M332789 一發光元件導熱板、轩發 光元件導熱板上躺丨钟要士♦、熱散熱條’其中’該發 及作為^ -1 s 電源及發光控觀路，似賴工作電源 光控制’該發光元件結合·光播導熱板上， 熱板結敎散孰=熱能ί引至該發光導熱板上’該發光元件導 熱能導引及⑽& 以融該_熱條將發光元件導熱板之 發光作層散熱之發光裝置’在於使由多數發光元件組成之 好t 元件均可麟均勻、迅速及良 操=問:消除峨裝置無法就每-咖^ 【實施方式】 夕參f H第二圖、第三®及第四W所示，為本創作之 =曰”、、之x光裝置100之第一實施例，其中該發光裝置_係 匕3至>'-發光元件導触1G、若干發光元件2g及 3〇，該發光元件導熱板10為導熱材料所構成，如金屬板、導體板 竟板、玻璃纖維強化塑膠_，FiberReinf〇rced piastks或fr4)等材料 構成，該發光元件導熱板10上規劃設置有一電源電路u及發光控制 線路12(如第四圖所示），供以連結工作電源及提供發光控制功能，且 該發光元件導驗10之_設柱干雜· n，賤結上述之電源 電路11及發光控繼路12，膽對外連駐作電職控觀號，上述 之發光元件導雛10上所_之電職路u及發光元件導熱板12、 連接導體13，並非以第-圖至第四圖所示為限，舉凡是等效之電路结 構，當不脫本創作之範疇。 ^ 各發光元件20之型式不限，在摘作所揭示之實施觸發光二極 體晶片，如表面黏著元件(SMD)型式之發光二極體，各發光元件2〇結 合於發光猶導熱板1G上，以無發光元料熱板1G上之電源電^ M332789 11及發光控制線路12連結，以受該發光元件導熱板1〇之控制而進行 發光點亮控制，並且，將各發光元件2〇所發出之熱能經由該發光導熱 板10作第一階層之導引散發。上述之各發光元件20與發光元件導熱 板10間之組合方式不限，在本創作中係以表面黏著技術(SMT)方式結 合於發光元件導熱板10。 上述之&熱政熱條30，為導熱材料所構成，如金屬板、導體板、 陶瓷板、玻璃纖維膠(FRP或FR4)等材料構成，該導熱散熱條3〇内部 I成谷置空間31，且該導熱散熱條3〇内部設有至少一對肋板％及 33，該肋板32及33與容置空間31間形成至少一嵌槽311，且該肋板 32及33間形成一開口 312，該嵌槽311供該發光元件導熱板ι〇嵌組 結合，使發光元件導熱板10上之各發光元件2〇均透過開口 312露出， 且該肋板32及33邊緣設有導斜面321及331(如第三圖所示），使該各 發光元件20所發出之亮光光線可透過該開口 312及導斜面321及331 之角度導引而擴散，該亮光光線擴散範圍可由導斜面321及331之角 度來決定。 上述之發光元件導熱板1〇連結該導熱散熱條3〇以作第二階層之 導引散熱，以將該發光元件導熱板10所導引之各發光元件2〇所產生 之熱能再作導引散熱。 上述之發光元件導熱板10與導熱散熱條30間之連結結構，並不 以上述之内部嵌槽311嵌組方式為限，其他等效之連結方式，如以黏 合或鎖合等等效結合方式，當不脫本創作之範疇。 明再配合第五圖及第六圖所示，為本創作之多階層散熱之發光裝 置100之第二實施例，其中，鮮在該導熱散熱條30頂面形成至少一 鏡片嵌槽34，該鏡片嵌槽34供一鏡片元件341嵌組結合，以藉由該鏡 片兀件341提供各發光元件2〇除了透過開口 312、導斜面321及331 之角度之第-層光學擴散結構外之第二層光學擴散結構，使各發光元 件20之發光效能更進一步提昇。 請再參閱第七圖所示，為本創作之多階層散熱之發光裝置1〇〇之 7 M332789 第三實施例’其中’該導熱散熱條30兩端分別結合一封套35及36， 該封套35及36上分別設有若干孔351及361，該孔351及361供該發 光元件導熱板1〇兩侧之連接導體13對應穿出固定，該封套35並再連 結一接頭37 ’該接頭37係由一上蓋371、絕緣套372及下蓋373組成， 使該發光元件導熱板10透過接頭37對外連結工作電源及控制訊號。 該發光元件導熱板10與外界工作電源及控制訊號連結方式，並不以接 頭37為限，其他等效之連結結構，當不脫本創作之範疇。 請再配合第八圖所示，為本創作之多階層散熱之發光裝置1〇〇之 第四實施例，其巾，揭示在該發光元件導熱板1G表面塗佈—層光學膠 膜層14，該光學膠膜層14為石夕膠、環氧樹脂等透光材料，以使該發光 兀件導熱板10表面可以得到防塵、防水及表面保護之功能。 上述第-圖〜第八圖所示本創作之多階層散熱之發絲置，其中 所揭示之細制及目式，係域於，脉_之技細容及技術手 段，所揭示較佳實施例之—隅，並不@而触其範轉。並且，舉凡一 切針對本創作之結構細部修飾、變更，或者是元件之等效替代、置換， 當不脫離本_之_精神及料，其範_由町之_請專利範圍 來界定之。 【圖式簡單說明】 第-圖係本創作第—實施例之多階層散熱之發_置之立體外觀結 構圖； 第二圖係第一圖之立體分解結構圖； 第三圖.局部放大圖，顯示本創作之發光元件導熱板、發光元件 及導熱散熱條間之連結結構； 第四圖為本創作之錯層散熱之發光裝置巾之發光元件料板之電 源電路及發光控觀路與發光元件間之電路方塊圖； 二創作之多階層散熱之發光裝置之第二實施例圖； 乐八圖為弟七圖之剖視放大圖； 8 M332789 第七圖係本創作之多階層散熱之發光裝置之第三實施例圖 第八圖係本創作之多階層散熱之發光裝置之第四實施例圖 【主要元件符號說明】 100發光裝置 11 電源電路 13 連接導體 20 發光元件 31 容置空間 312 開口 321及331導斜面 341鏡片元件 351及361孔 371 上蓋 373 下蓋 10 發光元件導熱板 12 發光控制線路 14 光學膠膜層 30 導熱散熱條 311嵌槽 32及33肋板 34 鏡片嵌槽 35及36封套 37 接頭 372 絕緣套M332789 A light-emitting element heat-conducting plate, Xuan light-emitting element heat-conducting plate, lying on the clock, ▲, hot heat strip 'where' the hair and as ^ -1 s power supply and lighting control view, depends on the work power light control 'this light Component bonding and photo-distribution on the heat-conducting plate, the hot plate is entangled and entangled = thermal energy is applied to the illuminating heat-conducting plate, and the light-emitting element is guided by heat conduction and (10) & The layer of heat-dissipating light-emitting device 'is that the good t-elements composed of most of the light-emitting elements can be uniform, rapid and good. = Q: The device can not be removed every time - [Embodiment] The third embodiment and the fourth W are the first embodiment of the x-ray device 100 of the present invention, wherein the light-emitting device_system 3 to >'-light-emitting element guide 1G, several The light-emitting elements 2g and 3〇, the light-emitting element heat-conducting plate 10 is made of a heat-conducting material, such as a metal plate, a conductor plate, a glass fiber reinforced plastic _, FiberReinf〇rced piastks or fr4), and the light-emitting element heat-conducting plate 10 is planned to have a power circuit u and light The circuit 12 (shown in the fourth figure) is provided for connecting the working power supply and providing the illumination control function, and