CN108447634A - Surface mounting type thermistor component - Google Patents
Surface mounting type thermistor component Download PDFInfo
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- CN108447634A CN108447634A CN201810081333.XA CN201810081333A CN108447634A CN 108447634 A CN108447634 A CN 108447634A CN 201810081333 A CN201810081333 A CN 201810081333A CN 108447634 A CN108447634 A CN 108447634A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a kind of surface mounting type thermistor components,Including the first chip,Second chip,First pin and second pin,First chip includes the first PTC core materials and is covered on the first PTC core materials,Two metal electrode layers of lower surface,Second chip includes the 2nd PTC core materials and is covered on the 2nd PTC core materials,Two metal electrode layers of lower surface,And first chip and the second chip stacked in layers,First pin connects a metal electrode layer of a metal electrode layer and the second chip for the first chip,Second pin connects another metal electrode layer of another metal electrode layer and the second chip of the first chip,Second pin includes the shared electrode being stacked and placed between the first chip and the second chip,To which the first chip and the second chip form parallel circuit,First PTC core materials include conductivity ceramics filler and carbon black,And the 2nd PTC core materials include carbon black.The cycle life that the present invention can bear 30V/40A is tested 300 times and will not be burnt.
Description
【Technical field】
The present invention relates to a kind of thermistor components, more particularly to a kind of table with high proof voltage and low resistance characteristic
Face pasting type thermistor component.
【Background technology】
Since current single battery voltage itself is relatively low, such as plumbic acid (Lead-Acid) 2V, ni-mh (Ni-MH) and ni-Cd
(Ni-Cd) battery is 1.2V, and lithium ion (Lithium Ion) battery is 3.7V, therefore in numerous applications, the electricity needed for the load
When pressure is higher than the voltage of single battery, it can power in the form of more batteries are concatenated, reach the demand for promoting voltage.
Battery can concatenate positive temperature coefficient (PTC) protection component, and reach the protection of overcurrent.Traditional PTC protections
Component is still based on carbon black and polymer composite system, since carbon black material conductivity is insufficient so that protection component consumption
Cross multiple-energy-source, relatively restricted battery can load current amount, reduce battery standby time, but because of the higher opposite resistance to electricity of its impedance
Pressure can reach requirement.Such as to replace original carbon black material compared with the ceramic powder of low resistance, it is contemplated that it is compound low resistance can be developed
Material, but because the opposite proof voltage of its low-resistance characteristic has not foot phenomenon.Traditional surface attaching type SMD protection components are limited
In original PCB process designs, material selection and inherent structure so that its proof voltage only can be of about 20V, when cell voltage continues to carry
Height, then traditional its protection that cannot be satisfied require.In order to break through conventional carbon black conductive trace and low resistance ceramic material at one stroke
The insufficient problem of pressure resistance, the present invention will be integrated by material to be designed with new construction, is helped the proof voltage of promotion product and is reached simultaneously
To the demand of low resistance.
【Invention content】
The purpose of the present invention is to provide a kind of surface mounting type thermistor component, with excellent low resistance and resistance to
Voltage characteristic can be tested 300 cycles without burning by the cycle life of 30V/40A, efficiently solve low resistance and height
Proof voltage is not easy the problem taken into account simultaneously.
The present invention is achieved through the following technical solutions above-mentioned purpose：A kind of surface mounting type thermistor component includes first
Chip, the second chip, the first pin and second pin.First chip includes the first PTC core materials and is covered on the first PTC cores
Material two metal electrode layers upper and lower surfaces of., second chip includes the 2nd PTC core materials and is covered on the 2nd PTC core materials
Two metal electrode layers upper and lower surfaces of, and first chip and two chip stacked in layers.First pin connects first core
One metal electrode layer of piece and a metal electrode layer of second chip.The second pin connects the another of first chip
Another metal electrode layer of a metal electrode layer and second chip.The second pin includes to be stacked and placed on first chip and the
Shared electrode between two chips, to which first chip and the second chip form parallel circuit.First PTC core materials include to lead
Electroceramics filler and carbon black, and the 2nd PTC core materials include carbon black.The surface mounting type thermistor component can bear 30V/
The cycle life of 40A is tested 300 times and will not be burnt.
