is a preferred method in the present embodiment to secure the heat dissipating fins (19) to the outer tube (1__1) and the inner tube (13). As shown in the sixth figure, another embodiment of the present invention is described, which is similar to the above embodiment in that the difference is only in the type of heat dissipation fin (1 9 ), and the plurality of heat dissipation M353625 fins (1 9 a coupling hole corresponding to the outer diameter of the outer tube (丄丄) or the inner tube (丄3), so that the plurality of heat dissipation fins (i 9) are sleeved in the horizontal manner. And the outer wall of the upper portion of the inner tube (13), that is, the heat dissipating fin (丄9) is in a lateral convection pattern, so that the surrounding gas absorbs the heat energy transmitted by the heat pipe (丄) to achieve the heat dissipation effect. (1 9) The method of fixing to the outer pipe (i) and the inner g (1 3) is also to adopt a soldering process that conforms to the EU's "Restricted Use of Hazardous Substances (R ο HS )" specification. g A ) is placed in the joint between the outer tube (1 1 ) and the inner tube (13) and the heat-dissipating piece (19) for solder bonding. In addition, the heat transfer tubes (D of the above embodiments are not limited to the longitudinal arrangement, and may be formed in a lateral direction or a (10) degree setting type, and in addition to the heat dissipation method using natural convection, With the erection of the fan, forced convection is used to improve the heat dissipation performance. In addition, the heat pipe (1) is outside the camp f 7a , rs ( 1 1 ) and the inner pipe (1 3).
銅管’其毛細結構（i 2)係可為燒結式、網目式及溝槽式結構， 如第五及第六圖所示，該毛細結構（12)係為燒結式結構，係 採用大量的金屬粉粒以高溫燒結的方式佈設於該外管（i丄）之 内壁、該内管（1 3)上段之内蜃〜， &冏壁以及该内管（13)下段之内、 外壁，該金屬粉粒係為銅粉。 如第六及七圓所示，該導熱管 為溝槽式結構，將該外管（1 1 壓的製作過程形成佈設於該外管 1)之毛細結構（1 2)係 )及内管（13)經由拉削與擠 (1 1)之内壁、該内管（1 3) 11 M353625 上段之内壁以及該内管（i 3)下段之内、外壁的軸向溝槽。 如第六及八圖所示，該導熱管（1 )之毛細結構（i 2)係 為網目式結構，將定型網目數之銅網經過清洗及必要之處理後捲 製以符合該外管（]_ i )及内管（i 3 )之管徑，再設置於該外 管（1 1)之内壁、該内管（1 3)上段之内壁以及該内管（工 3)下段之内、外壁而形成網目式之毛細結構（1 2 )。 此外，本創作之外管（i i )及内管（i 3)所佈設的毛細 結構（1 2)係並不限定於相同型態，亦可為燒結式、網目式及 溝槽式結構的父互搭配組合，如此同樣的可以達到利用毛細現象 快速進行水蒸氣擴散之功效。 再者，請參考第六圖，該毛細結構（丄2)並未接觸該底板 (17)與該外管（1 1)、内管（1 3)之封合處，該外管封蓋 (15)與該外管（1 1)、内管（丄3)之封合處以及該内管封 蓋（16)與該内管（13)之封合處而留有約2至1 〇公釐的 間隙，以避免當該銅銀合金填料（1 8)熔化成液態時因為毛細 作用滲入該毛細結構（i 2)中而破壞其毛細性能，此外，亦避 免因為該液態銅銀合金填料（丄8)滲入該毛細結構（丄2)所 導致各封合處的封合品質不佳而造成真空度不足的缺失，故可維 持該導熱管（1 )之熱傳導效率。 如第九A及九B圖所示，本創作係可應用於I c設計領域之 中’在該導熱管（1 )之底板（1 7)異於該外管（1 1 )及内 營（1 3 )之一側以濺鍍的方式設置一絕緣層（2 ),該絕緣層（2 ) 12 M353625 之材質係為碳化⑦、氧她錢她，其巾央設有―脸區域（2 A)以設置- I C晶片（3 )，該工c晶片（3 )係藉由錫焊或點 銀膠的方式SJ找該底板（！ 7)上，藉此，該底板（i 7)即 可吸收並傳導該I c晶片（3 )所散發的熱能，進而達到散熱的 效果。 如第十A及十B圖所示，本創作係可應用於一LED模組， 該導熱管（1 )之底板（i 7)異於該外管（i丄）及内管（工 3 )之一側以濺鍍的方式設置一絕緣層（2 )，該絕緣層（2 )之 材質係為碳化矽、氧化鋁或氮化鋁，其設有複數個鏤空區域（2 A)以設置複數個I C晶片（4)及L E D晶片（5 )，該i c晶 片（4)係藉由錫焊或點銀膠的方式固定於外圍的鏤空區域（2 A )’該L E D晶片（5 )則藉由錫焊或點銀膠的方式固定於其他 的鏤空區域（2 A )，藉此，該I c晶片（4 )及該L E D晶片（5 ) 可設置於該底板（1 7)上，並由該底板（i 7)吸收並傳導該 ICb曰片（4)及該LED晶片（5)所散發的熱能，進而達到 散熱的效果。 請參考第十一圖，本創作係可應用於熱能回收再利用之領 域，以太陽能產業為例，係以一支架（7)架設一發電裝置（6) 於該導熱管（1)之内管（13)中，該發電裝置（6)係具有 延伸出導熱管（1 )外侧之二導線（8 )，而該架設有發電裝置（6 ) 的導熱管（1 )與另一未架設發電裝置（6)的導熱管（丄）係 以其底板（1 7)相對設置於一太陽能板（9 )之二側，該太陽 13 M353625 能板（9)上設置有一符合該底板（17)形狀及尺寸的穿孔（9 A )以使該二底板（1 7)可相對接合而設置於該穿孔（9A) 中，該二底板（1 7)接合的方法係以錫填料（1 9 A)填置於 該二底板（1 7)之間以進行錫焊接合。 當該二導熱管（1 )尚未接受曰照時，該發電裝置（6)在 官體内的真空環境下.係為關閉狀態；當作為本實施例熱端的該架 設有發電裝置（6)的導熱管（1)接受曰照吸收熱能時，該導 參熱官（1 )之管體中作為工作流體的純水受熱氣化，使管體中壓 力增加而驅動該發電裝置（6)以將熱能轉換成電能並透過該導 線（8)將電力傳輸至外部電氣裝置使用。 