M331513 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種半導體承載裝置，特別是指一種 具有彈性擋件的半導體承載裝置。 【先前技術】 參閱圖1及圖2，習知的半導體托盤2包含一盤體21 、一設置於該盤體21周緣的圍壁22、多數設置於該盤體 21上表面211的第一限位塊23、多數設置於該盤體21下表 面212的第二限位塊24，以及多數限位槽25。 每限位槽25實質上是由該等第一限位塊23所框繞 出，且用以載放一球格陣列封裝元件（Ban Grid An>ay， BGA) 3。當二個托盤2上下疊合時，該多數第一及第二限 位塊23 24疋呈上下相對應地分別框繞於該限位槽25周 圍。 該球格陣列封裝元件3具有一片狀的本體3丄及多數設 置於邊本體31下面的接腳32。 於限位槽25的每一第一限位塊23具有一頂面 230、-第-侧面231及-第二侧面232，該第—侧面231 及該第二側® 232實質上朝向該限位# 25,該第一側面 231連接m 230周緣並垂直設置，冑第二侧面232連接 該第-側面231的下緣及該盤體21上表面2u，且向下並 朝向該限位槽25延伸，該第二側面232與垂直線的夹角大 於0度。 當該球格陣列封裝元件3置放於該托盤2之限位槽25 5 M331513 二、、，體31之下周緣抵住該第一侧面231與該第二側面 、#處，且該第二侧面232及該盤體21的上表面2ΐι 二以球格陣列封裝元件3的該⑽腳32實質上是相互間隔 防止該等接腳32撞擊到該第二側面232與該盤體21 勺上表面211而受損。M331513 VIII. New Description: [New Technical Field] The present invention relates to a semiconductor carrying device, and more particularly to a semiconductor carrying device having an elastic stop. [Previous Art] Referring to FIG. 1 and FIG. 2, a conventional semiconductor tray 2 includes a disk body 21, a surrounding wall 22 disposed on the periphery of the disk body 21, and a plurality of first limits disposed on the upper surface 211 of the disk body 21. The bit block 23, a plurality of second limiting blocks 24 disposed on the lower surface 212 of the disk body 21, and a plurality of limiting slots 25. Each of the limiting slots 25 is substantially surrounded by the first limiting blocks 23 and is used to carry a ball grid array component (Ban Grid An > BGA) 3 . When the two trays 2 are stacked one on another, the plurality of first and second limiting blocks 23 24 框 are respectively framed around the limiting slot 25 so as to correspond to each other. The ball grid array package component 3 has a sheet-like body 3A and a plurality of pins 32 disposed under the side body 31. Each of the first limiting blocks 23 of the limiting slot 25 has a top surface 230, a first side 231 and a second side 232. The first side 231 and the second side 232 are substantially facing the limit. #25, the first side surface 231 is connected to the circumference of the m 230 and disposed vertically. The second side surface 232 is connected to the lower edge of the first side surface 231 and the upper surface 2u of the disk body 21, and extends downward and toward the limiting slot 25. The angle between the second side 232 and the vertical line is greater than 0 degrees. When the ball grid array package component 3 is placed in the limiting slot 25 5 M331513 of the tray 2, the peripheral edge of the body 31 abuts the first side surface 231 and the second side surface, #, and the second The side surface 232 and the upper surface 2 of the disk body 21 are substantially spaced apart from each other by the (10) leg 32 of the ball grid array package component 3 to prevent the pins 32 from striking the second side surface 232 and the upper surface of the disk body 21 211 was damaged.
