TWM325443U - Heat sink apparatus for diode LED lighting - Google Patents

Heat sink apparatus for diode LED lighting Download PDF

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Publication number
TWM325443U
TWM325443U TW96208600U TW96208600U TWM325443U TW M325443 U TWM325443 U TW M325443U TW 96208600 U TW96208600 U TW 96208600U TW 96208600 U TW96208600 U TW 96208600U TW M325443 U TWM325443 U TW M325443U
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Taiwan
Prior art keywords
heat
light
emitting diode
substrate
lamp
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TW96208600U
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Chinese (zh)
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Bo-Huei Wei
Cheng-Gung Huang
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Bo-Huei Wei
Cheng-Gung Huang
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Priority to TW96208600U priority Critical patent/TWM325443U/en
Publication of TWM325443U publication Critical patent/TWM325443U/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

.Μ325443 • 八、新型說明: 【新型所屬之技術領域】 本創作係有關於一種燈具之散熱裝置,更具體而言之,特別是指 有關於一種吸熱導管中盛裝有液體之發光二極體燈具之散熱裝置。 【先前技術】 按,習用一般發光二極體(LED)燈具為了達到散熱的目的,幾乎 、都是利用熱能在燈具内部的輻射傳導,再藉由燈具的殼體將熱能傳遞 φ散逸至外面,不過,因為熱能的輻射傳導對於導熱而言,效率並不好, 容易造成發光二極體產生的熱能無法迅速排除,因而造成熱能積聚現 象,如此不僅易致配線或燈具構件損壞或熔毁,而且會加速造成發光 • 二極體的光衰情形,大幅減少其之使用壽命。 ^ 為了改善LED燈具的散熱絲,於是有業者開發出-種多熱管散 熱結構,如第1圖所示’係為第_0866號專利,其係利用在燈具1 上加設有若干熱管10及散_片n,如此LED 12發光所產生的轨能 .♦始能經由該各熱管10及散熱鰭片u而傳遞至該燈具i外面,從而達 •到散熱的目的,惟值得注意的是,利用該各熱管10及散熱韓片n以 將該燈具1的熱能吸收及導出,實際上並不如想像中的理想,因為該 各熱官10吸熱、導熱的速度極緩’乃無法使該燈具1達到快速降、田的 ㈣,結果熱能大量的在該燈具!内,終將影響到· 12的^用 壽命。 有鑑於此,本案創作人乃經詳思細索,並積多年 •之經驗,幾經試製與試作,終而得創作出—種發光二極體燈 5 M325443 裝置。 【新型内容】 本創作之首要目的,是在於提供一種發光二極體燈具之散熱裝 置,該散熱裝置可發揮快速地吸熱及導熱,使得燈具内的熱能可迅速 地被傳導至外面,如此熱能不致積聚在燈具内,將有助於減少發光二 極體的光衰速度,大幅延長其之使用壽命者。 ‘ 、緣是,依據本創作所提供之一種發光二極體燈具之散熱裝置,包 籲括: 預定數目之散熱鰭片,係_設在—燈具基板的外表面上,而該 基板在内表面上職置有縱數目之發光二極體; 吸熱導管,係為一内部盛裝有液體且封閉之中空 該燈具基板料絲上,讀雜賴則猶結。 本’J乍彳提供之-種發光二極體燈具之散熱 的吸熱導管其形狀係呈一字形或U字形,藉以增加其可適用之^圍吏。Μ 325443 • VIII. New description: [New technical field] This creation is about a heat sink for a luminaire, more specifically, a luminaire for a liquid-emitting diode containing a liquid in an endothermic conduit. The heat sink. [Prior Art] According to the conventional light-emitting diode (LED) lamp, in order to achieve the purpose of heat dissipation, almost all of the heat is radiated inside the lamp, and the heat energy transfer φ is dissipated to the outside through the casing of the lamp. However, because the radiation conduction of thermal energy is not good for heat conduction, it is easy to cause the thermal energy generated by the light-emitting diode to be quickly eliminated, thereby causing thermal energy accumulation, which is not only easy to cause damage or meltdown of wiring or lamp components, but also It will accelerate the light-emitting diodes and reduce the lifetime of the diodes. ^ In order to improve the heat-dissipating wire of the LED lamp, a manufacturer has developed a multi-heat pipe heat-dissipating structure, as shown in Fig. 1 , which is a patent of No. _0866, which uses a plurality of heat pipes 10 on the lamp 1 and散片片, such that the rail energy generated by the LED 12 illumination can be transmitted to the outside of the luminaire i via the heat pipes 10 and the heat dissipation fins u, thereby achieving the purpose of heat dissipation, but it is worth noting that The heat pipe 10 and the heat dissipating film n are used to absorb and extract the heat energy of the lamp 1 , which is actually not as ideal as expected, because the heat and heat conduction speed of each of the heat officials 10 is extremely slow, and the lamp 1 cannot be used. Achieving a rapid drop, the field (four), the result is a lot of heat in the fixture! Inside, it will eventually affect the life of the 12. In view of this, the creator of this case has carefully studied and accumulated many years of experience, after several trials and trials, and finally created a kind of light-emitting diode lamp 5 M325443 device. [New content] The primary purpose of this creation is to provide a heat sink for a light-emitting diode lamp, which can quickly absorb heat and heat, so that the heat energy in the lamp can be quickly transmitted to the outside, so that the heat is not Accumulation in the luminaire will help reduce the light decay speed of the LED and greatly extend its service life. The edge is a heat sink of a light-emitting diode lamp provided by the present invention, including: a predetermined number of heat-dissipating fins, which are disposed on the outer surface of the lamp substrate, and the substrate is on the inner surface The upper position is provided with a vertical number of light-emitting diodes; the heat-absorbing conduit is an inner liquid containing the liquid and closed to the hollow of the lamp substrate, and the reading is still awkward. The heat-absorbing conduit of the heat-dissipating light-emitting diode lamp provided by the present invention is in the shape of a figure or a U-shape, thereby increasing the applicable circumference.

