M312752 八、新型說明： ^ 【新型所屬之技術領域】 - 本創作係有關一種半導體封裝技術，特別是關於一種快閃記憶卡 之封裝結構。 【先前技術】 按，微型安全數位記憶卡（micro Secure Digital Memory Card， micro SD Card)係一種很輕巧的可攜式資料餘存裝置，可用於各 種不同的電子裝置，如個人電腦、手機、數位相機等等。習知 微型安全數位記憶卡之切割製程，係將鑄模（m〇lding)過後之 複數封裝體切割成單顆封裝體。如第1A圖及第1B圖所示，第 1A圖及弟1B圖分別為微型安全數位記憶卡之正視圖及後視圖， 微型SD卡100的形狀為多邊形且在其一側有一凸起及一凹陷之 形狀102。 參照第2圖為一般已知形成單顆微型sd卡方法之正面示意 圖，於一基板110上棑列複數個單顆微型SD卡模組基板12〇， 將晶片（圖上未不）放置於適當位置之後，利用封裝膠體13〇覆 蓋包含單顆微型SD卡模組基板12〇之基板11〇表面，待封裝膠 體130硬化後，利用水刀（water jet)或是雷射切割（laser cutdng ) (圖上未不）精準的將複數封裝體切割成如第1A圖之單顆微型 SD卡1〇〇。然而，雷射機器及水刀都是相當昂貴的機台設備，水 刀設備甚至需要額外購買研磨料（abrasive)來達到切割的功用； 另外，不卿利用水刀或是雷射切割的方式來進行切割製程，都必 須花上較多的時間作精準的校正及緩慢的切割，生產率也相對的 較低。同時切割面較為粗糙，尺寸不易控制，容易引起使用插拔 不易的問題。 5 M312752 第8A圖、第8B圖與第8C圖係以習知技術為切割完成單顆 微型SD卡100之側面與仰視示意圖。如第8A圖所示，微型SD 卡模組基板120會裸露於微塑SD卡1〇〇之側面，微型SD卡模 組基板120上之金屬走線122亦暴露突出於外，容易在使用插拔 後造成金屬碎屑污染與接觸不良。一般解決之道為先於其綠漆 (solder mask )邊緣處開窗再以回餘刻（etch back )方式將金屬 走線蝕刻掉，再進行習知封裝製程。然而，如第8B圖與第8C 圖所示，切割完成單顆微型SD卡1 〇〇於去角處理後，於斜角處 無法以相同方式解決微型SD卡模組基板12〇上之金屬走線122 暴露突出於外之問題。 為了達到產品切割無毛邊的訴求，昂貴的切割設備、低產出 率、及高昂的成本為其美中不足之處，因此，如何克服上述問題 與簡化製程提高良率是目前業界所急迫需要的。 【新型内容】 有鑑於此，本創作係針盤 之封狀辞構。 、上述之困擾，提出一種快閃記憶卡 本創作目的之一，係在楹 山士 *仏抓斗…也加他 和供一種快閃記憶卡之封裝結構，藉 此基板在進行龍步料，驗純及減個連接段，使 | @ & y 、項在獨立的記憶卡模組基板上注入 封裝材料，可避免封裝材料的^ & 勺浪費及減少封裝材料之成本。 本創作目的之一，係在接# 由在基板料複數個獨立的種㈣記憶卡之封裝結構，藉 此基板在進㈣❹科，基減複數錢接段，使 料，其中封裝⑽之覆蓋面積^記憶卡模組基板上注入封裝材 可設計尺寸精良之特殊形狀”於讀卡模組基板之面積，故 I程穩定無須大範圍切割後修邊。 6 M312752 由沖壓方式…係在提供—種快閃記憶卡之封裝結構，藉 進行切=用昂貴之切割機器，例如水刀機器或雷射機台，來 疋订動作以降低生產設備成本及提高產能 ίΓΓ的之―，係在提供—種快閃記憶卡之封裝結構 由沖壓應哭 —下I封裝結構，藉 切判時如沖床，來進行封裝體切割製程，因沖壓機器進行 α Ά傳統雷射切割或水刀切割要快，可以提高產能。M312752 VIII. New Description: ^ [New Technology Field] - This creation is about a semiconductor packaging technology, especially regarding a package structure of a flash memory card. [Prior Art] Press, micro Secure Digital Memory Card (micro SD Card) is a very lightweight portable data storage device that can be used in various electronic devices such as personal computers, mobile phones, and digital devices. Camera and more. Conventional micro-safety digital memory card cutting process is to cut a plurality of packages after the mold (m〇lding) into a single package. As shown in FIG. 1A and FIG. 1B, FIG. 1A and FIG. 1B are respectively a front view and a rear view of the micro secure digital memory card, and the micro SD card 100 has a polygonal shape and has a protrusion and a side on one side thereof. The shape 102 of the depression. Referring to FIG. 2, a front view of a method for forming a single micro sd card is generally known. A plurality of single micro SD card module substrates 12 棑 are arranged on a substrate 110, and the wafer (not shown) is placed in an appropriate manner. After the position, the surface of the substrate 11 including the single micro SD card module substrate 12 is covered by the encapsulant 13 ,, and after the encapsulation colloid 130 is hardened, a water jet or a laser cutdng is used ( The figure does not accurately cut the complex package into a single micro SD card as shown in Figure 1A. However, laser machines and waterjets are quite expensive machine equipment. Waterjet equipment even needs to purchase additional abrasives to achieve the function of cutting. In addition, it is not clear to use waterjet or laser cutting. For the cutting process, it takes a lot of time for precise correction and slow cutting, and the productivity is relatively low. At the same time, the cutting surface is rough and the size is not easy to control, which is easy to cause the problem of difficulty in using the plugging and unplugging. 