In one embodiment, first level part of first pin comprising bifurcated and the second horizontal component, and first water
Flat part and the second horizontal component are located at Different Plane, to be separately connected a metal electrode layer of first chip with this
One metal electrode layer of two chips.
In one embodiment, which includes third horizontal component as the shared electrode.
In one embodiment, the first level part is identical with the area of the second horizontal component.
In one embodiment, first pin and second pin also include to be used for surface-pasted weld part.
In one embodiment, first pin and second pin are one of the forming.
In one embodiment, the conductivity ceramics filler of the first PTC core materials includes tungsten carbide.
In one embodiment, the percent by volume of tungsten carbide is 30~45% in the first PTC core materials, the volume basis of carbon black
Than being 2~20%.
In one embodiment, the 2nd PTC core materials do not include conductivity ceramics filler, or also include that percent by volume is less than 10%
Conductivity ceramics filler.
In one embodiment, the thickness of the metal electrode layer is 50~90 μm.
Compared with prior art, the advantageous effect of surface mounting type thermistor component of the invention is：By multiple
The appropriate collocation of the Parallel Design, conductivity ceramics filler and carbon black of chip and the optimization of the thickness of metal electrode layer, Ke Yitong
When reach the demand of low resistance and high proof voltage so that proof voltage reaches 30V or 60V or more.
【Description of the drawings】
Fig. 1 is the side structure schematic diagram of the surface mounting type thermistor component of one embodiment of the invention；
Fig. 2 is the configuration schematic diagram of the surface mounting type thermistor component of one embodiment of the invention；
Fig. 3 is the schematic diagram of the first pin of the surface mounting type thermistor component of another embodiment of the present invention.
Reference sign：
10 surface mounting type thermistor components
11 first chips
12 first pins
13 second pins
14 electrode connecting portions
15 vertical component effects
16 weld parts
17 electrode connecting portions
18 vertical component effects
19 weld parts
21 second chips
111 the oneth PTC core materials
112 metal electrode layers
211 the 2nd PTC core materials
141 first level parts
142 second horizontal components
【Specific implementation mode】
Figure of description is please referred to below, and the present invention is further described.
Fig. 1 shows the schematic diagram of the surface mounting type thermistor component 10 of one embodiment of the invention, Fig. 2 display surfaces
The exploded perspective schematic diagram of pasting type thermistor component 10.Surface mounting type thermistor component 10 includes the of stacked in layers
One chip 11, the second chip 21, the first pin 12 and second pin 13.In the present embodiment, the first chip 11 is to include PTC core materials
111 and be covered on 111 upper and lower surface of PTC core materials metal electrode layer 112 sandwich structure.Similar, the second chip 21
And the sandwich structure comprising PTC core materials 211 He the metal electrode layer 112 for being covered on 211 upper and lower surface of PTC core materials.It should
First pin 12 and second pin 13 are bent structure, wherein multiple portions are bent into, or especially comprising horizontal and vertical
Part, but be not limited thereto.Preferably, whether first pin 12 or second pin 13 are all integrally formed knots
Entirety in structure, that is, the first pin 12 or second pin 13 is from same metal electrode film, can utilize punching press in advance
Be fabricated to the comb shape electrode for including multiple first pins 12 and second pin 13, and with the first chip 11,21 knot of the second chip
After conjunction multiple surface mounting type thermistor components 10 are formed through bending cutting.A metal electrode layer in first chip 11
112 and second metal electrode layer 112 in chip 21 connect first pin 12 formation and conduct, in the first chip 11
Another metal electrode layer 112 in another metal electrode layer 112 and the second chip 21 connects the second pin 13 and forms electricity
Conducting.In the present embodiment, one end of the second pin 13 forms horizontal component, is stacked and placed on the first upper and lower chip 11 and second
Between chip 21, as the shared electrode of the first chip 11 and the second chip 21, to first chip 11 and the second chip 21
Form parallel circuit.