the light-emitting component is inspected by the column, and the power supply circuit 11 and the illumination control device are connected. Road 12, the bile is connected to the electric service supervisory view, the above-mentioned light-emitting element guide 10, the electric circuit u, the light-emitting element heat-conducting plate 12, and the connecting conductor 13, are not in the first to fourth figures. The limitation is that the equivalent circuit structure does not deviate from the scope of the creation. ^ The type of each of the light-emitting elements 20 is not limited, and the implementation of the disclosed phototriode wafer, such as surface mount component (SMD), is disclosed. A type of light-emitting diode, each of the light-emitting elements 2 is coupled to the light-emitting heat-conducting plate 1G, and is connected to the power supply unit M332789 11 and the light-emitting control line 12 on the non-light-emitting element hot plate 1G to receive the heat-conducting plate of the light-emitting element. The illuminating lighting control is performed under the control of the illuminating device, and the thermal energy emitted from each of the illuminating elements 2 is transmitted through the illuminating heat conducting plate 10 as a first level. The respective illuminating elements 20 and the illuminating element heat conducting plate 10 are provided. The combination of the two is not limited, in this creation Bonded to the light-emitting element heat conducting plate 10 by surface adhesion technology (SMT). The above-mentioned & thermal hot strip 30 is composed of a heat conductive material such as a metal plate, a conductor plate, a ceramic plate, a glass fiber glue (FRP or FR4). The heat-dissipating heat-dissipating strips 3 are formed in the interior of the heat-dissipating heat-dissipating strips 3, and the heat-radiating heat-dissipating strips 3 are internally provided with at least one pair of ribs % and 33. The ribs 32 and 33 are formed between the ribs 32 and 33 and the accommodating space 31 At least one of the recesses 311, and an 312 is formed between the ribs 32 and 33. The recess 311 is configured to be coupled to the heat conducting plate of the illuminating element, so that the illuminating elements of the illuminating element 10 are transparent. The opening 312 is exposed, and the edges of the ribs 32 and 33 are provided with guiding surfaces 321 and 331 (as shown in the third figure), so that the bright light emitted by the light-emitting elements 20 can pass through the opening 312 and the guiding surfaces 321 and 331. The angle is guided and diffused, and the range of the light light diffusion can be determined by the angles of the guide surfaces 321 and 331. The heat conducting plate 1 〇 of the above-mentioned light-emitting element is connected to the heat-dissipating heat-dissipating strip 3 for guiding heat dissipation of the second layer to guide the heat energy generated by the light-emitting elements 2 导引 guided by the light-emitting element heat conducting plate 10 Cooling. The connection structure between the heat-conducting element 10 and the heat-dissipating heat-dissipating strip 30 is not limited to the above-mentioned inner recess 311, and other equivalent connecting methods, such as bonding or locking, are equivalent. When it is not out of the scope of this creation. In addition, as shown in the fifth and sixth figures, a second embodiment of the multi-layer heat-dissipating light-emitting device 100 is formed, wherein at least one lens recess 34 is formed on the top surface of the heat-dissipating heat-dissipating strip 30. The lens slot 34 is provided with a lens element 341 in combination to provide each of the light-emitting elements 2 by the lens element 341, except for the first layer optical diffusion structure passing through the opening 312 and the angles of the guiding surfaces 321 and 331 The layer optical diffusion structure further enhances the luminous efficacy of each of the light-emitting elements 20. Please refer to the seventh figure, which is a multi-layer heat-dissipating light-emitting device of the present invention. 