M320824 八、新型說明： 【新型所屬之技術領域】 本創作係涉及内埋式被動元件成型裝置， 提高内埋式被動元件之可靠度，且使芯板、^ I 電層緊密結合之内埋式被動元件成型裝置。均以及導 【先前技術】 知：，隨著通訊電子產品日益進步，輕一 已是市場主流趨勢’縮小零組件體積與使== 成為產品設計與應用之重點。系統構 用數目逐M320824 VIII. New Description: [New Technology Field] This creation involves embedded passive component molding equipment, which improves the reliability of embedded passive components, and makes the core board and the electrical layer tightly integrated. Passive component forming device. Both and the prior art [Prior Art] Know: With the advancement of communication electronic products, the light one is the mainstream trend in the market. 'Reducing the volume of components and making == become the focus of product design and application. Number of system configurations
Package)具有縮小構裝面積、高速化、開發(時ln 產成本低等優勢，已成為取代傳統個別構裝；二：f生 f。整個系統構裝分為整合型基板與高 ::中整合型基板強調基板的高功能及整合特= 也气3希望能將主動元件及光傳導通路 :例:奈米材料)及製程，將互連間距由現有：： 降到議微米以下在有限的基板空問内，縮小或埋 =動70件以創造更多空間來架構主動元件為目前廠商 ^模組化之重要技術。—般而言’内埋元件基板技術的 整合’可以用來取代傳統離散式被動元件（例如電 谷、電阻及電感等）’以新的功能性高分子複合材料技術， 將被動元件以塗佈、網印、壓合、㈣··· #方式埋藏 在電路板的内層中。内層的材料與疊層結構可以依照實際 5Package) has the advantages of reduced construction area, high speed, development (time and low production cost, etc., has become a substitute for the traditional individual structure; two: f raw f. The whole system is divided into integrated substrate and high:: integration The type of substrate emphasizes the high function and integration of the substrate. It is also expected that the active components and the light-conducting path: for example, nanomaterials and processes, reduce the interconnect pitch from the existing:: to less than the micron in the limited substrate. Within the space, shrinking or burying 70 pieces to create more space to construct active components is an important technology for current manufacturers. In general, the 'integration of embedded component substrate technology' can be used to replace traditional discrete passive components (such as electric valleys, resistors and inductors) to coat passive components with new functional polymer composite technology. , screen printing, pressing, (4) ··· # Way buried in the inner layer of the circuit board. The material and laminate structure of the inner layer can be practical.
如第一圖及第二圖所示，係為一般習有内埋式被動元 件成裂結構示意圖，其設有一芯板11，該芯板11上下侧 係具有内層線路層111，另有兩導電層12上設置有内埋 M320824 應用時之電路特性與需求來作選擇。傳統將被動元件堆疊 在基板外側（可能是基板的上下兩侧），可想而知有整體 組件厚度可觀之缺點。而相較於此，將被動元件内埋至基 板的優點眾多，除了可省下基板表面的空間使基板所需之 表面積縮小和整體組件厚度倍減之外，還可因被動元件埋 至基板内而大幅減少電路板之焊錫接點，降低因高頻所產 生之寄生效應，進而提升射頻模組在高頻的電氣響應，並 增加模組製作與組裝的良率與可靠度；也由於上述之優 點，使製造成本大幅降低，以目前被動零件的數量每年成 長30 %，同時基板面積以每年縮小30%的發展情勢下， 傳統離散式被動元件的更新替換勢在必行。因此如何將元 件精準地埋入基板内以形成一種穩定的基板結構，已為相 關業界努力研發的重要目標之一。 層13 ’將兩導電層12置於芯板11上下侧，並使内埋層 13置於導電層12與芯板11之間，再利用壓合方式由兩 導電層12朝芯板11 一侧壓合固定，使芯板u、内埋層 13以及導電層12壓合構成内埋式被動元件1。 惟’該導電層12 —般係為銅皮構成，故在進行壓合 過&中’壓合的力量無法平均分布於導電層12上，使得 導電層12上之内埋層13無法完全填滿於内層線路層111 +各線路間’而存在有空隙A，使得導電層12與芯板11 6 M320824 之結合力不佳容易相互剝離，而使得其可靠度降低。 【新型内容】 有鑑‘於此，本創作之主要目的係在於解決上述之缺 失，本創作係為一種可提高内埋式被動元件之可靠度，且 使芯板、内埋層以及導電層緊密結合之内埋式被動元件成 ‘ 型裝置。 為達上述目的，本創作之内埋式被動元件成型裝置， 其至少包含有：一芯板、至少二導電層、内埋層、高分子 層以及壓合件，該芯板上下侧係具有内層線路層，而芯板 上下側並依序疊設有内埋層、導電層以及高分子層，而該 〜 壓合件則於高分子層一側進行壓合，使芯板、内埋層以及 . 導電層壓合構成内埋式被動元件，進而使内埋層得以緊密 與芯板以及導電層結合。 【實施方式】As shown in the first figure and the second figure, it is a schematic diagram of a conventional cracked structure of a buried passive component, which is provided with a core board 11 having an inner layer circuit layer 111 on the upper and lower sides, and two conductive layers. The layer 12 is provided with a selection of circuit characteristics and requirements for embedding the M320824 application. Conventionally, passive components are stacked on the outside of the substrate (possibly on the upper and lower sides of the substrate), and it is conceivable that the thickness of the overall component is considerable. In contrast, the advantages of embedding a passive component in a substrate are numerous, except that the space on the surface of the substrate can be saved to reduce the surface area required for the substrate and the thickness of the entire component, and the passive component can be buried in the substrate. And greatly reduce the solder joints of the circuit board, reduce the parasitic effects caused