M309752 八、新型說明： 【新型所屬之技術領域】 本新型是有關於一種調針機，特別是指一種可利用電 流來調整、控制之調針機。 【先前技術】 半導體測試領域中，在晶圓測試階段一定會使用到一 個極為重要的治具_探針卡（Pn)be Card)。每—片日日日圓面積並 _ 不大又谷、、、内了數以百千計的晶粒在上面，相對地每一顆 晶粒的面積會更小。而在每一顆晶粒上更具有複數電極墊 ，進行晶圓測試時，則是以該探針卡上複數細微的探針， 將測試訊號送至每一顆晶粒的複數電極墊上，再分別加以 量測以進行完整的電性測試。 參閱圖1，一般探針卡丨包括有一電路板u，以及複數 與該電路板11連接之探針12。該複數探針12是以含有鎢 、鎳等金屬成份製成之細微針體，並分別具有一與該電路 _ S 11 ©接的連接端121，以及-用於與晶圓作接觸測試的 接觸端122。其中，該電路板U上形成有一穿孔11〇，該複 數探針12是沿著該穿孔11〇的周緣與該電路板u連接，通 過該穿孔11〇可直接目測到每一根探針12之接觸端122。 每一接觸端122的針尖位置必須與其欲進行接觸之晶 粒上的複數電極墊相互對應，並規範每一根探針12從接觸 端到該電路板11的長度都相同，以使晶圓測試作業進行時 ，每一根探針12都能準確且平均地與晶圓上每一顆晶粒的 電極墊作電性接觸，並各自進行不同電性準位及產品功能 5M309752 VIII. New description: 【New technology field】 This new type is related to a needle adjustment machine, especially a needle adjustment machine that can adjust and control the current. [Prior Art] In the field of semiconductor testing, an extremely important fixture, the Pn card, must be used during the wafer testing phase. Every day, the area of the Japanese yen and the _ is not large, and there are hundreds of thousands of grains on the top, and the area of each grain is relatively small. In each of the crystal grains, there are a plurality of electrode pads. When the wafer is tested, a plurality of fine probes are applied to the probe card, and the test signals are sent to the plurality of electrode pads of each of the crystal grains. The measurements were separately taken for a complete electrical test. Referring to Figure 1, a typical probe cartridge includes a circuit board u and a plurality of probes 12 coupled to the circuit board 11. The complex probe 12 is a fine needle body made of a metal component such as tungsten or nickel, and has a connection end 121 connected to the circuit _ S 11 ©, and a contact for contact testing with the wafer. End 122. The circuit board U is formed with a through hole 11 〇, and the plurality of probes 12 are connected to the circuit board u along the circumference of the through hole 11 , through which the probe 12 can be directly visually observed. Contact end 122. The tip position of each contact end 122 must correspond to the plurality of electrode pads on the die to be in contact with it, and the length of each probe 12 from the contact end to the circuit board 11 is specified to be the same for wafer testing. During the operation, each probe 12 can make electrical contact with the electrode pads of each die on the wafer accurately and evenly, and perform different electrical levels and product functions.
M309752 的測試。 由於遠探針卡1上之複數探針12是 時間與晶圓作接貞§、 # 、、'田彳政，且在長 U作接觸、W使用，以及清潔探針 成的碰觸等愔來，喳扠且立L 日守的所k 置改辦/ 易產生㈣與耗損，導致針腳的位 置改文’而影響其傳送測試訊號的能力 探針12的針尖減位於指定的位置上以 為二根 測讀邙妹 ，耳地傳达與量測 …V:須以一調針機’對該探針卡1上之複數探針 進仃私作業，而此-調針作業對於該探針+ 保養與製作至為重要。 、少 配合參閱圖2’為一般常見的調針機2,該調針機2具 有基座21、-设置於該基座21上的固定單元一門 隔：置於該固定單元22上方的舉臂單元23、一可驅動該‘ 臂早兀23相對該固定單元22作上下位移的連動單元μ， 及一顯微鏡25。 該連動單元24具有-拉桿241，使用者拉動該拉桿 241便可驅動該舉臂料23相對該固定單％ 22在一調針位 置與一非調針位置間移動。 進行調針時，先將如圖丨中所示之探針卡丨定置於該 舉臂單元23上，並將該複數探針12朝向該固定單元22 = 位置。