In the present embodiment, the first pin 12 includes electrode connecting portion 14, vertical component effect 15 and weld part 16, and wherein electrode connects
Portion 14 and weld part 16 are horizontally extending, and vertical component effect 15 extends in the vertical direction and connection electrode interconnecting piece 14 and weld part
16.Electrode connecting portion 14 connects a metal electrode layer of a metal electrode layer 112 and the second chip 21 for the first chip 11
112, the welding junction of the first weld part 16 as surface mount.For spy it, in the present embodiment, the electrode connecting portion 14 packet
First level part 141 containing bifurcated and the second horizontal component 142, and the first level part 141 and the second horizontal component 142
Positioned at different level.The first level part 141 includes to be distributed in two electrode strips of upper surface both sides, and be physically contacted first
The upper surface of chip 11.It is staggered before and after second horizontal component 142 and first level part 141, and the second chip 21 is physically contacted
Lower surface about center portion.Second horizontal component 142 is made with first level part 141 from same plank (such as nickel sheet)
It is bent to form after two cutting lines.The area of first level part 141 and the second horizontal component 142 is substantially identical, that is, wraps
The area of first level part 141 containing two electrode strips is approximately equal to the area of the second horizontal component 142, identical has to provide
Imitate electrode area.In one embodiment, the width about 0.75mm of each electrode strip of first level part 141, the second horizontal component 142
Width be about 1.5mm, to provide 11 and second chip 21 of upper and lower first chip equivalent effective electrode area.
Second pin 13 includes electrode connecting portion 17, vertical component effect 18 and weld part 19.The electrode connecting portion 17 is used as third
Horizontal component connects another metal electrode layer 112 of the first chip 11 and the second chip 21, and second vertical component effect 18 connection should
Electrode connecting portion 17 and weld part 19.In particular, first chip 11 and the second chip 21 is physically contacted in the electrode connecting portion 17
The metal electrode layer 112 of opposite face, also that is, the electrode connecting portion 17 is stacked at the first chip 11 and the adjacent gold of the second chip 21
Between belonging to electrode layer 112, the shared electrode as first chip 11 and the second chip 21.The weld part 16 and weld part 19 are curved
In being folded to, and weld part 16 and weld part 19 are generally aligned in the same plane, as welding surface, so that surface mount is in a circuit
Plate.The weld part 16 is bent inwardly from vertical component effect 15 in the present embodiment, and the weld part 19 is bent inwardly from vertical component effect 18.Welding
The visual actual demand adjustment of overbending direction in portion 16 and 19, is not limited thereto.
With reference to Fig. 3, the first pin 12 can also make a cutting line in same plank center, be bent to form width later
The identical and front and back first level part 141 being staggered and the second horizontal component 142, such as width is all 1.5mm, can equally be provided
The equivalent effective electrode area of 11 and second chip 21 of upper and lower first chip.Because the first level part 141 of Fig. 3 is unlike Fig. 2
It is divided into two electrode strips, there is more preferably intensity, and makes also fairly simple.
First pin 12 and the not expected short circuit problem of second pin 13 in order to prevent, surface attaching type overcurrent protecting group
In addition part 10 can coat insulating layer, which at least coats first chip 11 and the second chip 21 and the first partial pin
12 and second pin 13, the electrode connecting portion 14 and electrode connecting portion 17 are especially coated, but must at least expose the weld part
16 and weld part 19, so that surface mount is used.Thermosetting polymer can be selected in the insulating layer, must can tolerate follow-up reflow
The high temperature of (reflow soldering) processing procedure.In addition to insulation, the material for having heat dissipation characteristics may be selected in insulating layer, provide this
21 preferable heat dissipation effect of one chip 11 and the second chip, to increase maintenance current value.The thermal conductivity of insulating layer is up to 1W/m
K, 2W/mK or 4W/mK is held depending on demand.The insulating layer can utilize ejection formation, spraying or with heat conductive insulating sheet material
The modes such as cladding are made.
PTC core materials 111 and 211 include crystalline polymer polymer and interspersed conductive filler.Crystallinity high score
Sub- polymer is generally polyolefin polymers, such as：Polyethylene.The conductive filler is carbon black, metal or conductivity ceramics powder.