在該球格陣列封裝元件3的測試過程中，該托盤2及 t置於該托盤2上的多數球格陣列封裝元件3被放入測試 °，§亥測試機台必須多次取放該等球格陣列封裝元件3。 此種半導體托盤2多是直接使用於承載多數個球格P車 列封裝S件3,再藉由該等第—及第二限位塊Ml使該 等球格陣列封裝元# 3之間不會碰撞，但是，該等球格陣 列封裝元件3並不是直接固定於該半導體托盤2,該等球格 陣列封裝it件3與該等第—及第二限位塊23、24之間仍有 間隙，但因單獨的球格陣列封裝元件3承受震動位移的彈 ，較大’因此尚可達到預設之目的，但如果該等限位槽乃 是用於承置-承载有多個微小半導體元件之承載盤時（即，，盤 =有盤之悲樣）’稍微的震動位移即报可能造成該等微小半 1兀件脫離其定位處’如仍是採用如上述般非直接固定 的疋位方式，很可能會造成該等微小半導體元件脫離其定 位處並因此損壞，進而造成保護性不佳而有不適用之虞慮 【新型内容】 、…因此，本新型之目的，即在提供一種具有彈性擋件的 半導體承載裝置’並利用該等彈性播件將置於該半導體承 6 M331513 載裝置上的晶片或晶片承載盤 τ^^貝抵固疋，但又不會造成拔 離時的困難，進而提供永署於甘 扠仏承置於其上的晶片或晶片承載盤更 佳的保護性。 於是，本新型之具有彈性擋件的半導體承載裝置，適 用於承載多個被承置物，該半導體承載裝置包含一盤體， 以及複數限位塊。During the testing of the ball grid array package component 3, the plurality of ball grid array package components 3 on which the trays 2 and t are placed on the tray 2 are placed in the test °, and the test machine must be placed and placed multiple times. The ball grid array package component 3. The semiconductor tray 2 is directly used to carry a plurality of ball P-car package S pieces 3, and then the first and second limit blocks M1 are not between the ball grid array packages #3 Colliding, but the ball grid array package component 3 is not directly fixed to the semiconductor tray 2, and the ball grid array package member 3 and the first and second limit blocks 23, 24 are still Gap, but because the individual ball grid array package component 3 is subjected to shock displacement, the larger, so it can achieve the preset purpose, but if the limit slot is used for bearing - carrying a plurality of tiny semiconductors When the component is carrying the disk (ie, the disk = the sadness of the disk) 'a slight vibration displacement may cause the tiny half-piece to be disengaged from its position' if it is still not directly fixed as described above. The bit mode is likely to cause the tiny semiconductor components to be separated from their positioning and thus damaged, thereby causing poor protection and unsuitable considerations. [New content], therefore, the purpose of the present invention is to provide a Semiconductor carrier with elastic stop And using the elastic broadcast member to place the wafer or the wafer carrier tray on the semiconductor carrier 6 M331513 to the tamper, but it does not cause difficulty in pulling out, and thus provides Yongshang in the fork The wafer or wafer carrier on which the cymbal is placed provides better protection. Therefore, the semiconductor carrying device with the elastic member of the present invention is adapted to carry a plurality of mounted objects, the semiconductor carrying device comprising a disk body and a plurality of limiting blocks.