接著將一表面上預先刻繪有模擬晶粒上每一個電極 墊位置圖的透明玻璃基板（圖2中未示）固定於該固定單元22 上，操作人員只要經由該顯微鏡25觀視，便可以對照檢視 圖1中所示之该探針卡1上的那些探針12的針腳位置已經 偏移該玻璃基板上所繪製的電極墊位置而需要調整，並再 6Test of M309752. Since the plurality of probes 12 on the far probe card 1 are connected to the wafer by time §, #,, '田彳政, and are in contact with the long U, W, and the touch of the cleaning probe, etc.,喳 且 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立Reading sister, ear communication and measurement...V: It is necessary to use a needle adjustment machine to perform the smuggling operation on the probes on the probe card 1, and this - the needle adjustment operation for the probe + maintenance and Production is of the utmost importance. Referring to FIG. 2' is a general needle adjusting machine 2, the needle adjusting machine 2 has a base 21, a fixing unit disposed on the base 21, a door spacer: a lifting arm placed above the fixing unit 22 The unit 23, a linkage unit μ for driving the 'arm arm' 23 to move up and down relative to the fixed unit 22, and a microscope 25. The linkage unit 24 has a pull rod 241, and the user pulls the pull rod 241 to drive the lift arm 23 to move relative to the fixed single unit 22 between a needle position and a non-needle position. When the needle is adjusted, the probe card shown in Fig. 丨 is first placed on the arm unit 23, and the plurality of probes 12 are directed toward the fixed unit 22 = position. Then, a transparent glass substrate (not shown in FIG. 2) on which a surface pattern of each electrode pad on the dummy crystal is preliminarily imaged is fixed on the fixing unit 22, and the operator can view the microscope 25 through the microscope. The position of the pins of the probes 12 on the probe card 1 shown in the comparison view 1 has been shifted from the position of the electrode pads drawn on the glass substrate, and needs to be adjusted, and then
M309752 ^動該拉桿241，以使該㈣單元23相對於該固定單元22 在凋針位置與一非調針位置之間位移。 2舉臂單元23位於該調針位置時，該玻璃基板是相 =離該固定單元22，而使該複數探針12與該玻璃基板間 ^有—空隙。此時，操作人員便可以-鑷子伸入該電路 反U的穿孔m中’並利用該顯微鏡25放大觀視每一根探 針12並將該複數探針12之接觸端122調整至適當位置。 當該舉臂單it 23位於該非調針位置時，該玻璃基板是 相對接近但不接觸該複數探針12，於此藉由該顯微鏡Μ透 過该玻璃基板便可檢視該複數探針12的針腳位置是否位於 萑的電極墊位置上。若無’再重複前述步驟，直至每一 根探針12之針腳位置都能正確地落在每—個電極墊位置上 ’如此才算完成整個調針的工作。 曰然而，由於該探針卡丨上的複數探針12是依照每一顆 晶粒上的電極墊位置排列，而不同晶圓產品的電極塾排列 位置並不相同。配合圖3所示，該晶粒3的每一側邊上設 置有三排電極墊31，因此，用以測試該晶粒3之如圖1所 不的採針卡1，必須每一側邊皆設置有三排探針12，可想 而知的是當伸入該鑷子以調整位在内層之複數探針12時， 报容易會碰觸到其他的探針12，導致調針不易，進而使得 整個半導體的測試流程因調針困難而事倍功半地浪費許多 的4間。再者，當操作人員使用該調針機2進行調針作業 ^ ’更需要不時騰出手來使力扳動該拉桿241，以將該舉臂 單元23加以拉抬或下降。 7 M309752 有鐘於此，為使操作人員可順暢地進行調針的動作， =快速地調整所有之複數料12，即成為相關業者虽思改 善之處。 【新型内容】 因此，本新型之㈣’即在提供一種可以雙方向地調 正探針卡之探針，並可藉由電控方式賴整該舉臂單元之 位移的可電控調整之調針機。 於是 不新型可電控調整之調針機，是用於調整一探 ，：上的複數探針，其包含有一基座、一固定單元、一舉 臂單元、—定置單元、—觀視單元H控制面板單: /亥固疋單70疋设置於該基座上，並用以定置該探針卡。 該舉臂單元是間隔設置於該固定單元上方，並可被驅動以 相對於該固定單元上下位移，且該舉臂單元具有兩個間隔 相對之舉臂’而當該探針卡被定置在該固定單元上時，該 複數探針是朝向該舉臂單元。該定置單元是可拆卸地鎖： 亥舉煮單元上，其包括有一可被固置於該兩舉臂之間的 框架4當該探針卡敎置在該框架上時，該複數探針是 朝向4舉#單元。該觀視單元是設於該舉臂單元的上方， 而J供放大地觀察該複數探#。該控制面板|元則是與該 舉煮單元電連接，而可操控該舉臂單元之作動。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 乂下配合參考圖式之兩個較佳實施例的詳細說明中，將可 清楚的呈現。 M309752 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖4、5，本新型可電控調整之調針機4的第一較 佳實施例，適用於使一如圖1所示之探針卡1，其複數探針 12朝上地被調整。該調針機4之第一較佳實施例，包含有 一基座41、一固定單元42、一舉臂單元43、一定置單元 44、一觀視單元45、一承載單元46，以及一控制面板單元 48 ° 該基座41係概呈矩形態樣。該固定單元42是設置在 该基座41上’並包括有一其上形成有複數個真空吸孔422 的固定盤421。該舉臂單元43是間隔設置於該固定單元42 的上方位置處，並具有兩個同一高度之間隔相對的舉臂又 ，與一連接該二舉臂431的連結板432。該定置單元44是 設在該舉臂單元43的二舉臂431之間，並具有一框架441 、二用於固定該框架441的固定片442，及複數用於鎖固該 二固定片442與該二舉臂431的鎖固件443。該觀視單元 45則包括有一顯微鏡451，及一連設該顯微鏡451與該舉 臂單元43的固定板452。 該承載單元46是可分離地定置於該固定單元42上， 並具有—底板461、一圍繞設置於該底板461上的圍繞壁 462，及一垂直該圍繞壁462周緣並水平向外延伸之頂板 463 ’忒底板461與該圍繞壁462相配合圍繞界定 ☆ 空間464。 4置 麥閱圖6，該控制面板單元48是與如圖4中所示之古亥 9 M309752 舉臂單元43電連接，並包括有一用 有用以控制一外來電流通過 與否之電源開關件481、-用以使該舉臂單元43回歸至原 點之原點重置件482、-用以控制該舉f單元43每次移行 之單位距離的移距切換件483、一調整該舉臂單元Μ之位 置的調位轉盤484、-用以瞬間停止該舉臂單元43位移的 停機件485、一用以控制該等舉臂431上下位移至垂直分隔 的兩定點之腳踏式控制器486，以及一可顯示該舉臂單元 43之位移程纟，並可被接觸而控制該舉臂單元43之作動的 觸控式面板487。 