M312751 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種記憶卡成型結構改良（二），特別係一種具有完整性外 觀的記憶卡成型結構改良。 【先前技術】 當今記憶卡產品大量廣泛地應用於多種電子產品上，例如數位照相機、行動 電話、個人數位助理(PDA)等，其中記憶卡之體積日趨微型化，長與寬的尺寸約 可達1公分以下，厚度則大約1釐米以下，例如微型數位安全卡（Micro sj))或 微型多媒體卡(MMC Micro)等。 請參照第一 A圖，係揭示習知記憶卡成型結構之封裝方式示意圖◦如圖所 不’習知記憶卡結構係包括一電路基板1〇，其上表面設有一電路層12，下表面 設有複數個電性接點14，及一記憶體晶片16、控制晶片18、數個電子元件2〇 設置於電路基板10之上表面並與電路層12電性連接，一封裝膠體22包覆電路 _基板ίο及其上表面之此等元件，而僅露出電路基板10之下表面的電性接點14 以供與外界電性連接。 其中，形成此封裝膠體22之方式係將電路基板10放在一模具24之下模表 面上，且模具22具一進膠口 26，其位在電路基板10上方，之後膠體會從電路 基板10上方的進膠口 26注入以包覆電路基板1〇、記憶晶片16、控制晶片18 及電子το件20，膠體硬化完成後再從模具中取出記憶卡成品，如第一 β圖所示， 係完成後的記憶卡成品 '然，完成後的記憶卡成品在表面上就會有一殘留的進 膠口痕跡28可疋由於兄憶卡結構已達如此小的尺寸，所以一但在製作過程中 M312751 於記憶卡之外表面上蝴任何外觀的賊，爾的朗進膠口痕跡沈都會 十分明顯，且未來的記憶卡可能齡再缺則、狄寸發展，舰些記憶卡外 型上的缺陷更是難以忽視。 有鑑於此，本創作提供—種更完善的記憶卡成型結構，以解決上 述之缺失。 【新型内容】 丨 j乍之目的係在提供一種記憶卡成型結構改良（二），透過一模 、仗電路基板之至J _側面提供至少一進膠口進膠以完成一封裝膠 體，之後切割封裝膠體外表面所殘留的進膠口痕跡，即可克服習知記 憶卡之外型缺陷問題。 本創作之另目的係在提供一種記憶卡成型結構改良（二），利用一 體成型之祕方式完成記憶卡之封裝雜，使加1過程更加簡單化。 其上根據本創作揭不的記憶卡成型結構改良（二），係包括一電路基板，於 > 各又有I路層與複數個電性接點，此等電性接點與電路層電性 路=並作為與外界電性連接之接點，至少m立在電路基板之上表面且與電 路層電性連接，及_封裝膠體，用於包覆上述耕而露出此等電性接點，且 裳穋體係藉由—桓IP ' ^ 、一攸電路基板之至少一側面提供至少一進膠口進膠完成此封 破勝體再切別封裝膠體外表面所殘留的進膠口痕跡。 、 底下猎由具體實施例配合所_圖式詳加說明，當更容易瞭解本 創作之目的、技術内容、特點及其所達成之功效。 M312751 【實施方式】 • 賴時參照第二_第三圖’分獅本創作記憶卡成型結構之立體外觀示 意圖與結構示意圖。如_示，本創作之記憶卡成型結構3g，係包括一電 路基板32，在電路基板32之上表面設有一電路襲，下表面則設有複數個電性 接點36，其係藉由電路基板32内之複數個導電線路（圖中未示），以與電路層^ 電性連接並進而作為與外界電性連接之接點，並尚有—記憶體晶㈣、一控制 晶片40及數個選自於電阻、電容、域或戀科電子元件财桃基板犯之 籲上表面與電路層34電性連接，其中記憶體晶片38、控制晶片_透過打線(_ bonding)或覆晶（flip chip)之方式與電路層_性連接，及一封裝膠_包覆 上述兀件而僅露出電路基板32之下表面的電性接點36，且如第二圖所示，封裳 膠體44之外表面係完善而無缺陷的。 以下即係揭示封裝膠體44之形成方式，請同時參照第四細與第四B圖電 路基板32放置在-模具46内，此模具46具有一位在電路基板32側面的進膠口 48 ’之後即利用選自祕樹脂、尿素樹脂、美耐皿樹脂及環氧樹脂的熱固性谬 #體從進膠口48灌朦，其中熱固性膠體在12〇至烈忙下會硬化，硬化後即形成封 裝膠體44 ’接細綱㈣記針成品，再娜獅體批外表面所殘餘 的進膠口痕跡’就可產出如第二圖所示具有完整性外觀的記憶卡成型結獅。 且’模具46亦可具有多個進膠口48設置在魏基板32之不同的側面位置上，如 第四C圖所示，以將熱固性膠體流量分散。 由此可知’本創作主要係透過模具所提供的側面進膠口設計，即可—體成 型壓模完成記憶卡結構中的封裝膠體，之後只需切除封裝膠體外表面 殘餘的進膠口痕跡就可實現外觀無缺陷、瑕疫的記憶卡成型結構，故 M312751 本創作不但可應用於目前任何記憶卡，例如多媒體卡、SM記憶卡(SmartM312751 VIII. New description: [New technical field] This creation is related to the improvement of the memory card forming structure (2), especially the improvement of the memory card forming structure with complete appearance. [Prior Art] Today's memory card products are widely used in a variety of electronic products, such as digital cameras, mobile phones, personal digital assistants (PDAs), etc., in which the size of the memory card is increasingly miniaturized, and the size of the length and width is about Less than 1 cm, thickness is about 1 cm or less, such as Micro sj) or Micro Multimedia Card (MMC Micro). Referring to FIG. 1A, a schematic diagram of a package structure of a conventional memory card forming structure is disclosed. As shown in the figure, the conventional memory card structure includes a circuit board 1 , and a circuit layer 12 is disposed on the upper surface thereof, and the lower surface is provided. A plurality of electrical contacts 14 , a memory chip 16 , a control chip 18 , and a plurality of electronic components 2 are disposed on the upper surface of the circuit substrate 10 and electrically connected to the circuit layer 12 , and an encapsulant 22 covers the circuit The _substrate ίο and the elements on the upper surface thereof expose only the electrical contacts 14 on the lower surface of the circuit substrate 10 for electrical connection with the outside. The method for forming the encapsulant 22 is to place the circuit substrate 10 on the surface of the lower mold of the mold 24, and the mold 22 has a feed port 26 which is located above the circuit substrate 10, after which the colloid will pass from