M350830 五、新型說明： 【新型所屬之技術領域】 ’尤指一種表面黏著型 本創作係有關一種發光二極] 的發光二極體。 【先前技術】 、目刖的&車保險絲都以電性連結於該汽車設備的控制 以確保該迴路所電性連結的設備不會因為汽車瞬 .Ζ啟動’或開關瞬間按下所產生的逆向大電流（突 唬）給燒毁。 由於較早被製造出來的汽車保險絲在連結於兩個導電 】片之間的熔絲燒斷後，從保險絲的殼體外觀是無法直接 ==因此在檢修時，維修者必須逐-的將每個保險 二：：將導致維修上費時、費工。為了使檢修或維 :’將車保險絲的兩個導電插片之間電性連結有-二：：：的發光二極體’當二導電插片之間電性連結的熔 斷日:’該電流就流過該發光二極體，使發光二極體被 險:的蘇Γ修者打開保險絲盒後’可以直接看到那一個保 '、、X、，-極體被點贵’即表示該保險絲的炼絲以燒 斷’以，於維修者維修或更換保險絲。 阻佶姓Γ連’在一個導電插片之間的發光二極體為低電 特性的凡件，所以瞬間流過發光二極體的電流過大 雷：a W又發光一極體，因此在發光二極體的兩個接腳 ==於該兩個導電插片之間時，將於發光二極體其一 接腳上串聯一高電阻值的電阻元件’以避免瞬間流過大電 3 M350830 流將發光二極體燒毀。雖麸， ^ ^ _ …、在發光二極體的接腳上串聯 一個尚電阻值的電阻元件， 1上甲聯 抓.a 了以確保發光二極體不被燒 毁，但是以此種連接方式 骰凡 r ^ 1 、勿以成製作上的麻煩。 【新型内容】 本創作之主要目的，在於 一種將電阻晶片與發光__^傳、，4缺失本創作提出 、 極體的發光晶片結合在一個封梦 -、纟σ構裡，以形成具有電阻料枓& π t 、 絲料*發光二極體封裝結構，只 要將該發光一極體封裝έ士播蕾w^ 癱实雪奸― 連結於汽車保險絲的兩個 w 等電插片之間，在該汽鱼枉a 飞單保險、、·糸的兩個導電插片之間 絲燒斷後，該發光二極體封梦姓 方之間的熔 ..^ 訂裝、，‘ϋ構可以承受大電流流過而 被點党。 為達上述之目的，本創作提供一種表面黏著型 二極體封裝結構，包括：BU ^ 基板、一晶片組、-導線組及 。-土板上具有四個角落區，該每個角落區上具 有一個電極層，該每個電極層兩端各具有延伸於該基板^ 鲁面及背面的四個正面電極及四個背面電極，該四個正面電 極向該基板中央處各自延伸有一導電線路。該晶片組由兩 個電阻晶片及兩個發光晶Η έ 士、 ^ V. 口知尤曰曰片組成，5亥兩個電阻晶片及兩個 發光晶片以相互斜對角錯開的固晶於導電線路的一端上。 再將該導線組電性連結於該其一的電阻晶片與發光晶片之 間，使該電阻晶片與該發光晶片呈電性串聯連接。該外罩 體設於該基板的正面，並封罩該複數個導電線路、電阻晶 片、發光晶片及導線組。 【實施方式】 4 M350830 兹有關本創作之技術内容及詳細說明，現配合圖式說 明如下： 請參閱第一、二圖，係本創作之表面黏著型的發光二 極體封裝結構外觀立體及另一面外觀立體示意圖。如圖所 不：本創作之表面黏著型的發光二極體封裝結構，該發光 一極體封裝結構1 〇，包括：一基板；[、一晶片組2、一導 .線組3及一外罩體4。 該基板1，為絕緣材質，該基板1上具有四個角落 •區，於母個角落區上各具有一個弧形的缺口 11，於每個缺 U上了透過韻刻或印刷技術成形有一金屬材質的電極層 12，該每個電極層12兩端各具有延伸於該基板丨正面的正 面電極121a、121b、121c、121d及背面的背面電極U2a、 122b、122c、122d。再於每個正面電極 i2la、121b、 121c、121d向該基板1中央處延伸有一導電線路i2ga、 123b、123c、123d。在本圖式中，該金屬材質為銅箔。 該晶片組2，由兩個電阻晶片21a、21b及兩個發光 ’晶片22a、22b組成’該兩個電阻晶片21a、2比以斜對 .角錯開的方式固晶於該兩個導電線路i23a、123c的一端 上。另，兩個發光晶片22a、22b也以斜對角錯開的方式 固晶在另兩個導電線路123b、123d的一端上。在本圖式 中，5亥電阻晶片21a、21b以作為限流電阻，以保護發光 晶片 22a 、22b 。 5亥導線組3，為金線材質，以電性連結於該電阻晶片 21a及發光晶片22b之間與該電阻晶片21b及發光晶片 5 •M350830 22a之間，使該電阻晶片21a與該發光晶片22b ，及該電 阻曰曰片21b與發光晶片22a呈電性串聯連接。 。玄外罩體4，為透明樹脂，以設於該基板丨正面，並 封罩該複數個導電線路123a、、123c、，電阻晶 片21a、21b，發光晶片22a、22b及導線組3上，以避 免電阻晶片21a、21b及發光晶片22a、2213受外物破 壞。同時，該外罩體4也形成該發光二極體封裝結構1〇的 透鏡。 藉由上述以完成一個有極性表面黏著型的發光二極體 封裝結構ίο。當施加電壓之正電壓於該背面電極122c，而 負電壓施加於該背面電極122d時，該電流流經電阻晶片 21a及發光晶片22b，使該發光晶片22b被點亮。 同樣地，g正電壓施加在該背面電極122a，而負電壓 施加在該背面電極122b時，該電流流經電阻晶片21b及發 光晶片22a ，使該發光晶片22a被點亮。 請參閱第三圖，係本創作之表面黏著型的發光二極體 封裝結構的等效電路示意圖。如圖所示：此圖所揭露的等 效電路，係由兩組線路組成。第一組線路由電阻晶片 與發光晶片22b串聯連接而成，而第二組線路由發光晶片 22a與電阻晶片21b串聯連接而成。 電 面 亮 極 電 〇 在該第一組線路的電阻晶片21a輸入端a(為前述背面 122c)施加正電壓及發光晶片22b輸出端β(為前述背 極122d)施加負電壓，即可使該發光晶片 在該第二組線路的電阻晶片21b輸入端B， 22b被點 為前述 6 M350830 背面電極122a)施加正電壓及發光晶片22a輸出端a， (為前述背面電極122b)施加負電壓，即可使該發光晶片 22a被點亮。因此，藉由前述之第一及二組線路以形成有 極性的發光二極體電路。 請參閱第四圖’係本創作之表面黏著型的發光二極體 封裝結構使用狀態示意圖。如圖所示：當發光二極體封裝 …構女裝於Ά車保險絲殼體2〇内部’以背面電極U2a、 122d與該汽車保險絲殼體2〇内部之右側導電插片電性 連結，另一邊的背面電極122b、122c與左側導電插片2〇2 電性連結後，使原本有極性之發光二極體封裝結構形成無 極性的發光二極體封裝結構。當流人過大電流由右側導電 插片2〇1或由左側導電插片2〇2流入，使連結在左、右侧 導電插片202、201之間保險絲（圖中未示）燒斷後，即 可使其-發光晶片22a $ 22b被點亮，使用者或維修者得 知保險絲已被燒斷，須更換汽車保險絲。M350830 V. New description: [New technical field] ‘especially a surface-adhesive type. This creation is related to a kind of light-emitting diode. [Prior Art], the witnessed & car fuses are electrically connected to the control of the car equipment to ensure that the equipment electrically connected to the circuit is not activated by the car's instant start or the switch is pressed momentarily. Reverse large currents (bursts) are burned. Since the fuse of the earlier manufactured car fuse is blown after the fuse connected between the two conductive sheets, the