TW200533569A - Stacked tray assembly for semiconductor package substrate - Google Patents

Abstract

A stacked tray assembly for semiconductor package substrates is provided, in which a plurality of stacked trays having receiving cells for carrying semiconductor package substrates and separating structures for dividing each receiving cells is proposed, and at least a first engaged unit is formed on the external fringe of each tray. Then, at least an engaging member having a plurality of second engaged units is provided so as to engage with the first engaged units of the stacked trays, thereby stably positioning the stacked trays during the transporting process.

Description

200533569 V. Description of the invention (1) '-[Technical field to which the invention belongs] The present invention relates to a tray set for semiconductor packaging substrates, and more particularly to a tray set for semiconductor packaging substrates capable of stably holding each tray. [Previous Technology] For the semi-substrate package substrate used in the Ball Grid Array (BGA) semiconductor package, it is usually introduced after the chip is connected and the packaging process is completed. Placed in a tray (Tray) and formed by stacking the tray layers containing the substrates. Tray set 'to provide proper support and protection of the substrate with precision circuit. These substrates can be protected from X external force or mechanical shock in the subsequent transmission, testing, loading and related spear guards to ensure their structure. And the integrity of the wiring. For example, the structures of US Patent Nos. 5,400,9 0 4 and 6,1 1,6,4 2 7 are the structures of 5 types of trays 40, as shown in Figure 3a, Including the outer frame 4} and the majority of the brackets 4 2 in the outer frame 41 for carrying the substrate (not shown). The brackets 42 are arranged in an array, and are arranged by a plurality of vertical positions. The barrier structures 4 3 of the column are separated from each other. At the same time, an opening is formed in each bracket 42 to carry the substrate, and the substrates are positioned in each bracket 42 and restricted by the barrier structures 4 3. The movement of the substrates; in addition, the vertical staggered positions of the blocking structures 43, that is, the corner positions of each bracket 42, form another tenon 44 for supporting f to stack other trays 40, and Considering the height of the packaging colloid and the solder ball, these tenon 4 4 series protrude from the barrier structure 4 3 as a retaining member. In addition, each of the 5 rods located at different positions on the tray 40 0 can be ten. Sub-shaped, T-shaped, or L-shaped structures, with other brackets stacked on top of them

Page 9 200533569 V. Description of the invention (2) Avoid the bottom surface of the trays from contacting the substrate in the lower tray during the tray, and then keep the space for the substrates to move up and down in the tray; Figure 3B is the aforementioned A schematic diagram of the tray 40 after the substrate 45 is carried. During the transportation or handling of these pallets 40, a plurality of pallets 40 are stacked to form a pallet group to facilitate movement. At the same time, in order to avoid damage to each pallet 40 due to incomplete positioning during the movement, The substrate 45 is conventionally bundled with various layers of trays 40 using a magic band or rubber band, so that the overall tray group is firmly positioned. However, the foregoing two bundling methods have the disadvantage of their useful life, because the magic band Both the rubber ring and the rubber ring are extremely prone to the phenomenon of insufficient adhesion or fatigue fatigue after long-term use, which results in insufficient positioning force, which causes the trays 40 of various layers to be displaced during the handling process and even the substrates 45 to fall off and be damaged. Therefore, a solution is proposed in US Patent No. 5,4 2 1, 4, 55, which is shown in Figure 4, designing a clamping plate 5 5 (C 1 ip), and the majority of the trays A stacking strip 56 (Tab) corresponding to the clamping plate 5 5 is formed on the pallet group 51 stacked on 50, so that the clamping plate 5 5 and the majority are clamped before the pallet group 51 is transported. The engaging relationship of the strip 56 is to hold the pallets 50 in a stable position, so that each pallet 50 is fixed by the clamping plate 55 during transportation without being displaced, thereby avoiding the substrate carried in each pallet 50. Shedding or damage. However, this design also has other disadvantages in use. First, the manufacturing cost of the clamping plate 55 is not low. With the large use of the tray 50, a large burden on the overall cost will be formed. The plate 5 5 and the clamping strip 5 6 on the tray 50 are firmly engaged, and the manufacturing precision thereof needs to be particularly precise, which will also cause processing.

