M353624 八、新型說明： 【新型所屬之技術領域】 本新型涉及平面顯示器、電腦、大功率雷射二極體或電源供應器等發熱設 備的散熱結構’具體提供—種高效能風道散熱結構，屬於國際專利分類 G06F1/20「數據處理設備的冷卻方法」'丽L23/34「半導體或其它固態器 件零部件的冷卻裝置、通風裝置」技術領域。 【先前技術】 現今平面顯示器 '電腦、大功率雷射二極體或電源供應器等設備逐年提高 了使用功率。但大功率所產生的熱量未適當排除時，容易因過熱而降低性 能或損壞裝置。以大型平面顯示器的發光模組為例，該發光二極體平行排 列於平面面板及反射底板之間，隨著平面顯示器的面板逐漸增大，發光二 極體的數量也不斷提升’在大功率運作下累積大量熱能，溫度不斷上升的 發光體亮度會隨著產生色溫變化與光度降低，因此若熱量無法有效傳導至 外界時，就會造成平面顯示面板的溫度差異過大，嚴重影響顯示效果與顯 示器性能。 現有技術中一般顯示器或電腦等設備的散熱方式，種類較多，大部分使用 散熱風扇加速其熱對流，再從外殼體鰭片狀散熱面將熱量釋放出來。因此 有不同結構的散熱設計，以滿足背光模組或中央處理器的散熱需求，例 如：US 2006132699、JP2006222254 及 KR2005003751 等專利中公開的內 容。然而，上述專利皆會有散熱風扇高速轉動而產生大噪音的缺點。 【新型内容】 針對上述現有技術中的不足’本新型的目的’在於提供一種設備可使平面 5 M3 5 3 624 顯示器或電腦等提高空氣流動，散熱良好的高效能風道散熱結構。 本新型的目的是通過以下技術方案實現的。 一種高效能風道散熱結構，包括前集熱體、集熱通道、氣流通道腔體及後 散熱體。該裝置的組合是由平面顯示器發光模組、電腦中央處理器或其他 發熱元件緊密連接前集熱體，前集熱體另一端連接集熱通道，集熱通道後 端連接後散熱體。後散熱體置於氣流通道腔體內的下方，後散熱體包括後 . 散熱板和鰭狀散熱片，鰭狀散熱片均勻排佈於後散麵上。該氣流通道， 、 為前集熱體與後散熱體之間的隔熱層所包圍形成上下開口的腔體空間。集 I 熱通道除前後開口以連結前集熱體及後散熱體外，皆由隔熱材料層填滿， 使後段散熱單元體被隔離於上下開口的氣流通道下方，使熱流只經由前段 集熱體與後段散熱單元體間的集熱通道所傳導。 應用於電腦中央處理器散熱的情況，是由設在電路基板上的中央處理器及 其他發熱元件如顯卡連接集熱管一端，集熱管的另一端再與前集熱體前端 連接’前集熱體的後端與集熱通道連接，集熱通道連接其餘的設置及連接 方式同上段說明。 各單元詳細描述如下：發熱元件連接的集熱管，由高導熱金屬材料或金屬 g 熱管製作，其形狀可為條狀體或管狀體。前集熱體由高導熱金屬材料或鑽 石鍍膜金屬製作，其形狀可為板狀體。集熱通道可由致冷晶片(Thermo-• electric chip) '鑽:Ηϋ、鑽石鍍膜金屬、碳化矽或金屬等高導熱材料製成。 集熱通道的尺寸大小可依實際熱排放量調整。隔熱層腔體是由隔熱材料製 成’置於前集熱體與後散熱板的之間，及包圍氣流通道形成上下開口方 型'扁平管狀或圓管型的腔體空間。後散熱體上的鰭狀散熱片為上下平行 排列的鰭狀散熱片，其組成可用鋁或銅材料製成。後散熱板的面積可依排 熱需求不同進行調整。 因此本新型的設計，可不使用風扇、無噪音的情況下，排放多餘熱量，避 免精密設備因過熱而降低性能或損壞的散熱結構。 6 M353624 【實施方式】 有關本新型之前述及其他技術內容、特點與功效，在以下配合參考圖式之 較佳實施例的詳細說明中，將可清楚的呈現。 實施例1:本新型結構應用於平面顯示器散熱的情況。 以平面顯示器發光背光模組11的散熱為例，本新型結構可在不使用風扇 條件下，使背光模組11在穩定溫度的狀態下工作。 參見圖1、圖2及圖4，該散熱結構設於一平面顯示器背光模組11的後方， 散熱模組包括前段集熱體21、隔熱層腔體3含隔熱層腔體之前隔熱層31 及隔熱層腔體之背板32、集熱通道4、上下開口氣流通道6、後散熱體5 含後散熱板51與鰭狀散熱片52 〇 具體的散熱方式：平面顯示器背光模組11背面與前段集熱體21用散熱膏 貼合固定。在前集熱體21的另一面上用散熱膏貼合集熱通道4的前端面， 在集熱通道4的另一端上用散熱膏貼合固定於後散熱板51。前段集熱體 21與後段散熱單元體5中間，除集熱通道4外皆使用隔熱層31填滿隔開。 另外，後散熱體的兩側面與背面也由隔熱層腔體之背板32組成，其目的 是使後散熱體被隔離在上下開□氣流通道6内，熱流只經由集熱通道4控 制通過。該集熱通道4使用致冷晶片吸引前段集熱體21的熱量，同時將 熱量排往後段散熱板51與鰭狀散熱片52。 上述排放的熱量使後散熱板51及鰭狀散熱片52的溫度提高。因鰭狀散熱 片52置於有上下開口氣流通道6的內部下方，氣體經鰭片52加熱後膨脹， 形成熱氣流快速上升，由頂部開口 62排出。同時產生一定的真空度，吸 引下部冷空氣由進氣口 61進入通道內。冷空氣經由上下平行排列的鰭片 52再加熱排放，使氣體自動循環流動，因而達到了排出熱量的目的。 實施例2:本新型結構應用於電腦中央處理器及其他發熱元件散熱的情 況。 7 M353624 本新型在不使用風扇條件下’可使中央處理器及其他發熱元件在穩定溫度 的狀態下工作。參見圖3 ’散熱結構包含有：前集熱管22、前集熱體21、 隔熱層腔體3含隔熱層腔體之前隔熱層3丨及隔熱層腔體之背板32、集熟 通道4、上下開□氣流通道6、後散熱體5含後散熱板51與鰭狀散熱片 52。 散熱的步驟如下：中央處理器12的發熱背面與前集熱熱管22用散熱膏貼 合固定，在前集熱熱管22的另一端面上用散熱膏貼合集熱通道4的前端 面，在集熱通道4的另一端上用散熱膏貼合固定於後散熱板51。後段散熱 單元體前，除集熱通道4外均使用隔熱層腔體之前隔熱層3 i隔開。由隔 熱層腔體3組成的上下開口氣流通道6，其目的是使後散熱體被隔離在 内。熱流只經由集熱通道4控制，該集熱通道4使用致冷晶片吸收前集熱 熱管22的熱量。因而前集熱熱管22的熱量可快速排往後散熱板51與鰭 狀散熱片52，使後散熱板51及鰭狀散熱片52的溫度提高。由於散熱鰭片 52置於有上下開口氣流通道6的內部下方，氣體經鰭狀散熱片π的加熱 後膨脹，形成熱氣流快速上升，由頂部的開口 62排出。同時，產生一定 的真空度，吸引下部冷空氣由進氣口 61進入上下開口氣流通道6內，冷 空氣經由上下平行排列的鰭片52再加熱排放，因此氣體自動循環流動達 到排除熱量之目地。 綜上所述，本新型的散熱結構及散熱方式的小結如下：平面顯示器、電腦 或工業設備發熱體等與前集熱體用散熱膏接合固定，在前集熱體的另一面 上用散熱膏接合固定於集熱通道前端面。在集熱通道的另一端面用散熱膏 接合固定於後散熱板，前集熱體的熱量由集熱通道排往後散熱板與鰭片， 熱量使後散熱板及接觸鰭片的溫度提高。因該散熱鰭片置於有上下開口氣 流通道内下方，氣體經鰭狀散熱片加熱後澎漲形成熱氣流上升由頂部排氣 開口排出，同時吸引下部冷空氣由進氣口進入，達到氣體自行流動排除熱 量之目地。 8 M353624 惟以上所述者，僅為本新型之較佳實施例而已，當不能以此限定本新型實 施之範圍，即大凡依本新型申請專利範圍及新型說明內容所作之簡單的等 效變化與修飾，皆仍屬本新型專利涵蓋之範圍內。 【圖式簡單說明】 - 圖1為本新型散熱結構的分解組裝示意圖。 、 圖2為平面顯示器散熱結構的橫向剖面圖。 g 圖3為電腦散熱結構的橫向剖面圖。 圖4為散熱結構的俯視剖面圖。 圖5為上下開口氣流通道型式的舉例圖。 【主要元件符號說明】 圖中符號說明： g 11-平面顯示器發光模組，12-中央處理器，13-電路基板，14-基座；21-前 集熱體，22-集熱管，3-隔熱層腔體，31.熱層腔體之前隔熱層，32_隔熱 ' 層腔體之背板，4-集熱通道，5、後散熱體，51-後散熱板，52-鰭狀散熱 片，6-上下開口氣流通道’ 61-下部氣流進氣□，62-上部氣流排氣口，63-方型上下開口氣流通道，64-圓管型上下開口氣流通道，65-扁平管狀上 下開□氣流通道，7-機箱外殼。 