appearance of the housing from the fuse is not directly == Therefore, during maintenance, the repairer must Insurance 2:: Will result in time-consuming and labor-intensive maintenance. In order to make repairs or maintenance: 'The two conductive blades of the car fuse are electrically connected to each other - two::: light-emitting diodes' when the two conductive blades are electrically connected to each other: 'The current After flowing through the light-emitting diode, the light-emitting diode is in danger: the Susie repairer opens the fuse box and can directly see that one of the ', ', X, and - poles are expensive. The wire of the fuse is blown to repair or replace the fuse. The light-emitting diode between the conductive inserts is a low-electricity component, so the current flowing through the light-emitting diode instantaneously is too large: a W emits a polar body, so it emits light. Two pins of the diode == between the two conductive blades, a high-resistance resistance element is connected in series on one of the pins of the light-emitting diode to avoid instantaneous flow of the large power 3 M350830 flow Burn the LEDs. Although bran, ^ ^ _ ..., a resistor element with a resistance value is connected in series on the pin of the light-emitting diode, and the upper armor is caught by a. In order to ensure that the light-emitting diode is not burned, but with such a connection The way to 骰凡r ^ 1, do not make trouble in production. [New content] The main purpose of this creation is to combine a resistive wafer with a luminescence __^, a 4 missing genus, and a polar illuminating wafer in a dream-and-纟 构 structure to form a resistor.枓 amp amp 丝 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 After the wire is blown between the two conductive inserts of the steam squid a, the two conductive inserts of the squid, the illuminating diodes are sealed between the surnames. A large current is passed through and the party is ordered. For the above purposes, the present invention provides a surface mount type diode package structure comprising: a BU ^ substrate, a chip set, a wire set, and . - the earth plate has four corner regions, and each corner region has an electrode layer, and each of the electrode layers has four front electrodes and four back electrodes extending on the rear surface and the back surface of the substrate. The four front electrodes each extend a conductive line toward the center of the substrate. The chip set is composed of two resistive wafers and two light-emitting crystals, a V-shaped wafer, and a two-dimensional resistive wafer and two light-emitting wafers which are staggered diagonally opposite to each other to conduct electricity. On one end of the line. The wire group is electrically connected between the resistor chip and the light-emitting chip, and the resistor chip is electrically connected in series with the light-emitting chip. The cover body is disposed on the front surface of the substrate, and encapsulates the plurality of conductive lines, the resistor wafer, the light-emitting chip and the wire group. [Embodiment] 4 M350830 The technical content and detailed description of this creation are as follows: Please refer to the first and second figures, which are the surface-adhesive LED package structure of this creation. A three-dimensional view of the appearance. As shown