M340695 -八、新型說明： 【新型所屬之技術領域】 本創作涉及-種電子元件之屏_造，尤其涉及—種可鮮電磁波之 遮罩構造。 【先前技術】 電磁干擾係電子通信設備常見問題之一，通常之1電回路和信號通路 在有電流經過時，都會輕射出一定頻率之電磁波，如果這些電磁波之頻率 與其他電子兀件之工作頻率相近或者相同，則會影響到這些電子元件之信 號傳輸和玉作雜。如果這種賴波產生在手解—些詩電磁波來 • 傳輸#號之通信設備中，則會對通話質量造成較大影響。 爲了降低或^齡碰不良電磁干擾，通常會在電子通信設備之相關 電子70件周圍覆蓋-個由金屬導電材料所製成之金屬遮罩殼體，金屬遮罩 殼體之設魏财效做電子元件所赴之電魏，並且可通過靜電釋放 裝置將其上錄之靜電荷槪。金屬鮮殼體—方面解決了電磁干擾之問 =罢^於其罩覆於電子^件之上，而電子元件工作時會散發熱量，因此， 遮p體:般在其頂面都會設有散熱孔用以散熱，防止遮罩殼體内部溫度 成之電子元件作效率低下。傳統鮮殼體之散熱孔貫通設置於 遮罩趟之頂部，並且散航在縣赌絲面之表面之開口面 Φ 積大小致，其政熱性能不佳。但若將散熱孔之開口面積增大，則其對電 磁波之遮罩侧將會減弱，不能有效防止電磁干擾。 目此，有必魏習知電連翻之鮮構造予以改_克服習知技術中之 所述缺陷。 【新型内容】 電子在雜供—雜舰證社電磁请雜下纽散熱之 而成，其設有一 β的’本創作採用如下技術方案：—種電子元件之屏蔽構 二路f上以遮罩安裝在電路板上之電子元件所産生之電磁 ' 匕括有金屬殼體，所述金屬殼體由金屬材料衝壓 ! 6 M340695 頂面，所述細設有外表面和内表面， 面，頂面之側邊向下延伸有侧壁，其中所述散=靠面和内表 面積小於其在頂面内表面之開口面積。 …、 表面之開口 相較於習知技術，本創作電子元件之 罩殼體之散熱孔呈圓台形設置，形成_個1有如下有盈效果：遮 體内由電子元件産生之熱量並將其更好之聚集遮罩殼 保證了遮罩殼體之遮罩電磁波之;用在增強了散熱孔散熱性能之同時，也 【實施方式】 屬殼ΪΓ。閱第一圖和第二圖所示’電子元件之屏蔽構造主要包括有-個金 金屬殼體1爲金屬材料經猶壓而成，包括 由頂面狀_向下f折延伸之聰i，所财面千=之=_及 -個侧壁此間之連接處均呈圓滑之狐形，而側舰盘二 ===件^圖^之收容娜2。金屬殼體1側壁11之底部，* 延伸有焊接邊13用以與印刷電路板(未圖示)相焊、 頂面10包括有外表面101和内表面102，其通 表臟之散熱·，相鄰之散熱細之二 離，母-讎熱孔⑽在頂面_表面⑽—侧之開σ面積均大減 了Γ面積’該結構使得散熱孔100呈-個圓台狀，能夠更料 綱在頂面崎_之如面敎小，有—定之^值=據 ^場合，定。若用在手機等移動通信設備上，則開口面積不能削:或者 坟大。右開口過小，電子元件卫作時所產生之 體 ;i,rr ? 作異常。若開口面積過大，開口直徑超過了電子元件所産生電磁 ίΐί 料到顧之仙，社《雜干擾之性 此就a大大降低，造成手機等通信設備通料量之下降。關台 不會增大賴孔《罩殼齡表賴口之_，在顧了散^散熱ς能 7 M340695 之同時，也保證了遮罩殼體之遮罩電磁波之作用。 上述之實施方式僅爲本創作一個較佳之實施方式，在現實之應用中’ 金屬设體1和散熱孔100之形狀都會隨著應用途徑之不同而有所改變，比 如：散熱孔100可爲橢圓形或者散熱孔100不爲圓台形設置。因此，基於本 創作構思前提下所做出之任何改進均爲本創作之保持範圍。 【圖式簡單說明】 個角度之立體圖。 100 102 12M340695 - VIII, new description: [New technical field] This creation involves a kind of screen of electronic components, especially related to the mask structure of fresh electromagnetic waves. [Prior Art] Electromagnetic interference is one of the common problems in electronic communication equipment. Usually, when an electric current path and a signal path pass, electromagnetic waves of a certain frequency are lightly emitted. If the frequency of these electromagnetic waves and the operating frequency of other electronic components are Similar or identical, it will affect the signal transmission and jade of these electronic components. If this kind of ray wave is generated in the communication device of the hand-solving electromagnetic wave transmission number #, it will have a great influence on the call quality. In order to reduce or prevent poor electromagnetic interference, it is usually covered with a metal mask shell made of metal conductive material around the 70 pieces of electronic equipment of the electronic communication device, and the metal mask shell is set up to make electronic components. The electric power that goes to it, and the electrostatic charge recorded on it can be recorded by an electrostatic discharge device. The metal fresh shell - the aspect of solving the electromagnetic interference = the cover is covered on the electronic component, and the electronic component will dissipate heat when working, therefore, the cover body is generally provided with heat dissipation on the top surface thereof. The holes are used for heat dissipation, and the electronic components inside the mask case are prevented from being inefficient. The cooling holes of the traditional fresh casing are arranged at the top of the mask, and the surface of the opening surface of the gambling surface of the county is Φ, and the thermal performance is poor. However, if the opening area of the heat dissipation hole is increased, the mask side of the electromagnetic wave will be weakened, and electromagnetic interference cannot be effectively prevented. In view of this, it is necessary to change the fresh structure of the Wei-Xi-Qi-Qi to overcome the defects mentioned in the prior art. [New content] Electronics in the miscellaneous supply - miscellaneous ship certificate society electromagnetic mixed with the new heat dissipation, it has a β 'this creation uses the following technical solutions: - a kind of electronic components shielded two way f on the mask The electromagnetic generated by the electronic components mounted on the circuit board includes a metal casing, which is stamped from a metal material! 