17712 Silicon product. Pit 01 Page 10 200533569 V. Difficulty in the description of the invention (3); At the same time, the bigger problem is that if it is restricted by the fixed size of the clamping plate 5 5 after mass production, it will also be formed. The number of pallets 50 stacked in the pallet group 51 is limited, and the number of pallets 50 in the pallet group 51 cannot be increased or decreased according to actual needs. A better improvement method is strongly required to replace them. Therefore, how to develop a tray set for semiconductor packaging substrates to play the role of stably holding each stacking tray, and at the same time have the practical requirements of freely changing the number of tray stacks, low cost and high service life, have indeed been related to this field Urgent issues to be solved. [Summary of the Invention] Therefore, the main object of the present invention is to provide a tray set for a semiconductor package substrate capable of stably holding each stacking tray. Another object of the present invention is to provide a tray set for a semiconductor package substrate which can be used for a long time without being damaged. Still another object of the present invention is to provide a tray set for a semiconductor package substrate which can freely change the number of stacked trays. Another object of the present invention is to provide a tray set for a semiconductor package substrate which is low cost and easy to mass produce. Therefore, the tray set for a semiconductor package substrate proposed by the present invention includes: a plurality of trays stacked on each other, and each tray is formed with a plurality of brackets for carrying the semiconductor package substrate and for blocking each bracket Barrier structure, and at least one first fastening unit is formed on the outer edge of each tray; and at least one fastening member is provided with a plurality of second fastening units, so as to be simultaneously fastened by the second fastening unit. At the first fastening unit of the plurality of pallets stacked on each other, the plurality of pallets are stably stacked and positioned, wherein,

17712 Shi Xipin. Mouth Seven (1 Page 11 200533569 V. Description of the invention (4) The number of the second fastening unit is not less than the number of pallets stacked on each other ° The aforementioned first fastening unit may be one The formed protruding portion is injected, and the second fastening unit may be a button hole corresponding to the protruding portion. At the same time, the first fastening unit is respectively formed at the front and rear edges of two opposite sides of the tray, and The first fastening units on each tray are respectively formed at the same corresponding positions. In addition, the aforementioned fasteners can be a long plastic fastener, and the length is not less than the majority of the pallets stacked on each other. The total height of the stack, and the number of the second fastening units on the fastener is not less than the number of the pallets stacked on each other. Therefore, the tray set for the semiconductor package substrate proposed by the present invention is The matching design of the first fastening unit on the tray and the second fastening unit on the fastener exerts the effect of stably holding the stacked trays, which can avoid damage to the substrate on the tray and can also cooperate with the tray. Stacking number Increase and decrease the elasticity, and solve the disadvantages of the conventional positioning element manufacturing is not easy. [Embodiment] The following is a specific embodiment to explain the embodiment of the present invention, those who are familiar with this technology can easily understand from the content disclosed in this description Other advantages and effects of the present invention. The present invention can also be implemented or applied through other different specific examples. The details in this specification can also be made based on different perspectives and applications without departing from the spirit of the present invention. Modifications and changes. Preferred of the tray set 1 for a semiconductor package substrate proposed by the present invention

17712 ^ A.ptd Page 12 200533569 V. Description of the invention (5) The embodiment, as shown in Figure 1A, includes a plurality of pallets 10 (ding ray) stacked on each other, and each pallet 10 is formed. There are a plurality of brackets 11 arranged in an array and used to carry a semiconductor package substrate (not shown), and barrier structures 12 to block each bracket 11, and at the same time, the barrier structures 12 are vertically staggered. In position, a tenon 13 protruding from the barrier structure 12 is formed like a conventional tray to prevent the stacked trays 10 from contacting the substrate in the tray 10 of another layer. The tray set 1 of the present invention is characterized in that two opposite outer edges of each tray 10 are formed with two first fastening units 20 as shown in the top view of FIG. 1A or FIG. 1B. In the embodiment, the first fastening unit 20 is a protruding portion such as a convex button, which is made by injection molding and is formed on the front and rear ends of two opposite sides 15 of each tray 10 respectively. They are symmetrical to each other, and the positions of the protrusions 20 on each tray 10 are the same, so that after the trays 10 are stacked, the protrusions 20 on each tray 10 can be aligned on the same straight line; at the same time, The tray set 1 of the present invention further includes an additional fastening member 30 having a plurality of second fastening units 3 5. The fastening member 30 of this embodiment is a long plastic fastener, and the second The buckling unit 35 is a buckle hole opened in the plastic fastener, and the positions of the buckle holes 35 are corresponding to the positions of the most protrusions 20 of the trays 10, so that the buckle is 3 0 can be fastened to the protruding portions 20 of each tray 10 by the button holes 3 5 so as to be placed on both sides of the stacked trays 10 and to hold the phases firmly. The stack tray 10.

The number of the fasteners 30 can be increased or decreased depending on the number of the protrusions 20 formed on the sides 15 of the tray 10. In this embodiment, when the trays 10 are on the carrier substrate 2 5 After the stacking is completed, the tray group 1 is as the second A, 2 B

