TWI405944B - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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TWI405944B
TWI405944B TW99146941A TW99146941A TWI405944B TW I405944 B TWI405944 B TW I405944B TW 99146941 A TW99146941 A TW 99146941A TW 99146941 A TW99146941 A TW 99146941A TW I405944 B TWI405944 B TW I405944B
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magnetic
cavity
magnetic field
heat
dissipating device
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TW99146941A
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TW201226823A (en
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Jen Jie Chieh
Yuan Chin Chiang
Chia Che Ho
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Kinik Co
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Abstract

The present invention relates to a heat dissipation device, including: an outer pipe; an inner pipe disposed in the outer pipe and having a plurality of openings at two terminal walls thereof to allow the first chamber to communicate with the second chamber, an internal space of the inner pipe being served as a first chamber and a space between the inner pipe and the outer pipe being served as a second chamber; and a magnetic nanofluid filled in the first chamber and the second chamber and including a liquid fluid and a plurality of magnetic nanoparticles. Accordingly, the heat dissipation of the present invention can exhibit improved heat transfer performance and has advantages of simple structure and small size.

Description

散熱裝置Heat sink

本發明係關於一種散熱裝置,尤指一種適用於有效排逸廢熱之散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device suitable for effectively discharging waste heat.

目前散熱市場中,熱管因具有優異的熱傳性能,故成為使用最為廣泛之技術,並普遍應用於各種散熱系統中。增加熱管之熱傳導特性係現今熱管發展之重點,而主要研究方向有:改變熱管結構及改變工作流體。In the current heat dissipation market, heat pipes have become the most widely used technology because of their excellent heat transfer performance, and are widely used in various heat dissipation systems. Increasing the heat transfer characteristics of heat pipes is the focus of today's heat pipe development, and the main research directions are: changing the heat pipe structure and changing the working fluid.

就工作流體而言,奈米流體係最近的研究潮流,其將奈米尺寸的金屬或非金屬奈米粒子懸浮於流體中,以改變流體的基本流動及熱傳特性,且無以往添加大顆粒於流體後所造成之流道阻塞及壓降問題。習知使用之奈米流體顆粒主要包括:如金、銀、銅等金屬奈米粒子;如氧化鋁、氧化銅、二氧化矽等氧化物奈米粒子;及奈米碳管等。另外,亦有人提出可使用磁性奈米流體作為工作流體,其中已提出有各種磁性奈米粒子之製備方法,如台灣專利TW096116233號所揭露之超順磁性粒子,然而,將磁性奈米粒子應用於散熱系統中仍有發展改善之空間。另一方面,就熱管結構而言,目前使用之熱管主要有:單管式熱管、迴路式熱管及迴路脈衝式熱管。In terms of working fluids, the recent research trend of nanofluidic systems has suspended nanometer-sized metallic or non-metallic nanoparticles in fluids to alter the basic flow and heat transfer characteristics of fluids without the addition of large particles. The problem of channel blockage and pressure drop caused by the fluid. Conventionally used nanometer fluid particles mainly include: metal nanoparticles such as gold, silver, copper; oxide nanoparticles such as alumina, copper oxide, ceria; and carbon nanotubes. In addition, it has also been proposed to use a magnetic nanofluid as a working fluid, among which various magnetic nanoparticle preparation methods have been proposed, such as the superparamagnetic particles disclosed in Taiwan Patent No. TW096116233, however, magnetic nanoparticles are applied. There is still room for improvement in the cooling system. On the other hand, as far as the heat pipe structure is concerned, the heat pipes currently used mainly include: a single pipe heat pipe, a loop heat pipe, and a loop pulse heat pipe.

如圖1A所示,習知單管式熱管係由封閉管體11所構成,其內壁上披覆有毛細結構13,且內部設有工作流體14。據此,如圖1A所示,當單管式熱管之蒸發部B1之工作流體14受熱汽化時,汽化而成之氣相會往冷凝部B2移動(如箭頭所示),並於冷凝部B2將氣相冷凝成液相,而冷凝後之液相將藉由毛細結構13之毛细力流回蒸發部B1(如箭頭所示)。於單管式熱管中,由於蒸發氣相與冷凝液係於同一流道流動,故流速大之蒸氣容易對冷凝液產生剪力,遂使冷凝液無法流回蒸氣部,進而導致蒸發部發生乾燒的現象。此外,若單管式熱管所使用之工作流體為奈米流體時,蒸發時所發生之固氣相分離現象會使奈米粒子仍留置於蒸發部,反而導致熱阻增加。As shown in FIG. 1A, the conventional single-tube heat pipe is composed of a closed pipe body 11, the inner wall of which is covered with a capillary structure 13, and a working fluid 14 is disposed inside. Accordingly, as shown in FIG. 1A, when the working fluid 14 of the evaporation portion B1 of the single-tube heat pipe is heated and vaporized, the vaporized vapor phase moves toward the condensation portion B2 (as indicated by the arrow), and is in the condensation portion B2. The gas phase is condensed into a liquid phase, and the condensed liquid phase will flow back to the evaporation portion B1 by the capillary force of the capillary structure 13 (as indicated by the arrow). In the single-tube heat pipe, since the vaporization gas phase and the condensate flow in the same flow channel, the vapor having a large flow velocity easily shears the condensate, so that the condensate cannot flow back to the vapor portion, thereby causing the evaporation portion to dry. The phenomenon of burning. In addition, if the working fluid used in the single-tube heat pipe is a nanofluid, the solid-gas phase separation occurring during evaporation causes the nanoparticles to remain in the evaporation portion, which in turn causes an increase in thermal resistance.

日本專利JP57108593號即揭露一種單管式熱管充填磁性流體之散熱裝置,其雖利用纏繞於熱管外部之電磁線圈來加速磁性流體之速度,但由於蒸發氣相與冷凝液仍於同一流道流動,故蒸氣仍易阻礙冷凝液流回蒸發部,且蒸發時所發生之固氣相分離現象容易使磁性粒子仍留置於蒸發部,導致熱阻增加。Japanese Patent No. JP57108593 discloses a heat dissipation device for a single-tube heat pipe filled with a magnetic fluid, which uses an electromagnetic coil wound around a heat pipe to accelerate the speed of the magnetic fluid, but since the vapor phase and the condensate still flow in the same flow path, Therefore, the vapor is still likely to hinder the flow of the condensate back to the evaporation portion, and the solid-gas phase separation phenomenon occurring during evaporation tends to leave the magnetic particles in the evaporation portion, resulting in an increase in thermal resistance.