【實施方式】 由預定數目之散伽之散絲置’如第2至3 _,主要係 該預定數目GL2片及=熱導管3所組合而成;其中: 上,而該編在該敎4的:設在—燈具4基板41的外表面 /、的内表面上則設置有預定數目之發光二極 6 ^ M325443 •體42,且利用一透明燈罩43封閉該燈具4者; 該吸熱導管3係為-内部盛裝有液體31且封閉之中空金屬管(本 實施例係舉製作成u字形為例),乃固設在該燈具4基板4丨的外表面 上,且與該各散熱鰭片2呈相連結狀態,使得該吸熱導管3與該各散 熱鰭片2得緊密結合為-體,而為增加其間導熱之效率,其中在該吸 熱導管3與該各散細片2之間、在該吸鮮管3與該基板41之間以 ‘及在该各散熱鰭片2與該基板41之間都可再塗覆以導熱膏,如此將有 籲助於其間熱量贼全傳遞:此外,值得注意的是,如第4圖所示,其 中吸熱導管5也可以是形狀成型為一字形内部盛裝有液體51之中空金 屬管,並不影響其與該各散熱鰭片2及基板41的連結。 如第5圖所示,係顯示其中該吸熱導管6係部份地嵌設在該基板 41内,使該吸熱導管6可與該基板41接觸的面積變大,如此即有助 於加速熱能的吸收及傳導。 此外,如第6圖所示,旨在說明在該燈具4基板41的外表面上, •可同時固設有兩組相同的吸熱導管3與各散熱鰭片2,其吸收燈具4 内部熱能及將熱能再傳導散熱至外面的能力係同於先前實施例者;而 如第7圖所示,則係顯示其中該兩組吸熱導管3均係部份地嵌設在該 基板41内’使該各吸熱導管3可與該基板41接觸的面積變得更大, 如此將有助於加速熱能的吸收及傳導。 值得注意的是,為配合目前發光二極體燈具之實際運作,如第8 圖所示’其中該基板7可以係由一線路板71及一金屬板72所重疊組 . 成,其中該線路板71係供發光二極體42安裝連結之用,再將該線路 • M325443 .板71固設在該燈具4殼體之金屬板72上,同樣的透過該燈具4殼體 之金屬板72亦可將熱能傳遞散發出去。 至於本創作發光二極體燈具之散熱裝置其散熱之動作原理,請參 閱第2、4、5圖所示,該燈具4内部發光二極體42所產生之熱能,只 月色直接傳導至與其直接接觸之基板41,此時由於該基板41上連結有 吸熱導管3、5、6,因此熱能即會為該各吸熱導管3、5、6所吸收, •因為該各吸熱導管3、5、6内部均盛裝有液體31、51、61,該液體31、 籲51、61可供作為吸熱及散熱之介質使用,利用該液體31、5][、61將 可加速熱能的吸收及傳導,也就是說該燈具4發光二極體42所產生之 熱量在該各吸熱導管3、5、6内部液體31、51、61快速吸熱暨傳導作 用下’自可驗具4崎的高溫迅速抽離,並進-步將溫度傳導至該 各散熱鰭片2以達到快速降溫的目的。 表τ'上所述,本案創作實施例所揭露之散熱裝置,該散熱裝置可發 揮快速地吸減導熱,使紐制的熱能可迅速地被料至外面,如 φ此熱能不致積聚在燈具内,將有助於減少發光二極體的光衰速度,大 幅延長其之個壽命者,所財創狀實雜已毋庸置疑 ,此外本創 乍實關所揭路之結構,巾請前並未見諸刊物,亦未曾公開使用,是 文本發明之新穎性』及『進步性』又均已符合,爰依法提出新型 專利之申請,祈請惠予審查並早日賜准專利,減德便。 “ M325443 【圖式簡單說明】 第1圖習用發光二極體燈具之散熱裝置之縱向斷面示意圖。 第2圖本創作之縱向斷面示意圖。 第3圖本創作之立體示意圖。 第4圖本創作顯示吸熱導管為一字形型態之縱向斷面示意圖。 第5圖本創作顯示吸熱導管為嵌設型態之縱向斷面示意圖。 第6圖本創作顯示兩組吸熱導管及散熱鰭#固設在基板表面之縱 向斷面示意圖。 第7圖本__兩組吸熱導管及散熱則舰在基板内之縱向 斷面示意圖。 第8圖本創作顯示基板係由線路板與金屬板結合而成之縱向斷面 示意圖。 【主要元件符號說明】 1 燈具 10 熱管 11 散熱鰭片 12 LED 2 散熱續片 3 吸熱導管 31 液體 4 燈具 41 基板 42 發光二極體 43 燈罩 5 吸熱導管 51 液體 6 吸熱導管 61 液體 ,M325443 7 基板 72 金屬板[Embodiment] A predetermined number of scattered filaments are set as '2nd to 3rd', mainly composed of the predetermined number of GL2 sheets and = heat pipes 3; wherein: a predetermined number of light-emitting diodes 6 ^ M325443 body 42 are disposed on the inner surface of the outer surface / of the substrate 4 of the lamp 4, and the lamp 4 is closed by a transparent lamp cover 43; the heat pipe 3 is The hollow metal tube (which is exemplified in the U-shape) is filled with the liquid 31 and is fixed on the outer surface of the substrate 4 of the lamp 4, and the heat dissipation fins are 2 is in a connected state, so that the heat absorbing duct 3 and the heat dissipating fins 2 are tightly combined into a body, and in order to increase the efficiency of heat conduction therebetween, between the heat absorbing duct 3 and the respective fins 2, The fresh tube 3 and the substrate 41 can be recoated with a thermal paste between the heat sink fins 2 and the substrate 41, so that there is a call for the heat thief to pass through: It should be noted that, as shown in FIG. 4, the heat absorbing duct 5 may also be shaped into a shape. There are 51 containing empty liquid metal in the pipe, which is connected to not affect the respective radiation fins 2 and the substrate 41. As shown in FIG. 5, it is shown that the heat absorbing duct 6 is partially embedded in the substrate 41, so that the area in which the heat absorbing duct 6 can contact the substrate 41 becomes large, which contributes to the acceleration of thermal energy. Absorption and conduction. In addition, as shown in FIG. 6, it is intended to illustrate that on the outer surface of the substrate 41 of the lamp 4, two sets of the same heat absorbing duct 3 and the heat radiating fins 2 can be simultaneously fixed, which absorb the internal heat energy of the lamp 4 and The ability to dissipate heat energy to the outside is the same as in the previous embodiment; and as shown in Fig. 7, it is shown that the two sets of heat absorbing ducts 3 are partially embedded in the