in the figure: the surface-adhesive LED package structure of the present invention, the light-emitting diode package structure includes: a substrate; [, a chip set 2, a guide, a wire set 3 and a cover Body 4. The substrate 1 is made of an insulating material. The substrate 1 has four corners and regions, each of which has a curved notch 11 on the parent corner region, and a metal is formed on each of the missing U by rhyme or printing technology. The electrode layer 12 of the material has a front surface electrode 121a, 121b, 121c, 121d extending on the front surface of the substrate and a back surface electrode U2a, 122b, 122c, and 122d on the back surface of each of the electrode layers 12. Further, each of the front electrodes i2la, 121b, 121c, 121d extends a conductive line i2ga, 123b, 123c, 123d toward the center of the substrate 1. In the figure, the metal material is copper foil. The chip set 2 is composed of two resistive wafers 21a, 21b and two light-emitting 'wafers 22a, 22b'. The two resistive wafers 21a, 2 are fixed to the two conductive lines i23a in a diagonally offset manner. On one end of 123c. Further, the two light-emitting wafers 22a, 22b are also crystallized on one end of the other two conductive lines 123b, 123d in a diagonally diagonally offset manner. In the figure, the 5 watt resistor chips 21a, 21b serve as current limiting resistors to protect the luminescent wafers 22a, 22b. The 5th wire group 3 is made of a gold wire material and electrically connected between the resistor chip 21a and the light emitting chip 22b and the resistor chip 21b and the light emitting chip 5 • M350830 22a to make the resistor chip 21a and the light emitting chip. 22b, and the resistor chip 21b is electrically connected in series with the light-emitting chip 22a. . The outer cover 4 is a transparent resin disposed on the front surface of the substrate and encloses the plurality of conductive lines 123a, 123c, the resistive chips 21a, 21b, the light-emitting chips 22a, 22b and the wire group 3 to avoid The resistor wafers 21a and 21b and the light-emitting wafers 22a and 2213 are damaged by foreign objects. At the same time, the outer cover 4 also forms a lens of the light emitting diode package structure 1〇. By the above, a light-emitting surface-encapsulated light-emitting diode package structure is completed. When a positive voltage of a voltage is applied to the back surface electrode 122c and a negative voltage is applied to the back surface electrode 122d, the current flows through the resistor wafer 21a and the light-emitting chip 22b, and the light-emitting wafer 22b is turned on. Similarly, a g positive voltage is applied to the back surface electrode 122a, and when a negative voltage is applied to the back surface electrode 122b, the current flows through the resistor wafer 21b and the light-emitting wafer 22a, and the light-emitting chip 22a is turned on. Please refer to the third figure, which is the equivalent circuit diagram of the surface-bonded LED package structure. As shown in the figure: The equivalent circuit disclosed in this figure consists of two sets of lines. The first group of wires is formed by connecting the resistor chip and the light-emitting chip 22b in series, and the second group of wires is formed by connecting the light-emitting chip 22a and the resistor wafer 21b in series. The