明併參照圖4、5，並依據上述架構，以說明該調針 機4進订該等探針12(圖未示）之接觸端122向上之調針作業 的實施情形，首先該舉臂單元43是位於一最低的原點，當 治人進行.周針作業時，該控制面板單元48 ^電源開關件術 是被扳動至指示『開啟』的位置，以啟動該舉臂單元43， 再將4探針卡1是置於該頂板463上並使得該複數探針 朝向5亥舉臂單兀43，且該探針卡i之背面上的一些如電阻 、電容等被動元件，是被容納在該容置空間464中，以使 該探針卡1置於該頂板463上時能保持平整，並藉由複數 螺絲與該頂板463相互鎖合。另外，空氣是可經由該固定 單元42上之袓數真空吸孔422，自上而下地被抽出，而將 該承載單元46吸固於該固定盤421上。 接著將一表面上預先刻繪有模擬晶圓上每一個電極墊 位置圖的透明玻璃基板5固定於該定置單元44之框架441 上。於是操作人員只要經由該顯微鏡45丨觀察，便可對照 10 M309752 檢視該探針卡i上的那些探針12的接觸端122位置未對應 該玻璃基板5上所繪製的電極塾位置，而應被調整。在: ’應注意的是，該刻繪有模擬晶圓上每一個電極墊位置圖 的透明玻璃基板5，亦可以做成投影片的方式來替代，並不 限於本實施例之說明。 當操作人員欲調整特定的探針之位置時，則需先決定 該舉臂單元43每單位距離需被調整的幅度，並將該移距= • 換件483扳動至例如『χ !⑽』、『χ 1〇』等合適之指 示位置，再轉動該調位轉盤484，以將該舉臂單元Μ移^ 至適當的調針位置，或亦可踩踏該腳踏式控制器_而將 該舉臂單元43 - 口氣朝上移行至定點，再慢慢轉動該調位 轉盤484以細調該舉臂單元43之位置。 待該舉臂單元43達該調針位置之後，該玻璃基板5是 相對遠離該固定單元42上的探針卡卜而使該複數探針η 舆該玻璃基板5間形成有4隙，操作人員即以—錯子伸 入該空隙中’並利用該顯微鏡451放大觀視每―根探針12 ，以進行§周整該複數探針12之針腳位置的工作。 之後再將該舉臂單元43下降至—非騎位置，使該玻 璃基板5是相對接近但不接觸該複數探針12，再藉由該顯 微鏡451透過該玻璃基板5便可檢㈣複數探_ 12的針„、 ，置是否位於正確的電極墊位置上。若無，再昇起該舉； 早兀43，並重複前述以該鑷子調針的步驟，直至每—根探 針12之針大位置都能正讀地落在刻印有電極塾位置的玻璃 基板5上，如此才算完成整個調針的工作，之後則可再次 11 M309752 踩踏該之腳踏式控制器486，或按控該原點重置件術，以 使該舉臂單元43回歸至原點。 請參閱圖7,本新型可電控調整之調針機6的第二較佳 實施例，適用於使一如圖1所示之探針卡卜其複數探針 12朝下地被調整，而本新型可電控調整之調針機6的第二 較佳實施例之構造其構造大致與該第一較佳實施例相同了 該調針機6同樣包含有一基座41、一固定單元42、—舉臂 單元43、-定置單元44、一觀視單元45、一承載單元仏 及&制面板單元48。相同處於此不再資述，惟不同之 處在於’該調針機6更包含有-吸附單元47。在該第二較 佳實施例中’該吸附單元47是具有—概呈帽子狀的中空殼 體471，及複數貫通該殼體471的通孔472。 請一併參照圖7、8，並依據上述架構，以說明該調針 機6進行該等探針12(圖7、8中未示）之接觸端122向下之 調針作業的實際情形，首先將圖i所示之該探針卡丄改置 於該定置單元44之框架441上’並將該複數探針12向下 朝向該固定單元42的位置’然後將該吸附單元47置於該 固定盤42i ±。接著將一表面上預先刻緣有模擬晶圓上每 -個電極墊位置圖的透明玻璃基板5定置於該吸附單元Ο 的中空殼體471表面上，由於該複數通孔仍是貫通該殼 體471 ’所以該固定盤421上的複數真空吸孔422會經由該 複數通孔472 ’將该玻璃基板5吸附於該吸附單元ο上。 此時’由於該複數探針12之接觸端122必須對應該玻 璃基板5上所緣製的電極塾位置，所以進行調針的操作人 12 M309752 貝只要經由該顯微451鏡觀視’便可對照檢查該探針卡1 上的那些探針12的針尖位置已經偏移而需要調整。 、當操作人員欲調整特定的探針之位置時，係如前所述 之透過該控制面板單元48而調整該舉臂單元43至-適者 的調針位置。於此，該玻璃基板5是相對遠離該框架= 上的探針卡卜而使該複數探針12與該破璃基板$間形成 有-空隙。此時’操作人員便可以—鎖子伸入該複數探針 並利用該顯微鏡451放大觀視每—根探針12，以進 行該複數探針12之接觸端122的調整工作。 當操作人員透過該控制面板單元48而將該舉臂單元43 下降至-非調針位置時，該玻璃基板5是相對接近但不接 探針12。此時，藉由該顯微鏡451便可檢視« 木 <接觸端122是否位於正確的電極塾位置上。若 無，#^昇起該舉臂單元43而使該探針卡！遠離該玻璃基板 。，亚里複前述以⑽子調針的步驟，直至每―根探針η Ϊ=置都能正確地落在每-個電極塾位置上，如此才 异元成整個調針的工作。 另為說明的是，择作人g介 # 术作人貝亦可猎由觸碰該觸控式面板 Γ/:1?該舉臂單元43之位移程度。另外，若該舉臂 早犬然間失控地位移，操作人員則可按控該停機件 485，即可使該舉臂單元43瞬間靜止。 依據上述的說明，可知本新型可電控調整之調針機4、 6’是藉由該定置單元44在該等探針㈣接觸端122向上 或向下調針時可分別固定該探針卡ι與該玻璃基板5，達到 13 M309752 =:卡？與該玻璃基板5的位置互調的功能，便於操 作^依錢情況視該探針卡〗4工作枝程度，而使該 等板針12針腳向上或是向下地調整該複數探針12。再者， 也由於該探針+ 1之調針工作變的較為容易，所以能相對 針卡/广調針時間，對整個測試流程來說可縮短 。夕Τ機專待該探針卡丨的維修時間。 綜上所述，本新型可電控調整之調針機4藉由該探針 …定置於該固定單元42上，並將該複數探針12朝向 ^舉臂單元43的位置處，而調整接觸端122之位置；亦可 藉由將該探針+ !固定於框架441的適當位置處，以使該 複數探針U朝向該固定單元42，進而達到雙向固定該探針 卡卜以便於探針12向上或是向下調整該複數探針12的功 效所以操作人員以本新型可電控調整之調針機4進行調 針作業時’可更為順手且簡冑，並相對地節省調針時間， 故確實能達到本新型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 乾圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一般探針卡的側視示意圖； 圖2是一般調針機的立體示意圖； 圖3是一晶圓上一個晶粒的上視示意圖，說明該晶粒 上之複數電極墊的排列關係； 14 M309752 圖4是本新型可電控調整之調 立體分解示意圖； 較佳實施例的 0疋囷4中之該較佳實施一 鲈杜與竑你I 6 旧立體不意圖，說明該 車乂佳只訑丨向上凋針時的組合態樣； 圖6是本新型可電控調整之調針機的… 的示意圖，說明其構件之相對關係位置；4面板早兀 圖7是本新型可電控調整之 立體分解示意圖；及 機弟—較佳實施例的 圖8是圖7中之該第二較佳實施例的立體示意圖，說 Μ季父佳實施例向上調針時的組合態樣。