5 M312752 Fig. 8A, Fig. 8B and Fig. 8C are schematic views showing the side and bottom view of a single micro SD card 100 for cutting by a conventional technique. As shown in FIG. 8A, the micro SD card module substrate 120 is exposed on the side of the microplastic SD card, and the metal traces 122 on the micro SD card module substrate 120 are also exposed and protruded. Corrosion of metal debris and poor contact after pulling. The general solution is to open the window at the edge of the powder mask and then etch back the metal traces in an etch back manner before performing the conventional packaging process. However, as shown in FIG. 8B and FIG. 8C, after the single micro SD card is cut and cut, the metal on the micro SD card module substrate 12 cannot be solved in the same manner at the oblique angle. Line 122 is exposed to problems that are outstanding. In order to meet the requirements of product cutting without burrs, expensive cutting equipment, low output rate, and high cost are in the ointment. Therefore, how to overcome the above problems and simplify the process to improve the yield is urgently needed by the industry. [New content] In view of this, this creation is the seal of the dial. The above-mentioned troubles, one of the purposes of the creation of a flash memory card, is in the 楹 士 士 仏 ... ... ... ... 也 也 也 也 也 也 也 也 也 也 也 也 也 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供 供Verifying the purity and subtraction of the connection section, so that | @ & y, the item is injected into the packaging material on the independent memory card module substrate, can avoid the waste of the packaging material and reduce the cost of the packaging material. One of the purposes of this creation is to connect the packaging structure of the memory card by a plurality of independent species (four) in the substrate material, whereby the substrate is in the (four) ❹科, base reduction complex number of segments, the material, the coverage area of the package (10) ^Injecting the package material on the memory card module substrate can design a special shape with excellent size" on the area of the card reader module substrate, so the I process is stable without the need for extensive cutting and trimming. 6 M312752 by stamping method... The structure of the flash memory card is cut by the use of expensive cutting machines, such as waterjet machines or laser machines, to reduce the cost of production equipment and increase productivity. The package structure of the flash memory card should be crying--I package structure, and the package cutting process can be carried out by cutting the judgment time, such as punching machine, α Ά traditional laser cutting or water knife cutting is fast, can improve Capacity.
*其=作!的之―’係在提供—種快閃記憶卡之封裝結構，藉 土，之連接段的設計’可料特過程相沖壓太接近封裝 體而U成封裝材料㈣或封裝體斷裂，進而可以提昇生產 本創作目的之-，録提供-種㈣記針之封裝結構，利 用鑛齒工具、晶片切割機之鑽石刀刀或高轉速之印刷電路板成型 铁刀’精準的將封㈣因㈣切狀❹餘的邊料磨平以達 品無毛邊之要求。 本創作=的之_，係在提供—種㈣記憶卡之封裝結構，兑 封裝材料，直接塑成—去角化標準外型可簡化去角程序且封裝 材料之覆^面積係大於記憶卡模組基板之面積，故記憶卡模组基 板上之金屬走線不會於側面裸露導致其後使用時因金屬碎屑 (dust)造成污染或接觸不良。 根據上述目的，本創作之一實施例係提供一種快閃記情卡之 封裝結構，料括：-基板，基板上具有複數個記憶卡模二板 設置於其上且母记憶卡模組基板係以複數個連接段與基板懸 空相接，曰曰片，係分別設置於每一記憶卡模組基板上，其中晶 片係與每憶卡模組基板電性連接；以及一封裝材料，係分別 覆蓋晶片與記憶卡模組基板之上表面並暴露出記憶卡模組基板 之下表面與部分連接段。 M312752 本創作之另實施例係提供一種快閃記憶卡之封裝結構，係 包括：了記憶卡模組基板，係'具有複數個連接段用以與一基板懸 工相接’ ’m於記憶卡模組基板上，其中晶片係與記 憶卡模組基板電性連接；以及_封裝材料，係覆蓋晶片、記憶卡 模組基板之上表_連接段輕露出記針·基板之下表面。 