9M353624 VIII. New Description: [New Technology Field] The new type relates to a heat dissipation structure of a heating device such as a flat panel display, a computer, a high-power laser diode or a power supply, and specifically provides a high-efficiency air duct heat dissipation structure. It belongs to the international patent classification G06F1/20 "Cooling method for data processing equipment" - Li L23/34 "Cooling device and ventilation device for semiconductor or other solid-state device parts". [Prior Art] Today's flat panel displays, such as computers, high-power laser diodes or power supplies, have increased their power use year by year. However, when the heat generated by high power is not properly removed, it is easy to reduce performance or damage the device due to overheating. Taking a light-emitting module of a large flat-panel display as an example, the light-emitting diodes are arranged in parallel between the flat panel and the reflective bottom plate. As the panel of the flat-panel display is gradually increased, the number of the light-emitting diodes is also continuously increased. Accumulating a large amount of heat energy under operation, the brightness of the illuminating body with increasing temperature will change with the color temperature and the luminosity. Therefore, if the heat cannot be effectively transmitted to the outside world, the temperature difference of the flat display panel will be too large, which will seriously affect the display effect and the display. performance. In the prior art, a general display or a computer or the like has a plurality of heat dissipation methods, and most of them use a heat dissipation fan to accelerate the heat convection, and then release heat from the finned heat dissipation surface of the outer casing. Therefore, there are different structures of heat dissipation design to meet the heat dissipation requirements of the backlight module or the central processing unit, such as those disclosed in patents such as US 2006132699, JP2006222254 and KR2005003751. However, the above patents all have the disadvantage that the cooling fan rotates at a high speed to generate a large noise. [New content] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a high-efficiency air duct heat-dissipating structure in which a device can be used to improve the air flow and heat dissipation of a flat surface or a computer. The purpose of the novel is achieved by the following technical solutions. A high-efficiency air duct heat dissipation structure includes a front heat collector, a heat collecting passage, an air flow passage cavity, and a rear heat sink. The combination of the device is closely connected to the front heat collector by the flat panel display lighting module, the computer central processing unit or other heating elements, the other end of the front heat collecting body is connected to the heat collecting channel, and the rear end of the heat collecting channel is connected to the heat collecting body. The rear heat sink is disposed below the airflow passage cavity, and the rear heat sink includes a rear heat sink and a fin heat sink, and the fin heat sink is evenly arranged on the rear surface. The air flow passage is surrounded by a heat insulating layer between