該等複數限位塊是設置於該盤體上，並在該盤體上框 繞出複數托槽，每-托槽之相對應的該等限位塊具有至少 -朝該托槽之幾何中心延伸之彈性擋件，該彈性擋件是由 可撓性材質所製成，每一彈性擋件從相對應的該等限位塊 至該彈性擋件的末端依序具有一固接部，一中段部，及一 接觸部，且该中段部之厚度小於該接觸部之厚度。 本新型之功效在於利用該等彈性擋件，使該等被承置 物能夠被料彈性擋件利抵@定，進而增加定位穩定性 ，且該等彈性擋件的可撓性特色及其構造，也可確保該等 被承置物在被置入或拔除時的順暢性與容易性。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明中’類似的元件是以相同的編號來表示。 如圖3'4所示，本新型具有彈性擋件的半導體承載裝 置之第一較佳實施例，包含一盤體4，以及複數限位塊5。 7 M331513 該盤體4呈矩形狀，該等複數限位塊5是設置於該盤 體4之表面上，並在該盤體4上框繞出八個托槽6(該等托 槽6之數量可因不同設計而改變，在此僅以八個來舉例說 明），每一托槽6之相對應的該等限位塊5具有二朝該托槽 " 6之幾何中心延伸之彈性擋件51，該等彈性擋件51是由可 撓性材質所製成，每一彈性擋件51從相對應的該等限位塊 5至該彈性擋件51的末端依序具有一固接部511，一中段部 512，及一接觸部513，且該中段部512之厚度小於該接觸 鲁 部5 13之厚度。在本實施例中，每一托槽6之相對應的該 等限位塊5可進一步界定為相向且相間隔的一第一限位部 52及一第二限位部53，而該等彈性擋件5ι是自該第一限 位部52延伸出。另外，上述之每一彈性擋件51之中段部 512形成有一貫穿的穿孔514。 當一被承置物1〇〇(—已封裝之晶片或一載有多數小型 晶片的晶片承載盤）被放入該托槽6中時，即會與該等彈性 ❿ 擋件51之接觸部513與相對應之該等限位塊5頂抵，進而 將該被承置物_卡固於由該等限位塊5框繞出的該托槽6 内。值得注意的是，由於每一彈性措件51衫白匕是由可換性材 科^裝成（本實知例中採用塑膠），且其中段部Η 2之厚度皆 ' 是薄於該固接部511以及該接觸部513，進而使該彈性擋件 …易因外力而形變，進而使該被承置物100:= 拔離日守更為順暢。另外，位於該中段部之穿孔514之 ::文同樣是在於使該彈性擋件51更容易形變，進一步增加 "被承置物100在置入或拔離時的順暢性，當然，該等彈 8 M331513 性擋件51也可為不具有位於其中段部512上之穿孔514的 悲樣，同樣可達到相似之功效，在此並不加以設限。 值知一提的是，每一托槽6之相對應的該等限位塊5 也可僅具有一朝該托槽6之幾何中心延伸之彈性擋件5工， 同樣可達到頂抵固定該被承置物1〇〇之功效。 如圖5所示，本新型具有彈性擋件的半導體承載裝置 之第二較佳實施例，大致上是與該第一較佳實施例相同， 相同之處不再贅言，其中不相同之處在於··每一托槽6之 相對應的該等限位塊5具有四彈性擋件51，其配置型態為 二彈性擋件51是自該第一限位部52延伸出，一彈性擋件 51是自該第二限位部53延伸出，而當該被承置物1〇〇被置 入該托槽6中時，該等彈性元件是分列於該被承置物1〇〇 之相鄰的兩邊，並藉由該等彈性擋件51及相對應之該等限 位塊5相配合地將該被承置物1 〇〇卡固於該托槽6中。 由該第一及第二較佳實施例即可看出，該等彈性擋件 51之數量及配置方式變化相當多，實難將其一一舉例述明 ’故僅舉二種可能之實施態樣來舉例說明。 本新型之優點在於： 1_可安全地用於承載已載有多數小型晶片之承載盤， 或已封裝之晶片；本新型是利用其彈性擋件5丨及相 對應之該等限位塊5將該被承置物1〇〇卡固於相對 應之托槽6中，雖然是與該被承置物1〇〇直接接觸 ，但由於該被承置物100為承載盤或已封裝之晶片 ，該等彈性擋件51及相對應之該等限位塊5並不會 M331513 與該晶片（或承載於該等承載盤上之小型晶片）直接 碰觸並造成損害。 2·定位更穩固，·有別於習知的半導體托盤在使用時， 其被承置物100與相對應之限位塊5間仍有間隙， 本新型是直接利用其彈性擋件51及相對應之該等限 位塊5將該被承置物1〇〇卡固於相對應之托槽6中 ，進而使該被承置物100能更穩固地被定位於相對 應之托槽6中，此種定位方式特別適合用於承置已 裝有小型晶片的承載盤。 3.置入或拔離時的順暢性；由於該等彈性擋件51是由 可撓性材質所製成，且其外型結構具有一厚度較薄 的中段部512，進而使該等彈性擋件51更容易因外 力產生形變，進而在有效頂抵該被承置物1〇〇之餘 也不會影響到其置入或拔除時的順暢性。 歸納上述，本新型之具有彈性擋件51的半導體承载裝 置，利用該等彈性播件51及相對應之該等限位塊5，使該 等被承置物能夠被頂抵固定並卡固於相對應之托槽6中， 進而增加定位穩定性，相當適合於承載已裝有多數小型晶 片之承載盤’且該等彈性擋件51的可撓性特色及其構造， 也可確保該被承難⑽在被置人或拔除時的順暢性與容 易性，故確實能達到本新型之目的。 、 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修舞，皆仍 10 M331513 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明一種習知的半導體托盤； 圖2是圖1之該半導體托盤的一剖視圖； 圖3是一俯視圖，說明本新型具有彈性擋件的半導體 承載裝置之第一較佳實施例； 圖4是一局部立體圖，說明該第一較佳實施例之一彈 性擋件之構造；及 ί 圖5是一俯視圖，說明本新型具有彈性擋件的半導體 承載t置之第一較佳實施例。The plurality of limiting blocks are disposed on the disk body, and the plurality of brackets are arranged on the disk body, and the corresponding limiting blocks of each of the brackets have at least - a geometric center toward the bracket The elastic member is made of a flexible material, and each of the elastic members has a fixing portion from the corresponding one of the limiting blocks to the end of the elastic member. a middle portion, and a contact portion, and the thickness of the middle portion is smaller than the thickness of the contact portion. The utility model has the advantages that the elastic members can be used to ensure that the objects to be placed are restrained by the elastic members, thereby increasing the positioning stability, and the flexibility characteristics and the configuration of the elastic members. It also ensures the smoothness and easiness of the placed objects when they are placed or removed. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. As shown in FIG. 3'4, a first preferred embodiment of the semiconductor carrier device having a resilient member includes a disk body 4 and a plurality of limiting blocks 5. 