為解決上述蒸發部易乾燒之問題,另提出有迴路式熱管之技術。如圖1B所示,習知迴路式熱管係藉由封閉式迴路管21內的工作流體24於蒸發部B1與冷凝部B2進行熱交換,其中蒸發氣相與冷凝液係於不同流道流動,故可避免蒸氣對冷凝液產生剪力而造成冷凝液無法流回蒸氣部之問題。In order to solve the problem that the above-mentioned evaporation part is easy to dry, another technique of a loop type heat pipe is proposed. As shown in FIG. 1B, the conventional loop heat pipe performs heat exchange between the evaporation portion B1 and the condensation portion B2 by the working fluid 24 in the closed circuit tube 21, wherein the evaporation gas phase and the condensate flow in different flow paths. Therefore, the problem that the vapor can cause shearing force to the condensate and the condensate cannot flow back to the vapor portion can be avoided.

另一方面,為解決上述奈米粒子與氣相分離之問題,另提出有迴路脈衝式熱管之技術。如圖1C所示,習知迴路脈衝式熱管主要係由多支熱管串聯構成之多迴路式管體31,其中工作流體34於該多迴路式管體31中可形成氣相與奈米流體之傳輸單元,以避免奈米粒子留置於蒸發部B1。然而,該習知迴路脈衝式熱管卻有構造複雜且所佔空間極大之缺點。On the other hand, in order to solve the problem of separating the above-mentioned nanoparticle from the gas phase, a technique of a loop pulse type heat pipe has been proposed. As shown in FIG. 1C, the conventional loop pulse type heat pipe is mainly a multi-circuit type pipe body 31 composed of a plurality of heat pipes connected in series, wherein the working fluid 34 can form a gas phase and a nano fluid in the multi-circuit type pipe body 31. The transfer unit prevents the nanoparticles from remaining in the evaporation portion B1. However, the conventional loop pulse type heat pipe has the disadvantages of complicated structure and large space occupation.

此外,日本專利JP57096557號、日本專利JP8014779號及台灣專利TW097145608號另揭露一種藉由工作流體於雙管分流之結構中流動而帶走熱之技術,其中,為增加熱導效果,其增加接觸面積並設有多數檔板或散熱鰭片,使工作流體能充分進行熱交換。然而,此結構卻可能導致工作流體流速減緩,反而無法達到快速散熱之目的。尤其,若此結構使用奈米流體作為工作流體,亦可能因氣固分離而導致熱阻上升。In addition, Japanese Patent No. JP57096557, Japanese Patent No. JP8014779, and Taiwan Patent No. TW097145608 disclose a technique for removing heat by flowing a working fluid in a double-pipe split structure, wherein, in order to increase the heat conductivity effect, the contact area is increased. It has a number of baffles or fins to allow the working fluid to exchange heat. However, this structure may cause the working fluid flow rate to slow down, but it may not achieve the purpose of rapid heat dissipation. In particular, if the structure uses a nanofluid as a working fluid, the thermal resistance may increase due to gas-solid separation.

本發明之目的係在提供一種散熱裝置,俾能提高散熱效率,且具有結構簡單及不佔空間等優點。The object of the present invention is to provide a heat dissipating device, which can improve heat dissipation efficiency, and has the advantages of simple structure and no space occupation.

為達成上述目的,本發明提供一種散熱裝置,包括:一外管;一內管,係設置於該外管內,其中該內管之內部空間構成一第一腔體,而該內管與該外管間之空間則構成一第二腔體,且該內管之兩端壁上具有複數個開孔,以使該第一腔體與該第二腔體互相連通;以及一磁性奈米流體,係填充於該第一腔體及該第二腔體中,其中該磁性奈米流體包括一液態流體及複數個磁性奈米粒子。In order to achieve the above object, the present invention provides a heat dissipating device comprising: an outer tube; an inner tube disposed in the outer tube, wherein the inner space of the inner tube constitutes a first cavity, and the inner tube and the inner tube The space between the outer tubes constitutes a second cavity, and the end walls of the inner tube have a plurality of openings for interconnecting the first cavity and the second cavity; and a magnetic nanofluid Filled in the first cavity and the second cavity, wherein the magnetic nanofluid comprises a liquid fluid and a plurality of magnetic nanoparticles.

據此,本發明係藉由雙套管之熱管結構,使工作流體(即磁性奈米流體)之蒸發氣相及高溫液相與冷凝液於不同流道流動,以避免習知單管式熱管易發生之蒸發部乾燒問題。在此,本發明散熱裝置中所填充的磁性奈米流體受熱時,液態流體可藉由蒸發與冷凝之熱傳方式,以達到快速傳遞熱量之效果;除此之外,更可藉由磁性奈米流體中粒子與粒子間的碰撞及粒子與管壁的碰撞,以有效提升熱傳效果。尤其,本發明散熱裝置中之內管兩端壁上因形成具有類似噴嘴作用之開孔,故可使磁性奈米流體受熱時形成氣液相共存之傳輸單元,以避免習知單管式熱管易發生粒子留置蒸發部導致熱阻上升之問題,且無須再增加接觸面積或增設檔板或散熱鰭片即可展現優異之熱導效果,俾可避免接觸面積增加或增設檔板或散熱鰭片導致工作流體流速減緩之問題,以達到快速散熱之目的。相較於習知迴路脈衝式熱管,本發明之散熱裝置可展現優異之熱傳特性,且具有結構較為簡單、製作成本較低及體積較小之優點。Accordingly, the present invention uses a double-tube heat pipe structure to flow the vaporized gas phase of the working fluid (ie, magnetic nanofluid) and the high-temperature liquid phase and the condensate in different flow paths to avoid the conventional single-tube heat pipe. The problem of dry burning in the evaporation department that is prone to occur. Here, when the magnetic nano-filled fluid filled in the heat-dissipating device of the present invention is heated, the liquid fluid can be transferred by heat transfer by evaporation and condensation to achieve the effect of rapidly transferring heat; in addition, The collision between particles and particles in the rice fluid and the collision of the particles with the tube wall to effectively improve the heat transfer effect. In particular, in the heat dissipating device of the present invention, the end walls of the inner tube are formed with openings similar to those of the nozzle, so that the magnetic nano-fluid can form a gas-liquid phase coexisting transmission unit when heated, so as to avoid the conventional single-tube heat pipe. It is prone to the problem that the thermal retention of the particles is caused by the indwelling of the particles, and the thermal contact effect can be exhibited without increasing the contact area or adding baffles or fins. The contact area can be increased or the baffles or fins can be added. The problem of slowing the flow rate of the working fluid is to achieve rapid heat dissipation. Compared with the conventional loop pulse type heat pipe, the heat dissipating device of the invention can exhibit excellent heat transfer characteristics, and has the advantages of simple structure, low manufacturing cost and small volume.

