、M346779 八、新型說明： 【新型所屬之技術領域】 本創作係有關-種機械、電器或電子設備用的「散熱鰭片結構， 其是針對各種機械、電n或電子設備制通電雕中會產生的高1 況，而細流體並配合散_片的制及通過，能將該高溫快速:收 並散發達到降溫，藉以增加各設備散熱效率的獨特設計。 【先前技術】 按’ 4多機械、電子設備在使用過程中，都會因為電力的通過或 加熱行為而產生有大量的高溫，該些高溫會造成内部設備的運作不順 暢，而長_高温與溫度過高，甚至會造成元件的壽命降低或損壞，、 為了維持機械、電子設備的正常運作，便有_人開發出可供快速散 熱的散熱鰭片結構，目前習式的散熱鰭片結構多枝如第6圖所示， 其包括有：若干散熱組片60、若干流體管70及配合一流體座組80所 組成’其中’各散熱組片60均是利用沖壓方式製成，以形成一片狀體， 而表面並沖製出有若干的穿孔61，各流體管7〇是配合該穿孔61的外 徑设置，該流體座組8〇是提供各流體管7〇組設並接通，且該流體座 組80設有一輸入口 81及一輸出口 82。 藉由上述結構，各散熱組片60是依序並間隔疊設後，以各流體管 70由各穿孔61穿設過，而流體管7〇與穿孔61間並且必須使用接著 劑、散熱膏或焊接手段，使各流體管70與各散熱組片60能結合固定， _體座組80再由流體管7〇兩端結合，使氣體或液體能由流體座組8〇 5 M346779 的輸入口 81進入，在通過流體管7〇後’俾由輸出口犯再流出，使氣 體或液體中的熱源，在經過各散熱組片6G時，能被各散熱組片⑼所 吸附’並且«辦氣_，讓通舣辟7G喊體歧魏触冷卻。 上述的習式結構具有下述的使躲失，因散熱組片6G與流體管 70是分別的二構件’故二構件間必定有騎生，是以熱傳導性不 L ’再者’為了改善該隙縫產生的熱傳導性不佳問題，各流體管刊 與散熱組片60的穿孔61穿設後，還必須利用接著劑、散熱膏或谭接 手段，使各_管7G與各散熱邮6G結合固定，故可知雜習知社 構具有組錢雜與構件繁多之缺點，且暨使制了接著劑、散執膏或 ^旱接手段，散熱組片60與流體管7〇仍然是二獨立構件，無 熱組片60的最佳散埶#要，u n 數流約0㈣Γ 必須複數使用並配合複 Β ㈣的方式與組合受限，制的範缚狹窄。 本^，鑑於此’乃思及創作的意念，遂以多年的經驗 计，經多方探討並試作樣品試驗，及多次修正改良，乃推出本創作。 【新型内容】 欲解決之技術問題點·· 件，熱;Γ結構，具有散熱组片與流體管為二獨立構 補間隙，該更著劑、散熱f或料手段做固定或填 X/、々、組表歿雜與構件繫多 受限，岸用的城用的方式與組合 心耗命狹卡，此乃欲解決之技術問題點。 6 M346779 解決問題之技術特點·· 本創作係提供一種散献 ^文熱部位間形成有一散熱空間，藉 有一板體，該板體内貫=構，該散熱制是-體成型，且具 設有複數散編，姆=.，職_脚通道方向並 此構成散熱鰭片結構結構 對照先前技術之功效： 作之主要目的乃係提供散熱鰭片結構，其整個散熱鰭片是— 虹里’所有結構均為一體相連，因此具備有導熱效果佳的優點，且 不需要任何的__及程序，還具有减簡減構件鮮之優點， 另本創作的散細料有乡種之制对，應賴範_歧。 【實施方式】 為使貴審查委員對本創作之目的、特徵及功效能夠有更進一步 之瞭解與認識，以下綺配合【圖式簡單說明】詳述如后： 夕 首先，先請由第1、2圖所示觀之，一散熱鰭片1〇是一體成型出， 该-體成型多半是以紹擠型所加工成，該散熱鰭片1〇具有一板體U， 该板體11内貫設有一通道丨2，該通道12並以至少一的分隔板13分 隔為至少二等分，奴置三分隔板13時，該通道12是被分隔為四等 分，另該板體11的外側沿著通道12方向並設有複數散熱部位14，而 该各二相鄰散熱部位14間形成有一散熱空間15，於該散熱部位14的 垂直方向處切設有複數的缺槽16，以該缺槽16的設置可以增加散熱 7 M346779 部位14的表面積，在該散熱鰭片10的板體11沿通道12方向兩端另 I伸出有配口奴17,而在該散熱鰭片10的板體11不具散熱部位14 一邊還各凹設有一配合槽π。 如第3圖所示，為散熱鰭片1〇的一種使用方式，複數散熱縫片 ，10配合-流體座組20使用，其中，該^|座組2〇内側間隔_若干 •的、、且"又孔21，而其他位置一處則設有一輸入口 22及一輪出口 23，該 輸入口 22及輸出口 23並與該各組設孔21通連，該輸入口 22是提供 流體的接設人，該輪出σ 23是提供越的接設出，該各散熱鰭片1〇 疋分別以兩端的配合段17設置在流體座組2〇的二對應組設孔21間， •使通道12接通該輸出口 23與該輸入口 22，以該各散熱鰭片1〇將該 流體座組20的所有組設孔21循環接通，再如第4圖所示觀之，當流 體由流體座組20的輸入口 22進入後，會再透過流體座組20内部通設 到各散熱鰭片10的通道12—端，由該通道12通過整個散熱鰭片仞 ❿後’再透過該通道12由另一端流出，最後會由流體座組20的輪出口 .23流出。 • 藉由上述散熱鰭片10的一種使用方式，當流體通過散熱鰭片10 的通道12時，流體上的熱源會直接傳導到板體11及散熱部位14，令 該熱源被散熱部位14散到空氣中，讓通過散熱鰭片流體能夠被冷 卻降低溫度。 如第5圖所示，為散熱鰭片1〇的另一種使用方式，該一散熱鰭片 8 M346779 ίο配合有一傳導片30的使用，該傳導片3〇是貼合在—晶片仙上， 其中’該散熱鰭片10是以具通道12的一端跟該傳導片加結合固定， 使_熱鰭片10垂直立在傳導片30上，而該散細片1〇°的°通道12 另-端是被封閉，該封閉是為焊接、膠合、m合或填塞方式完成，該 通迢12中並填充有散熱的流體物質，例如散熱膏或散熱膠等。 * 错由上述散熱鰭片10的另一種使用方式，當傳導片30貼合的晶 _片40運作發熱時，該熱源直接傳導到該散熱鰭片1〇與傳導片洲，而 •流體物質的散熱膏熱傳導效能佳，因此會由散熱膏與通道^迅速將熱 源傳導給整個板體n，再由板體u透過散熱部位u達到快速散熱的 目的。 藉上述具體實施例之結構，可得到下述之效益：整個散熱趙片1〇 是一體成型，所有結構均為-相連，因此具備有導熱效果佳的優點， 更不需要使糊_合賴合手段十散熱則1()即具備有板體 通逼12、複數散細立14與散熱郎15，因此不需要任何的組 裝動作及程序，而具有組賴易與構件鮮之優點，且本創作的散熱 鰭片10具有多種之應用方式，可以單—使财能複數配合使用，且複 數配合使㈣，可依需要直接增加搭接，所剌的範絲泛。 綜上所述，本創作確實已達突破性之結構設計，而具有改良之創 乍内容，_又_達職紅之_倾進步性，且本創作未見於 =物’亦機紐’當符合專㈣關法條之蚊，爰依法提出 ’利申请，懇請審查委員授予合法專利權，至為感禱。 9 M346779 ~ 【圖式簡單說明】 第1圖：係本創作之立體圖。 第2圖：係本創作之侧視剖面圖。 第3圖：係本創作之一種使用狀態立體組合圖。 第4圖：係本創作之一種使用狀態組合剖面暨流體通過示意圖。 , 第5圖：係本創作之另一種使用狀態立體組合圖。 第6圖：係習式結構之立體分解圖。 【主要元件符號說明】 習式部份： 散熱組片-- -60 穿孔---- -61 流體管--- -70 流體座組-- -80 入口---- -81 輸出口--- -82 本創作部份： 散熱鰭片-- -10 板體 -11 ---- -12 分1¾板--- -13 散熱部位一一 -14 散熱空間一一 -15 缺槽 -16 配合段--- -17 配合槽--- -18 流體座組-- -20 矣臣言曼孑L--- -21 輸入口--- -22 輸出口--- -23 傳導片--- -30 曰曰片 -40 10, M346779 VIII, new description: [New technology field] This creation is related to a kind of "heat dissipation fin structure for mechanical, electrical or electronic equipment, it is for various mechanical, electrical or electronic equipment The resulting high 1 condition, and the fine fluid combined with the production and passage of the scatter sheet, can quickly turn the high temperature: the absorption