7 M331513 The disk body 4 has a rectangular shape, and the plurality of limiting blocks 5 are disposed on the surface of the disk body 4, and the eight brackets 6 are framed on the disk body 4 (the brackets 6 are The number can vary from design to design, here only eight (for example), the corresponding limit block 5 of each bracket 6 has a velocities extending toward the geometric center of the bracket " The elastic member 51 is made of a flexible material, and each of the elastic members 51 has a fixing portion from the corresponding one of the limiting blocks 5 to the end of the elastic member 51. 511, a middle portion 512, and a contact portion 513, and the thickness of the middle portion 512 is smaller than the thickness of the contact portion 5 13 . In this embodiment, the corresponding limiting blocks 5 of each of the brackets 6 can be further defined as a first limiting portion 52 and a second limiting portion 53 which are opposite and spaced apart, and the elasticity The stopper 5ι extends from the first limiting portion 52. Further, the middle portion 512 of each of the above-mentioned elastic members 51 is formed with a through hole 514 therethrough. When a substrate 1 (a packaged wafer or a wafer carrier disk carrying a plurality of small wafers) is placed in the bracket 6, a contact portion 513 with the elastic stoppers 51 is provided. The corresponding limit blocks 5 are abutted against the corresponding ones, and the objects to be placed are locked in the brackets 6 which are surrounded by the limit blocks 5. It is worth noting that since each elastic tool 51 is made of a replaceable material (the plastic is used in the actual example), and the thickness of the segment Η 2 is thinner than the solid The connecting portion 511 and the contact portion 513 further cause the elastic member to be deformed by an external force, thereby further smoothing the mounted object 100: = pulling away from the sun. In addition, the perforation 514 located in the middle portion is similarly to make the elastic member 51 easier to deform, and further increases the smoothness of the placed object 100 when being placed or removed. Of course, the bombs The 8 M331513 retaining member 51 can also be a sad one without the perforations 514 located in the middle portion 512, and similar effects can be achieved, and are not limited herein. It is to be understood that the corresponding limiting blocks 5 of each bracket 6 may also have only one elastic member extending toward the geometric center of the bracket 6, and the same can be achieved by the topping. The effect of being placed on the shelf. As shown in FIG. 5, the second preferred embodiment of the semiconductor carrier device having the elastic member is substantially the same as the first preferred embodiment, and the similarities are no longer in common, wherein the difference is that The corresponding limiting block 5 of each of the brackets 6 has four elastic members 51. The configuration is such that the two elastic members 51 extend from the first limiting portion 52, and an elastic member 51 is extended from the second limiting portion 53. When the mounted object 1 is placed in the bracket 6, the elastic members are adjacent to the adjacent one of the objects 1 The two sides of the two sides are engaged in the bracket 6 by the elastic members 51 and the corresponding limiting blocks 5 in cooperation. It can be seen from the first and second preferred embodiments that the number and arrangement of the elastic members 51 vary considerably, and it is difficult to exemplify them one by