the circuit substrate 10. The upper rubber inlet 26 is injected to cover the circuit substrate 1 , the memory wafer 16 , the control wafer 18 , and the electronic τ device 20 . After the colloid hardening is completed, the finished memory card is removed from the mold, as shown in the first β-picture. After the completion of the memory card finished product 'Ran, the finished memory card finished product will have a residual glue trace on the surface 28 can be 疋 because the brother recall card structure has reached such a small size, so in the production process M312751 The thief who looks at any appearance on the surface of the memory card will be very obvious, and the memory card of the future will be very obvious, and the memory card of the future may be lacking in size, the development of Di inch, and the defects on the shape of some memory cards. It is hard to ignore. In view of this, this creation provides a more complete memory card forming structure to solve the above-mentioned lack. [New content] The purpose of 丨j乍 is to provide a memory card molding structure improvement (2), through at least one glue inlet to the J _ side of the circuit board to complete a package of colloids, and then cut The residual glue trace on the outer surface of the encapsulant can overcome the defects of the conventional memory card. Another purpose of this creation is to provide a memory card molding structure improvement (2), which utilizes the secret method of one-piece molding to complete the packaging of the memory card, and makes the process of adding 1 more simple. The memory card forming structure improved according to the present invention (2) includes a circuit substrate, and each has an I layer and a plurality of electrical contacts, and the electrical contacts and the circuit layer are electrically Sexual path = as a contact with the external electrical connection, at least m on the upper surface of the circuit board and electrically connected to the circuit layer, and _ encapsulation colloid for covering the above-mentioned ploughing to expose the electrical contacts And the 穋 穋 system provides at least one glue into the glue by at least one side of the circuit board to complete the sealing of the body and then the trace of the glue remaining on the outer surface of the package rubber. Bottom hunting is explained in detail by the specific embodiment. It is easier to understand the purpose, technical content, characteristics and effects of this creation. M312751 [Embodiment] • Refer to the second and third diagrams of the lion's creation of the memory card to form a three-dimensional appearance and structure. For example, the memory card forming structure 3g of the present invention includes a circuit substrate 32, a circuit is disposed on the upper surface of the circuit substrate 32, and a plurality of electrical contacts 36 are disposed on the lower surface by the circuit. A plurality of conductive lines (not shown) in the substrate 32 are electrically connected to the circuit layer and further serve as a contact point electrically connected to the outside, and there are still a memory crystal (four), a control wafer 40 and a number The surface of the circuit board is electrically connected to the circuit layer 34, wherein the memory chip 38, the control chip _ _ bonding or flip chip (flip) is selected from a resistor, a capacitor, a domain or a love electronic component. Chip) is connected to the circuit layer _, and an encapsulant _ covers the above-mentioned components to expose only the electrical contacts 36 on the lower surface of the circuit