M336531 八、新型說明： 【新型所屬之技術領域】 本創作係與光學滑鼠有關，特別是有關於一種光學滑 鼠模組封裝結構。 5【先前技術】 ^ 4知光學滑鼠為了要利於組裝，用以縮短製作光學滑 鼠=加工時間；如國内專利公告編號第M288726號專利案 揭路有種「用於光學滑鼠之邊射型雷射與感測器之積體 =」’其主要包含有：一封裝體係具有一基板及一設於該 1〇基板且透光之封蓋，該基板與該封蓋形成一容置空間；一 设於該基板之雷射發光晶片係位於該容 光束；—設於該封裝體之影像感測晶t二 學：接收經反射後之該光束。藉此，此案能將光 之主要％件模組化’以達到利於組裝之目的。 =’由㈣基板_㈣之製備料較為複 雜4要經過多次加工方可製成所需要之形 ，、 雖4此案縮短了組裝光學滑鼠的時間，卻相對r，f 5之’ 該封蓋之加工時間;對於 如之目的，具有製備光學滑鼠模組耗費工日$之予缺=加工時間 改進^上所陳，習知光學滑鼠模組具有上述之缺失而有待 【新型内容】 4 M336531 本創作之主要目的在於提供一種光學滑鼠模組封裝結 構’其能夠簡化光學滑鼠模組的加工步驟，具有縮短光學 滑鼠模組加工時間之特色。 為達成上述目的，本創作所提供一種光學滑鼠模組封 5裝結構，包含有：一基板；一設於該基板之光發射元件， 係具有一發射區，該發射區投射一光束；一設於該基板之 光感測晶片，係具有一接收區，該接收區接收經由折射而 返回之及光束，一封裝層係以模壓方式(molding)包覆該基 板、該光發射元件以及該光感測晶片且形成二分別對應該 ίο發射區以及該接收區之穿孔，該等穿孔供該光束通過。 藉此，本創作所提供光學滑鼠模組封裝結構透過上述 結構，其能夠以模壓方式簡化光學滑鼠模組的製作步驟； 其相較於習用者，具有縮短光學滑鼠模組加工時間之特色。 15【實施方式] 為了詳細說明本創作之結構、特徵及功效所在，茲舉 以下較佳實施例並配合圖式說明如後，其中： 第一圖為本創作一較佳實施例之頂侧視圖。 第一圖為第一圖沿2·2方向之剖視圖。 ί〇 ，請參閱第一圖及第二圖，本創作一較佳實施例所提供 光學滑鼠模組封裝結構(10)，包含有··一基板(2〇)、一光發 射元件(30)、一光感測晶片（4〇)、一封裝層（5〇)以及二 玻璃（60)。 一 u予 該基板(20)係為一般習用之導線架，在此容不贅述。 5 M336531 該光發射元件(30)係為發光二極體，該光發射元件(3〇) 設於該基板(20)且具有一發射區(32)，該發射區（32)投射一 光束，該光束會投射於一反射面（圖中未示），例如··桌面， 再往該光感測晶片（40)折射。 5 15 涊无墩測日曰片（40)設於該基板（20)且具有一接收區 (42)，該接收區(42)接收經由折射而返回之該光束，並藉由 該光束判別光學滑鼠之位移量。 忒封叙層（50)係以模壓方式（m〇lding)包覆該基板 (2〇)、該光發射元件(3 0)以及該光感測晶片（4〇)且形成二分 別對應該光發射元件(30)之發射區（32)以及該光感測晶片 (40)之接收區(42)之穿孔(52);該等穿孔(52)係自該基板(2〇) 側往外界方向逐漸擴張，用以供該光束通過。其中，該封 衣層（50)係延自壤氧基樹脂(ep〇xy代㈣、石夕樹脂㈣議 resm)、填石夕核氧樹脂㈣lc〇n_fllled ep〇xy代㈣以及聚脂樹 脂(polyester resin)其中-種；本實施例中， 以環氧基樹脂為例。 1 學賴_分別設於騎裝層⑽且遮蔽該 以供該絲通過；其巾，鱗光學玻璃(3〇)係 八有為光效果，用以改變该光束特性而提供特定光學嗖 ⑽^由^述結構，本猶係直接崎裝材形成該聰層 作業，其加工程序相較於習知者簡化且加工 日寸間較Μ，換言之，本創料需要事先製備特 ==形成封裝體，具有確實縮短光學料模組加 20 M336531 本創作於前揭實施例中所揭露的構成元件，僅為舉例 說明，並非用來限制本案之範圍，其他等效元件的替代或 變化，亦應為本案之申請專利範圍所涵蓋。 M336531 【圖式簡單說明】 第一圖為本創作一較佳實施例之頂側視圖 弟二圖為弟一圖沿2-2方向之剖視圖。 5【主要元件符號說明】 封裝結構(10) 光發射元件(30) 光感測晶片（40) 封裝層（50) 10 光學玻璃(60) 基板(20) 發射區(32) 接收區(42) 穿孔(52)M336531 VIII. New Description: [New Technology Field] This creation is related to optical mouse, especially for an optical mouse module package structure. 5 [Prior Art] ^ 4 Knowing that the optical mouse is used to facilitate the assembly, to shorten the production of optical mouse = processing time; such as the domestic patent publication No. M288726 patent case, there is a kind of "for the side of optical mouse The integrated structure of the laser and the sensor = "' mainly includes: a packaging system having a substrate and a transparent cover disposed on the substrate, the substrate and the cover forming an accommodation a space; a laser emitting chip disposed on the substrate is located in the volume beam; and an image sensing crystal disposed in the package: receiving the reflected beam. In this way, the case can modularize the main part of the light to achieve assembly. = 'The material prepared by (4) substrate _ (4) is more complicated. 4 It has to be processed several times to make the required shape. Although this case shortens the time for assembling the optical mouse, it is relative to r, f 5' The processing time of the cover; for the purpose, for the purpose of preparing the optical mouse module, the cost of the workday is reduced = the processing time is improved. The conventional optical mouse module has the above-mentioned missing and waiting for [new content] 】 4 M336531 The main purpose of this creation is to provide an optical mouse module package structure that simplifies the processing steps of the optical mouse module and has the feature of shortening the processing time of the optical mouse module. In order to achieve the above object, the present invention provides an optical mouse module package 5 package structure, comprising: a substrate; a light emitting element disposed on the substrate, having an emitter region, the emitter region projecting a light beam; The light sensing chip disposed on the substrate has a receiving area, the