the front heat collecting body and the rear heat sink to form a cavity space of the upper and lower openings. The I heat channel is filled with the heat insulating material layer except for the front and rear openings to connect the front heat collecting body and the rear heat radiating body, so that the rear heat radiating unit body is isolated under the air flow channel of the upper and lower openings, so that the heat flow only passes through the front stage heat collecting body. Conducted by the heat collecting channel between the rear heat dissipating unit body. The heat dissipation applied to the central processing unit of the computer is connected to the central end of the heat collecting tube by a central processing unit and other heating elements disposed on the circuit board, and the other end of the heat collecting tube is connected to the front end of the front heat collecting body. The rear end is connected to the heat collecting channel, and the remaining settings and connection manners of the heat collecting channel are the same as those in the above paragraph. Each unit is described in detail as follows: The heat collecting tube to which the heating element is connected is made of a highly thermally conductive metal material or a metal g heat pipe, and may be in the form of a strip or a tubular body. The front heat collector is made of a highly thermally conductive metal material or a diamond coated metal, and its shape may be a plate-like body. The heat collecting channel can be made of a high thermal conductive material such as a Thermo-• electric chip 'drill: Ηϋ, diamond coated metal, tantalum carbide or metal. The size of the heat collecting channel can be adjusted according to the actual heat discharge. The heat insulating layer cavity is made of a heat insulating material. It is placed between the front heat collecting body and the rear heat radiating plate, and surrounds the air flow passage to form a cavity type of a flat tubular or circular tube type. The fin fins on the rear heat sink are fin fins arranged in parallel above and below, and the composition thereof may be made of aluminum or copper material. The area of the rear heat sink can be adjusted according to the heat demand. Therefore, the design of the new model can discharge excess heat without using a fan or noise, and avoid the performance of the precision equipment or the damaged heat dissipation structure due to overheating. 6 M353624 [Embodiment] The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Embodiment 1: The novel structure is applied to the case of heat dissipation of a flat panel display. Taking the heat dissipation of the flat panel display illumination backlight module 11 as an example, the novel structure can operate the backlight module 11 under a stable temperature without using a fan. Referring to FIG. 1 , FIG. 2 and FIG. 4 , the heat dissipation structure is disposed at the rear of a flat panel display backlight module 11 , and the heat dissipation module includes a front heat collecting body 21 and a heat insulating layer cavity 3 including a heat insulating layer cavity. The back layer 32 of the layer 31 and the heat insulation layer cavity, the heat collecting channel 4, the upper and lower open air flow channels 6, and the rear heat sink 5 include the rear heat sink 51 