substrate 32, and as shown in the second figure, the sealing body 44 The outer surface is perfect and flawless. Hereinafter, the manner in which the encapsulant 44 is formed is disclosed. Please refer to the fourth and fourth B circuit substrates 32 in the mold 46, which has a bit after the glue inlet 48' on the side of the circuit substrate 32. That is, the thermosetting 选自# body selected from the group consisting of secret resin, urea resin, melamine resin and epoxy resin is poured from the rubber inlet port 48, wherein the thermosetting colloid is hardened under 12 〇 to strong, and the encapsulant is formed after hardening. 44 'The fine (4) needle finished product, and the remaining traces of the glue on the outer surface of the lion body batch can produce the memory card forming lion with the integrity appearance as shown in the second figure. And the mold 46 may have a plurality of feed ports 48 disposed at different side positions of the WE substrate 32, as shown in FIG. 4C, to disperse the flow of the thermosetting colloid. It can be seen that 'this creation is mainly through the side feed port design provided by the mold, the body molding die can complete the encapsulation colloid in the memory card structure, and then only the residual glue residue on the outer surface of the encapsulant can be removed. It can realize the memory card molding structure with no defect and plague appearance, so M312751 can be applied not only to any current memory card, such as multimedia card, SM memory card (Smart
Media Card)、數位安全卡、CF記憶卡(Compact Flash Card)、MS記憶卡(MemoryMedia Card), digital security card, CF memory card (Compact Flash Card), MS memory card (Memory
Stick Card)等，且對於逑你數位安全卡、微型多媒體卡等之微卡或是 未來尺寸更小的記憶卡更是提供一種良好的封裝膠體形成方式。 以上所述之實施例僅係為說明本創作之技術思想及特點，其目的 在使熟習此項技藝之人士能夠瞭解本創作之内容並據以實施，當不能 以之限定本創作之專利範圍，即大凡依本創作所揭示之精神所作之均 馨等變化或修飾，仍應涵蓋在本創作之專利範圍内。 【圖式簡單說明】 第- Α圖係f知記憶卡成型結構之封裝方式示意圖。 第- B圖係習知記憶卡成型結構之立體外觀示意圖。 第二圖係本創作之立體外觀示意圖。 弟二圖係本創作之結構剖面示意圖。Stick Card), etc., and for your digital security card, micro-memory card, etc., or a smaller memory card in the future, it provides a good way to form a package. The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, changes or modifications made by the general spirit in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation. [Simple description of the diagram] The first-figure diagram f is a schematic diagram of the packaging method of the memory card forming structure. Figure-B is a schematic view of the stereoscopic appearance of a conventional memory card forming structure. The second picture is a three-dimensional appearance of the creation. The second picture of the brother is a schematic diagram of the structure of the creation.
第四A圖係本創作進行膠體封裝示意圖。 第四B圖係本創作進行膠體封裝示意圖。 第四C圖係本創作進行膠體封裝示意圖。 【主要元件符號說明】 10電路基板12電路層 14電性接點16記憶晶片 18控制晶片20電子元件 22封裝膠體24模具 M312751 26進膠口 28進膠口痕跡 30記憶卡成型結構 32電路基板34電路層 36電性接點38記憶體晶片 40控制晶片42電子元件 44封裝膠體 46模具 48進膠口The fourth A picture is a schematic diagram of the colloidal packaging of the present creation. The fourth B diagram is a schematic diagram of the colloidal packaging of the present creation. The fourth C picture is a schematic diagram of the colloidal package of the present creation. [Main component symbol description] 10 circuit substrate 12 circuit layer 14 electrical contact 16 memory chip 18 control wafer 20 electronic component 22 package colloid 24 mold M312751 26 feed port 28 into the glue mark 30 memory card molding structure 32 circuit substrate 34 Circuit layer 36 electrical contact 38 memory wafer 40 control wafer 42 electronic component 44 package colloid 46 mold 48 into the glue mouth