Carbon black is cheap, but its volumetric resistivity value is higher.The volumetric resistivity value of metal and conductivity ceramics powder is relatively low, is suitable for component
The application of miniaturization and low resistance occasion.The particle size of conductive filler is between 0.01 μm to 30 μm.Metal powder is optional
From nickel, cobalt, copper, iron, tin, lead, silver, gold, platinum or other metals and its alloy.Conductivity ceramics powder in conductive filler can be selected from
Metal carbides, such as：Titanium carbide (TiC), Tanization Qiu (WC), vanadium carbide (VC), zirconium carbide (ZrC), niobium carbide (NbC), carbon
Change tantalum (TaC), molybdenum carbide (MoC) and hafnium carbide (HfC)；Or it is selected from metal boride, such as：Titanium boride (TiB2), vanadium boride
(VB2), zirconium boride (ZrB2), niobium (Nb) boride (NbB2), molybdenum boride (MoB2) and hafnium boride (HfB2)；Or it is selected from metal nitride, example
Such as：Zirconium nitride (ZrN).The conductive filler of the present invention can be selected from aforementioned metal or conductivity ceramics and form it through physically or chemically mode
Mixture, alloy, solid solution or nucleocapsid.
Generally speaking, surface mounting type thermistor component 10 is made by following steps：(a) raw material disposal：Due to
Original conductive powder particle was not of uniform size, and excessive powder size will all so that the reliability of material declines, thus need by
Screening, can just pick out most appropriate particle diameter distribution and particle size.And then the recovery of lifting assembly.(b) macromolecule with lead
Electric filler blending：It is adjusted by material prescription, searches out optimal material mixture ratio, changed simultaneously different blending parameters and see
Examine correlation of the material with resistance.In addition the glass transition temperature for system being blended in ceramic powders macromolecule is set in 90~140
Between DEG C, the glass transition temperature of high-temperature macromolecule blending system is set between 160~280 DEG C.(c) material and metal foil pressure
The conjunction stage：It, will via the runner design of the rheological behavior and injection film head of adjustment material, and under the regulation and control of the parameters such as equipment precision
It can be with the splendid conductive polymer composite of output thickness evenness.(d) finished product assembles the stage：The plank after pressing is completed,
It will be processed as finished product, and carry out a series of reliability and verified with environment, be fabricated to square battery thermistor.
In addition to it is above-mentioned include the embodiment of two chips other than, the case where present invention is equally applicable for more chips in parallel.Example
Such as three chips in parallel.According to same way, it is excessively electric that the present invention can produce the surface attaching type comprising more parallel chips
Stream protection component, to further decrease whole resistance value.
The surface mounting type thermistor component 10 of the present invention carries out proof voltage cycle life (cyclic life) and tests,
Using tester table, component moment, test material was in constantly start repeatedly by the electric current beyond product specification in a short time
It is structural whether to be destroyed under situation, cause component to burn, and the product of client can be emulated the current anomaly the case where
Under, the ability of component protection product tests (reliability test) for component reliability.
The test of proof voltage cycle life is carried out below for surface attaching type overcurrent protecting component shown in FIG. 1.Group
Part belongs to the component of 2920 sizes, and the metal electrode layer of PTC core surfaces selects 2oz copper foils, that is, its thickness is 70 μm.It is to be measured
Component applies 30V/40A to carry out cycle life test, measures the electricity after different triggering (trip) numbers or cycle-index
Resistance value.The display of table 1 uses the comparison of two kinds of different materials formulas, the conductive filler of the first chip in one embodiment to select carbon
Change the mixture of tungsten (being indicated with W) and carbon black (being indicated with C), the conductive filler of the second chip is purely using carbon black, not comprising leading
Electroceramics filler.Resistance value described in table 1 after different triggering (trip) numbers or cycle-index, Ri are the initial of component
Resistance value, R1、R10、R50、R100、R200And R300It indicates respectively after recycling 1 time, 10 times, 50 times, 100 times, 200 times and 300 times
Resistance value.Another embodiment is then by the first chip and the second chip all using the mixture of tungsten carbide and carbon black.Mutually compared with
Under, conductive filler in the 2nd PTC core materials of conductive filler selection W+C and the second chip in the first PTC core materials of the first chip
Select the embodiment of C that can will not be burnt by 300 tests of cycle life, however the first chip and the second chip are all adopted
With the embodiment of W+C, then it can not pass through 300 tests of cycle life.Namely a chip selection conductivity ceramics filler and carbon
Black mixture selects carbon black person, shows preferable voltage-resistent characteristic as conductive filler, the conductive filler of another chip.By
This is as it can be seen that the conductive filler that chip is selected can also influence voltage-resistent characteristic.In practical operation, the 2nd PTC core materials are only
It can be necessarily less than 10% comprising a small amount of conductivity ceramics filler, such as percent by volume.