one. Therefore, only two possible implementation states are described. To illustrate. The advantages of the present invention are as follows: 1_ can be safely used to carry a carrier disk that has been loaded with a plurality of small wafers, or a packaged wafer; the present invention utilizes its elastic member 5丨 and the corresponding limit block 5 Fixing the substrate 1〇〇 in the corresponding bracket 6 , although in direct contact with the substrate 1 , because the substrate 100 is a carrier or a packaged wafer, The resilient stop 51 and the corresponding stop block 5 do not directly contact the wafer (or the small wafer carried on the carrier) and cause damage. 2. The positioning is more stable. When the semiconductor tray is different from the conventional one, there is still a gap between the receiving object 100 and the corresponding limiting block 5. The present invention directly utilizes the elastic member 51 and correspondingly. The limiting block 5 is fastened to the corresponding bracket 6 by the receiving member 1 , so that the mounted object 100 can be positioned more stably in the corresponding bracket 6 . The positioning method is particularly suitable for holding a carrier tray that has a small wafer. 3. Smoothness when placed or removed; since the elastic members 51 are made of a flexible material, and the outer structure has a thin section of the middle portion 512, thereby making the elastic blocks The piece 51 is more likely to be deformed by an external force, and furthermore, it does not affect the smoothness of the insertion or removal when it is effectively abutted against the object to be placed. In summary, the semiconductor carrier device with the elastic member 51 of the present invention utilizes the elastic member 51 and the corresponding limiting block 5 to enable the objects to be fixed and fastened to the phase. Corresponding brackets 6 further increase the positioning stability, and are quite suitable for carrying the carrier trays which have many small wafers, and the flexible features and structures of the elastic members 51 can also ensure the bearing. (10) The smoothness and easiness of being placed or removed can indeed achieve the purpose of the present invention. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and repair according to the scope of the novel application and the new description of the present invention. Dance, still 10 M331513 is covered by this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a conventional semiconductor carrier; FIG. 2 is a cross-sectional view of the semiconductor carrier of FIG. 1. FIG. 3 is a plan view showing the novel semiconductor carrier having an elastic member. FIG. 4 is a partial perspective view showing the configuration of an elastic member of the first preferred embodiment; and FIG. 5 is a plan view showing the semiconductor carrier with the elastic member of the present invention. The first preferred embodiment is set.
11 M331513 【主要元件符號說明】 4 ............盤體 5 ............限位塊 51 ..........彈性擋件 511 ........固接部 512 ........中段部 513 ........接觸部 514........穿孔 52 ..........第一限位部 53 ..........第二限位部 6............托槽 100........被承置物11 M331513 [Explanation of main component symbols] 4 ............Disk 5 ............Limit block 51 .......... Elastic stopper 511 ........ fixing portion 512 ........ middle portion 513 ........ contact portion 514........ perforation 52 .. ........The first limiting portion 53 ..........the second limiting portion 6 ......... bracket 100..... ...contained
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