TWM312020U - Light emitting diode package structure - Google Patents

Light emitting diode package structure Download PDF

Info

Publication number
TWM312020U
TWM312020U TW095221308U TW95221308U TWM312020U TW M312020 U TWM312020 U TW M312020U TW 095221308 U TW095221308 U TW 095221308U TW 95221308 U TW95221308 U TW 95221308U TW M312020 U TWM312020 U TW M312020U
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
package structure
diode package
light
Prior art date
Application number
TW095221308U
Other languages
English (en)
Inventor
Wen-Lung Su
Original Assignee
Lighthouse Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lighthouse Technology Co Ltd filed Critical Lighthouse Technology Co Ltd
Priority to TW095221308U priority Critical patent/TWM312020U/zh
Priority to US11/675,431 priority patent/US7615799B2/en
Publication of TWM312020U publication Critical patent/TWM312020U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW095221308U 2006-12-04 2006-12-04 Light emitting diode package structure TWM312020U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095221308U TWM312020U (en) 2006-12-04 2006-12-04 Light emitting diode package structure
US11/675,431 US7615799B2 (en) 2006-12-04 2007-02-15 Light-emitting diode package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095221308U TWM312020U (en) 2006-12-04 2006-12-04 Light emitting diode package structure

Publications (1)

Publication Number Publication Date
TWM312020U true TWM312020U (en) 2007-05-11

Family

ID=38741342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095221308U TWM312020U (en) 2006-12-04 2006-12-04 Light emitting diode package structure

Country Status (2)

Country Link
US (1) US7615799B2 (zh)
TW (1) TWM312020U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103887398A (zh) * 2012-12-22 2014-06-25 展晶科技(深圳)有限公司 发光二极管封装结构

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM309757U (en) * 2006-09-19 2007-04-11 Everlight Electronics Co Ltd Side view LED package structure
US7993038B2 (en) * 2007-03-06 2011-08-09 Toyoda Gosei Co., Ltd. Light-emitting device
KR100986202B1 (ko) * 2008-07-01 2010-10-07 알티전자 주식회사 사이드 뷰 발광 다이오드 패키지
US8651704B1 (en) 2008-12-05 2014-02-18 Musco Corporation Solid state light fixture with cooling system with heat rejection management
KR101028195B1 (ko) * 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR101840031B1 (ko) * 2011-08-18 2018-03-20 엘지이노텍 주식회사 발광 장치
KR20140006378A (ko) * 2012-07-04 2014-01-16 삼성전자주식회사 디스플레이 장치
JP6252023B2 (ja) * 2013-08-05 2017-12-27 日亜化学工業株式会社 発光装置
USD740239S1 (en) * 2014-05-07 2015-10-06 Bejan Esau Amini LED illumination tile
KR102248642B1 (ko) * 2014-08-13 2021-05-06 엘지디스플레이 주식회사 엘이디 패키지
TW201721906A (zh) * 2015-12-14 2017-06-16 億光電子工業股份有限公司 發光二極體封裝結構及其製造方法
EP3544066A1 (en) * 2018-03-23 2019-09-25 Excellence Opto. Inc. High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission
JP1654099S (ja) * 2019-04-12 2020-03-02 放熱構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
KR100951626B1 (ko) * 2002-03-08 2010-04-09 로무 가부시키가이샤 반도체 칩을 사용한 반도체 장치
TW558775B (en) * 2002-06-27 2003-10-21 Solidlite Corp Package of compound type LED
USD504116S1 (en) * 2003-04-07 2005-04-19 Nichia Corporation Light emitting diode
USD509488S1 (en) * 2003-07-28 2005-09-13 Nichia Corporation Light emitting diode
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
JP2006245020A (ja) * 2005-02-28 2006-09-14 Sharp Corp 発光ダイオード素子とその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103887398A (zh) * 2012-12-22 2014-06-25 展晶科技(深圳)有限公司 发光二极管封装结构
TWI580077B (zh) * 2012-12-22 2017-04-21 榮創能源科技股份有限公司 發光二極體封裝結構
CN103887398B (zh) * 2012-12-22 2017-06-20 展晶科技(深圳)有限公司 发光二极管封装结构

Also Published As

Publication number Publication date
US7615799B2 (en) 2009-11-10
US20080128738A1 (en) 2008-06-05

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees
MK4K Expiration of patent term of a granted utility model