同時，該未架設發電裝置（6 )的導熱管（丄）係以該太陽 能板（9)阻隔日照而作為冷端，透過其底板（丄7)的連結提 供散熱功能，以避免該架設有發電裝置（6)的導熱管（1)中 之發電裝置（6)過熱導致該發電裝置（6)因溫度過高而停止 • 作動，此外，該未架設發電裝置（β)的導熱管（丄）更可輔以 風扇進行強制對流或浸泡於冷水中而進一步提升其散熱的效率。 本創作之導熱管藉由在該外管中凸設一内管，並且將該毛細 結構佈設於該外管與内管之内壁以及該内管下段之㈣相較於 • f用單—管體之熱管，本創作之毛細結構的佈設面積增加，可使 ' ㈣散熱區域亦隨之增加，使得熱能傳導更均勻快速，進而提升 散熱效率；除此之外，其制範料僅可及於z c設計及led 模組的散熱，更可藉由本創作高效率熱傳導所提供的發電功能而 14 M3 53 625 應用於熱能回收再利用之領域，包括太陽能熱能回收利用、 廢熱回收利用及5丨擎廢熱回收利科，以上所述者，僅為本創作 之較佳實_，當不能㈣限定本施之_ ·故，凡依本 創作申明專利範圍及創作說明書内容所作之簡單的等效變化與修 飾’皆應仍屬本創作專利涵蓋之範圍内。 【圖式簡單說明】 第一圖係本創作之立體圖。 第二圖係本創作之縱向剖視圖。 第二圖係本創作縱向設置散熱鰭片 之立體圖。 第四圖係本創作縱向設置散熱鰭片之橫向剖視圖。 第五圖係本創作縱向設置散熱鰭片之橫向剖視局部放大圖。 第六圖係本創作橫向設置餘鰭片之縱向剖視圖。 第七圖係本創作之溝槽式毛細結構示意圖。 第八圖係本創作之網目式毛細結構示意^ 第九A®係本創作制於！ c設計領域之立體分解圖。 第九B圖係本創作應用於IC設計領域之平面圖。 第十A圖係本創作應用於LED模組之立體分解圖。 第十B圖係本創作應用於L ED模組之平面圖。 第十-圖係本創作應用於熱能回收再湘領域之縱向吾 【主要元件符號說明】 °㈣圖。 (1)導熱管 /1\The brass tube's capillary structure (i 2) may be a sintered type, a mesh type, and a grooved structure. As shown in the fifth and sixth figures, the capillary structure (12) is a sintered structure and is used in a large amount. The metal powder particles are disposed on the inner wall of the outer tube (i丄) in a high-temperature sintering manner, the inner wall of the upper portion of the inner tube (13), and the inner wall and the outer wall of the lower portion of the inner tube (13). The metal powder is copper powder. As shown in the sixth and seventh circles, the heat pipe is of a grooved structure, and the outer pipe (the process of forming the 1 1 pressure is formed in the capillary structure (1 2) of the outer pipe 1) and the inner pipe ( 13) An axial groove passing through the inner wall of the broaching and squeezing (1 1), the inner wall of the inner tube (1 3) 11 M353625, and the inner and outer walls of the lower portion of the inner tube (i 3). As shown in the sixth and eighth figures, the capillary structure (i 2) of the heat pipe (1) is a mesh structure, and the copper mesh of the fixed mesh number is subjected to cleaning and necessary processing to be rolled to conform to the outer pipe ( The pipe diameter of the inner pipe (i 3 ) is disposed on the inner wall of the outer pipe (1 1), the inner wall of the upper pipe of the inner pipe (13), and the lower portion of the inner pipe (work 3), The outer wall forms a mesh-like capillary structure (12). In addition, the capillary structure (12) disposed outside the tube (ii) and the inner tube (i 3) of the present invention is not limited to the same type, and may be the parent of the sintered, mesh, and grooved structures. The combination of the same type can achieve the effect of rapid water vapor diffusion by using capillary phenomenon. Furthermore, referring to the sixth figure, the capillary structure (丄2) does not contact the sealing portion of the bottom plate (17) and the outer tube (1 1) and the inner tube (13), and the outer tube cover ( 15) leaving about 2 to 1 与 with the sealing of the outer tube (1 1), the inner tube (丄3), and the sealing portion of the inner tube cover (16) and the inner tube (13) a gap of PCT to avoid the capillary properties of the copper-silver alloy filler (18) when it is melted into a liquid state by capillary action into the capillary structure (i 2), and also avoid the liquid copper-silver alloy filler (丄8) Infiltration of the capillary structure (丄2) results in poor sealing quality at each sealing portion, resulting in a lack of vacuum, so that the heat transfer efficiency of the heat pipe (1) can be maintained. As shown in Figures 9A and 9B, this creation can be applied to the Ic design field. 