M309752 ^ The lever 241 is moved to displace the (four) unit 23 relative to the fixed unit 22 between the needle position and a non-needle position. When the arm unit 23 is located at the position of the needle, the glass substrate is a phase away from the fixing unit 22, and a gap is formed between the plurality of probes 12 and the glass substrate. At this point, the operator can push the tweezers into the perforations m of the U-turn of the circuit and use the microscope 25 to zoom in and view each of the probes 12 and adjust the contact end 122 of the plurality of probes 12 to the proper position. When the arm unit is 23 is located in the non-adjusting position, the glass substrate is relatively close to but not in contact with the plurality of probes 12, and the pins of the plurality of probes 12 can be viewed through the glass substrate through the microscope. Whether the position is at the electrode pad position of the crucible. If the above steps are not repeated, until the stitch position of each probe 12 is correctly placed on each of the electrode pad positions, then the entire needle adjustment operation is completed. However, since the plurality of probes 12 on the probe cartridge are arranged in accordance with the position of the electrode pads on each of the crystal grains, the arrangement of the electrodes of the different wafer products is not the same. As shown in FIG. 3, three rows of electrode pads 31 are disposed on each side of the die 3. Therefore, the pin card 1 used to test the die 3 as shown in FIG. 1 must be on each side. There are three rows of probes 12, and it is conceivable that when the dice are inserted to adjust the plurality of probes 12 in the inner layer, it is easy to touch the other probes 12, which makes the adjustment of the needles difficult, thereby making the whole The semiconductor test process wasted a lot of four because of the difficulty of adjusting the needle. Furthermore, when the operator uses the needle adjuster 2 to perform the needle adjustment operation, it is more necessary to vacate the hand from time to time to force the pull rod 241 to pull or lower the lift arm unit 23. 7 M309752 There is a clock here, in order to enable the operator to smoothly adjust the needle movement, = quickly adjust all the multiple materials 12, that is, the relevant industry has improved. [New content] Therefore, the present invention (4) provides a probe that can adjust the probe card in both directions, and can adjust the displacement of the arm unit by electronic control. Needle machine. Therefore, the new type of needle adjustment machine capable of electronically adjusting is used for adjusting a probe, which includes a base, a fixed unit, a lift arm unit, a fixed unit, and a viewing unit H control. Panel list: / Haigu 疋 single 70 疋 is set on the base and used to fix the probe card. The lifting arm unit is spaced above the fixing unit and can be driven to be displaced up and down with respect to the fixing unit, and the lifting arm unit has two spaced opposite arms 'when the probe card is fixed at the When the unit is attached, the plurality of probes are oriented toward the arm unit. The fixed unit is detachably locked: the boiled cooking unit includes a frame 4 that can be fixed between the two arms, when the probe card is placed on the frame, the plurality of probes are Head toward 4 units #. The viewing unit is disposed above the lifting arm unit, and J is for observing the complex detecting # in an enlarged manner. The control panel|element is electrically connected to the cooking unit, and can be operated by the lifting unit. