TWI283225B - Stacked tray assembly for semiconductor package substrate - Google Patents

Abstract

A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.

Description

1283225 V. INSTRUCTIONS OF THE INVENTION (1) [Technical Fields of the Invention] - A type of tray for a semiconductor package substrate, especially a tray for a semiconductor package substrate of a fixed position of each tray. In the case of a semiconductor package substrate (SutlStrate) for a Bal1 Grid Array (BGA) semiconductor package, when it is connected, the package process is usually completed. First placed in a tray and pulled in 'and stacks the tray layers that are placed on the substrate to form two, I group / to provide appropriate support and protection of the substrate with the precision circuit Transmission, testing, loading and related systems, day, can be exempted from external force or mechanical shock (Mechanical Sh〇ck), to ensure the integrity of its structure and layout. For example, in the case of U.S. Patent No. 5,40,904 and No. 6 1 1 427, the structure of the tray 40 is as shown in Fig. 3A, including the outer frame "with the outer frame 4". A plurality of pins 1 for carrying the substrate (not shown) are arranged in an array, and are separated from each other by a plurality of vertical spacers 43 and each An opening is formed in a bracket 42 for carrying the substrate, and the substrate is positioned in each of the brackets 42 by the blocking structures 43 to limit the movement of the substrates; in addition, the blocking structures are “straight and staggered” That is, the corner edge position of each of the brackets 4 2 is formed to further form a cassette 44 for stacking the other trays 40, and the heights of the package colloid and the solder balls are considered. The barrier structure 43 serves as a holder 'further'. The respective tabs 44 located at different positions on the tray 40 may be in the shape of a cross, a T-shape, or an L-shaped structure for stacking the pots on top of them.

1283225 V. Description of the Invention (2) When the disk is in the disk, the bottom surface of the trays is prevented from contacting the substrate in the lower layer of the tray, thereby maintaining the upper and lower displacement spaces of the substrates in the tray; the (10) drawing is the tray 40 described above. A schematic view after carrying the substrate 45. During the transport or transportation of the trays 40, a plurality of trays 40 are stacked to form a tray group for facilitating movement, and at the same time, in order to prevent each tray 40 from being damaged due to the positioning during the movement, the substrate 45 is damaged. It is customary to use a magic strap or a rubber band to bundle the trays of each layer, so that the overall tray group is positioned stably. However, the two types of strapping have the disadvantages of the use period, because the magic strap and the rubber band are both It is extremely easy to have insufficient adhesiveness or elastic fatigue after long-term use, and the positioning force is insufficient, which causes the displacement of the trays 40 of the various layers during the handling process and even causes the substrates to "fall off and be damaged. Therefore, U.S. Patent No. 5, 421, 45 No. 5 proposes a solution which, as shown in Fig. 4, designs a clamping plate 55 (C1 ip) and forms on the tray group 51 which is stacked by the number of trays 50. a clamping strip 56 (Tab) corresponding to the clamping plate 55, so that the clamping plate 55 and the plurality of clamping strips 56 are engaged with each other before the tray group 51 is transported, and the trays are stably fixed. Each tray 50 is subjected to this during shipping The fixing of the fixing plate 55 is not caused, so that the substrate carried in each tray 50 is prevented from falling off or being damaged. However, this design also has other disadvantages in use. First, the clamping plate 55 The manufacturing cost is not low, and with the large use of the tray 5〇, a large burden on the body cost will be formed, and the clamping strip 56 of the clamping plate 55 and the tray 5 is surely engaged, and the manufacturing precision is required. Particularly precise, will also lead to processing

1283225 V. Description of the invention (3) Difficulty; the number of fixed stacks after the same quantity, the quantity, the need for more, therefore, the number of stacks of stable fixed position pallets is related to this field [invention] Therefore, the stacking 牦The semiconductor package of the present invention is a semiconductor package of the present invention. Therefore, the system includes: a plurality of semiconductors for carrying the barrier structure, and a component; and at least the second fastening When the unit is fastened, the bigger problem lies in the size, which will lead to a better improvement method. = How does she develop a semiconductor stacking tray? The effect of the soil, the low-cost and high service life. Waiting for the topic to be solved urgently. It is limited to the tray 50 of the tray 50 stack 51 of the clamping plate 5 5 sets 51, and the combination of the trays for the tray 50 of the tray group 51 can be freely changed, and the semiconductor of the invention has another purpose. The package body is further used for the purpose of the invention. The invention is provided with a stack of semiconductors for each of the trays and a fastener unit. At the same time, the package substrate is provided with a tray set for providing a plate for providing the disk pack. The outer edge of the semi-lead tray-mounted substrate has a tray that is fastened to the plurality of trays for providing a stable fixed position group. Use without being subject to a stack of trays that can be freely changed. A low-cost and easy-to-mass tray set for a body package substrate, wherein each tray is formed with a plurality of brackets for blocking each bracket and a plurality of first plurality of phases formed by at least one first fastening sheet The disk stabilizes the stack of two fastening units, and positions the stacks of the stacked stacks, wherein