and the fin heat sink 52. Specific heat dissipation mode: flat display backlight module 11 The back surface and the front stage heat collector 21 are fixed by heat-dissipating paste. The front end surface of the heat collecting passage 4 is bonded to the other surface of the front heat collecting body 21 with a heat-dissipating paste, and is fixed to the rear heat radiating plate 51 by heat-dissipating paste on the other end of the heat collecting passage 4. The front stage heat collecting body 21 and the rear stage heat radiating unit body 5 are filled and separated by the heat insulating layer 31 except for the heat collecting passage 4. In addition, the two sides and the back surface of the rear heat sink are also composed of the back plate 32 of the heat insulating layer cavity, and the purpose thereof is to isolate the rear heat sink from the upper and lower open air flow passages 6, and the heat flow is controlled only through the heat collecting passage 4. . The heat collecting passage 4 uses the refrigerant chip to suck the heat of the front stage heat collector 21 while discharging the heat to the rear stage heat radiating plate 51 and the fin fins 52. The heat discharged as described above increases the temperature of the rear heat sink 51 and the fin fins 52. Since the fin fins 52 are placed under the inside of the upper and lower open air passages 6, the gas is heated by the fins 52 to expand, and the hot airflow is rapidly increased, and is discharged from the top opening 62. At the same time, a certain degree of vacuum is generated, and the lower cold air is sucked into the passage from the intake port 61. The cold air is reheated and discharged through the fins 52 arranged in parallel above and below, so that the gas is automatically circulated, thereby achieving the purpose of discharging heat. Embodiment 2: The novel structure is applied to the heat dissipation of a computer central processing unit and other heat generating components. 7 M353624 This new model allows the central processing unit and other heating elements to operate at a stable temperature without the use of a fan. Referring to FIG. 3 'the heat dissipation structure includes: the front heat collecting tube 22, the front heat collecting body 21, the heat insulating layer cavity 3, the heat insulating layer cavity 3, and the backing plate 32 of the heat insulating layer cavity, and the set The cooked channel 4, the upper and lower open air flow channels 6, and the rear heat sink 5 include a rear heat sink 51 and a fin fin 52. The heat dissipating step is as follows: the heat generating back surface of the central processing unit 12 and the front heat collecting heat pipe 22 are fixed and fixed by the heat dissipating paste, and the front end surface of the heat collecting channel 4 is attached to the other end surface of the front heat collecting heat pipe 22 with the heat dissipating paste. The other end of the hot runner 4 is fixed to the rear heat sink 51 by a heat-dissipating paste. Before the rear heat dissipation unit body, except for the heat collecting channel 4, the heat insulating layer cavity is used to separate the insulating layer 3 i. The upper and lower open air flow passages 6 composed of the heat insulating layer cavity 3 are intended to isolate the rear heat sink. The heat flow is