本發明之散熱裝置更可包括:一毛細結構,係披覆於該第一腔體或該第二腔體之內壁上。據此,冷凝後之液態流體除了重力作用外,其更可藉由毛細作用,快速回流至蒸發部,以提高熱傳效率。The heat dissipating device of the present invention may further comprise: a capillary structure covering the inner wall of the first cavity or the second cavity. Accordingly, in addition to the action of gravity, the condensed liquid fluid can be quickly returned to the evaporation portion by capillary action to improve heat transfer efficiency.

本發明之散熱裝置更可包括:一磁場產生單元,係設置於該內管之外圍或該內管中。據此,該磁場產生單元可增加局部磁場,進一步提高磁性奈米流體之熱導係數。The heat dissipating device of the present invention may further comprise: a magnetic field generating unit disposed in a periphery of the inner tube or in the inner tube. Accordingly, the magnetic field generating unit can increase the local magnetic field to further increase the thermal conductivity of the magnetic nanofluid.

於本發明中,磁性奈米流體中之磁性奈米粒子並無特殊限制,其可為任何具有磁性之奈米粒子,如三氧化二鐵奈米粒子、四氧化三鐵奈米粒子或其混合物等,且粒徑較佳是小於10 nm;此外,磁性奈米流體中之液態流體亦無特殊限制,其可為任何習知適用於熱管中之液態流體,舉例如水、油、丙酮、癸烯、乙二醇、氟化液或其混合;再者,磁性奈米粒子於液態流體中之濃度較佳為1.6×10-2 emu/g至8 emu/g。In the present invention, the magnetic nanoparticle in the magnetic nanofluid is not particularly limited, and may be any magnetic nanoparticle such as ferric oxide nanoparticles, triiron tetroxide particles or a mixture thereof. And the particle size is preferably less than 10 nm; in addition, the liquid fluid in the magnetic nanofluid is also not particularly limited, and may be any liquid fluid suitable for use in a heat pipe, such as water, oil, acetone, decene. , ethylene glycol, liquid or mixed fluoride; Furthermore, the concentration of magnetic nanoparticles in the liquid fluid is preferably 1.6 × 10 -2 emu / g to 8 emu / g.

於本發明中,以散熱裝置總體積為基準,該磁性奈米流體之充填量較佳為裝置總體積之30至50體積百分比。In the present invention, the filling amount of the magnetic nanofluid is preferably from 30 to 50% by volume based on the total volume of the heat dissipating device.

於本發明中,該毛細結構並無特殊限制,其可為任何習知之毛細結構,舉例包括絲網結構(如銅網)、溝槽結構、燒結結構、纖維結構或蝕刻結構等。In the present invention, the capillary structure is not particularly limited, and may be any conventional capillary structure, and includes, for example, a wire mesh structure (such as a copper mesh), a groove structure, a sintered structure, a fiber structure, or an etched structure.

於本發明中,散熱裝置之兩端可分別為一蒸發部及一冷凝部。在此,蒸發部與冷凝部可使用疏密程度不同之毛細結構,較佳為,蒸發部使用密度較密之毛細結構(即,蒸發部處之毛細結構密度高於冷凝部處之毛細結構密度),以提昇工作流體蒸發量。In the present invention, the two ends of the heat dissipating device may be an evaporation portion and a condensation portion, respectively. Here, the evaporating portion and the condensing portion may use a capillary structure having a different degree of density. Preferably, the evaporating portion uses a denser capillary structure (that is, the capillary structure density at the evaporation portion is higher than the capillary structure density at the condensing portion). ) to increase the amount of working fluid evaporation.

於本發明中,該磁性奈米流體可於一傳輸流道中產生一氣液相共存之傳輸單元,俾能有效地將廢熱由蒸發部傳導至冷凝部排逸。於此,而該傳輸流道可位於該第一腔體或該第二腔體中。詳細地說,傳輸流道可位於第一腔體中,而毛細結構則可披覆於第二腔體之內壁上;或者,傳輸流道係於第二腔體中,而毛細結構則係披覆於第一腔體之內壁上。In the present invention, the magnetic nanofluid can generate a gas-liquid phase coexisting transport unit in a transport flow path, and can effectively conduct waste heat from the evaporation portion to the condensation portion. Here, the transport channel can be located in the first cavity or the second cavity. In detail, the transport flow path may be located in the first cavity, and the capillary structure may be coated on the inner wall of the second cavity; or the transport flow channel may be in the second cavity, and the capillary structure is Covered on the inner wall of the first cavity.

於本發明中,當傳輸流道係位於第一腔體中時,第一腔體或第二腔體可包括一容置部,其係位於該傳輸流道之外側,俾使磁場產生單元可設置於該容置部中。另一方面,當傳輸流道係位於第二腔體中時,第二腔體則可包括一容置部,其係位於該傳輸流道之外側,俾使磁場產生單元可設置於該容置部中。又,該磁場產生單元亦可設置於該外管之外側。據此,該磁場產生單元所產生之磁場可橫向穿過該傳輸流道。此外,該磁場產生單元較佳係產生適當強度之磁場,俾可於不影響磁性奈米流體流動下增加局部磁場,避免磁性奈米粒子吸附於管中,造成散熱裝置之熱傳性能下降。較佳為,磁場產生單元於傳輸流道之磁場強度為1000 Oe至4000 Oe,更佳為1000 Oe至3000 Oe,最佳為2000 Oe。In the present invention, when the transport flow channel is located in the first cavity, the first cavity or the second cavity may include a receiving portion located on the outer side of the transport flow path, so that the magnetic field generating unit can It is disposed in the accommodating portion. On the other hand, when the transport channel is located in the second cavity, the second cavity may include a receiving portion located on the outer side of the transport channel, so that the magnetic field generating unit can be disposed in the receiving In the ministry. Moreover, the magnetic field generating unit may be disposed on the outer side of the outer tube. Accordingly, the magnetic field generated by the magnetic field generating unit can transversely pass through the transport flow path. In addition, the magnetic field generating unit preferably generates a magnetic field of appropriate intensity, and the local magnetic field can be increased without affecting the flow of the magnetic nano-fluid, and the magnetic nano-particles are prevented from being adsorbed into the tube, thereby causing a decrease in heat transfer performance of the heat dissipating device. Preferably, the magnetic field generating unit has a magnetic field strength in the transport channel of from 1000 Oe to 4000 Oe, more preferably from 1000 Oe to 3000 Oe, most preferably 2000 Oe.