【實施方式】* Its = "!" is provided in the package structure of a flash memory card, borrowing soil, the design of the connection section can be stamped too close to the package and U into the packaging material (four) or package Breaking, which in turn can enhance the purpose of production - the package structure of the record-providing (four) pin, using the mineral tooth tool, the diamond cutter of the wafer cutting machine or the high-speed printed circuit board forming iron knife 'accurate sealing (4) Because (4) the cut edge material is smoothed to meet the requirements of the product without burrs. The _ of this creation = is provided in the package structure of (4) memory card, with the packaging material, directly molded - the dehorning standard shape can simplify the chamfering process and the coverage area of the packaging material is larger than the memory card model The area of the substrate is such that the metal traces on the memory card module substrate are not exposed to the side, resulting in contamination or poor contact due to metal dust during subsequent use. According to the above object, an embodiment of the present invention provides a package structure of a flash ticker card, which comprises: a substrate having a plurality of memory card modules disposed thereon and a mother memory card module substrate The plurality of connecting segments are connected to the substrate, and the cymbals are respectively disposed on each of the memory card module substrates, wherein the chip is electrically connected to each of the memory card module substrates; and a packaging material is separately covered The wafer and the upper surface of the memory card module substrate expose the lower surface of the memory card module substrate and a portion of the connecting portion. M312752 Another embodiment of the present invention provides a package structure of a flash memory card, comprising: a memory card module substrate, having a plurality of connection segments for suspending connection with a substrate. On the module substrate, the chip is electrically connected to the memory card module substrate; and the package material covers the wafer and the memory card module substrate. The connection portion lightly exposes the lower surface of the needle/substrate. [Embodiment]
首先，請先參閱第3A圖，為賴作之—實施狀基板設計 圖。如圖所示，於此實施例中，—基板ι〇上具有複數個 =卡模絲板2〇設置於其上，且每—記針模組基板2〇係各 複數個連接段22與基板10懸空相接，連接段22 ，間則絲板Η) 如第3Β _示，為本創作之一實 模組基板20中之適當 =之㈣切割結構示意圖。將晶片（圖中未示）置放於記憶卡 一封裝材料（molding 例如—環氧樹脂材料，分別覆蓋每-記憶卡模組 基板20與連接段22並暴露出部分連接段22，其甲 〇 的幾何外形與記憶卡模組基板2〇 ^热务攸相似，封裝材料30分別覆蓋記 :基板2〇m積敍於任—記憶卡模組基板2〇 t另外’為了防止灌模㈣時發生溢膠的情況，可以在模 =示）貼佈膠帶，使得基板1G、記憶卡模組基板2G與灌模模 ㈣圖中未不）能完全貼緊而不溢膠。接著進行切割（sin V驟’利用沖壓機器—),如沖床，將複數個連接段 22为割沖斷以形成複數個獨立的記憶卡封裝體。 參考第3C圖，為此實施顯過㈣後之獨立的記憶卡財 體不意圖。為了避免沖壓過程當中因沖壓太過接近記憶卡封襄體 而造成封裝材料30剝落或記憶卡封裝體斷裂，沖壓的距 憶卡封裝體有些許的間隔’因此，經過㈣切割後之記憶卡封農 8 M312752 體旁會具有凸出部，其AA’線段剖視圖如第3D圖所示，此凸出 部乃基板10上之原先連接段22的部分。請繼續參考第3C圖， 本創作快閃記憶卡封裝結構係包括一記憶卡模組基板20，此記憶 卡模組基板20具有複數個連接段22用以與一基板（圖上未示） 懸空相接；以及一封裝材料30，係覆蓋記憶卡模組基板20與連 接段22。其中，部分連接段22係暴露於封裝材料30外。 接下來，第4A圖為本創作之一實施例之細化步驟示意圖， 可利用鋸齒工具40 ( saw-tooth )磨平多餘邊料，即記憶卡封裝體 旁連接段22之凸出部分。於一實施例中，細部磨光（grind，polish ) 可利用不同的研磨工具分成若干階段執行，舉例來說，於細化初 始階段，欲快速移除因沖壓切割所形成連接段22之凸出部分， 可選用較粗顆粒或程度的工具磨光凸出部。參照第4B圖，待凸 塊幾乎消失時，則可選用較細顆粒或程度的工具細化整個記憶卡 封裝體的邊緣。參照第4C圖，待細化至無毛邊之後，再進行去 角（chamfer )步驟將記憶卡封裝體塑成標準外型，可以理解的， 去角步驟亦可分成若干階段進行。透過細化的過程，沖壓切割過 後的記憶卡封裝體的尺寸大小會因為經過若干細化步驟去除多 餘邊料，而達到國際標準尺寸，如第4D圖所示。要說明的，細 化過程當中所使用之工具並不侷限於鋸齒工具40,亦可利用晶片 切割機之鑽石刀刃切割（dicing)距離封裝體間距很小的邊料凸 出部、或是利用高轉速之印刷電路板成型銑刀（router)將因沖 壓切割所形成的凸出部磨削（route )至無毛邊。 