M349555 八、新型說明： 【新型所屬之技術領域】 且特別是有關於一種測 本創作有關於一種測試裝置 試應變值的應變感應模組。 【先前技術】 化轉片是一種能將被測試件上應變(S㈣的變 變化的感應元件。電阻式應變片主要有金屬 =广個部位，檢測出機械裝置各部份的受=被 如應力（Stress)、振動、衝擊、離心力和不平衡力大小等。 金屬電阻應變片的工作原理是電阻的應變效應，即導 體的電阻隨著機械變形而發生變化的現象。 片的基本結構如圖i所示。圖工為先前技術中應變片、= 的不意圖。應變片100包括保護片1〇1、基底1〇2、感應 拇103和引線1〇4。感應柵1〇3是由應變靈敏係數比較大 的金屬電阻絲製成。當金屬電阻絲受外力作用時，其長度 和截面積便會發生變化，從而改變了電阻絲的電阻值。 圖2所不為使用應變片測試一電路板的示意圖。將應 變片100的基底102使用粘結劑（通常為瞬間粘結劑）粘 在待測板105的應變測點上。應變片100產生的阻值變化 非常微弱’通常會使用應變儀1〇6來進行信號處理，之後 再輸出至顯示裝置（圖未示）。應變儀106使用一導線1 〇7 與引線104連接。藉此，應變儀106可以感測應變片1〇〇 M349555 的阻值變化。 由於應變片100的引線104很細，特別是引線104與 應變片100電阻絲的連接強度很低，極易被拉斷或損傷， 且應變片100的基底102較脆。使用完畢後，如果想要將 應變片從待測板105上拆下，容易損壞基底102或引線 104，從而破壞了應變片測試的準確性。因此，公知的應 變片使用完畢後，無法從待測板上拆下，只能報廢，造成 測試成本增加。 【新型内容】 有鑒於此，本創作的目的是提供一種應變感應模組， 以改善現有技術的缺失。 根據本創作之一特色，本創作提供一種應變感應模 組，其包括薄板和應變片。應變片設置在薄板上。薄板貼 附在一電路板的待測點上。 本創作的有益效果在於：由於薄板的彈性較佳，測試 完成之後，應變感應模組能夠方便地從電路板上取下，而 重複利用，測試成本可大幅降低。 為讓本創作的上述特徵和優點能更明顯易懂，下文特 舉較佳實施例，並配合附圖，作詳.細說明如下。 【實施方式】 本實施例中的應變片以一金屬電阻應變片為例，其為 一種已知的用於檢測電路板上某一待測點應變值的裝 7 M349555 二=自身的阻值變化指示出待測點的應變值。在其 =:中，應變片也可以是一半導體應變片，其能夠更 精準地指示出應變值。 =為摘作-較佳實_的應變感應额結構示意 圖。本只施例所提供的應變感應模組3〇〇包括薄板3〇1和 應變片3〇2。應變片302使用點結劑貼附在薄板3〇1上。 ^本實施例中，薄板3G1可以為—廢棄的印刷電路板（pdnt PCB)。因柳轉間裡，這種印刷電路板 ik手可以取用，使用廢棄的PCB可以大幅降低測試 ^本。此外’ PCB相對於應變片的基底來說，具有更佳的 韌性，拆卸時不會被損壞。 在本實施例中，上述薄板3〇1具體製作時，先將 的⑽裁切成長寬為5毫米的正方形，並在中間用小㈣ 出兩條互相垂直的支線，而成為十字。繼而，取出應變片 3〇2,以薄板3G1中心的十字作為定位點，將應變片搬 ^立線與十字重合，進行⑽。接著，再絲貼完成的應 交感應杈組300放置24小時，以保證應變片3〇2與薄板 3j)l完全枯緊。為了防止應變片3〇2受潮引起無法準確測 量應變，在本實施例t ’應變片3〇2上還塗覆有一層防潮 層304。在本實施例t，防潮層遍的材質是環氧樹脂。 應變感應模組300固化完成後，可按照應變片的外 形，將多餘的PCB用剪刀裁掉，應變片接線處pcB保留。 由此，形成如圖3所示的應變感應模組3〇〇，其包括薄板 301和應變片302，薄板3〇1的面積與應變片3〇2的面積 M349555 大致相等。 圖4為本創作一較佳實施例的應變感應模組測試電路 板使用示意圖。 應變感應模組300透過粘結劑而貼附於電路板303的 待測點上。應變片302使用導線107連接至測試儀器，例 如應變儀106，以顯示其測量到的資料。 圖5為本創作一較佳實施例的應變感應模組連接至應 變儀的方塊圖。 由圖5中可以看出，應變儀106更具有電橋電路501 和顯示模組502。電橋電路501連接至應變感應模組300， 感測應變感應模组300的阻值變化，並產生阻值變化引起 的差動信號而產生測試結果。顯示模組5 02連接至電橋電 路501，用以顯示測試結果。 測試完畢後，將溶膠劑滴在薄板301周圍，待溶膠劑 與粘結劑充分作用後，給薄板301 —定的衝擊力，使得薄 板301脫離電路板303。 為了證明本實施例中的應變感應模組與公知的應變 片比同樣能夠精準地測試到電路板的應變值，表Μ給出 了相關的實驗資料。 量塊 (inches) 標準（με) 偏差（με) ε〇 (με) ε〇.3 (με) 0.248 210 50 199 207 0.186 670 50 650 693 9 M349555 0.124 " 1 1 一 1100 55 1078 ----- 1144 0.062 1600 80 1581 1673 0 2100 105 2021 2130 表1-1 矣 1 -1 τ±7 AA 次 丨 η k、仏 -----1 表i-i中的資料是使用標準量具600量測到的。圖（ 是量具的分解示意圖。量具600用於測試應變片測量 的值是否準確。 第一端607和第二端6〇8的垂直高度不同，第一端⑼7 明顧低於第二端6〇8。電路板6G9被 W間，量具㈣使得電路板6〇9產生：： 艾片（位於電路板上的方框處）用來測量電路板6的 待測點的應變值。 ’' 罝塊601〜6〇5用於分別放置於第一端 6〇9之間’以使電路板609產生不同的板f 欄列出了這五個量塊601〜605的不同厚度。 607和電路板 。表Μ第一 不π 定在電路板_上之後，在電路板_處 ==時’能夠測到不同的應變值，表W第二攔 放二二標準提供的在不放置量塊 許的誤塊時應變片應測得的應變標準值和 弟四攔列出了實際測量時，未 應變片測得的電㈣mt禾_在溥板 丁 W私路板應變值e 〇。表 測量時，貼附在03真攔列出了 在〇.3毛未薄板上的應變片測得的電路 M349555 變值<S 0.3。可以看出，p + 〇_3亚未超出目前測試標準的允許 誤差範圍。 在其他貝細例中^，本實施例所提供的應變片亦可貼附 在^).25mm和〇‘35咖的薄板上，其所測得的應變值也在 允許的誤差範圍内。 T·上所述本創作車父佳實施例使用了薄板貼附在應變 片土形成的應變感應模_試電路板的應變，經實驗驗證 測試結果在允許的誤差範圍内，且這種應變感應模組能夠 方便地k %路板上拆下，進而重複利用，降低了測試成本。 雖然本創作已以具體實施例揭露如上，然其僅為了說 創作的技㈣容’而並非將本創作狭祕限定於上述 實施例，任何所屬技術領域中具有通常知識者，在不脫離 本新型的精神和範圍内，當可作些許的更動與潤飾，因此 本創作的保護範圍當視後附的專利申請範圍所界定者為 平 0 【圖式簡單說明】 圖1為先前技術中應變片結構的示意圖。 圖2所示為使用應變片測試一電路板的示意圖。 圖3為本創作一較佳實施例的應變感應模組結構示意 圖。 圖4為本創作一較佳實施例的應變感應模組測試雷 板使用示意圖。 圖5為本創作一較佳實施例的應變感應模組連接至應 M349555 變儀的方塊圖。 圖6是量具的分解示意圖。 