於本發明中,該磁場產生單元並無特殊限制,其可為任何可產生磁場之元件,如環狀靜磁鐵、四極式靜磁鐵、電磁鐵等。In the present invention, the magnetic field generating unit is not particularly limited, and may be any element that generates a magnetic field, such as a ring static magnet, a quadrupole static magnet, an electromagnet or the like.

本發明之散熱裝置更可包括:一感應線圈,係設置於該外管之外圍,俾使該感應線圈可因磁性流體流動所造成之磁場變化而產生感應電流。據此,該散熱裝置亦可與一電力裝置(如風扇、USB、電池等)電性連接,以提供電力予該電力裝置。The heat dissipating device of the present invention may further include: an induction coil disposed on a periphery of the outer tube to cause the induction coil to generate an induced current due to a change in a magnetic field caused by the flow of the magnetic fluid. Accordingly, the heat sink can also be electrically connected to a power device (such as a fan, USB, battery, etc.) to provide power to the power device.

承上所述,本發明係藉由雙套管之熱管結構,使工作流體(即磁性奈米流體)之蒸發氣相及高溫液相與冷凝液於不同流道流動,以避免習知單管式熱管易發生之蒸發部乾燒問題。在此,本發明散熱裝置中所填充的磁性奈米流體受熱時,液態流體可藉由蒸發與冷凝之熱傳方式,以達到快速傳遞熱量之效果;除此之外,更可藉由磁性奈米流體中粒子與粒子間的碰撞及粒子與管壁的碰撞,以有效提升熱傳效果。尤其,本發明散熱裝置中之內管兩端壁上因形成具有類似噴嘴作用之開孔,故可使磁性奈米流體受熱時形成氣液相共存之傳輸單元,以避免習知單管式熱管易發生粒子留置蒸發部導致熱阻上升之問題,且無須再增加接觸面積或增設檔板或散熱鰭片即可展現優異之熱導效果,俾可避免接觸面積增加或增設檔板或散熱鰭片導致工作流體流速減緩之問題,以達到快速散熱之目的;再者,本發明散熱裝置更可設置有磁場產生單元,以增加局部磁場,提高磁性奈米流體之熱導係數。相較於習知迴路脈衝式熱管,本發明之散熱裝置可展現優異之熱傳特性,且具有結構較為簡單、製作成本較低及體積較小之優點。According to the above, the present invention uses a double-tube heat pipe structure to flow the vaporized gas phase of the working fluid (ie, magnetic nanofluid) and the high-temperature liquid phase and the condensate in different flow paths to avoid the conventional single tube. The problem of dry burning of the evaporation part that is prone to heat pipe. Here, when the magnetic nano-filled fluid filled in the heat-dissipating device of the present invention is heated, the liquid fluid can be transferred by heat transfer by evaporation and condensation to achieve the effect of rapidly transferring heat; in addition, The collision between particles and particles in the rice fluid and the collision of the particles with the tube wall to effectively improve the heat transfer effect. In particular, in the heat dissipating device of the present invention, the end walls of the inner tube are formed with openings similar to those of the nozzle, so that the magnetic nano-fluid can form a gas-liquid phase coexisting transmission unit when heated, so as to avoid the conventional single-tube heat pipe. It is prone to the problem that the thermal retention of the particles is caused by the indwelling of the particles, and the thermal contact effect can be exhibited without increasing the contact area or adding baffles or fins. The contact area can be increased or the baffles or fins can be added. The problem that the working fluid flow rate is slowed down is to achieve the purpose of rapid heat dissipation. Furthermore, the heat dissipating device of the present invention can be further provided with a magnetic field generating unit to increase the local magnetic field and improve the thermal conductivity of the magnetic nanofluid. Compared with the conventional loop pulse type heat pipe, the heat dissipating device of the invention can exhibit excellent heat transfer characteristics, and has the advantages of simple structure, low manufacturing cost and small volume.

以下係藉由特定的具體實施例說明本發明之實施方式,熟習此技藝之人士可由本說明書所揭示之內容輕易地了解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明之精神下進行各種修飾與變更。The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

實施例1Example 1

請參見圖2,其係為本發明一較佳實施例之散熱裝置示意圖。Please refer to FIG. 2 , which is a schematic diagram of a heat sink according to a preferred embodiment of the present invention.

如圖2所示,本實施例之散熱裝置包括:一外管41;一內管42,係設置於該外管41內,其中該內管42之內部空間構成一第一腔體A,而內管42與外管41間之空間則構成一第二腔體B,且該內管42之兩端壁上具有複數個開孔421,以使第一腔體A與第二腔體B互相連通;一毛細結構43(於本實施例中,該毛細結構43為一銅網結構),係披覆於第二腔體B之內壁(即,內管42之外壁與外管41之內壁)上;一磁性奈米流體44,係填充於第一腔體A及第二腔體B中,其充填量可約為30至50體積百分比,其中磁性奈米流體44包括一液態流體441及複數個磁性奈米粒子442,而該些磁性奈米粒子442之粒徑小於10 nm,且其於液態流體441中之濃度約為1.6×10-2 emu/g至8 emu/g;一磁場產生單元45,係設置於內管42中。在此,第一腔體A包括傳輸流道A1及容置部A2,且該散熱裝置之兩端分別作為蒸發部B1及冷凝部B2,其中,傳輸流道A1係磁性奈米流體44與其蒸發氣體傳輸流動之通道,而容置部A2係位於傳輸流道A1之外側,且用於容置磁場產生單元45。As shown in FIG. 2, the heat dissipating device of the present embodiment includes: an outer tube 41; an inner tube 42 disposed in the outer tube 41, wherein the inner space of the inner tube 42 constitutes a first cavity A, and The space between the inner tube 42 and the outer tube 41 constitutes a second cavity B, and the end walls of the inner tube 42 have a plurality of openings 421 so that the first cavity A and the second cavity B are mutually Connected; a capillary structure 43 (in the present embodiment, the capillary structure 43 is a copper mesh structure), is coated on the inner wall of the second cavity B (ie, the outer wall of the inner tube 42 and the outer tube 41) a magnetic nanofluid 44 filled in the first cavity A and the second cavity B, the filling amount of which may be about 30 to 50 volume percent, wherein the magnetic nanofluid 44 comprises a liquid fluid 441 And a plurality of magnetic nano particles 442 having a particle diameter of less than 10 nm and a concentration in the liquid fluid 441 of about 1.6×10 -2 emu/g to 8 emu/g; The magnetic field generating unit 45 is disposed in the inner tube 42. Here, the first cavity A includes a transport flow path A1 and a accommodating portion A2, and both ends of the heat dissipating device serve as an evaporation portion B1 and a condensing portion B2, respectively, wherein the transport flow channel A1 is a magnetic nano-fluid 44 and evaporates The gas transports the flow path, and the accommodating portion A2 is located on the outer side of the transport flow path A1 and is for accommodating the magnetic field generating unit 45.