and the emission to cool down, so as to increase the unique design of the heat dissipation efficiency of each device. [Prior Art] Press '4 more machinery During the use of electronic equipment, there will be a large amount of high temperature due to the passage of electricity or heating behavior. These high temperatures will cause the internal equipment to operate unsmoothly, while the long_high temperature and temperature are too high, and even the life of the components may be caused. Reduced or damaged, in order to maintain the normal operation of machinery and electronic equipment, there have been people who have developed a heat sink fin structure for rapid heat dissipation. At present, the heat sink fin structure of the conventional method is as shown in Fig. 6, which includes There are: a plurality of heat dissipating panels 60, a plurality of fluid tubes 70 and a fluid housing group 80 formed therein, wherein each of the heat dissipating assemblies 60 are formed by stamping to form a sheet-like body, and the surface is punched out with a plurality of perforations 61. Each of the fluid tubes 7〇 is disposed to fit the outer diameter of the perforations 61. The fluid block group 8〇 provides the fluid tubes 7〇 and is connected and connected. The fluid block group 80 is provided with an input port 81 and an output port 82. With the above structure, the heat dissipation fins 60 are sequentially stacked and spaced apart, and the fluid tubes 70 are pierced by the respective through holes 61. Between the fluid tube 7〇 and the perforation 61 and the use of an adhesive, a thermal grease or a welding means, the fluid tubes 70 and the heat dissipation fins 60 can be combined and fixed, and the body block 80 is further joined by the fluid tube 7 〇. The gas or liquid can be entered from the input port 81 of the fluid block 8〇5 M346779, and then passed through the fluid pipe 7俾, and then discharged from the output port, so that the heat source in the gas or liquid passes through each heat sink 6G. At the same time, it can be adsorbed by each heat sink (9) and the gas is _, so that the 7G shouts the body and the Wei touches the cooling. The above-mentioned structure has the following evasive, due to the heat sinking 6G and fluid The tube 70 is a separate two-components. Therefore, there must be riding between the two components, and the thermal conductivity is not L'. In order to improve the thermal conductivity caused by the gap, after each fluid tube and the perforation 61 of the heat dissipation fin 60 are pierced, it is necessary to use the adhesive, the thermal grease or the tandem means to make each tube 7G and each The heat-distributing post 6G is combined with the fixed, so it can be known that the miscellaneous learning community has the disadvantages of complicated money and various components, and the remedy makes the adhesive, the loose cream or the dry joint means, the heat-dissipating film 60 and the fluid tube 7〇 still It is a two-independent component, the best divergence of the unheated film 60, and the unnumbered stream is about 0 (four) Γ It must be used in combination with the complex Β (4) and the combination is limited, and the system is narrow. The ^, in view of this Nai Si and the idea of creation, based on years of experience, after many discussions and trials of sample tests, and many revisions and improvements, is the creation of this creation. [New content] Technical problems to be solved · · pieces, heat; The structure has a heat dissipating set and a fluid tube as two independent compensating gaps, and the fixing agent, heat dissipating material or material means are fixed or filled X/, 々, group table noisy and component system is limited, shore city The way to use and the combination of heart consumption, the card is intended to be solved. Technical issues. 