6 M340695 top surface, the outer surface and the inner surface, the surface, the top surface The side edges extend downwardly with side walls, wherein the bulk = back surface and inner surface area are smaller than the open area of the inner surface of the top surface. ..., the opening of the surface is compared with the prior art, the heat dissipation hole of the cover shell of the electronic component of the present invention is arranged in a truncated cone shape, and the formation of the _1 has the following profit effect: the heat generated by the electronic component in the cover body is better and better. The collecting mask shell ensures the electromagnetic wave of the mask of the mask shell; and is used to enhance the heat dissipation performance of the heat sink hole, and the embodiment is also a shell. Referring to the first figure and the second figure, the shielding structure of the electronic component mainly includes a gold metal casing 1 which is formed by pressing a metal material, and includes a conical surface extending from a top surface to a downward f-shape. The financial side of the thousand = = and - the side of the side of the connection between the two are sleek fox-shaped, while the side of the ship two === pieces ^ Figure ^ contain the Na 2. The bottom of the side wall 11 of the metal casing 1 has a welded edge 13 for soldering with a printed circuit board (not shown), and the top surface 10 includes an outer surface 101 and an inner surface 102, which are transparent to the surface. The adjacent heat dissipation is two, and the opening-to-surface (10)-side opening σ area is greatly reduced by the Γ area. The structure makes the heat dissipation hole 100 be a truncated cone shape, which can be more The outline is on the top surface of the _ _ as small as the surface, there is a certain value = according to ^ occasion, set. If it is used on a mobile communication device such as a mobile phone, the opening area cannot be cut: or the grave is large. The right opening is too small, and the body produced by the electronic component is made; i, rr ? is abnormal. If the opening area is too large, the diameter of the opening exceeds the electromagnetic content generated by the electronic components to Gu Zhixian. The nature of the interference is greatly reduced, resulting in a decrease in the amount of communication equipment such as mobile phones. Turning off the platform will not increase Lai Kong's hood, which will ensure the shielding electromagnetic wave of the mask shell while taking care of the heat dissipation energy of 7 M340695. The embodiment described above is only a preferred embodiment of the present invention. In a practical application, the shape of the metal body 1 and the heat dissipation hole 100 may vary depending on the application route. For example, the heat dissipation hole 100 may be an ellipse. The shape or the heat dissipation hole 100 is not provided in a truncated cone shape. Therefore, any improvements made based on the premise of this creation are the scope of this creation. [Simple diagram of the diagram] A perspective view of the angle. 100 102 12
【主要元件符號說明】 頂面 10 外表面 101 側壁 11 4接邊 13[Main component symbol description] Top surface 10 External surface 101 Side wall 11 4 edge 13
第一圖爲本創作電子元件屏蔽構造之立體圖· 第二圖爲第一圖所示電子元件之屏蔽構造二L 散熱孔 内表面 收容空間The first figure is a perspective view of the shield structure of the electronic component. The second figure is the shield structure of the electronic component shown in the first figure. L L heat sink inner surface accommodating space