據此,請參見圖2,當外管41內壁上毛細結構43之磁性奈米流體44因外管41被加熱而氣化時,高壓蒸氣會高速通過該蒸發部B1處之開孔421而進入內管42,並同時推動內管42外壁上毛細結構43之磁性奈米流體44,因此第一腔體A之傳輸流道A1中會形成一小段氣體推一小段磁性奈米流體之氣液相共存傳輸單元,而容置部A2之磁場產生單元45可產生橫向穿過該傳輸流道A1之磁場(即,該磁場垂直於氣液相傳輸單元傳輸方向),以增加局部磁場,提高傳輸單元中磁性奈米流體44之熱傳導係數,其中,為提昇工作流體蒸發量,蒸發部B1較佳係使用密度較密之毛細結構43;而後,當傳輸單元流至冷凝部B2時,磁性奈米流體44會先潤濕內管42外壁上之毛細結構43,再藉由毛細力流至外管41內壁上之毛細結構43,以進行熱交換冷凝,而蒸氣則通過冷凝部B2處之開孔421與毛細結構43而進入冷凝部B2冷凝;最後,冷凝後之磁性奈米流體44會流回至蒸發部B1,並沖刷蒸發時殘留於外管41內壁上毛細結構43之磁性奈米粒子442,俾使磁性奈米粒子442流入內管42外壁上毛細結構43之磁性奈米流體44中。Accordingly, referring to FIG. 2, when the magnetic nanofluid 44 of the capillary structure 43 on the inner wall of the outer tube 41 is vaporized by the heating of the outer tube 41, the high-pressure vapor passes through the opening 421 at the evaporation portion B1 at a high speed. The inner tube 42 is inserted, and at the same time, the magnetic nano-fluid 44 of the capillary structure 43 on the outer wall of the inner tube 42 is pushed. Therefore, a small gas is formed in the transport channel A1 of the first chamber A to push a small portion of the magnetic nano-fluid gas. The phase coexisting transmission unit, and the magnetic field generating unit 45 of the accommodating portion A2 can generate a magnetic field transversely passing through the transport channel A1 (ie, the magnetic field is perpendicular to the transmission direction of the gas-liquid phase transmission unit) to increase the local magnetic field and improve transmission. The heat transfer coefficient of the magnetic nanofluid 44 in the unit, wherein in order to increase the evaporation amount of the working fluid, the evaporation portion B1 preferably uses a densely dense capillary structure 43; and then, when the transfer unit flows to the condensation portion B2, the magnetic nanometer The fluid 44 first wets the capillary structure 43 on the outer wall of the inner tube 42 and then flows to the capillary structure 43 on the inner wall of the outer tube 41 by capillary force for heat exchange condensation, and the vapor passes through the condensation portion B2. The hole 421 and the capillary structure 43 enter the cold The condensation portion B2 is condensed; finally, the condensed magnetic nano-fluid 44 flows back to the evaporation portion B1, and scoured the magnetic nanoparticles 442 remaining on the inner wall 41 of the outer tube 41 during evaporation to cause the magnetic nano-particles The particles 442 flow into the magnetic nanofluid 44 of the capillary structure 43 on the outer wall of the inner tube 42.

承上所述,本實施例所提供之散熱裝置主要結構特徵在於:(1)內管之兩端具有複數個開孔(作用如噴嘴),其有利於形成氣液相共存之傳輸單元,避免磁性奈米粒子留置於蒸發部而導致熱阻上升之問題;(2)蒸發氣相及高溫液相與冷凝液於不同流道流動。As described above, the main structural features of the heat dissipating device provided in this embodiment are as follows: (1) Both ends of the inner tube have a plurality of openings (acting as nozzles), which are favorable for forming a transmission unit in which gas and liquid phases coexist, avoiding The problem that the magnetic nanoparticles are left in the evaporation portion and the thermal resistance is increased; (2) the evaporation gas phase and the high temperature liquid phase and the condensate flow in different flow paths.

實施例2Example 2

本實施例之散熱裝置與實施例1所述大致相同,惟不同處在於,本實施例之磁場產生單元45係設置於內管42與外管41之間。詳細地說,請參見圖3,於本實施例中,該第二腔體B包括一容置部B3,其係位於內管42與外管41之間,且該磁場產生單元45係設置於容置部B3中。The heat sink of this embodiment is substantially the same as that described in Embodiment 1, except that the magnetic field generating unit 45 of the present embodiment is disposed between the inner tube 42 and the outer tube 41. In detail, referring to FIG. 3, in the embodiment, the second cavity B includes a receiving portion B3 between the inner tube 42 and the outer tube 41, and the magnetic field generating unit 45 is disposed on In the housing portion B3.

實施例3Example 3

本實施例之散熱裝置與實施例1所述大致相同,惟不同處在於,如圖4所示,本實施例之磁場產生單元45係設置於外管41之外側。The heat sink of this embodiment is substantially the same as that described in Embodiment 1, except that, as shown in FIG. 4, the magnetic field generating unit 45 of the present embodiment is disposed on the outer side of the outer tube 41.

實施例4Example 4

本實施例之散熱裝置與實施例1所述大致相同,惟不同處在於,如圖5所示,本實施例之散熱裝置更包括:一感應線圈46,係設置於該外管41之外圍。在此,該感應線圈46可與一電力裝置51(如風扇、USB、電池等)電性連接,以提供電力予該電力裝置51。The heat dissipating device of the embodiment is substantially the same as that of the first embodiment, except that, as shown in FIG. 5, the heat dissipating device of the embodiment further includes an induction coil 46 disposed on the periphery of the outer tube 41. Here, the induction coil 46 can be electrically connected to a power device 51 (such as a fan, a USB, a battery, etc.) to provide power to the power device 51.