第5圖為本創作之一實施例的流程示意圖。請同時參照第3B 圖與第5圖，提供一具有複數個記憶卡模組基板20的基板10， 記憶卡模組基板20係以複數個連接段22與基板10懸空相接， 並將晶片置放固定於記憶卡模組基板20上適當位置（S10)。之後 利用一封裝材料30覆蓋記憶卡模組基板（S20)並暴露出部分連接 段22。待封裝的步驟完成與封裝材料30硬化後，進行沖壓切割 9 M312752 形成複數個記憶卡封裝體（S30)。之後，利用細化工具細化單記憶 卡封裝體的邊緣凸出之連接段(S40)，其中細化包含磨光記憶卡封 裝體旁凸出之連接段與對每一記憶卡封裝體進行去角的處理。 第6圖為依據本創作之不同實施例說明設置在基板10上之 複數個連接段22’之分佈示意圖。連接段22’係用來連接複數個記 憶卡模組基板20之用，故連接段22,在基板1〇上之位置' 形狀、 大小並不限定於上述實施例中所顯示。連接段22’可依照記憶卡 模型基板20在基板10上之不同排列方式，而有不同的位置、形 狀、大小之變化，係可呈多邊形、條狀、圓形或具多弧度之形狀。 請參照第7圖，此為一快閃記憶SIM卡結構示意圖，於本實 施例中，此快閃記憶SIM卡的封裝材料30之覆蓋面積係大於記 憶卡模組基板20，且於此快閃記憶SIM卡背面之記憶卡模組基 板20上係有金手指24設置於其上。於本創作中，可應用於微型 安全數位記憶卡或微型安全數位記憶卡封裝，然並不僅限於此， 本創作可應用於各式快閃記憶卡之封裝。 另，請參照第9圖與第3B圖，首先提供一具有複數個記憶 卡模組基板20的基板1〇,記憶卡模組基板20係以複數個連接段 22與基板1〇懸空相接，並將晶片（圖上未示）置放固定於記憶 卡模組基板20上適當位置（S10)，並將晶片係與每一記憶卡模組 基板20電性連接（S12)。之後，使用一上模基板與一支撐基板進 行一灌模程序形成封裝材料分別覆蓋晶片與記憶卡模組基板20 之上表面並暴露出記憶卡模組基板20之下表面與部分連接段 22(S22)，其中封裝材料係直接塑成一去角標準外型。待封裝材料 硬化後，進行沖壓切割形成複數個記憶卡封裝體（S30)。之後，利 用細化工具細化單記憶卡封裝體的邊緣凸出之連接段22(S40)， 其中細化包含磨光記憶卡封裝體旁凸出之連接段22。由於封裝材 料係直接塑成一去角標準外型，故於本實施例中，無須對每一記 憶卡封裝體進行去角的處理。 M312752 接續上述說明並參照第10A圖、第1〇B圖盥第i〇C 、 此實施例中，使用—上模基板60與—支撐基板進行— 序形成封裝材料30。上模基板6M系具有灌孔6憎其上， 係由灌孔64 $人形成’支撐基板62健供支樓功^ 一承接平台或基座所取代。封裝材料3〇分f、 =模組基之上表面並暴露出記憶卡模組基板日2日 = 連接段(圖上未示)。於本實施例中，封裝材料30之S 払準外型係由上模基板60所塑型，如第1〇 去角 2限於此，封裝材料3。之去角標準外型係 殳，、形狀所加以塑型，如第1〇A圖所示。 文 線之『：圖，第1〇C圖可視為第3C圖中之BB，剖 口J面不思圖，於本實施例之結構一曰 記憶卡模組基板20上，晶片5〇係 〃一日日片50設置於 憶卡模組基板2G電性連接。„ 歧其他方式與記 卡模組基板2G之上表面並係覆蓋晶片％與記憶 封襄材料30係直接塑成標準己=模組基板20之下表面。 覆蓋連接段(圖上未示) 。另’封裝材料30是否 板20之下表面具有 求加以變化。記憶卡模組基 、Μ (圖上未示）於其上。 根據上述，本創作之牿 模組基板並以複數個連接^、#由在基板上排列複數個記憶卡 板，·利用沖壓方式分割連懸空連接基板及記憶卡模組基 由於連接段與封裝體間具奴=離已形成複數個記憶卡封裝體； 封裝體而造成封裝材料。、緩衝空間，可避免因沖壓太過靠近 幅提高 。且因為灌模步驟日^或封裝體斷裂，使此封裝體的良率大 憶卡模組基板上進行灌模t不須將整個基板完全包覆，只須在記 費。更甚者，沖壓骏置、1、 ^即可，可以節省封裝材料之成本花 率之外，不僅可以接^比雷射機器或水刀機器便宜，在提高量 阅產能亦可降低生產成本。 綜合上述，本創作係藉由在基板設計複數個記憶卡模組基板 及複數個連接段，使此基板在進行灌模步驟時，只須在記憶卡模 組基板上注入封裝材料，可避免封裝材料的浪費及減少封裝材料 之成本。其中，封裝材料之覆蓋面積係大於記憶卡模組基板之面First of all, please refer to Figure 3A for the implementation of the substrate design. As shown in the figure, in this embodiment, the substrate ι has a plurality of = card-shaped wire plates 2 〇 disposed thereon, and each of the stylus module substrates 2 is connected to each of the plurality of connecting segments 22 and the substrate 10 hanging and connecting, connecting segment 22, and between the wires, as shown in Fig. 3, is a schematic diagram of the appropriate (four) cutting structure in the real module substrate 20 of the present invention. A wafer (not shown) is placed on the memory card-encapsulation material (molding, for example, an epoxy material, covering each of the memory card module substrate 20 and the connecting segment 22, respectively, and exposing a portion of the connecting portion 22, the nail file The geometric shape is similar to that of the memory card module substrate 2, and the packaging material 30 is covered separately: the substrate 2〇m is summarized in the memory card module substrate 2〇t in addition to prevent the filling (four) from occurring In the case of overflowing the glue, the tape can be applied in the mold, so that the substrate 1G, the memory card module substrate 2G and the filling mold (4) are not completely closed without overflowing. Subsequent cutting (sin V step' using a stamping machine), such as a punch press, divides the plurality of connecting segments 22 into cuts to form a plurality of individual memory card packages. Referring to Figure 3C, it is not intended to implement the independent memory card economy after (4). In order to avoid the peeling