17712 Product.ptd Page 11 1283225 V. INSTRUCTIONS (4) The number of the second fastening units is not less than the number of trays stacked on each other. The first two fastening sheets are the first fastening edge and each position. In addition, the length of the fastening tray is such that the number of the fastening trays can be avoided by the unit. [Embodiment] The following is a description of the embodiments of the present invention with different viewpoints and modifications. The first protruding portion of the hairpin, the first buckle ,L, at the same time, the front and rear sides of the pair are formed in the same pair of rubber fasteners, and the total height of the stack, and the tray group for stacking each other, the second on the piece The effect of the buckle, the stacking number of the tray is easy to be shortcoming. In the embodiment, it is easy to understand other different details, and the fastening unit may be based on the two-phase one tray of the tray corresponding to the injection molding. The first fastening unit is a unit that can be combined with the unit, and the foregoing is not less than the amount on the piece. The tray is matched with the elastic on the tray, and is used by the person of the art to perform the application and the application. The number of stacks of the long strip-shaped plastic trays of the plurality of second fastening units stacked on each other is not less than that of the first fastening unit and the fastening position of the fastening unit on the semiconductor package substrate It can also be used in conjunction with the manufacture of components to achieve a stable substrate damage, and to solve the specific specific examples of the conventional positioning can be pointed out and effective. The present invention is not limited by the spirit of the present invention. The preferred embodiment of the present invention is to provide a preferred embodiment of the present invention.

17712 Product.ptd Page 12 1283225 V. INSTRUCTIONS (5) One stack of pallets 1 arranged in an array and used for blocking the vertical staggering of the spacers 1 2 from the barrier structure 1 2 The upper tray 10 is touched to the layer tray embodiment thereof, as shown in FIG. A, including a plurality of (Tray) 'each _ tray 1 形成 is formed with a plurality of semiconductor package substrates (not shown) The barrier structure 1 2 of the bracket bracket 1 1 is formed, and at the same time, the bumps 13 are formed as in the conventional tray to avoid the substrates in the stacked stacks 10 . The tray set 1 of the present invention is characterized in that two opposite outer edges of each tray are formed with two first fastening units 20 as shown in the upper view of FIG. 1 or FIG. The first fastening unit 2 is a protruding portion such as a convex button, which is formed by injection molding and is respectively formed on the front and rear ends of the opposite side edges 15 of each tray 10 and symmetric with each other. And the positions of the protrusions 20 on each of the trays 10 are all the same, so that the protrusions 20 on each tray 10 after the trays 1 are stacked can be arranged on the same straight line; meanwhile, the present invention The tray set 1 further includes an external fastening member 30 having a plurality of second fastening units 35. The fastening member 30 of the embodiment is a long plastic fastener, and the second fastening unit 3 5 is a buckle hole formed on the plastic fastener, and the positions of the fastening holes 35 are corresponding to the positions of the plurality of protrusions 20 of the trays, so that the fastening component 30 can The latching holes 35 are respectively fastened to the protruding portions 20 of each of the trays 10 to be attached to the two sides of the stacking trays, and are stably fixed. Stack of each tray 1 billion.

The number of the fasteners 30 is increased or decreased according to the number of the protrusions 20 formed on the side 丨 5 of the tray , 5, in the embodiment, when the trays 10 are on the carrier substrate 25 After the stacking is completed, the tray group 1 is like 2a, 2B.