electric bright electrode is applied with a positive voltage applied to the input end a of the resistance chip 21a of the first group (the front surface 122c) and a negative voltage applied to the output end β of the light-emitting chip 22b (for the back electrode 122d). The light-emitting chip is applied with a positive voltage and an output terminal a of the light-emitting chip 22a at the input terminals B, 22b of the resistive chip 21b of the second group of wires, and a negative voltage is applied to the output terminal a of the light-emitting chip 22a. The luminescent wafer 22a can be illuminated. Therefore, the first and second sets of lines described above are used to form a polarized light-emitting diode circuit. Please refer to the fourth figure, which is a schematic diagram of the state of use of the surface-bonded LED package structure. As shown in the figure: when the light-emitting diode package...the female body is inside the brake fuse housing 2〇', the back electrode U2a, 122d is electrically connected to the right-side conductive insert inside the automobile fuse housing 2〇, After the back electrodes 122b and 122c on one side are electrically connected to the left conductive tab 2〇2, the originally polarized light emitting diode package structure forms a non-polarity light emitting diode package structure. When an excessive current flows from the right conductive tab 2〇1 or the left conductive tab 2〇2, the fuse (not shown) connected between the left and right conductive tabs 202 and 201 is blown, that is, The illuminating wafer 22a $ 22b can be illuminated, and the user or the repairer knows that the fuse has been blown and the car fuse must be replaced.
並非用來限定本 扼圍所做的均等 上述僅為本創作之較佳實施例而已， ，作實施之範圍。即凡依本創作申請專利 ^化與修飾，皆為本創作專利範圍所涵蓋 【圖式簡單說明】 第一圖，係本創作之表面黏著型的發光 觀立體示意圖。 二極體封裝結構 外 二極體封裝結構的 第二圖，係本創作之表面黏著型的發光 另一面外觀立體示意圖。It is not intended to limit the scope of the present invention. The foregoing is only the preferred embodiment of the present invention. That is to say, the patent application and modification according to this creation are covered by the scope of the creation patent. [Simple description of the drawing] The first picture is a three-dimensional schematic diagram of the surface adhesion type of the creation. Diode Package Structure The second diagram of the outer diode package structure is a three-dimensional schematic diagram of the surface of the present invention.
係本創作之表面黏著型的發光二極體 封裝結構的 M350830 等效電路示意圖。 第四圖，係本創作之表面黏著型的發光二極體封裝結構使 用狀態示意圖。 【主要元件符號說明】 發光二極體封裝結構10 基板1 、 缺口 11 電極層12 •正面電極 121a、121b、121c、121d 背面電極 122a、122b、122c、122d 導電線路 123a、123b、123c、123d 晶片組2 電阻晶片21a 、21b 發光晶片22a、22b2b 導線組3 I 外罩體4 輸入端A、B -輸出端B、A ’ 汽車保險絲殼體20 右侧導電插片201 左側導電插片202The equivalent circuit diagram of the M350830 is a surface-mounted LED package structure. The fourth figure is a schematic diagram showing the state of use of the surface-adhesive light-emitting diode package structure of the present invention. [Description of main component symbols] LED package structure 10 substrate 1, notch 11 electrode layer 12 • front electrodes 121a, 121b, 121c, 121d back electrodes 122a, 122b, 122c, 122d conductive lines 123a, 123b, 123c, 123d Group 2 Resistive Wafers 21a, 21b Luminescent Wafers 22a, 22b2b Wire Set 3 I Outer Cover 4 Inputs A, B - Outputs B, A ' Automotive Fuse Housing 20 Right Conducting Insert 201 Left Conducting Insert 202