of the encapsulating material 30 or the breakage of the memory card package due to the stamping being too close to the memory card encapsulation during the stamping process, the stamped memory card package has a slight interval. Therefore, after (four) cutting, the memory card is sealed. The agricultural 8 M312752 has a projection on the side of the body, and its cross-sectional view of the AA' line is shown in Fig. 3D, and the projection is the portion of the original connecting section 22 on the substrate 10. Please refer to FIG. 3C. The flash memory card package structure includes a memory card module substrate 20 having a plurality of connecting segments 22 for hanging with a substrate (not shown). And a packaging material 30 covering the memory card module substrate 20 and the connecting portion 22. Wherein, some of the connecting segments 22 are exposed to the outside of the encapsulating material 30. Next, Fig. 4A is a schematic view showing the refinement step of an embodiment of the present invention. The excess edge material, i.e., the protruding portion of the connecting portion 22 of the memory card package, can be smoothed by a saw-tooth. In one embodiment, the grind can be performed in several stages using different grinding tools. For example, in the initial stage of refining, the protrusion of the connecting section 22 formed by the stamping is quickly removed. In part, a coarser particle or a degree of tool can be used to polish the projection. Referring to Figure 4B, when the bumps are almost gone, the edges of the entire memory card package can be refined with finer particles or a degree of tool. Referring to Fig. 4C, after the refining to the absence of burrs, the chamfer step is used to mold the memory card package into a standard shape. It will be understood that the cornering step can also be carried out in several stages. Through the refinement process, the size of the memory card package after stamping and cutting will reach the international standard size by removing the excess margin through several refinement steps, as shown in Fig. 4D. It should be noted that the tool used in the refining process is not limited to the sawtooth tool 40, and the diamond cutting edge of the wafer cutting machine can also be used to dicing the edge protruding portion with a small distance from the package or using the high edge. The rotational speed printed circuit board forming router will route the projections formed by stamping and cutting to no burrs. Figure 5 is a schematic flow chart of an embodiment of the present invention. Referring to FIG. 3B and FIG. 5 simultaneously, a substrate 10 having a plurality of memory card module substrates 20 is provided. The memory card module substrate 20 is suspended from the substrate 10 by a plurality of connecting segments 22, and the wafer is placed. It is fixed to an appropriate position on the memory card module substrate 20 (S10). Thereafter, the memory card module substrate (S20) is covered with a package material 30 and a portion of the connecting portion 22 is exposed. After the step of being packaged is completed and the encapsulating material 30 is hardened, punching and cutting is performed. 