實施例5Example 5

本實施例之散熱裝置與實施例3所述大致相同,惟不同處在於,本實施例之傳輸流道係位於第二腔體中,而毛細結構則係披覆於第一腔體之內壁上。The heat dissipating device of this embodiment is substantially the same as that described in Embodiment 3, except that the transport channel of the embodiment is located in the second cavity, and the capillary structure is coated on the inner wall of the first cavity. on.

據此,當散熱裝置蒸發部中之磁性奈米流體被加熱而氣化時,高壓蒸氣會推動磁性奈米流體,俾於第二腔體中形成一小段氣體推一小段磁性奈米流體之氣液相共存傳輸單元(亦即,本實施例之傳輸流道係位於第二腔體中),而設置於外管外側之磁場產生單元可產生橫向穿過該傳輸流道之磁場(即,該磁場垂直於氣液相傳輸單元傳輸方向),以增加局部磁場,提高傳輸單元中磁性奈米流體之熱傳導係數,其中,為提昇工作流體蒸發量,蒸發部較佳係使用密度較密之毛細結構;而後,當傳輸單元流至冷凝部時,冷凝後之液體會沿著內管內壁上之毛細結構流回至蒸發部,並沖刷蒸發時殘留於蒸發部上毛細結構之磁性奈米粒子。Accordingly, when the magnetic nanofluid in the evaporation portion of the heat sink is heated and vaporized, the high pressure vapor pushes the magnetic nanofluid, and a small gas is formed in the second cavity to push a small amount of magnetic nanofluid gas. a liquid phase coexisting transmission unit (that is, the transport flow path of the embodiment is located in the second cavity), and the magnetic field generating unit disposed outside the outer tube can generate a magnetic field transversely passing through the transport flow path (ie, the The magnetic field is perpendicular to the transmission direction of the gas-liquid phase transport unit) to increase the local magnetic field and increase the heat transfer coefficient of the magnetic nanofluid in the transmission unit. Among them, in order to increase the evaporation amount of the working fluid, the evaporation portion preferably uses a dense density capillary structure. Then, when the transfer unit flows to the condensing portion, the condensed liquid flows back to the evaporation portion along the capillary structure on the inner wall of the inner tube, and washes the magnetic nanoparticles remaining in the capillary structure on the evaporation portion during evaporation.

試驗例1Test example 1

將佔裝置總體積之50體積百分比之水充填於習知單管式熱管(如圖1A所示)中,而佔裝置總體積之50體積百分比之磁性奈米流體(濃度約為8emu/g)充填於具有噴嘴結構且蒸發氣相/高溫液相與冷凝液於不同流道流動之散熱裝置中,於20W至60W之熱傳功率下比較熱阻,其結果如圖6所示。其中,RMF 係指具有噴嘴結構之散熱裝置充填磁性奈米流體之熱阻,Rwater 則係指單管式熱管充填水之熱阻。此外,該磁性奈米流體係使用水及粒徑小於10 nm之四氧化三鐵奈米粒子分別作為液態流體及磁性奈米粒子。Filling 50% by volume of the total volume of the device into a conventional single-tube heat pipe (as shown in Figure 1A), and accounting for 50% by volume of the total volume of the magnetic nanofluid (concentration is about 8emu/g) The heat resistance is compared in a heat sink having a nozzle structure and an evaporating gas phase/high temperature liquid phase and a condensate flowing in different flow paths, and the heat resistance is compared under a heat transfer power of 20 W to 60 W, and the results are shown in FIG. 6 . Among them, R MF refers to the thermal resistance of the heat sink filled with magnetic nozzles, and R water refers to the thermal resistance of the single tube heat pipe filling water. In addition, the magnetic nanoflow system uses water and triiron tetroxide particles having a particle diameter of less than 10 nm as the liquid fluid and the magnetic nanoparticle, respectively.

如圖6所示,充填磁性奈米流體之散熱裝置的熱阻皆小於充填水之散熱裝置的熱阻。由此可知,將磁性奈米流體充填於本發明具有噴嘴結構且蒸發氣相/高溫液相與冷凝液於不同流道流動之散熱裝置中確實可展現較佳之熱傳導效果。As shown in FIG. 6, the heat resistance of the heat sink filled with the magnetic nanofluid is smaller than the heat resistance of the heat sink filling the water. It can be seen that the magnetic nanofluid is filled in the heat dissipating device having the nozzle structure of the present invention and the evaporating gas phase/high temperature liquid phase and the condensate flowing in different flow channels can indeed exhibit a better heat conduction effect.

試驗例2Test example 2

分別將不同濃度之磁性奈米流體(濃度約為1.6×10-2 emu/g與4 emu/g)充填於具有噴嘴結構之散熱裝置中,並於不同外加磁場強度下,與水充填於習知單管式熱管(如圖1A所示)中之熱傳導係數進行比較,其結果如圖7所示。其中,KMF 係指具有噴嘴結構之散熱裝置充填磁性奈米流體之熱傳導係數,Kwater 係指單管式熱管充填水之熱傳導係數。此外,該磁性奈米流體係使用水及粒徑小於10 nm之四氧化三鐵奈米粒子分別作為液態流體及磁性奈米粒子。如圖78所示,磁場強度為1000 Oe至3000 Oe時,充填磁性奈米流體之散熱裝置的熱傳導係數優於充填水之散熱裝置,而磁性奈米流體濃度為4 emu/g且磁場強度為2000 Oe時則可展現最佳之熱傳導性質,其熱傳導係數約為水的3.7倍。Different concentrations of magnetic nanofluids (concentrations of about 1.6×10 -2 emu/g and 4 emu/g) were respectively filled in a heat sink with a nozzle structure, and filled with water under different applied magnetic field strengths. The heat transfer coefficient in the single-tube heat pipe (shown in Fig. 1A) is compared, and the results are shown in Fig. 7. Among them, K MF refers to the heat transfer coefficient of the magnetic nano-fluid filled with the heat sink of the nozzle structure, and K water refers to the heat transfer coefficient of the single-tube heat pipe filling water. In addition, the magnetic nanoflow system uses water and triiron tetroxide particles having a particle diameter of less than 10 nm as the liquid fluid and the magnetic nanoparticle, respectively. As shown in Fig. 78, when the magnetic field strength is 1000 Oe to 3000 Oe, the heat transfer coefficient of the heat sink filled with the magnetic nanofluid is better than that of the water-filled heat sink, and the magnetic nanofluid concentration is 4 emu/g and the magnetic field strength is At 2000 Oe, the best thermal conductivity is exhibited, and its heat transfer coefficient is about 3.7 times that of water.