'The bottom plate (17) of the heat pipe (1) is different from the outer pipe (1 1) and the internal camp ( 1 3) One side is sputtered to provide an insulating layer (2), the insulating layer (2) 12 M353625 is made of carbonized 7, oxygen her money, the towel has a "face area" (2 A The IC chip (3) is placed on the bottom plate (! 7) by soldering or spotting silver (S7), whereby the bottom plate (i 7) can be absorbed. And conducting the heat energy emitted by the IC chip (3) to achieve the heat dissipation effect. As shown in Figures 10A and 10B, the creation system can be applied to an LED module, and the bottom plate (i 7) of the heat pipe (1) is different from the outer tube (i丄) and the inner tube (3) One side is provided with an insulating layer (2) by sputtering, and the insulating layer (2) is made of tantalum carbide, aluminum oxide or aluminum nitride, and is provided with a plurality of hollow regions (2 A) to set plural IC chip (4) and LED chip (5), the ic chip (4) is fixed to the peripheral hollow region (2 A ) by soldering or silver paste glue. The LED chip (5) is Soldering or spotting silver glue is fixed to other hollow regions (2 A ), whereby the IC chip (4) and the LED chip (5) can be disposed on the bottom plate (17), and The bottom plate (i 7) absorbs and conducts the heat energy emitted by the ICb chip (4) and the LED chip (5) to achieve the heat dissipation effect. Please refer to the eleventh figure. This creation can be applied to the field of heat recovery and reuse. Take the solar industry as an example. A support device (6) is used to build a power generation device (6) inside the heat pipe (1). (13), the power generating device (6) has two wires (8) extending outside the heat pipe (1), and the heat pipe (1) of the power generating device (6) is provided with another heat generating device (6) The heat pipe (丄) is disposed on the two sides of a solar panel (9) with the bottom plate (17) opposite thereto, and the solar 13 M353625 energy plate (9) is provided with a shape conforming to the bottom plate (17) and Dimensional perforations (9 A ) are provided in the perforations (9A) such that the two bottom plates (17) are relatively joined, and the two bottom plates (17) are joined by tin filler (1 9 A). A solder joint is performed between the two bottom plates (17). When the two heat pipes (1) have not been subjected to the lighting, the power generating device (6) is in a closed state in a vacuum environment in the official body; the power generating device (6) is provided as the frame of the hot end of the embodiment. When the heat pipe (1) receives the heat absorbed by the heat, the pure water as the working fluid in the pipe body of the heat guide (1) is heated and vaporized, so that the pressure in the pipe body is increased to drive the power generating device (6) to Thermal energy is converted into electrical energy and transmitted to the external electrical device through the conductor (8). At the same time, the heat pipe (丄) of the unmounted power generating device (6) is configured to block the sunlight as the cold end of the solar panel (9), and provide a heat dissipation function through the connection