receiving area receives a light beam returned by refraction, and an encapsulating layer encapsulates the substrate, the light emitting element, and the light by molding The wafer is sensed and two perforations corresponding to the emitter region and the receiving region are formed, the perforations being passed by the beam. Therefore, the optical mouse module packaging structure provided by the present invention can simplify the manufacturing process of the optical mouse module by molding in the above-mentioned structure; compared with the conventional one, the optical mouse module processing time is shortened. Features. [Embodiment] In order to explain the structure, features and functions of the present invention in detail, the following preferred embodiments are described with reference to the accompanying drawings, wherein: . The first figure is a cross-sectional view of the first figure in the direction of 2·2. For example, the optical mouse module package structure (10) provided by the preferred embodiment of the present invention includes a substrate (2〇) and a light emitting element (30). ), a light sensing wafer (4 〇), an encapsulation layer (5 〇), and two glass (60). The substrate (20) is a commonly used lead frame, and will not be described here. 5 M336531 The light emitting element (30) is a light emitting diode, the light emitting element (3) is disposed on the substrate (20) and has an emitting area (32), and the emitting area (32) projects a light beam. The light beam is projected onto a reflective surface (not shown), such as a desktop, and is then refracted to the light sensing wafer (40). 5 15 涊 墩 测 测 ( ( 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 5 5 5 5 5 5 5 5 5 5 5 5 The amount of displacement of the mouse. The encapsulation layer (50) coats the substrate (2〇), the light-emitting element (30), and the photo-sensing wafer (4〇) in a molding manner and forms two corresponding lights respectively. An emissive region (32) of the radiating element (30) and a perforation (52) of the receiving region (42) of the photo-sensing wafer (40); the perforations (52) are from the substrate (2〇) side to the outside direction Gradually expanding for the beam to pass. Wherein, the sealing layer (50) is extended from a lyophilic resin (ep〇xy generation (4), Shixi resin (4) resm), a stone nucleus oxygen resin (4) lc〇n_fllled ep〇xy generation (4), and a polyester resin ( In the present embodiment, an epoxy resin is exemplified. 1 Learning _ is set on the riding layer (10) and is shielded for the passage of the wire; its towel, scaly optical glass (3 〇) is a light effect, which is used to change the characteristics of the beam to provide a specific optical 嗖 (10) ^ According to the structure of the description, this is the direct formation of the Cong layer, and the processing procedure is simplified compared with the conventional ones and the processing time is relatively thin. In other words, the invention needs to be prepared in advance to form a package. , with a true shortening of the optical module plus 20 M336531. The constituent elements disclosed in the previous embodiments are merely illustrative and are not intended to limit the scope of the case. Alternatives or changes to other equivalent components should also be The scope of the patent application in this case is covered. M336531 [Simple description of the drawings] The first figure is a top side view of a preferred embodiment of the creation. The second picture is a cross-sectional view of the second side of the figure taken along line 2-2. 5 [Description of main component symbols] Package structure (10) Light-emitting component (30) Light-sensing wafer (40) Package layer (50) 10 Optical glass (60) Substrate (20) Emitter area (32) Receiving area (42) Perforation (52)