by high frequency, thereby improving the electrical response of the RF module at high frequencies, and increasing the yield and reliability of module fabrication and assembly; The advantages are that the manufacturing cost is greatly reduced. With the current number of passive parts growing by 30% per year, and the substrate area is reduced by 30% per year, the replacement of traditional discrete passive components is imperative. Therefore, how to accurately embed the components in the substrate to form a stable substrate structure has become one of the important goals of the related industry. The layer 13' places the two conductive layers 12 on the upper and lower sides of the core board 11, and places the buried layer 13 between the conductive layer 12 and the core board 11, and then presses the two conductive layers 12 toward the side of the core board 11 by pressing. The press-fit is fixed, and the core board u, the buried layer 13 and the conductive layer 12 are pressed together to form the buried passive element 1. However, the conductive layer 12 is generally made of copper, so that the force of pressing in the press-over & cannot be evenly distributed on the conductive layer 12, so that the buried layer 13 on the conductive layer 12 cannot be completely filled. There is a gap A between the inner layer circuit layer 111 and each line, so that the bonding force between the conductive layer 12 and the core board 11 6 M320824 is easily peeled off from each other, so that the reliability thereof is lowered. [New content] This is the main purpose of this creation is to solve the above-mentioned defects. This creation is to improve the reliability of embedded passive components and to make the core board, buried layer and conductive layer tight. The embedded passive component is combined into a 'type device. In order to achieve the above object, the embedded passive component forming device of the present invention comprises at least: a core plate, at least two conductive layers, an inner layer, a polymer layer and a pressing member, and the lower layer of the core has an inner layer a circuit layer, and a buried layer, a conductive layer and a polymer layer are sequentially stacked on the lower side of the core board, and the pressing member is pressed on one side of the polymer layer to make the core board and the buried layer and The conductive laminate forms a buried passive component, which in turn allows the buried layer to be tightly bonded to the core and conductive layers. [Embodiment]
為能使貴審查委員清楚本創作之結構組成，以及 整體運作方式，茲配合圖式說明如下： 本創作「内埋式被動元件成型裝置」如第三圖所示， 係至少包含有： 一芯板21，該芯板21上下側係具有内層線路層211。 至少二導電層22，如圖所示，係具有二導電層22設 於芯板21上下側，該導電層22可以為銅材質。 内埋層23，如圖所示之實施例中，其内埋層23係為 7 M320824 塗佈於導電層22 —側之電容。 高分子層24，係設於各導電層22相對於芯板21之 另側，其高分子層24可以為矽膠墊、離型膜或聚乙烯膜 (PE 膜）。 ' 整體組裝時，將兩導電層22疊置於芯板21上下側， 並使内埋層23置於導電層22與芯板21之間，亦即芯板 ' 21上下侧之内層線路層211上依序設有内埋層23、導電 層22以及高分子層24，並利用一壓合件25設於高分子 層24外側，對高分子層24進行壓合，如第四圖所示，可 將高分子層24剝離，而使芯板21、内埋層23以及導電 層22壓合構成内埋式被動元件2，如第五圖所示。 - 再者，亦可先將内埋層23塗佈於芯板21之内層線路 . 層211上，如第六圖所示，同樣將二導電層22置於芯板 21上下側後，於二導電層22外利用高分子層24以及壓 合件25，對高分子層24進行壓合，如第七圖所示，同樣 可使怒板21、内埋層23以及導電層22壓合構成内埋式 ^ 被動元件2 ;當然，内埋式被動元件之結構可由上述各實 - 施例之結構所組成，亦可由不同結構組成，例如芯板上下 兩側設有一層以上之導電層等。 值得一提的是，本創作利用具有流動性及可塑性之高 分子層疊設於導電層外再進行壓合，可使壓合件壓合之力 量藉由高分子層均勻分布於導電層上，使欲壓合之内埋層 得以完全填充於内層線路層之各線路間，令内埋層得以緊 密與芯板以及導電層結合，增加該内埋式被動元件之可靠 8 M320824 度。 如上所述，本創作提供一種較佳可行内埋式被動元件 成型裝置，爰依法提呈新型專利之申請；惟，以上之實施 說明及圖式所示，係本創作較佳實施例者，並非以此侷限 _ 本創作，是以，舉凡與本創作之構造、裝置、特徵等近似 或相雷同者，均應屬本創作之創設目的及申請專利範圍之 内。 ^【圖式簡單說明】 第一圖係為習有内埋式被動元件未壓合之結構示意圖。 第二圖係為習有内埋式被動元件之結構示意圖。 - 第三圖係為本創作中内埋式被動元件未壓合之結構示意 . 圖。 第四圖係為本創作中内埋式被動元件壓合完成之結構示 意圖。 第五圖係為本創作中内埋式被動元件之結構示意圖。 % 第六圖係為本創作中内埋式被動元件未壓合之另一結構 - 示意圖。 第七圖係為本創作中内埋式被動元件之另一結構示意圖。 