M307189 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種夾持電路板用之前導治具，尤指— 種適用於在濕製程中防止電路板卡板之夾持電路板用之前 導治具。 【先前技術】M307189 VIII. New description: [New technical field] This creation is about a pre-guided fixture for holding a circuit board, especially one that is suitable for preventing the clamping of the circuit board during the wet process. Guide tool. [Prior Art]
10 15 20 由於電子產品日趨輕量化、薄型化、小型化、多功能 化等需求，同時帶動積體電路晶片封裝技術的發展，進而 促使晶片封裝朝向多腳化、薄型化、及引腳微細化，甚至 無引腳構裝等技術。 為因應輕薄短小的趨勢以及追求封裝的高密度化’對 於小面積、I/O接聊提高、佈線緻密化、低雜訊、產品可靠 f、甚f製作成本諸求’已成為封裝基板製作之重要課 題。目前晶片尺寸型封I (Chip Seale Paekage ; csn、塑勝 ^陣列封裝（HaStle歸GHd A叫；pBGA)、及覆晶（啊 ChlP，FC)技術為封裝主流技術。 一ί卿及PBGA中，所謂csp即為晶片級封裝的意思， :曰的是封裝產品邊長為内含晶片@ 12倍以内，或是 ?:=積小於内含晶….5倍，此範圍内之封裝產 二rrsp’csp係為達到微型化並同時提供更進階 卑’日日片級封裝用載板因應而生。而pBGA中，一般 片的製作定義為所謂的零階構裝，將晶片安 、板或V線采的程序被稱為一階構裝，構裝完成的晶 5 M307189 片組裝到模組或介面卡上稱為二階構裝，將介面卡安裝到 母板或系統板的過程稱為三階構裝。PBGA則為電子封妒 中一階封裝（Primary Level Package)用的载板，隨著封裝 接腳數的增加及電子產品輕薄短小的需求，pbga亦已^ 5 為一階封裝的主流。 市場上對於CSP及PBGA產品輕薄短小之要求，目前已 走向總板厚小於〇.lmm之超薄基板。然而此種㈣基板的板 材太薄、太軟，很容易因濕製程中藥液的喷壓而使進板邊 龜起，導致板子於槽液中卡板，造成產線停擺而降低產能， 10因此’如何在目前為CSP以及PBGA封裝製程中，解決因生 產超薄基板而產生製程中會有卡板現象的問題急待解決。 【新型内容】 15 20 一鑒於上述習知問題，本創作提供一種夾持電路板用之 則導治具，其係包含：—主板以及複數個凸出部。其中， 主板係為矩形狀，用以加強電路板的強度。另一方^ 數個凸出部係配置於主板之一長邊，且與主板一體成型稷 猎以夾持電路板。湘本創作提供之料治具，以爽持電 路板之後，可發揮提升電路㈣度之效。因此 期間，電路板輸送過財，本創作俾能防止卡板情形:發 生0 x 根據上述本創作之夾持電路板用之前導治具，電路板 内：包含-功能區以及一空瞻區，其中空·區係位於電路 板邊緣區域’功能區係為電路_具電性魏之區域。 6 M307189 根據上述本創作之夾持 導治具夾持電路板之方法無 持電路板。 電路板用之前導治具，其中前 限制，較佳地係利用凸出部夾 < +剐1卞〜八付电峪扳用之前導治呈， 出部夾持電路板之方法盔 ，、，、中凸 電路板上表面與下表面， =錯方式柑制 以父錯的方式箝制電路板的空曠區， ^10 15 20 Due to the increasing demand for thinner, thinner, smaller, and more versatile electronic products, the development of integrated circuit chip packaging technology has also led to the development of chip packages that are multi-legged, thinner, and pin miniaturized. , even technology without lead assembly. In order to respond to the trend of thinness and shortness, and to pursue high density of packaging, 'for small area, I/O connection improvement, wiring densification, low noise, reliable product, and f production cost' has become a package substrate. important topic. At present, Chip Seale Paekage; csn, plastic wins array package (HaStle GHd A called; pBGA), and flip chip (ah ChlP, FC) technology are the mainstream packaging technology. In one qingqing and PBGA, The so-called csp is the meaning of wafer-level packaging, 曰 是 封装 封装 封装 封装 封装 封装 封装 封装 封装 @ @ @ @ @ @ @ @ @ @ @ @ @ @ @ @ @ @ @ rr rr rr rr rr rr rr rr rr rr rr rr rr rr 'csp is designed to achieve miniaturization and at the same time provide a more advanced hurry's day-to-day package. In