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. M309752 Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. Referring to Figures 4 and 5, a first preferred embodiment of the electronically adjustable needle adjusting machine 4 is adapted to adjust a probe card 1 as shown in Figure 1 with its plurality of probes 12 facing upwards. . The first preferred embodiment of the needle adjusting machine 4 includes a base 41, a fixing unit 42, a lifting arm unit 43, a fixed unit 44, a viewing unit 45, a carrying unit 46, and a control panel unit. 48 ° The base 41 is a rectangular shape. The fixing unit 42 is disposed on the base 41 and includes a fixed disk 421 on which a plurality of vacuum suction holes 422 are formed. The lifting arm unit 43 is disposed at an upper position of the fixing unit 42 at intervals, and has two lifting arms that are opposite to each other at the same height, and a connecting plate 432 that connects the two lifting arms 431. The fixing unit 44 is disposed between the two arms 431 of the lifting arm unit 43 and has a frame 441, two fixing pieces 442 for fixing the frame 441, and plural numbers for locking the two fixing pieces 442 and The lock 443 of the two arms 431. The viewing unit 45 includes a microscope 451, and a fixing plate 452 to which the microscope 451 and the arm unit 43 are attached. The carrying unit 46 is detachably disposed on the fixing unit 42 and has a bottom plate 461, a surrounding wall 462 disposed on the bottom plate 461, and a top plate extending perpendicularly outward from the periphery of the surrounding wall 462. The 463 '忒 bottom plate 461 cooperates with the surrounding wall 462 to define a ☆ space 464. 4, FIG. 6, the control panel unit 48 is electrically connected to the Guk 9 M309752 lifting arm unit 43 as shown in FIG. 4, and includes a power switch member 481 for controlling the passage of an external current. - an origin reset member 482 for returning the lift arm unit 43 to the origin, a shift switch 483 for controlling the unit distance of the f unit 43 to move each time, and an adjustment of the lift arm unit The positioning dial 484 at the position of the cymbal, the stopping member 485 for instantaneously stopping the displacement of the lifting arm unit 43, and the pedal controller 486 for controlling the up and down displacement of the lifting arms 431 to two fixed points of the vertical separation, And a touch panel 487 that can display the displacement range of the arm unit 43 and can be contacted to control the movement of the arm unit 43. Referring to Figures 4 and 5, and in accordance with the above-described architecture, the needle-changing machine 4 is configured to perform an upward adjustment operation of the contact end 122 of the probes 12 (not shown). First, the arm unit is 43 is located at a lowest origin. When the person performs the work of the week hand, the control panel unit 48 ^ power switch is moved to the position indicating "ON" to activate the arm unit 43, and then The 4 probe card 1 is placed on the top plate 463 and the plurality of probes are directed toward the 5th arm, and some passive components such as resistors, capacitors, etc. on the back side of the probe card i are accommodated. In the accommodating space 464, the probe card 1 can be kept flat when placed on the top plate 463, and interlocked with the top plate 463 by a plurality of screws. In addition, air can be drawn