6 M346779 Technical Features for Solving the Problem··························································································· There are multiple hashes, m =., _ foot channel direction and this constitutes the structure of the fin structure against the previous technology: The main purpose is to provide a fin structure, the entire fin is - Hongli All the structures are connected in one piece, so they have the advantages of good heat conduction effect, and do not need any __ and procedures, but also have the advantages of reducing the simplicity of the components, and the creation of the scattered materials has the same kind of system. Should be dependent on Fan. [Embodiment] In order to enable your review committee to have a better understanding and understanding of the purpose, characteristics and efficacy of this creation, the following 绮 with the [simplified description of the schema] is detailed as follows: First, first, please first, by 1, 2 As shown in the figure, a heat dissipating fin 1 is integrally formed, and the body forming is mostly processed by a squeeze type, and the heat dissipating fin 1 has a plate body U, and the plate body 11 is disposed inside. There is a channel 丨2, which is separated by at least one partition plate 13 into at least two aliquots. When the three partition plates 13 are in the slave, the channel 12 is divided into quarters, and the plate body 11 is A plurality of heat dissipating portions 14 are formed on the outer side of the channel 12, and a plurality of heat dissipating spaces 15 are formed between the two adjacent heat dissipating portions 14, and a plurality of notches 16 are cut in the vertical direction of the heat dissipating portion 14 to The arrangement of the notch 16 can increase the surface area of the heat dissipating portion 7 M346779. The plate body 11 of the heat dissipating fin 10 protrudes from the end of the channel 12 in the direction of the channel 12 with a mating slave 17, and the plate on the heat dissipating fin 10 The body 11 does not have a heat dissipating portion 14 and is also provided with a matching groove π on each side. As shown in FIG. 3, in one use mode of the heat dissipating fins 1 , a plurality of heat dissipating slits, 10 mating-fluid block groups 20 are used, wherein the inner side of the mating group 2 is spaced apart from each other, and " hole 21, and at another position is provided with an input port 22 and a round of outlet 23, the input port 22 and the output port 23 are connected to the set of holes 21, the input port 22 is to provide fluid connection It is assumed that the wheel σ 23 is provided for the connection, and the heat dissipating fins 1 设置 are respectively disposed between the two corresponding grouping holes 21 of the fluid block group 2〇 with the engaging sections 17 at both ends, 12, the output port 23 and the input port 22 are turned on, and the heat dissipating fins 1 循环 circulate all the set holes 21 of the fluid block group 20, and as shown in FIG. 4, when the fluid is After the input port 22 of the fluid block 20 enters, it will pass through the inside of the fluid block 20 to the channel 12 end of each heat sink fin 10, and the channel 12 passes through the entire heat sink fin and then passes through the channel. 