pBGA, the production of a typical film is defined as a so-called zero-order package, which will be mounted on a chip, board or The procedure of the V line is called the first-order structure. The assembly of the crystal 5 M307189 piece is assembled on the module or interface card. It is called the second-order structure. The process of installing the interface card to the motherboard or system board is called three. PBGA is the carrier board for the first level package in the electronic package. With the increase of the number of package pins and the demand for light and thin electronic products, pbga has also been a first-order package. Mainstream. The demand for CSP and PBGA products in the market is short and light. The ultra-thin substrate with a thickness less than 〇.lmm. However, the plate of the (four) substrate is too thin and too soft, and it is easy to cause the blade to be torn due to the spraying of the liquid in the wet process, resulting in the card being stuck in the bath. The board causes the production line to stop and reduce the production capacity. 10 Therefore, it is urgent to solve the problem that there will be a card in the process due to the production of ultra-thin substrates in the current CSP and PBGA packaging process. [New content] 15 In view of the above-mentioned conventional problems, the present invention provides a guiding tool for holding a circuit board, which comprises: a main board and a plurality of protruding portions, wherein the main board is rectangular and used to reinforce the circuit board. The other side has a number of protruding parts arranged on one of the long sides of the main board, and is integrated with the main board to hunt and hold the circuit board. The material jig provided by Hiroshi creation can be used after the board is held. Improve the circuit (four) degree. Therefore, during the period, the board is transported for money, this creation can prevent the card case: 0 x According to the above-mentioned creation of the clamping circuit board with the previous jig, within the board: include - function District and an air perspective The area, where the space and the area are located in the edge area of the circuit board, the functional area is the area of the circuit _ electrical power. 6 M307189 The method of holding the circuit board according to the above-mentioned clamping fixture is not holding the circuit board. The front guide is used for the board, wherein the front limit is preferably the use of the bulging clip < + 剐 1 卞 ~ 八 峪 峪 用 之前 之前 之前 之前 之前 之前 , , , , , , , , , , , , On the upper and lower surfaces of the convex circuit board, the wrong way is to clamp the open area of the circuit board in a wrong way. ^