from the top to bottom through the number of vacuum suction holes 422 on the fixing unit 42, and the carrying unit 46 is sucked on the fixed plate 421. Next, a transparent glass substrate 5 on a surface on which a position map of each electrode pad on the dummy wafer is preliminarily imaged is fixed on the frame 441 of the fixed unit 44. Therefore, the operator can observe the position of the contact end 122 of the probe 12 on the probe card i against the position of the electrode 塾 on the glass substrate 5 according to the observation of 10 M309752 by the operator, and should be Adjustment. In the following, it should be noted that the transparent glass substrate 5 on which the position map of each electrode pad on the wafer is simulated may be replaced by a projection sheet, and is not limited to the description of the embodiment. When the operator wants to adjust the position of the specific probe, it is necessary to first determine the extent to which the arm unit 43 needs to be adjusted per unit distance, and move the shift = • the change piece 483 to, for example, "χ!(10)" And a suitable indicating position such as "χ 1〇", and then rotating the positioning dial 484 to move the lifting arm unit to an appropriate needle position, or to step on the pedal controller _ The arm unit 43 - moves the breath upward to a fixed point, and then slowly rotates the positioning dial 484 to finely adjust the position of the arm unit 43. After the lifting arm unit 43 reaches the needle position, the glass substrate 5 is relatively far away from the probe card on the fixing unit 42 to form a gap between the plurality of probes η and the glass substrate 5, and the operator That is, the errone is inserted into the gap and the microscope 451 is used to enlarge the view of each of the probes 12 to perform the work of stitching the stitch positions of the plurality of probes 12. Then, the lifting arm unit 43 is lowered to the non-riding position, so that the glass substrate 5 is relatively close but does not contact the plurality of probes 12, and then the microscope 451 can pass through the glass substrate 5 to detect (4) complex detection. The needle of 12 is placed at the correct electrode pad position. If not, raise the lift again; The position can be read on the glass substrate 5 engraved with the electrode , position, so that the whole needle adjustment work can be completed, and then the pedal controller 486 can be stepped on again by 11 M309752, or the original controller can be pressed. Point resetting operation to return the lifting arm unit 43 to the origin. Referring to FIG. 7, a second preferred embodiment of the electronically adjustable needle adjusting machine 6 of the present invention is adapted to be as shown in FIG. The probe card is shown with its multiple probes 12 adjusted downwards, and the second preferred embodiment of the novel electronically adjustable needle adjuster 6 is constructed substantially the same as the first preferred embodiment. The needle adjusting machine 6 also includes a base 41, a fixing unit 42, and an arm unit 43. A fixed unit 44, a viewing unit 45, a carrying unit 仏 and a panel unit 48. The same is not described here, except that the needle adjusting machine 6 further includes an adsorption unit 47. In the second preferred embodiment, the adsorption unit 47 is a hollow housing 471 having a