17712 硅 品 .ptd Page 13 200533569 5. Description of the invention (6) As shown in the figure, two sets of fasteners 3 0 (two side views of 2 B) symmetrical to the stack trays 10 are used in pairs. (Only shown on one side), thereby stably holding each tray 10 to prevent the substrate 25 in the tray 10 from falling off or being damaged during transportation. Compared with the conventional technology, the tray set 1 of the present invention obviously has a higher flexibility of the stacking number of trays 10, because the length of the strip-shaped fasteners 30 is not less than the stacking of the trays 10 The total height, and the number of rows of button holes 3 5 opened on the fastener 30 is not less than the number of the pallets 10 stacked on each other, plus the protrusions 20 on each pallet 10 are located at the same Corresponding positions, so even if the stacking number of pallets 10 of the pallet group 1 is increased or decreased, it will not form the restriction of the positioning of the fasteners 30, which fully meets the flexibility and requirements of plant handling. At the same time, the design of the aforementioned fasteners 30 and tray protrusions 20 does not reduce their positioning function due to long-term use, and there is no known problem with the failure of magic belts or rubber bands. With its simple design, it has the advantages of low cost and easy mass production. The foregoing embodiment discloses an example of the specific design, quantity, and position of the tray 10, the first fastening unit 20, and the fastener 30, and the second fastening unit 35 of the present invention. However, this example is not a limitation of the present invention. The shape, quantity, and position of the first fastening unit 20 can also be changed or increased or decreased according to the user's needs for positioning the tray 10, and the design of the fastening member 30 and the second fastening unit 3 5 The style can be changed with the first fastening unit 20, for example, the first fastening unit 20 on the outer edge of the tray 10 is a recessed hole, and the second of the fastening member 30 is changed. The fastening unit 35 is a protruding fastening portion, etc., and can also be applied to the hair

17712 Silicon Product. Mouth Seven (1 Page 14 200533569 V. Description of the Invention (7) states that it is only necessary to make its fastening relationship not limited to the stacking number of trays 10, that is, the above is only the best of the present invention. The embodiments are not intended to limit the scope of the present invention, that is, the present invention can in fact make other changes. Therefore, those skilled in the art can complete the work without departing from the spirit and technical ideas disclosed in the present invention. All equivalent modifications or changes shall still be covered by the scope of patent application mentioned later.

17712 Shi Xipin.ptd Page 15 200533569 Brief description of the drawings [Simplified description of the drawings] Figure 1 A is an exploded view of a preferred embodiment of the tray set of the present invention; Figure 1 B is a tray set of the present invention. An exploded top view of the preferred embodiment; FIG. 2A is a schematic diagram of the preferred embodiment of the tray set of the present invention after the carrier substrate is assembled and FIG. 2B is a preferred embodiment of the tray set of the present invention in the bearing A side view of the substrate and the assembly; FIG. 3A is a schematic diagram of a conventional tray structure; FIG. 3B is a schematic diagram of a conventional tray structure after a substrate is carried; and FIG. 4 is a US patent No. 5, 4 2 1, 4 5 Pallet group positioning method disclosed in No. 5 case. (Description of component symbols) I Tray set 10 Tray II Bracket 12 Barrier structure · 13 Tenon 15 Side 20 First fastening unit 25 Base plate 3 0 Fastener

17712 Silicone.ptd Page 16 200533569

17712 Shi Xipin. Oral Words (1 page 17

Claims (1)

200533569 6. Scope of patent application 1. A tray set for a semiconductor package substrate includes: a plurality of trays (T ray) stacked on each other, each tray is formed with a plurality of brackets for carrying the semiconductor package substrate and A blocking structure for blocking each bracket, and at least one first fastening unit is formed on the outer edge of each tray; and at least one fastener is provided with a plurality of second fastening units to borrow the second The fastening unit is simultaneously fastened to the first fastening unit of the plurality of pallets stacked on each other, so that the plurality of pallets are stably stacked and positioned, wherein the number of the second fastening unit is not less than the pallets stacked on each other. quantity. 2. The tray set for a semiconductor package substrate according to item 1 of the patent application scope, wherein the first fastening unit is a protruding portion. 3. For example, a tray set for a semiconductor package substrate of the scope of application for a patent, wherein the second fastening unit is a button hole. 4. For example, a tray set for a semiconductor package substrate of the scope of application for a patent, wherein the first fastening units are respectively formed on two opposite sides of the tray. 5. For example, a tray set for a semiconductor package substrate according to item 4 of the patent application scope, wherein the first fastening unit is formed at the front and back edges of two opposite sides of the tray, respectively. 6. The tray set for a semiconductor package substrate according to item 1 of the scope of patent application, wherein the first fastening units on the plurality of trays stacked on each other are respectively formed at corresponding corresponding positions. 7. If the tray set for the semiconductor package substrate of item 1 of the patent application scope, 17712 硅 品 .ptd Page 18 200533569 6. Scope of patent application Among them, the first fastening unit is made by injection molding. 8. The tray set for a semiconductor package substrate according to item 1 of the scope of the patent application, wherein the fastening member is in a strip shape, and the length is not less than the total stacking height of the plurality of trays stacked on each other. 9. A tray set for a semiconductor package substrate as claimed in item 1 of the patent scope, wherein the fastener is a plastic material. 10. The tray set for a semiconductor package substrate according to item 1 of the patent application, wherein most of the brackets on the tray are arranged in an array. 17712 Shi Xipin. Mouth Seven (1 page 19