Table 1
Structure as shown in Figure 1, including two chips surface attaching type overcurrent protecting component, wherein the gold selected
Can also voltage-resistent characteristic be influenced by belonging to the thickness of electrode layer.As shown in table 2, the two component belongs to the group of 2920 sizes
Part, and using the formula of same tungsten carbide and carbon black mixt, but the thickness of the metal electrode layer of upper and lower surface is selected respectively
1oz copper foils and 2oz copper foils, that is, respectively 35 μm and 70 μm.Cycle life of the embodiment of 1oz and 2oz through 30V/40A is surveyed
The resistance R of examination, wherein 1oz embodiments after 300 tests of cycle life200It is apparently higher than the embodiment of 2oz, and 1oz embodiments
It can not be burnt by 300 tests of cycle life, nothing burns phenomenon to 1oz embodiments by 300 tests of cycle life.Gold
The thickness for belonging to electrode layer cannot be too thin, preferably 50~90 μm, such as 60 μm, 70 μm or 80 μm.
Table 2
As shown in Figure 1 include two chips surface attaching type overcurrent protecting component (the double-deck PTC), and comprising
The cycle life that the traditional surface attaching type overcurrent protecting component (single layer PTC) of one single chip carries out 30V/40A together is surveyed
Examination, test result are as shown in table 3.The two component belongs to the component of 2920 sizes, and is mixed using same tungsten carbide and carbon black
The thickness of the formula of object, the metal electrode layer of upper and lower surface equally selects 2oz copper foils.As seen from the results in Table 3, the reality of single layer PTC
Applying example can not be burnt by the test by of cycle life 50 times, the embodiment of the double-deck PTC can by 300 tests of cycle life nothing
Burn phenomenon.The embodiment of obvious bilayer PTC can greatly improve its voltage-resistent characteristic compared to single layer PTC person.
Table 3
The percent by volume of the tungsten carbide in tungsten carbide and carbon black mixt selected by above-described embodiment is 30~45%,
Or specifically for 35% or 40%, the percent by volume of carbon black is 2~20%, or especially 5%, 10% or 15%.
Generally speaking, it is tested through the cycle life under different voltages, traditional design usually is only capable of bearing the electricity of about 20V
Pressure, surface attaching type overcurrent protecting component of the invention then can at least bear to reach 30V, or even can further bear 40V or more
High 60V voltages.
Exploitation is applicable to the protection assembly material of the protective current of the square lithium ion battery of high proof voltage by the present invention,
The development and application for doing high proof voltage with polymer composite by the ceramic electric conductor of a new generation, compare the carbon black system of prior-generation
Under the situation of same electric current, it can be resistant to and be depressed into 30V or more, and higher holding electric current can be provided, so upper in application
Development is no longer limited to the application of the low-voltage batteries module such as general laptop, may extend to high voltage applications end and string
Energy-storage battery etc. of the exploitation of batteries in parallel connection as needed for electric vehicle or generating equipment does overcurrent protection appropriate, especially electronic
The environmental protection carrier such as vehicles, while certainly scheme all is known about by this product, it can more assist Battery Plant's development high power capacity electricity
Pond and application and battery pack group have loaded onto more selections, are promoted needed for whole industry development with cooperation.
The technology contents and technical characterstic of the present invention have been disclosed as above, however relevant technical staff in the field is still potentially based on
The enlightenment of the present invention and open and make various replacements and modification without departing substantially from spirit of that invention.Therefore, protection scope of the present invention
It should be not limited to shown in embodiment, and should include various replacements and modification without departing substantially from the present invention, and be covered by claim.