17712 Product Gentleman (3 Page 13 1283225 V. Invention Description (6) As shown in the figure, two sets of two and two symmetrical parts on the sides of the stacking trays are used. 3 (the side of Figure 2B) The view is only shown on one side), thereby stably fixing the trays 10 to prevent the substrate 25 in the tray 1 from falling off or being damaged during transportation. Compared with the prior art, the tray set 1 of the present invention obviously has The higher the elasticity of the stacking number of the trays 10, because the length of the long strip fasteners 3 is not less than the total height of the stacks of the trays 10, and the fasteners 3 are opened The number of the row of button holes 35 is not less than the number of the trays stacked on each other, and the protrusions 20 on each tray 10 are located at the same position, so even the tray 1 of the tray group 1 〇The number of stacks is increased or decreased, “the formation and restraint of the fasteners 30 are not formed, which fully meets the elasticity and demand of the waste house handling. At the same time, the design of the aforementioned fasteners 30 and the tray protrusions 20 Does not reduce its positioning function due to long-term use, without the customary magic band or eraser The failure problem has an extremely high service life, and furthermore, it can be utilized by the simple design of the ancient ten to achieve low cost and easy mass production, etc. The foregoing embodiment discloses the first fastening of the tray 1 of the present invention. An example of the specific design, number and position of the unit 2 〇 and the fastening member 3 0 二 2 fastening unit 3 5 , but this example is not a limitation of the present invention, and the shape, number and position of the first fastening unit 2 〇 It is also possible to change or increase or decrease the requirement of the positioning of the tray 10 by the user. The design of the fastening member 30 and the pattern of the second fastening unit 35 can be changed with the first fastening unit 20. For example, the first fastening unit 20 of the outer edge of the tray 10 is a recessed hole, and the second fastening unit 35 of the fastener 30 is a protruding fastening portion or the like. Suitable for this hair

1283225 V. Inventive Note (7) It is only necessary to make the fastening relationship not limited to the stacking number of the trays 10, that is, the above-mentioned "5rJ~" is only a preferred embodiment of the present invention, and is not used The scope of the present invention is defined, that is, the invention may be modified in other ways, and thus all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention are disclosed. It should still be covered by the scope of the patent application described later.

17712矽品.口1廿第15页1283225 BRIEF DESCRIPTION OF THE DRAWINGS [Brief Description] FIG. 1A is an exploded perspective view of a preferred embodiment of the tray set of the present invention, and FIG. 1B is a tray set of the present invention. 2A is a schematic view of a preferred embodiment of the tray set of the present invention on a carrier substrate and combined; FIG. 2B is a preferred embodiment of the tray set of the present invention on a carrier substrate And a side view of the combination; FIG. 3A is a schematic view of a conventional tray structure; FIG. 3B is a schematic view of a conventional tray structure after carrying a substrate; and FIG. 4 is a US Patent No. 5, 4 2 1, 4 5 5 The tray group positioning method disclosed in the case. (Component symbol description) I Pallet set 10 Tray II bracket 12 Barrier structure 13 Cartridge 15 Side 20 First fastening unit 25 Base plate 30 Fasteners

17712 Products.ptd Page 16 1283225 Schematic description 35 Second fastening unit 40 Tray 41 Frame 42 Bracket 43 Barrier structure 44 Cartridge 45 Base plate 50 Pallet 51 Pallet set 5 5 Clamping plate 56 Clamping strip

17712 Product.ptd Page 17

Claims (1)

1283225 VI. Patent Application Range 1. A tray set for a semiconductor package substrate, comprising: a plurality of stacked trays (Tray), each of which is formed with a plurality of brackets for carrying semiconductor package substrates and a barrier structure for blocking each of the brackets, and each of the outer edges of the tray is formed with at least one first fastening unit; and at least one fastening member having a plurality of second fastening units for borrowing the second The fastening unit is simultaneously fastened to the first fastening unit of the plurality of stacked trays, so that the plurality of trays are stably stacked and positioned, wherein the number of the second fastening units is not less than the stacked trays quantity. 2. The tray set for a semiconductor package substrate according to claim 1, wherein the first fastening unit is a protrusion. 3. The tray set for a semiconductor package substrate according to claim 1, wherein the second fastening unit is a buttonhole. 4. The tray set for a semiconductor package substrate according to claim 1, wherein the first fastening unit is formed on two opposite sides of the tray, respectively. 5. The tray set for a semiconductor package substrate according to claim 4, wherein the first fastening unit is formed on the front and rear edges of the opposite sides of the tray, respectively. 6. The tray set for a semiconductor package substrate according to claim 1, wherein the first fastening units on the plurality of trays stacked on each other are formed at corresponding positions. 7. A tray set for a semiconductor package substrate according to claim 1 of the patent scope, 17712石夕品. 口1: (1 Page 18 1283225 VI. Patent application range, wherein the first fastening unit is made by injection molding. 8. For the semiconductor package substrate of claim 1 a tray set, wherein the fastening member has a strip shape, and the length thereof is not less than a total stack height of the plurality of stacked trays. 9. The tray group for a semiconductor package substrate according to claim 1 of the patent scope, The fastener unit is a plastic material. The tray group for a semiconductor package substrate according to claim 1, wherein the plurality of brackets on the tray are arranged in an array. 17712 Products.ptd Page 19