【主要元件符號說明】 ' 100、302 :應變片 101 :保護片 102 :基底 I 103 :感應柵 104 :引線 105 :待測板 106 :應變儀 107 :導線 300 :應變感應模組 301 :薄板 303、609 :電路板 304 :防潮層 501 :電橋電路 502 :顯示模組 600 :量具 601〜605 :量塊 607 :第一端 608 :第二端 12M349555 VIII. New description: [New technical field] There is a strain sensing module for a test device with a test strain value. [Prior Art] The rotating sheet is an inductive element capable of straining (S(4)) on the tested piece. The resistive strain gauge mainly has a metal=wide part, and the various parts of the mechanical device are detected as being stressed. (Stress), vibration, impact, centrifugal force and unbalanced force, etc. The working principle of the metal resistance strain gauge is the strain effect of the resistance, that is, the resistance of the conductor changes with mechanical deformation. The basic structure of the sheet is shown in Figure i As shown in the prior art, the strain gauge 100 includes a protective sheet 1〇1, a substrate 1〇2, a sensing thumb 103, and a lead 1〇4. The sensing grid 1〇3 is sensitive to strain. The metal resistance wire is made of a relatively large coefficient. When the metal resistance wire is subjected to an external force, its length and cross-sectional area change, thereby changing the resistance value of the resistance wire. Figure 2 is not to test a circuit board using strain gauges. The substrate 102 of the strain gauge 100 is adhered to the strain measuring point of the board to be tested 105 using an adhesive (usually a momentary adhesive). The resistance generated by the strain gauge 100 is very weak 'usually used The meter 1 6 performs signal processing and then outputs to a display device (not shown). The strain gauge 106 is connected to the lead 104 using a wire 1 〇 7. Thereby, the strain gauge 106 can sense the strain gauge 1〇〇 The resistance value of the M349555 is changed. Since the lead 104 of the strain gauge 100 is very thin, especially the connection strength between the lead 104 and the strain gauge 100 is very low, it is easily broken or damaged, and the base 102 of the strain gauge 100 is relatively brittle. After use, if the strain gauge is to be detached from the board to be tested 105, the substrate 102 or the lead 104 is easily damaged, thereby destroying the accuracy of the strain gauge test. Therefore, after the known strain gauge is used, it cannot be treated. The removal of the test board can only be scrapped, resulting in an increase in test costs. [New content] In view of this, the purpose of this creation is to provide a strain sensing module to improve the lack of prior art. According to one of the characteristics of this creation, this book The creation provides a strain sensing module comprising a thin plate and a strain gauge. The strain gauge is disposed on the thin plate. The thin plate is attached to a point to be tested on a circuit board. The beneficial effect of the creation is: The elasticity of the thin plate is better. After the test is completed, the strain sensing module can be easily removed from the circuit board, and the recycling cost can be greatly reduced. To make the above features and advantages of the creation more obvious, the following DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The strain gauges in this embodiment are exemplified by a metal resistance strain gauge, which is a known method for detecting a circuit board. The strain value of a certain point to be measured is 7 M349555 2 = its own resistance value indicates the strain value of the point to be measured. In its =:, the strain gauge can also be a semiconductor strain gauge, which can indicate more accurately. The strain-inducing value is the schematic diagram of the strain-sensing structure of the extracting-preferred real-time. The strain sensing module 3〇〇 provided by the present embodiment includes the thin plate 3〇1 and the strain