11...封閉管體11. . . Closed pipe

13,43...毛細結構13,43. . . Capillary structure

14,24,34...工作流體14,24,34. . . Working fluid

21...封閉式迴路管twenty one. . . Closed loop tube

31...多迴路式管體31. . . Multi-circuit tube

41...外管41. . . Outer tube

42...內管42. . . Inner tube

421...開孔421. . . Opening

44...磁性奈米流體44. . . Magnetic nanofluid

441...液態流體441. . . Liquid fluid

442...磁性奈米粒子442. . . Magnetic nanoparticle

45...磁場產生單元45. . . Magnetic field generating unit

46...感應線圈46. . . Induction coil

51...電力裝置51. . . Power device

A...第一腔體A. . . First cavity

A1...傳輸流道A1. . . Transport channel

A2,B3...容置部A2, B3. . . Housing

B...第二腔體B. . . Second cavity

B1...蒸發部B1. . . Evaporation department

B2...冷凝部B2. . . Condensation

圖1A係習知單管式熱管之示意圖。Figure 1A is a schematic view of a conventional single tube heat pipe.

圖1B係習知迴路式熱管之示意圖。Figure 1B is a schematic view of a conventional loop heat pipe.

圖1C係習知迴路脈衝式熱管之示意圖。Figure 1C is a schematic diagram of a conventional loop pulse type heat pipe.

圖2係本發明一較佳實施例之散熱裝置示意圖。2 is a schematic view of a heat sink according to a preferred embodiment of the present invention.

圖3係本發明另一較佳實施例之散熱裝置示意圖。3 is a schematic view of a heat sink according to another preferred embodiment of the present invention.

圖4係本發明另一較佳實施例之散熱裝置示意圖。4 is a schematic view of a heat sink according to another preferred embodiment of the present invention.

圖5係本發明另一較佳實施例之散熱裝置示意圖。FIG. 5 is a schematic diagram of a heat sink according to another preferred embodiment of the present invention.

圖6係具有噴嘴結構之散熱裝置充填磁性奈米流體及單管式熱管充填水於不同熱傳功率下之熱阻比較圖。Fig. 6 is a comparison diagram of thermal resistance of a heat sink filled with a nozzle structure filled with a magnetic nanofluid and a single-tube heat pipe filled with water at different heat transfer powers.

圖7係具有噴嘴結構之散熱裝置充填不同濃度磁性奈米流體及單管式熱管充填水於不同磁場強度下之熱傳導係數比較圖。Fig. 7 is a comparison diagram of heat transfer coefficients of different concentrations of magnetic nano-fluids and single-tube heat pipe filling water with different heat-dissipating devices having a nozzle structure under different magnetic field strengths.

41...外管41. . . Outer tube

42...內管42. . . Inner tube

421...開孔421. . . Opening

43...毛細結構43. . . Capillary structure

44...磁性奈米流體44. . . Magnetic nanofluid

441...液態流體441. . . Liquid fluid

442...磁性奈米粒子442. . . Magnetic nanoparticle

45...磁場產生單元45. . . Magnetic field generating unit

A...第一腔體A. . . First cavity

A1...傳輸流道A1. . . Transport channel

A2...容置部A2. . . Housing

B...第二腔體B. . . Second cavity

B1...蒸發部B1. . . Evaporation department

B2...冷凝部B2. . . Condensation

Claims (17)