substrate 41. The area in which each of the heat absorbing conduits 3 can contact the substrate 41 becomes larger, which will help accelerate the absorption and conduction of thermal energy. It is worth noting that in order to cooperate with the actual operation of the current LED lamp, as shown in FIG. 8 , the substrate 7 can be stacked by a circuit board 71 and a metal plate 72. The circuit board is formed. The 71 series is used for mounting and connecting the light-emitting diodes 42, and the line M325443 is fixed to the metal plate 72 of the casing of the lamp 4, and the metal plate 72 of the casing of the lamp 4 can also be passed through. Dissipate heat energy. As for the principle of heat dissipation of the heat sink of the light-emitting diode lamp, as shown in Figures 2, 4 and 5, the heat generated by the internal light-emitting diode 42 of the lamp 4 is directly transmitted to the moonlight. The substrate 41 is in direct contact with the heat-absorbing conduits 3, 5, and 6 connected to the substrate 41, so that the heat is absorbed by the heat-absorbing conduits 3, 5, and 6, because the heat-absorbing conduits 3, 5, The inside of the 6 is filled with liquids 31, 51, 61. The liquids 31, 51, 61 can be used as a medium for heat absorption and heat dissipation, and the liquid 31, 5] [, 61 can accelerate the absorption and conduction of heat energy, That is to say, the heat generated by the light-emitting diode 42 of the lamp 4 is quickly extracted from the high temperature of the self-checking tool 4, under the rapid heat absorption and conduction of the liquids 31, 51, and 61 of the heat-absorbing conduits 3, 5, and 6. Further, the temperature is transmitted to the heat dissipation fins 2 to achieve rapid cooling. As shown in the table τ', the heat dissipating device disclosed in the creation example of the present invention can quickly absorb and reduce the heat conduction, so that the thermal energy of the button can be quickly discharged to the outside, such as φ, the heat energy does not accumulate in the lamp. It will help to reduce the light decay rate of the light-emitting diodes and greatly extend the life of the light-emitting diodes. The financial creations are undoubtedly complicated, and the structure of the roads revealed by the company is not Seeing the publications, they have not been used publicly, and the novelty of the text invention and the "progressiveness" have all been met. The application for a new type of patent is filed according to law, and the application for review and early grant of patents will be granted. M325443 [Simple description of the drawing] Fig. 1 is a schematic longitudinal sectional view of a heat dissipating device for a light-emitting diode lamp. Fig. 2 is a schematic longitudinal sectional view of the creation. Fig. 3 is a perspective view of the creation. The creation shows a schematic view of the longitudinal section of the heat-absorbing conduit in a flat shape. Figure 5 shows the longitudinal section of the heat-absorbing conduit in the embedded configuration. Figure 6 shows the two sets of heat-absorbing conduits and heat-dissipating fins #fixed Schematic diagram of the longitudinal section on the surface of the substrate. Figure 7 is a schematic diagram of the longitudinal section of the two sets of heat-absorbing conduits and heat sinks in the substrate. Figure 8 shows that the substrate is made up of a combination of a circuit board and a metal plate. Schematic diagram of longitudinal section [Description of main components] 1 Lamp 10 Heat pipe 11 Heat sink fin 12 LED 2 Heat sink 3 Heat pipe 31 Liquid 4 Lamp 41 Base plate 42 Light-emitting diode 43 Lampshade 5 Heat pipe 51 Liquid 6 Heat pipe 61 Liquid, M325443 7 substrate 72 metal plate