gauge 3〇2. The strain gauge 302 is attached to the thin plate 3〇1 using a spotting agent. In this embodiment, the thin plate 3G1 may be a waste printed circuit board (pdnt PCB). Because of the switchboard, the printed circuit board can be used, and the use of discarded PCB can greatly reduce the test. In addition, the PCB has better toughness relative to the substrate of the strain gauge and will not be damaged during disassembly. In the present embodiment, when the thin plate 3〇1 is specifically produced, the (10) is first cut into a square having a width of 5 mm, and two mutually perpendicular branch lines are formed in the middle to form a cross. Then, the strain gauge 3〇2 is taken out, and the cross of the center of the thin plate 3G1 is used as an anchor point, and the strain gauge is moved to the vertical line to overlap the cross, and (10) is performed. Then, the wire assembly 300 which has been wire-bonded is placed for 24 hours to ensure that the strain gauge 3〇2 and the thin plate 3j)l are completely tightened. In order to prevent the strain gauge 3〇2 from being wet, the strain cannot be accurately measured. In the present embodiment, the strain gauge 3〇2 is further coated with a moisture-proof layer 304. In the present embodiment t, the material of the moisture barrier layer is epoxy resin. After the strain sensing module 300 is cured, the excess PCB can be cut off with scissors according to the shape of the strain gauge, and the strain gauge wiring pcB remains. Thereby, the strain sensing module 3A shown in Fig. 3 is formed, which includes the thin plate 301 and the strain gauge 302, and the area of the thin plate 3〇1 is substantially equal to the area M349555 of the strain gauge 3〇2. 4 is a schematic view showing the use of a strain sensing module test circuit board according to a preferred embodiment of the present invention. The strain sensing module 300 is attached to the point to be tested of the circuit board 303 through an adhesive. Strain gauge 302 is connected to a test instrument, such as strain gauge 106, using wire 107 to display the measured data. FIG. 5 is a block diagram of a strain sensing module connected to a strain gauge according to a preferred embodiment of the present invention. As can be seen from FIG. 5, the strain gauge 106 further has a bridge circuit 501 and a display module 502. The bridge circuit 501 is connected to the strain sensing module 300, senses the resistance change of the strain sensing module 300, and generates a differential signal caused by the resistance change to generate a test result. Display module 052 is coupled to bridge circuit 501 for displaying test results. After the test is completed, the sol agent is dropped around the thin plate 301, and after the sol agent and the adhesive sufficiently act, the impact force is applied to the thin plate 301, so that the thin plate 301 is separated from the circuit board 303. In order to prove that the strain sensing module in this embodiment can accurately test the strain value of the circuit board as well as the known strain gauge, the relevant experimental data is given. Inches Standard (με) Deviation (με) ε〇(με) ε〇.3 (με) 0.248 210 50 199 207 0.186 670 50 650 693 9 M349555 0.124 " 1 1 1100 55 1078 ---- - 1144 0.062 1600 80 1581 1673 0 2100 105 2021 2130 Table 1-1 矣1 -1 τ±7 AA times 丨η k, 仏-----1 The data in Table ii is measured using a standard measuring tool 600 . Figure (is an exploded view of the gage. The