一種散熱裝置,包括:一外管;一內管,係設置於該外管內,其中該內管之內部空間構成一第一腔體,而該內管與該外管間之空間則構成一第二腔體,且該散熱裝置之兩端分別為一蒸發部及一冷凝部,該內管之兩端壁上具有複數個開孔,以使該第一腔體與該第二腔體互相連通;以及一磁性奈米流體,係填充於該第一腔體及該第二腔體中,其中該磁性奈米流體包括一液態流體及複數個磁性奈米粒子。 A heat dissipating device includes: an outer tube; an inner tube disposed in the outer tube, wherein an inner space of the inner tube constitutes a first cavity, and a space between the inner tube and the outer tube constitutes a a second cavity, and the two ends of the heat dissipating device are respectively an evaporation portion and a condensation portion, the end walls of the inner tube have a plurality of openings, so that the first cavity and the second cavity are mutually And a magnetic nanofluid filled in the first cavity and the second cavity, wherein the magnetic nanofluid comprises a liquid fluid and a plurality of magnetic nanoparticles. 如申請專利範圍第1項所述之散熱裝置,更包括:一毛細結構,係披覆於該第二腔體之內壁上,且該磁性奈米流體係於一傳輸流道中產生一氣液相共存之傳輸單元,而該傳輸流道係於該第一腔體中。 The heat dissipating device of claim 1, further comprising: a capillary structure covering the inner wall of the second cavity, and the magnetic nano flow system generates a gas phase in a transport channel A coexisting transmission unit, and the transport channel is in the first cavity. 如申請專利範圍第1項所述之散熱裝置,更包括:一毛細結構,係披覆於該第一腔體之內壁上,且該磁性奈米流體係於一傳輸流道中產生一氣液相共存之傳輸單元,而該傳輸流道係於該第二腔體中。 The heat dissipating device of claim 1, further comprising: a capillary structure covering the inner wall of the first cavity, and the magnetic nano flow system generates a gas phase in a transport flow path A coexisting transmission unit, and the transport channel is in the second cavity. 如申請專利範圍第1項所述之散熱裝置,其中,該些磁性奈米粒子於該液態流體中之濃度為1.6×10-2 emu/g至8emu/g。The heat dissipating device according to claim 1, wherein the magnetic nanoparticles have a concentration in the liquid fluid of from 1.6×10 -2 emu/g to 8 emu/g. 如申請專利範圍第1項所述之散熱裝置,其中,該些磁性奈米粒子之粒徑小於10nm。 The heat dissipating device according to claim 1, wherein the magnetic nanoparticles have a particle diameter of less than 10 nm. 如申請專利範圍第1項所述之散熱裝置,其中,該液態流體係選自由水、油、丙酮、癸烯、乙二醇、氟化液及其混合物所組成之群組。 The heat sink according to claim 1, wherein the liquid flow system is selected from the group consisting of water, oil, acetone, decene, ethylene glycol, fluorinated liquid, and mixtures thereof. 如申請專利範圍第1項所述之散熱裝置,其中,該些磁性奈米粒子為三氧化二鐵奈米粒子、四氧化三鐵奈米粒子或其混合物。 The heat dissipating device according to claim 1, wherein the magnetic nanoparticles are iron oxide nanoparticles, triiron tetroxide particles or a mixture thereof. 如申請專利範圍第1項所述之散熱裝置,其中,該磁性奈米流體之充填量為裝置總體積之30至50體積百分比。 The heat sink of claim 1, wherein the magnetic nanofluid is filled in an amount of 30 to 50 volume percent of the total volume of the device. 如申請專利範圍第2項或第3項所述之散熱裝置,其中,該蒸發部處之該毛細結構密度高於該冷凝部處之該毛細結構密度。 The heat sink of claim 2, wherein the capillary structure density at the evaporation portion is higher than the capillary structure density at the condensation portion. 如申請專利範圍第2項或第3項所述之散熱裝置,其中,該毛細結構為絲網結構、溝槽結構、燒結結構、纖維結構或蝕刻結構。 The heat dissipating device of claim 2, wherein the capillary structure is a mesh structure, a groove structure, a sintered structure, a fiber structure or an etched structure. 如申請專利範圍第2項所述之散熱裝置,更包括:一磁場產生單元,係設置於該內管之外圍或該內管中,且該磁場產生單元所產生之磁場係橫向穿過該傳輸流道。 The heat dissipation device of claim 2, further comprising: a magnetic field generating unit disposed in a periphery of the inner tube or in the inner tube, and the magnetic field generated by the magnetic field generating unit is transversely transmitted through the transmission Flow path. 如申請專利範圍第11項所述之散熱裝置,其中,該第一腔體包括一容置部,其係位於該傳輸流道之外側,且該磁場產生單元係設置於該容置部中。 The heat dissipation device of claim 11, wherein the first cavity includes a receiving portion located on an outer side of the transport flow path, and the magnetic field generating unit is disposed in the receiving portion. 如申請專利範圍第3項所述之散熱裝置,更包括:一磁場產生單元,係設置於該內管之外圍,且該磁場產生單元所產生之磁場係橫向穿過該傳輸流道。 The heat dissipating device of claim 3, further comprising: a magnetic field generating unit disposed on a periphery of the inner tube, and the magnetic field generated by the magnetic field generating unit is transversely passed through the transport flow path. 如申請專利範圍第11項或第13項所述之散熱裝置,其中,該第二腔體包括一容置部,其係位於該傳輸流道之外側,且該磁場產生單元係設置於該容置部中。 The heat dissipation device of claim 11, wherein the second cavity comprises a receiving portion located on an outer side of the transport flow path, and the magnetic field generating unit is disposed in the space Set in the department. 如申請專利範圍第11項或第13項所述之散熱裝置,其中,該磁場產生單元係設置於該外管之外側。 The heat sink according to claim 11 or 13, wherein the magnetic field generating unit is disposed on an outer side of the outer tube. 如申請專利範圍第11項或第13項所述之散熱裝置,其中,該磁場產生單元於該傳輸流道處所產生之磁場強度為1000 Oe至4000 Oe。 The heat dissipating device of claim 11, wherein the magnetic field generating unit generates a magnetic field intensity of 1000 Oe to 4000 Oe at the transport flow path. 如申請專利範圍第11項或第13項所述之散熱裝置,更包括:一感應線圈,係設置於該外管之外圍。 The heat dissipation device of claim 11 or 13, further comprising: an induction coil disposed on a periphery of the outer tube.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220169904A1 (en) * 2019-05-28 2022-06-02 Volvo Truck Corporation System and Method for Charge Induced Monofunctionalized Nanofluid Heat Transfer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566675B (en) * 2013-08-12 2017-01-11 宏碁股份有限公司 Cycling heat dissipation module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796557A (en) * 1980-12-08 1982-06-15 Toshiba Corp Cooling supporting base for semiconductor substrate
JPS57108593A (en) * 1980-12-25 1982-07-06 Inoue Japax Res Inc Heat pipe
JPH0814779A (en) * 1994-06-30 1996-01-19 Sharp Corp Heat pipe
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US20040000150A1 (en) * 2001-07-02 2004-01-01 Symko Orest G. High frequency thermoacoustic refrigerator
TWI246579B (en) * 2004-03-12 2006-01-01 Hon Hai Prec Ind Co Ltd Heat pipe
TWI259569B (en) * 2005-06-09 2006-08-01 Ind Tech Res Inst Micro channel heat sink driven by hydromagnetic wave pump
CN100425935C (en) * 2004-03-02 2008-10-15 鸿富锦精密工业(深圳)有限公司 Heat pipe
TWM353625U (en) * 2008-08-28 2009-03-21 Wen-Chi Liao Heat guide pipe
TW200923309A (en) * 2007-11-22 2009-06-01 Everlight Electronics Co Ltd Heat transfer apparatus, heat pipe and method of transferring heat

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796557A (en) * 1980-12-08 1982-06-15 Toshiba Corp Cooling supporting base for semiconductor substrate
JPS57108593A (en) * 1980-12-25 1982-07-06 Inoue Japax Res Inc Heat pipe
JPH0814779A (en) * 1994-06-30 1996-01-19 Sharp Corp Heat pipe
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US20040000150A1 (en) * 2001-07-02 2004-01-01 Symko Orest G. High frequency thermoacoustic refrigerator
CN100425935C (en) * 2004-03-02 2008-10-15 鸿富锦精密工业(深圳)有限公司 Heat pipe
TWI246579B (en) * 2004-03-12 2006-01-01 Hon Hai Prec Ind Co Ltd Heat pipe
TWI259569B (en) * 2005-06-09 2006-08-01 Ind Tech Res Inst Micro channel heat sink driven by hydromagnetic wave pump
TW200923309A (en) * 2007-11-22 2009-06-01 Everlight Electronics Co Ltd Heat transfer apparatus, heat pipe and method of transferring heat
TWM353625U (en) * 2008-08-28 2009-03-21 Wen-Chi Liao Heat guide pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220169904A1 (en) * 2019-05-28 2022-06-02 Volvo Truck Corporation System and Method for Charge Induced Monofunctionalized Nanofluid Heat Transfer

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