M341927M341927
且特別是一 種半導體 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種封裝結構 元件的封裝結構。 【先前技術】And especially a semiconductor. 8. New description: [New technical field] This creation is about a package structure of a package structure component. [Prior Art]
隨著科技的進步，半導體產業蓬勃發展 (例如:晶粒)的封裝技術也不斷推陳出冑，所〜導體元件 對於半導體元件作包裝，可以保護半導體元；係 並提供與外界電路連接的功能。 α政熱’ ，像 是二造:::封裝技術仍具有許多問題需要解決 因此’基於上述原因’需要—種新的封裝結構 到降低製造成本的目的 【新型内容】 本創作的目的就是提供一種封裝結構，所解決的技術 問題係為此封裝結構的侧面可連接外部電路，解決問題的 技術手段可參照以下的實施例。 依照本創作一實施例，一種封裝結構包含：一基板、 多個焊墊、多個焊線、多個導電條、一晶粒、一封裝膠體。 其中，多個焊墊，位於此基板上且分別配置於此基板之兩 側；多個導電條，分別位於多個焊墊上；至少一晶粒，位 於此基板上；多個焊線，電性連接此晶粒與多個焊墊；以 及’此封裝膠體上覆此基板，其中每一導電條的一面暴露 5 M341927 「------------： . i μ . ' I . ·，- I * f . ^ ^ i ^ • i年月日7 ： 丨 於此封裝膠體外。藉此，此封裝結構的側面所暴露的導電 • 條可連接外部電路。對照先前技術的功效係為此封裝結構 無需額外的接腳來連接外部電路，有效地降低製造成本。 以下將以實施例對上述之說明以及接下來的實施方式 做詳細的描述，並對本創作提供更進一步的解釋。 【實施方式】 為了使本創作之敘述更加詳盡與完備，可參照下列之 圖示及各種實施例，圖示中相同之號碼代表相似之元件。 另一方面’眾所週知的電路元件並未描述於實施例中，以 避免造成本創作不必要的P艮制。 請參照第1A-1B圖，其中第1A圖係繪示依照本創作 實施例的一種封裝結構的立體圖，而第1B圖係繪示沿第 3A圖之A-A線的剖面圖。第1B圖中，封裝結構1〇〇可包 含一基板110、多個焊墊130、多個焊線15〇、多個導電條 120、至少一晶粒160、一封裝膠體170。其中，多個焊墊 130係位於基板11〇上且分別配置於基板11()之二側，多個 導電條120分別位於多個焊墊130上，且導電條12〇電性 連接焊墊130’晶粒160位於基板11〇上，多個焊線15〇 電性連接蟲粒160與多個焊墊130,封裝膠體17〇上覆基板 110,並包覆晶粒160及焊線150,其中導電條13〇的面220 暴露於封裝膠體170外，且導電條130的面220分別眺連 基板110兩侧的側面430。如此一來，可藉由暴露於封裝膠 體170外的面220，使晶粒160與外部電路作電性連接。 另外，導電條120可包含金屬，封裝膠體17〇可包含 M341927 環氧樹脂。 97i 7. 3 1 修正補充 年月曰 雖然未創作已以實施例揭露如上，然其並非用以限定 本創作，任何熟習此技藝者，在不脫離本創作之精神和範 圍内，當可作各種之更動與潤飾，因此本創作之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1A圖係繪示依照本創作實施例的一種封裝結構的 立體圖。 第1B圖係繪示沿第1A圖之A_A線的剖面圖。 【主要元件符號說明】 100 :封裝結構 110 :基板 120:導電條 130 :焊墊 15〇 :焊線 160 :晶粒 170 :封裝膠體 220 :面 43〇 :側面 7With the advancement of technology, the packaging technology of the semiconductor industry booming (for example, die) is constantly evolving. The conductor components are packaged for semiconductor components to protect the semiconductor elements; the system provides functions for connecting to external circuits. . "α政热', like the second::: packaging technology still has many problems to be solved, so 'based on the above reasons' need - a new packaging structure to reduce manufacturing costs [new content] The purpose of this creation is to provide a The package structure, the technical problem to be solved is that the side of the package structure can be connected to an external circuit, and the technical means for solving the problem can be referred to the following embodiments. According to an embodiment of the present invention, a package structure includes: a substrate, a plurality of pads, a plurality of bonding wires, a plurality of conductive stripes, a die, and an encapsulant. Wherein, a plurality of solder pads are disposed on the substrate and respectively disposed on two sides of the substrate; a plurality of conductive strips respectively located on the plurality of pads; at least one die on the substrate; a plurality of bonding wires, electrical Connecting the die and the plurality of pads; and 'this encapsulant overlying the substrate, wherein one side of each of the strips is exposed to 5 M341927 "------------: . i μ . ' I ·, - I * f . ^ ^ i ^ • i date 7: 丨 outside the package, whereby the conductive strips exposed on the sides of the package structure can be connected to external circuits. For this package structure, no additional pins are needed to connect the external circuit, which effectively reduces the manufacturing cost. The above description and the following embodiments will be described in detail with reference to the embodiments, and further explanation of the present invention is provided. [Embodiment] In order to make the description of the present invention more detailed and complete, reference is made to the following drawings and various embodiments, in which like numerals represent like elements. On the other hand, the well-known circuit elements are not described in the implementation. In the example 1A-1B, wherein FIG. 1A is a perspective view of a package structure according to the present embodiment, and FIG. 1B is a view along line 3A. A cross-sectional view of the AA line. In FIG. 1B, the package structure 1A may include a substrate 110, a plurality of pads 130, a plurality of bonding wires 15A, a plurality of conductive strips 120, at least one die 160, and a package. The plurality of soldering pads 130 are disposed on the substrate 11 and are respectively disposed on the two sides of the substrate 11 (). The plurality of conductive strips 120 are respectively disposed on the plurality of pads 130, and the conductive strips 12 are electrically connected. The pad 130 dies 160 are located on the substrate 11 , and the plurality of bonding wires 15 are electrically connected to the worm 160 and the plurality of pads 130 . The encapsulant 17 is overlying the substrate 110 and covers the die 160 and the bonding wires. 150, wherein the surface 220 of the conductive strip 13 is exposed outside the encapsulant 170, and the surface 220 of the conductive strip 130 is respectively connected to the side 430 on both sides of the substrate 110. Thus, the surface exposed by the encapsulant 170 can be exposed 220, the die 160 is electrically connected to an external circuit. In addition, the conductive strip 120 may comprise a metal, and the encapsulant 17 M341927 Epoxy resin may be included. 97i 7. 3 1 Amendment Supplementary Year 曰 Although it has not been created by the above examples, it is not intended to limit the creation of this work, and anyone who is familiar with the art does not deviate from the spirit of this creation. In the scope of the present invention, the scope of protection of the present invention is subject to the definition of the patent application scope. [FIG. 1A] FIG. FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A. [Main component symbol description] 100: package structure 110: substrate 120: conductive strip 130: pad 15: wire 160 : die 170 : encapsulant 220 : face 43 〇: side 7