gage 600 is used to test whether the value measured by the strain gage is accurate. The vertical height of the first end 607 and the second end 6〇8 are different, and the first end (9) 7 is lower than the second end 6〇 8. The circuit board 6G9 is between W and the measuring tool (4) causes the circuit board 6〇9 to generate:: The dies (located at the box on the circuit board) are used to measure the strain value of the circuit board 6 to be measured. '' 601~6〇5 are used to be placed between the first ends 6〇9 respectively to enable the board 609 to produce different board f columns. The different thicknesses of the five gauge blocks 601~605 are listed. 607 and the board. After the first π π is fixed on the board _, the different strain values can be measured at the board _ ===, the second block of the table W is provided by the second standard, and the error is not placed. When the block strain gauge should be measured by the strain standard value and the fourth block is listed in the actual measurement, the unmeasured piece measured the electricity (four) mt Wo _ in the 溥 丁 私 W private plate strain value e 〇. Attached to the 03 block, the circuit M349555 measured in the strain gauge on the 毛.3 hairless sheet is changed to <S 0.3. It can be seen that p + 〇_3 The sub-area does not exceed the allowable error range of the current test standard. In other cases, the strain gauge provided in this embodiment can also be attached to the sheet of ^).25mm and 〇'35 coffee, which is measured. The strain value is also within the allowable error range. The above-mentioned embodiment of the present invention uses the strain of the strain sensing die-tested circuit board formed by the thin plate attached to the strained soil, and the experimentally verified test result is within the allowable error range, and the strain sensing is performed. The module can be easily removed from the K% board and reused, reducing the cost of testing. Although the present invention has been disclosed above in the specific embodiments, it is merely for the purpose of describing the skill of the creation, and is not intended to limit the present invention to the above embodiments, and any one of ordinary skill in the art without departing from the present invention. In the spirit and scope, when a little change and refinement can be made, the scope of protection of this creation is as defined in the scope of the attached patent application. [Simplified illustration] Figure 1 shows the strain gauge structure in the prior art. Schematic diagram. Figure 2 shows a schematic diagram of testing a board using strain gauges. FIG. 3 is a schematic structural view of a strain sensing module according to a preferred embodiment of the present invention. 4 is a schematic view showing the use of a strain sensing module test slab in accordance with a preferred embodiment of the present invention. FIG. 5 is a block diagram of a strain sensing module connected to a M349555 transformer according to a preferred embodiment of the present invention. Figure 6 is an exploded perspective view of the gauge. [Description of main component symbols] '100, 302: strain gauge 101: protective sheet 102: substrate I 103: sensing grid 104: lead 105: board to be tested 106: strain gauge 107: wire 300: strain sensing module 301: thin plate 303 609: circuit board 304: moisture barrier 501: bridge circuit 502: display module 600: gauge 601~605: gauge block 607: first end 608: second end 12