9 M312752 A plurality of memory card packages (S30) are formed. Then, the connection portion (S40) of the edge protruding of the single memory card package is refined by using a refinement tool, wherein the connection segment protruding from the side of the polished memory card package is refined and the memory card package is removed. The handling of the corners. Fig. 6 is a schematic view showing the distribution of a plurality of connecting segments 22' provided on a substrate 10 in accordance with different embodiments of the present invention. The connecting portion 22' is for connecting a plurality of memory card module substrates 20. Therefore, the position and shape of the connecting portion 22 on the substrate 1' are not limited to those shown in the above embodiment. The connecting segments 22' may have different shapes, shapes, and sizes according to the different arrangement of the memory card model substrate 20 on the substrate 10. They may be in the shape of a polygon, a strip, a circle, or a multi-radius. Please refer to FIG. 7 , which is a schematic structural diagram of a flash memory SIM card. In this embodiment, the coverage area of the package material 30 of the flash memory SIM card is greater than that of the memory card module substrate 20 , and is flashed here. A memory card module substrate 20 on the back of the memory SIM card is provided with a gold finger 24 disposed thereon. In this creation, it can be applied to micro-safe digital memory cards or micro-secure digital memory card packages. However, this is not limited to this. This creation can be applied to the packaging of various flash memory cards. In addition, referring to FIG. 9 and FIG. 3B, a substrate 1 having a plurality of memory card module substrates 20 is first provided. The memory card module substrate 20 is connected to the substrate 1 by a plurality of connecting segments 22, A wafer (not shown) is placed on the memory card module substrate 20 at an appropriate position (S10), and the wafer is electrically connected to each of the memory card module substrates 20 (S12). Thereafter, a molding process is performed using an upper mold substrate and a support substrate to form a package material covering the upper surface of the wafer and the memory card module substrate 20 and exposing the lower surface of the memory card module substrate 20 and the partial connection portion 22 ( S22), wherein the encapsulating material is directly molded into a chamfered standard shape. After the material to be packaged is hardened, punching and cutting are performed to form a plurality of memory card packages (S30). Thereafter, the edge of the single memory card package is used to refine the connecting portion 22 of the single memory card package (S40), wherein the connection portion 22 protruding from the side of the polished memory card package is refined. Since the packaging material is directly molded into a chamfered standard shape, in this embodiment, it is not necessary to perform chamfering treatment for each memory card package. M312752 Continuing the above description and referring to FIG. 10A and FIG. 1B, the first embodiment, the package material 30 is formed by using the upper mold substrate 60 and the support substrate. The upper mold substrate 6M has a filling hole 6 on which the support substrate 62 is formed by the filling hole 64. The supporting substrate 62 is replaced by a supporting platform or a receiving base. The package material 3 is divided into f, = the upper surface of the module base and exposes the memory card module substrate 2 days = connection segment (not shown). In the present embodiment, the S 払 quasi-outer type of the