Claims (1)

,M325443 九、申請專利範圍: 1· 一種發光二極體燈具之散熱裝置,包括: 預疋數目之散_>;,係均固設在—燈具基板的外表面上,而 該基板在内表面上則設置有預定數目之發光二極體; -吸熱導管,係為-内部盛裝有液體且封閉之中空管,乃固执 在該燈具基板的外表面上,且與該各散熱鰭片相連結。 ’又 裝置,其中 φ 2·根據申請專利範圍第】項所述的發光二極體燈具之散熱 該吸熱導管的形狀係呈一字形。 3·根據申請專利細第丨撕述的發光二極體燈具之散熱|置, 該吸熱導管的形狀係呈U字形。 、其中 ,其中 4·根據申請專利範圍第1項所述的發光二極體燈具之散熱妒置 • 該吸熱導管的數目為一只以上。 裝置,其中 5·根據申請專利範圍第1項所述的發光二極體燈具之散執 該基板係由一線路板及一金屬板所重豐組成。 ,其中 根據申請專利範圍第1項所述的發光二極體燈具之散熱穿置 該吸熱導管係接合在該基板的外表面上。 11 6· ^ M325443 7.根據申請專利範圍1所述的發光二極體燈具之散熱裝置,其中該吸 熱導管係部份地嵌設在該基板内。M325443 IX. Patent application scope: 1. A heat sink for a light-emitting diode lamp, comprising: a predetermined amount of _>; a predetermined number of light-emitting diodes are disposed on the surface; - an heat-absorbing conduit is a hollow tube that is filled with a liquid and is enclosed, and is fixed on the outer surface of the lamp substrate, and is opposite to the heat-dissipating fins link. Further, the device, wherein φ 2·the heat dissipation of the light-emitting diode lamp according to the scope of the patent application is in a shape of a line. 3. According to the heat dissipation of the light-emitting diode lamp which is described in the patent application, the shape of the heat-absorbing conduit is U-shaped. Among them, 4· The heat dissipation device of the light-emitting diode lamp according to the first application of the patent application scope 1 • The number of the heat absorption pipes is one or more. The device, wherein the substrate of the light-emitting diode lamp according to claim 1 is composed of a circuit board and a metal plate. The heat-dissipating light-emitting diode of the light-emitting diode lamp according to claim 1 is bonded to the outer surface of the substrate. The heat sink of the light-emitting diode lamp of claim 1, wherein the heat sink conduit is partially embedded in the substrate. 1212
TW96208600U 2007-05-25 2007-05-25 Heat sink apparatus for diode LED lighting TWM325443U (en)

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