Claims (10)
1. a kind of surface mounting type thermistor component, it is characterised in that：The surface mounting type thermistor component can be born
The cycle life of 30V/40A is tested 300 times and will not be burnt comprising
The first chip and the second chip of several stacked in layers, first chip include the first PTC core materials and be covered on this first
PTC core materials two metal electrode layers upper and lower surfaces of, second chip include the 2nd PTC core materials and are covered on the 2nd PTC cores
Material two metal electrode layers upper and lower surfaces of；
First pin, first pin connect a metal electrode layer of first chip and a metal electricity of second chip
Pole layer；And
Second pin, the second pin connect another metal electrode layer of first chip and another gold of second chip
Belong to electrode layer；
Wherein the second pin includes the shared electrode being stacked and placed between first chip and the second chip, to first chip
Parallel circuit is formed with the second chip；
Wherein the first PTC core materials include conductivity ceramics filler and carbon black, and the 2nd PTC core materials include carbon black.
2. surface mounting type thermistor component according to claim 1, it is characterised in that：First pin includes bifurcated
And the first level part on the different level and the second horizontal component, the first level part and the second horizontal component
It is separately connected a metal electrode layer of first chip and a metal electrode layer of second chip.
3. surface mounting type thermistor component according to claim 1, it is characterised in that：The second pin includes third
Horizontal component is as the shared electrode.
4. surface mounting type thermistor component according to claim 2, it is characterised in that：The first level part and
The area of two horizontal components is identical.
5. surface mounting type thermistor component according to claim 3, it is characterised in that：First pin and second draws
Foot also includes to be used for surface-pasted weld part.
6. surface mounting type thermistor component according to claim 1, it is characterised in that：First pin and second draws
Foot is one of the forming structure.
7. surface mounting type thermistor component according to claim 1, it is characterised in that：First PTC core materials are led
Electroceramics filler includes tungsten carbide.
8. surface mounting type thermistor component according to claim 7, it is characterised in that：Carbon in first PTC core materials
The percent by volume for changing tungsten is 30~45%, and the percent by volume of carbon black is 2~20%.
9. surface mounting type thermistor component according to claim 1, it is characterised in that：2nd PTC core materials do not wrap
Filler containing conductivity ceramics, or also include the conductivity ceramics filler that percent by volume is less than 10%.
10. surface mounting type thermistor component according to claim 1, it is characterised in that：The thickness of the metal electrode layer
Degree is 50~90 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810081333.XA CN108447634B (en) | 2018-01-26 | 2018-01-26 | Surface-mounted thermistor assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810081333.XA CN108447634B (en) | 2018-01-26 | 2018-01-26 | Surface-mounted thermistor assembly |
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| CN108447634A true CN108447634A (en) | 2018-08-24 |
| CN108447634B CN108447634B (en) | 2020-01-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494035A (en) * | 2018-11-13 | 2019-03-19 | 昆山聚达电子有限公司 | The production method of thermistor |
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| CN2735515Y (en) * | 2004-09-10 | 2005-10-19 | 聚鼎科技股份有限公司 | Over-current protection assembly |
| TW201327588A (en) * | 2011-12-29 | 2013-07-01 | Polytronics Technology Corp | Thermistor |
| CN104681224A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Large-current over-current over-temperature protection element |
| CN108878080A (en) * | 2017-05-16 | 2018-11-23 | 聚鼎科技股份有限公司 | Surface adhesive overcurrent protection element |
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2018
- 2018-01-26 CN CN201810081333.XA patent/CN108447634B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2735515Y (en) * | 2004-09-10 | 2005-10-19 | 聚鼎科技股份有限公司 | Over-current protection assembly |
| TW201327588A (en) * | 2011-12-29 | 2013-07-01 | Polytronics Technology Corp | Thermistor |
| CN104681224A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Large-current over-current over-temperature protection element |
| CN108878080A (en) * | 2017-05-16 | 2018-11-23 | 聚鼎科技股份有限公司 | Surface adhesive overcurrent protection element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494035A (en) * | 2018-11-13 | 2019-03-19 | 昆山聚达电子有限公司 | The production method of thermistor |
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