encapsulating material 30 is molded by the upper mold substrate 60, and the first 〇 angle 2 is limited to this, and the encapsulating material 3 is limited thereto. The standard shape of the chamfer is 殳, and the shape is shaped as shown in Figure 1A. "Figure, the first 〇C picture can be regarded as the BB in the 3C figure, the section J face is not considered, in the structure of the embodiment, on the memory card module substrate 20, the chip 5 〇 system The one-day film 50 is electrically connected to the memory card module substrate 2G. „ Different ways to cover the upper surface of the card module substrate 2G and cover the wafer % and the memory sealing material 30 are directly molded into the standard = the lower surface of the module substrate 20. Cover the connecting section (not shown). In addition, the encapsulating material 30 has a surface to be changed. The memory card module base, Μ (not shown) is mounted thereon. According to the above, the module substrate of the present invention is connected in plurality. #Arrange a plurality of memory card boards on the substrate, and use the stamping method to divide and connect the floating connection substrate and the memory card module base. Since the connection section and the package body have slaves, a plurality of memory card packages are formed; the package body The encapsulation material and the buffer space can be avoided because the stamping is too close to the web, and because the filling step or the package is broken, the yield of the package is not required to be filled on the card module substrate. The entire substrate is completely covered, only need to be charged. Even worse, the stamping, 1, ^ can save the cost of packaging materials, not only can be compared to laser machines or waterjet machines Cheap, increase the amount of production In addition, in the above, the present invention designs a plurality of memory card module substrates and a plurality of connecting segments on the substrate, so that the substrate only needs to be injected on the memory card module substrate during the filling step. The packaging material can avoid the waste of the packaging material and reduce the cost of the packaging material, wherein the covering area of the packaging material is larger than the surface of the memory card module substrate
M312752 積，故可設計尺寸精良之特殊形狀且製程穩定無須大範圍切割後 修邊。藉由沖壓方式，分割基板上之連接段，可直接分離基板與 記憶卡封裝體，不須利用昂貴之切割機器，例如水刀機器或雷射 機台，以降低生產設備成本。藉由沖壓機器，如沖床，來進行封 裝體切割製程，沖壓機器進行切割時的速度較傳統雷射切割=水 刀切割要快，可以提高產能。本創作基板上連接段的設叶°，可^ 免沖壓過程時因沖壓太接近封裝體而造成封裝材料剝落 :斷裂，進而可以提昇生產良率，利用鑛齒工具、晶片切 =石刀刃或高轉速之印刷電路板成型銑刀，精準的將封裝體 垄切割之後多餘的邊料磨平以達到產品無毛邊之要求。冲 系直接塑成一去角化標準外型可簡化去角程序，且二 金屬走線，故記憶卡模組基板上 、覆基板側面 其後使用時因金屬碎屑(-〇造 ，所作之均等變化或修飾，：涵 12 M312752 【圖式簡單說明】 第1A圖與第1B圖分別為習知微型數位安全卡之正視圖及後視 圖。 第2圖為先前技術利用水刀或雷射切割之示意圖。 ^ 第3A圖為本創作之一實施例之基板設計之示意圖。 第3B圖為本創作之一實施例之示意圖。 第3C圖為本創作之一實施例之示意圖。 > 第3D圖為第3C圖AA’剖線之剖面示意圖。 第4A、4B、4C與4D圖為本創作之一實施例之細化步驟示意圖。 第5圖為本創作之一實施例的流程示意圖。 第6圖為依據本創作之不同實施例說明之示意圖。 第7圖為依據本創作之不同實施例說明之示意圖。 第8A圖、第8B圖與與第8C圖分別為習知微型數位安全卡之側 視圖與仰視圖。 p 第9圖為本創作之一實施例的流程示意圖。 第10A圖、第10B圖與第10C圖分別為依據本創作之不同實施 例說明之示意圖。 