7 M332789 The third embodiment 'where the heat-conducting heat-dissipating strip 30 is respectively combined with a sleeve 35 and 36, the envelope 35 And a plurality of holes 351 and 361 respectively provided for the connecting conductors 13 on both sides of the heat conducting plate 1 of the light emitting element, and the connecting piece 35 is further connected with a joint 37' The utility model is composed of an upper cover 371, an insulating sleeve 372 and a lower cover 373, so that the heat conducting plate 10 of the light emitting element is externally connected to the working power source and the control signal through the joint 37. The light-emitting element heat-conducting plate 10 is connected to the external working power source and the control signal, and is not limited to the connector 37. The other equivalent connection structure does not deviate from the scope of the creation. In addition, as shown in the eighth figure, the fourth embodiment of the multi-layer heat-dissipating light-emitting device of the present invention, the towel, discloses that the surface of the light-emitting element heat-conducting plate 1G is coated with a layer of optical adhesive film layer 14, The optical adhesive film layer 14 is a light transmissive material such as a stone adhesive or an epoxy resin, so that the surface of the heat conductive plate 10 of the light-emitting device can be protected from dust, water and surface. The above-mentioned first-to-eighth diagrams show the multi-layer heat-dissipating hairline of the present invention, wherein the disclosed fine-grained and meshing methods are based on the technical details and technical means of the present invention. For example - oh, not @ and touch it. Moreover, all the modifications, alterations, or equivalent substitutions and replacements of the components of the creations are defined without departing from the spirit and material of the article. [Simplified illustration of the drawing] The first figure is the three-dimensional appearance structure diagram of the multi-layer heat dissipation of the first embodiment of the present invention; the second figure is the three-dimensional decomposition structure diagram of the first figure; , showing the connection structure between the heat-conducting plate, the light-emitting element and the heat-dissipating heat-dissipating strip of the light-emitting element of the present invention; the fourth figure is the power circuit and the light-emitting control road and the light-emitting device of the light-emitting component material plate of the light-emitting device of the created layer Circuit block diagram between components; second embodiment of a multi-layer heat-dissipating light-emitting device; Le Ba diagram is a cross-sectional enlarged view of the brother's seven-figure; 8 M332789 The seventh figure is the multi-layer heat dissipation of the present creation EMBODIMENT OF THE EMBODIMENT FIG. 8 is a fourth embodiment of the multi-layer heat-dissipating light-emitting device of the present invention. [Main component symbol description] 100 light-emitting device 11 power supply circuit 13 connecting conductor 20 light-emitting element 31 accommodating space 312 opening 321 and 331 guide bevels 341 lens elements 351 and 361 holes 371 upper cover 373 lower cover 10 light-emitting element heat conducting plate 12 light-emitting control line 14 optical film layer 30 heat-dissipating heat-dissipating strip 311 recess 32 Rib 33 engaging groove 34 of the lens 35 and the cuff 37 36 372 insulating sleeve joint