hat-like shape and a plurality of through holes 472 extending through the housing 471. Please refer to FIGS. 7 and 8 together. According to the above structure, in order to explain the actual situation that the needle adjusting machine 6 performs the downward adjustment operation of the contact end 122 of the probes 12 (not shown in FIGS. 7 and 8), the probe shown in FIG. The cassette is placed on the frame 441 of the fixed unit 44 and the position of the plurality of probes 12 is directed downward toward the fixed unit 42. Then the adsorption unit 47 is placed on the fixed disk 42i ±. A transparent glass substrate 5 preliminarily having a position map of each electrode pad on the dummy wafer is disposed on the surface of the hollow casing 471 of the adsorption unit ,, since the plurality of through holes are still penetrated through the casing 471 ' The plurality of vacuum suction holes 422 on the fixed disk 421 will pass the glass base through the plurality of through holes 472 ' 5 is adsorbed on the adsorption unit ο. At this time, since the contact end 122 of the complex probe 12 must correspond to the position of the electrode rim on the glass substrate 5, the operator who performs the needle adjustment 12 M309752 The microscopic 451 mirror view can be used to check that the tip position of the probes 12 on the probe card 1 has been shifted and needs to be adjusted. When the operator wants to adjust the position of the specific probe, it is as before. The adjustment of the arm unit 43 to the needle position of the appropriate person is performed through the control panel unit 48. Here, the glass substrate 5 is relatively far away from the probe card on the frame = the complex probe 12 is A gap is formed between the glass substrates $. At this point, the operator can insert the lock into the plurality of probes and use the microscope 451 to zoom in on each of the probes 12 to perform the adjustment of the contact end 122 of the plurality of probes 12. When the operator lowers the lift arm unit 43 to the -non-adjustment position through the control panel unit 48, the glass substrate 5 is relatively close but not attached to the probe 12. At this time, the microscope 451 can be used to check whether or not the contact end 122 is at the correct electrode position. If not, #^ raises the arm unit 43 to make the probe card! Keep away from the glass substrate. , Alibaba repeats the above steps of (10) sub-needle adjustment, until each of the probes η Ϊ = set correctly falls on each of the electrode 塾 positions, so that the aliens become the entire needle adjustment work. In addition, the selection of the person can also be used to touch the touch panel Γ/:1? The degree of displacement of the arm unit 43. In addition, if the lift arm is displaced out of control early, the operator can press the stop member 485 to make the lift arm unit 43 instantaneously stationary. According to the above description, it can be seen that the needle-adjusting machine 4, 6' of the electronically controllable adjustment can fix the probe card by the fixing unit 44 when the needle (four) contact end 122 is adjusted up or down. With the glass substrate 5, reach 13 M309752 =: card? The function of intermodulating the position of the glass substrate 5 facilitates the operation of the probe card 4 according to the degree of the operation, and the pin 