of the bottom plate (丄7) to prevent the frame from generating electricity. The overheating of the power generating device (6) in the heat pipe (1) of the device (6) causes the power generating device (6) to stop due to excessive temperature, and the heat pipe (丄) of the power generating device (β) is not installed. It can be supplemented with a fan for forced convection or immersion in cold water to further improve the efficiency of heat dissipation. The heat pipe of the present invention has an inner tube protruding from the outer tube, and the capillary structure is disposed on the inner wall of the outer tube and the inner tube and the lower portion of the inner tube (four) compared with the single tube body of the f The heat pipe, the layout area of the capillary structure of the creation is increased, so that the heat dissipation area of the (4) is also increased, so that the heat conduction is more uniform and rapid, thereby improving the heat dissipation efficiency; in addition, the specification is only applicable to the zc. Design and cooling of the LED module, 14 M3 53 625 can be used in the field of heat recovery and recycling, including solar thermal energy recovery, waste heat recovery and 5 丨 waste heat recovery. Ricoeur, the above mentioned, is only the best of this creation _, when it can't (4) limit the _ · Therefore, the simple equivalent change and modification made by the author's claim patent scope and the content of the creative manual' All should remain within the scope of this creation patent. [Simple description of the diagram] The first picture is a perspective view of the creation. The second figure is a longitudinal section view of the creation. The second figure is a perspective view of the longitudinal fins of the present creation. The fourth figure is a transverse cross-sectional view of the longitudinal fins of the present invention. The fifth figure is a partial enlarged view of the transverse section of the longitudinal fin of the present invention. The sixth figure is a longitudinal cross-sectional view of the lateral fins of the present creation. The seventh picture is a schematic diagram of the grooved capillary structure of the present creation. The eighth picture shows the mesh structure of the creation. The ninth A® series is created by this! c. An exploded view of the design field. The ninth B diagram is a plan view of the present application applied to the field of IC design. The tenth A picture is an exploded view of the LED module applied to the LED module. The tenth B diagram is a plan view of the creation of the L ED module. The tenth-picture series is applied to the longitudinal section of the heat recovery and the Xiangxiang field. [Main component symbol description] ° (four) diagram. (1) Heat pipe /1\
管 外 15 M353625 (1 2)毛細結構 (1 3)内管 (1 4 )通孔 (1 5)外管封蓋 (1 5 0 )穿孔 (1 6)内管封蓋 (1 7)底板 (1 8)銅銀合金填料 (19)散熱鰭片 (1 9 A)錫填料 (2)絕緣層 (2 A)鏤空區域 (3 ) I C晶片 (4 ) I C晶片 (5 ) L E D晶片 (6 )發電裝置 (7 )支架 (8 )導線 (9)太陽能板 (9 A)穿孔Outer tube 15 M353625 (1 2) Capillary structure (1 3) Inner tube (1 4 ) Through hole (1 5) Outer tube cover (1 50) Perforation (16) Inner tube cover (17) Base plate ( 1 8) Copper-silver alloy filler (19) Heat sink fin (1 9 A) Tin filler (2) Insulation layer (2 A) Hollow area (3) IC chip (4) IC chip (5) LED chip (6) Power generation Device (7) bracket (8) wire (9) solar plate (9 A) perforation