controlled only by the heat collecting passage 4 which uses the heat of the front heat collecting tubes 22 to absorb the heat of the heat collecting tubes 22. Therefore, the heat of the front heat collecting tube 22 can be quickly discharged to the rear heat sink 51 and the fin heat sink 52, so that the temperature of the rear heat sink 51 and the fin heat sink 52 is increased. Since the heat radiating fins 52 are placed under the inside of the upper and lower open air flow passages 6, the gas is expanded by heating of the fin fins π, and the hot air current is rapidly increased, and is discharged from the opening 62 at the top. At the same time, a certain degree of vacuum is generated, and the lower cold air is sucked into the upper and lower open air flow passages 6 from the air inlet 61, and the cold air is reheated and discharged through the fins 52 arranged in parallel above and below, so that the gas automatically circulates to the point of eliminating heat. In summary, the summary of the heat dissipation structure and the heat dissipation method of the present invention is as follows: a flat display, a heating element of a computer or an industrial device is bonded and fixed with a heat sink of a front heat collector, and a heat sink is used on the other side of the front heat collector. The joint is fixed to the front end surface of the heat collecting passage. The other end surface of the heat collecting channel is fixed to the rear heat dissipating plate by a heat dissipating paste, and the heat of the front heat collecting body is discharged from the heat collecting channel to the rear heat dissipating plate and the fin, and the heat increases the temperature of the rear heat dissipating plate and the contact fin. Because the heat dissipating fins are placed in the upper and lower open airflow passages, the gas is heated by the fin fins to form a hot air flow, which is discharged from the top exhaust opening, and attracts the lower cold air to enter the air inlet to reach the gas itself. Flow to remove heat. 8 M353624 However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change made by the novel patent application scope and the new description content is Modifications are still within the scope of this new patent. [Simple description of the diagram] - Figure 1 is a schematic exploded view of the new heat dissipation structure. 2 is a transverse cross-sectional view of the heat dissipation structure of the flat display. g Figure 3 is a transverse cross-sectional view of the computer's heat dissipation structure. 4 is a top cross-sectional view of the heat dissipation structure. Fig. 5 is a view showing an example of an upper and lower open air flow passage pattern. [Main component symbol description] Symbol description in the figure: g 11-flat display illumination module, 12-central processor, 13-circuit substrate, 14-base; 21-front collector, 22-collector, 3- Insulation cavity, 31. Thermal layer cavity before insulation, 32_insulation 'layer cavity back plate, 4-heat collecting channel, 5, rear heat sink, 51- rear heat sink, 52-fin Heat sink, 6-upper open air flow passage '61-lower air intake □, 62-upper air vent, 63-square upper and lower open air flow, 64-round type upper and lower open air flow, 65-flat tubular Open the airflow channel up and down, 7-case housing. 9