12 is adjusted upward or downward by the pin 12 pins. Moreover, since the adjustment of the probe + 1 is easier, the needle/wide adjustment time can be shortened for the entire test procedure. The Τ machine is dedicated to the repair time of the probe cassette. In summary, the electronically adjustable needle adjusting machine 4 is placed on the fixing unit 42 by the probe, and the plurality of probes 12 are oriented toward the position of the arm unit 43 to adjust the contact. The position of the end 122; the probe + is also fixed at a suitable position of the frame 441 so that the plurality of probes U face the fixing unit 42, thereby achieving bidirectional fixing of the probe card to facilitate the probe 12 Adjusting the function of the plurality of probes 12 upwards or downwards, so the operator can make the needle adjustment operation of the electronically adjustable needle adjustment machine 4 more convenient and simple, and relatively save the needle adjustment time. Therefore, it is indeed possible to achieve the purpose of this new type. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification of the patent application and the new description of the present invention. , are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic side view of a general probe card; FIG. 2 is a perspective view of a general needle adjustment machine; FIG. 3 is a top view of a die on a wafer, illustrating the die The arrangement of the plurality of electrode pads; 14 M309752 FIG. 4 is a schematic exploded perspective view of the electronically controllable adjustment of the present invention; the preferred embodiment of the preferred embodiment of FIG. 4 is a 立体 Du and 竑 you I 6 old stereo Intention, which shows the combination of the car 乂 訑丨 訑丨 訑丨 ;; Figure 6 is a schematic diagram of the electronically adjustable needle adjustment machine of the present invention, illustrating the relative position of the components; 4 panel early map 7 is a three-dimensional exploded view of the electronically controllable adjustment of the present invention; and FIG. 8 is a perspective view of the second preferred embodiment of FIG. 7 in the preferred embodiment of the present invention. The combination of time.
15 M30975215 M309752
【主要元件符號說明】 1 探針卡 442 固定片 11 電路板 443 鎖固件 110 穿孔 45 觀視單元 12 探針 452 固定板 121 連接端 46 承載單元 122 接觸端 461 底板 2 調針機 462 圍繞壁 21、 41 基座 463 頂板 11、 42 固定單元 464 容置空間 23、 43 舉臂單元 47 吸附單元 24 連動單元 471 殼體 241 拉桿 472 通孔 25、 451 顯微鏡 48 控制面板單元 3 晶粒 481 電源開關件 31 電極墊 482 原點重置件 4 調針機 483 移距切換件 421 固定盤 484 調位轉盤 422 真空吸孔 485 停機件 431 舉臂 486 腳踏式控制器 432 連結板 487 觸控式面板 44 定置單元 5 玻璃基板 441 框架 16[Main component symbol description] 1 Probe card 442 Fixing plate 11 Circuit board 443 Locking device 110 Perforation 45 Viewing unit 12 Probe 452 Fixing plate 121 Connecting end 46 Carrying unit 122 Contact end 461 Base plate 2 Needle adjusting machine 462 Surrounding wall 21 41 base 463 top plate 11, 42 fixing unit 464 accommodation space 23, 43 arm unit 47 adsorption unit 24 linkage unit 471 housing 241 pull rod 472 through hole 25, 451 microscope 48 control panel unit 3 die 481 power switch 31 Electrode pad 482 Home position resetter 4 Needle changer 483 Shift switch 421 Fixed plate 484 Positioning turntable 422 Vacuum suction hole 485 Stopper 431 Lifting arm 486 Foot control 432 Link plate 487 Touch panel 44 Setting unit 5 glass substrate 441 frame 16