【主要元件符號說明】 100 微型SD卡 102 一凸起及一凹陷之形狀 110 基板 13 M312752 120 微型SD卡模組基板 122 金屬走線 130 封裝膠體 10 基板 20 記憶卡模組基板 22 連接段 22’ 連接段 24 金手指 30 封裝材料 40 鋸齒工具 50 晶片 60 上模基板 62 支撐基板 64 灌孔 S10 將晶片置放在記憶卡模組基板上之適當位置 S12 將晶片與記憶卡模組基板電性連接 S20 利用封裝材料覆蓋記憶卡模組基板 S22 使用一上模基板與一支撐基板進行一灌模程序形成封裝 材料用以覆蓋記憶卡模組基板 S3 0 待封裝體硬化後進行沖壓切割 S40 利用細化工具細化連接段凸出部 14M312752 product, so you can design a special shape with excellent size and stable process without trimming after extensive cutting. By dividing the connecting segments on the substrate by stamping, the substrate and the memory card package can be directly separated without using an expensive cutting machine such as a water jet machine or a laser machine to reduce the cost of the production equipment. The stamping machine, such as a punching machine, is used to perform the package cutting process. The speed of the cutting machine is faster than conventional laser cutting = waterjet cutting, which can increase the productivity. The setting of the connecting section on the substrate of the present invention can eliminate the peeling of the encapsulating material due to the stamping process being too close to the package: the fracture can be increased, thereby improving the production yield, using the mineral tooth tool, the wafer cutting = stone blade or high The rotational speed of the printed circuit board forming milling cutter accurately smoothes the excess edge material after the ridge of the package is cut to achieve the requirement of no burrs of the product. The punching system is directly molded into a chamfered standard shape, which simplifies the chamfering process, and the two metal wires are routed. Therefore, the metal chip is used on the memory card module substrate and the side of the substrate, and the metal crumb is used. Variation or modification, culvert 12 M312752 [Simple description of the diagram] Figures 1A and 1B are front and rear views, respectively, of a conventional micro-digit security card. Figure 2 is a prior art using waterjet or laser cutting Fig. 3A is a schematic view of a substrate design according to an embodiment of the present invention. Fig. 3B is a schematic view showing an embodiment of the creation. Fig. 3C is a schematic view showing an embodiment of the creation. > 3D 4A, 4B, 4C, and 4D are schematic diagrams of the refinement steps of one embodiment of the creation. FIG. 5 is a schematic flow chart of an embodiment of the creation. The figure is a schematic diagram according to different embodiments of the present invention. Fig. 7 is a schematic diagram illustrating different embodiments according to the present invention. Figures 8A, 8B and 8C are respectively side of a conventional micro digital security card. View and bottom view. p 9th A schematic diagram of a flow of an embodiment of the present invention. Fig. 10A, Fig. 10B and Fig. 10C are schematic views respectively illustrating different embodiments according to the present invention. [Description of main components] 100 micro SD card 102 A recessed shape 110 substrate 13 M312752 120 micro SD card module substrate 122 metal trace 130 encapsulant 10 substrate 20 memory card module substrate 22 connecting segment 22' connecting segment 24 gold finger 30 packaging material 40 sawtooth tool 50 wafer 60 The mold substrate 62 supports the substrate 64. The filling hole S10 places the wafer on the memory card module substrate at an appropriate position S12. The wafer is electrically connected to the memory card module substrate. S20 covers the memory card module substrate S22 with the packaging material. The substrate and a supporting substrate are subjected to a filling process to form a packaging material for covering the memory card module substrate S3 0. After the hardening of the package body is performed, the stamping is performed. S40 is refined by the refining tool.