9 M320824 【主要元件代表符號說明】 芯板11 内層線路層111 導電層12 内埋層13 内埋式被動元件2 芯板21 内層線路層211 導電層22 内埋層23 高分子層24 壓合件25In order to enable your review board members to understand the structure of the creation and the overall operation mode, the following is a description of the following: The creation of the "buried passive component molding device" as shown in the third figure includes at least one core. The board 21 has an inner layer circuit layer 211 on the upper and lower sides. At least two conductive layers 22, as shown, have two conductive layers 22 disposed on the upper and lower sides of the core plate 21, and the conductive layer 22 may be made of copper. The buried layer 23, as in the illustrated embodiment, has a buried layer 23 of 7 M320824 applied to the side of the conductive layer 22. The polymer layer 24 is disposed on the other side of each of the conductive layers 22 with respect to the core plate 21. The polymer layer 24 may be a silicone pad, a release film or a polyethylene film (PE film). In the overall assembly, the two conductive layers 22 are stacked on the upper and lower sides of the core board 21, and the buried layer 23 is placed between the conductive layer 22 and the core board 21, that is, the inner layer circuit layer 211 on the upper and lower sides of the core board '21. The buried layer 23, the conductive layer 22 and the polymer layer 24 are sequentially disposed on the outer side of the polymer layer 24 by a pressing member 25, and the polymer layer 24 is pressed together, as shown in the fourth figure. The polymer layer 24 can be peeled off, and the core plate 21, the buried layer 23, and the conductive layer 22 are pressed together to form the buried passive element 2, as shown in the fifth figure. - Further, the buried layer 23 may be first applied to the inner layer of the core board 21. On the layer 211, as shown in the sixth figure, the second conductive layer 22 is also placed on the upper and lower sides of the core board 21, and then The polymer layer 24 is pressed by the polymer layer 24 and the pressing member 25 outside the conductive layer 22, and as shown in the seventh figure, the anger plate 21, the buried layer 23, and the conductive layer 22 can also be pressed together. Buried ^ Passive component 2; Of course, the structure of the buried passive component may be composed of the structures of the above embodiments, or may be composed of different structures, for example, more than one conductive layer on the lower side of the core. It is worth mentioning that this product uses a polymer layer with fluidity and plasticity to be laminated on the conductive layer and then pressed, so that the force of pressing the pressing member can be evenly distributed on the conductive layer by the polymer layer. The buried layer to be pressed is completely filled between the lines of the inner circuit layer, so that the buried layer can be tightly combined with the core board and the conductive layer, thereby increasing the reliability of the buried passive component by 8 M320824 degrees. As described above, the present invention provides a preferred and feasible embedded passive component molding apparatus, and an application for a new patent is proposed according to the law; however, the above embodiments and drawings show that the preferred embodiment of the present invention is not This limitation is based on the fact that the structure, device, features, etc. of the creation are similar or identical, and should be within the creation purpose of the creation and the scope of patent application. ^ [Simple description of the diagram] The first diagram is a schematic diagram of the structure in which the embedded passive components are not pressed. The second figure is a schematic diagram of the structure of a buried passive component. - The third diagram is a schematic representation of the structure of the embedded passive components in the creation. The fourth figure is a structural schematic of the completion of the pressing of the embedded passive components in the creation. The fifth picture is a schematic diagram of the structure of the embedded passive component in the creation. % The sixth figure is another structure of the embedded passive component that is not pressed in the creation. The seventh figure is another schematic diagram of the buried passive component in the creation. 9 M320824 [Description of main component representative symbols] Core board 11 Inner wiring layer 111 Conductive layer 12 Buried layer 13 Buried passive component 2 Core board 21 Inner layer circuit layer 211 Conductive layer 22 Buried layer 23 Polymer layer 24 Press part 25