12 flows out from the other end and eventually flows out of the wheel outlet .23 of the fluid block set 20. • By using one of the above-mentioned heat dissipation fins 10, when the fluid passes through the channel 12 of the heat dissipation fin 10, the heat source on the fluid is directly transmitted to the plate body 11 and the heat dissipation portion 14, so that the heat source is dispersed by the heat dissipation portion 14. In the air, the fluid passing through the fins can be cooled to lower the temperature. As shown in FIG. 5, in another way of using the heat dissipating fins 1 , the heat dissipating fins 8 M346779 are matched with the use of a conductive sheet 30 , which is attached to the wafer. The heat dissipating fin 10 is fixed and fixed with one end of the channel 12 so that the heat fin 10 stands perpendicularly on the conductive sheet 30, and the fine film 1°° channel 12 is another end It is closed, and the sealing is completed by welding, gluing, m-bonding or filling. The overnight 12 is filled with a heat-dissipating fluid substance such as a thermal grease or a heat-dissipating glue. * Another way of using the above-mentioned heat dissipating fins 10 is that when the crystal piece 40 to which the conductive sheet 30 is attached is heated, the heat source is directly transmitted to the heat dissipating fins 1 and the conductive film, and the fluid substance The heat-dissipating paste has good heat conduction performance, so the heat source and the channel ^ will quickly transfer the heat source to the whole board n, and then the board body u can quickly dissipate heat through the heat-dissipating part u. By the structure of the above specific embodiment, the following benefits can be obtained: the entire heat dissipation film 1 is integrally formed, and all the structures are connected, so that the heat conduction effect is good, and the paste is not required. Means 10 heat dissipation is 1 () that has the board body forced 12, the complex number of fine 14 and the heat sink 15, so does not require any assembly actions and procedures, but has the advantages of group and easy components, and this creation The heat dissipating fins 10 have various application modes, and can be used in combination with a plurality of financial resources, and a plurality of combinations can be used to make a splicing, and the splicing can be directly added as needed. In summary, this creation has indeed achieved a breakthrough structural design, and has improved content of innovation, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Specialized (4) Mosquitoes in the legal section, 提出Proposed an application for profit, and asked the reviewing committee to grant legal patent rights. 9 M346779 ~ [Simple description of the diagram] Figure 1: This is a perspective view of the creation. Figure 2: A side cross-sectional view of the creation. Figure 3: This is a three-dimensional combination of the state of use. Figure 4: This is a schematic diagram of the use of state combined profile and fluid passage. , Figure 5: Another stereoscopic combination of the use state of this creation. Figure 6: An exploded view of the structure of the habit. [Main component symbol description] Part of the formula: Heat sinking block --- 60 perforation --- - - 61 fluid tube --- - 70 fluid seat group --- 80 inlet --- - - 81 outlet -- - -82 This part of the creation: Heat sink fins - -10 plate body-11 ---- -12 points 13⁄4 board --- -13 Heat dissipation parts one to one-14 Heat dissipation space one to one-15 missing slot-16 Section--- -17 Cooperating groove--- -18 Fluid seat set-- -20 矣 言 言 孑 - - L--- - 21 Input port --- -22 Output port --- -23 Conductive film --- -30 曰曰片-40 10