進行。 f 纽礙電路板功能區之製程 10 15 根據上述本創作之夾持電 具之材質無限制，較佳地係為 板，其中金屬板可為不銹鋼板 根據上述本創作之夾持電 數個凸出部之配置方式無限制 式配置於主板之長邊。 路板用之前導治具，前導治 FR-4基板或耐腐蝕之金屬 〇 路板用之前導治具，其中複 ，較佳地係以等間隔排列方 20 根據上述本創作之央持電路板用之前導治具，其中凸 出部之幾何條件無限制，例如可為半圓形、三角形、擴圓 二矩形料任意形狀’只要可箝制電路板的形狀均可。 土地係為矩形，而且此矩形狀之凸出部之長邊係可連結 :主板’而與主板一體成型。另外，此矩形狀之凸出部長 邊長度無限制，較佳地係介於1{)至3G毫米之範圍内。同 樣地出部不論為何種形狀，其舆主板連接之—側均可 適用。另夕卜此矩形狀之凸出部之寬邊長度大致上係小於 或專於凸出部之長邊長度，較佳地介於1G至2〇毫米之範 7 M3 07189 之夾持電路板用之前導治具，其中前 ，較佳地係介於〇.2至丨毫米之範圍 之夾持電路板用之前導治具，其中主 ，較佳地係介於400至6〇〇毫米之範 根據上述本創作之夾持電路板用之前導治且， 板之寬邊長度無限制，較佳地係介於80至15〇Π毫米 根據上述本創作之夾持電路板用之前導治具，其中複 ，個凸出部之間距無限制’較佳地係介於40至60毫米之 範圍内。 15 圍内。 根據上述本創作 導治具之厚度無限制 内0 根據上述本創作 板之長邊長度無限制 圍内。 其中主 之範圍 在本創作中之前導治具主要用以夾持電路板，更精確 的既，係為夾持一超薄之電路板。主要原因在於因為水平 機台製程(如線路成型製程中之顯影、银刻、去膜或電鍍導 =孔製程或綠漆製程中之顯影），對於小於（U毫米之超薄 ，路板常有卡板問題，由於超薄電路板的板材太薄、太軟， 谷易因濕製程巾藥液的噴壓而使進板邊輕起，I致電路板 於槽液中卡板，造成產線停擺而降低產能。因&，需要本 創作之别導治具以夾持電路板，進而降低報廢率、提升良 【實施方式】 20 M307189 以下係藉由特定的具體實施例說明 5 10 15 20 式祕熟習此技藝之人式可由本說明書所揭示之:容：:: 了解本創作之其他優點與功效。本創作亦可藉由以也 =體貫施例加以施行或應用，本說明書中的各項 可土於不同觀點與應用，在不棒離本創作之下^ 種修飾與變更。 3砰下進仃各 實施例 為解決濕製程時，輪送電路板2G過程中，嚴 問題，特有本創作產生。故提供以下實施例，具體說 創作所述之夾持電路板20用之前導治具。 =，請參考圖卜本實施例係一種夾持電路板用 ::冶具。其中，該前導治具主要包含：一主板m以 及複數個凸出部1〇2。 本實施例中’主板101係為矩形狀，其周緣具有一對 t板長邊以及一對主板寬邊，而且主板長邊大於主板寬 邊。此外’本創作所述之前導治具，尺寸大小原本無限制。 ^而’為了配合濕製程期間的工作條件，本實施例提供之 則導治具’對於主板1G1之尺寸方面，做出了以下的定義。 /、令’ β亥主板101長邊之長度，係介於4〇〇至6⑻毫米之 ，圍内，本實施例係使用51〇毫米長的主板ι〇ι。主板ι〇ι 見邊之長度’係介於80至15〇毫米之範圍内，本實施例則 使用125毫米寬的主板ι〇1。 、另一方面，複數個凸出部102係配置於該主板1〇1長 邊即為主板101周緣上，長度較大之邊。而且，凸出部 9 M307189 與主板1G1係為—體成型之前導治具。換言之，於本實 1上=出邛ι〇2與主板101係分屬於前導治具的不同部 ^ /岫導/〇具雖包含主板101與複數個凸出部102，其本 質上乃為-體成型。此外’凸出冑1〇2可藉以任何形：， 於及主板1G1長邊。而本實施例中，凸出# 1 〇2係以 等間隔排列方式配置於主板1G1長邊，而且複數個凸出部 102之間’各間隔介於4〇至6〇毫米之範圍内’而本實施例 則使用間隔50毫米。再者，凸出部1〇2之幾何條件在本實 施例中係為一矩形，其周緣具有-對凸㈣102之長邊以 及—對凸出部1G2之寬邊，而且凸㈣m之長邊大於凸 出部呢之寬邊。其中，凸出部1〇2之長邊連結於主板⑻， 即以較長之邊連結於該主板1G1，而整合成本實施例提供之 前導治具。 此外，本創作料之料治具，尺寸大小原本無限制。 15 $而，為了配合濕製程期間的工作條件，本實施例提供之 前導治具，對該等凸出部102之尺寸方面，做出了以下的 • 定f。其中，該凸出部⑽之長邊長度介於10至3〇毫米 之範圍内’本實施例則使用2〇毫米的長度。該凸出部1〇2 之寬邊長度介於10至20毫米之範圍内，而本實施例則使 20 用15毫米的寬度。 關於本創作所述之前導治具整體厚度方面，其厚度大 J、本無限制。而本貫施例中，前導治具之厚度介於〇.2至1 氅米之範圍内。另外，本創作所述之前導治具材質不限， 為配合濕製程期間的工作條件，宜使用耐腐蝕性佳的材 M307189 料。故本實施例中，前導治具係為不錄鋼板成型而得之。 本實施例係提供一種夾持電路板用之前導治具，其作 用方式以及前導治具夹持電路板之方式可請進—步夫考圖 2所示’該前導治具係用以夾置—電路板i該電路板ς 之形式、種類不限。而本實例中，所使用之電路板2〇係包 含-功能區201以及—空曠區2〇2的—種超薄電路板，1 中空瞻區2〇2係位於電路板2G邊緣區域，功能區加係ς 於空瞻區202以外之區域。換言之，本實施例提供之前導 治具，可用以夾持任何形式、種類之電路板2〇。 10 15 20 此等凸出部1〇2係以交錯方式箱制電路板加上、下兩 側之表面，而且此等凸出部1〇2僅箝制住電路板2〇空瞻區 的部份。因此，於本實施中，前導治具係藉由凸出部 102交錯之方式以夾持電路板2〇。 因此，本實施例提供—種夾持電路板20用之前導治 具，其係包括主板1〇1與複數個凸出部1〇2。並利用此2 出部=錯箝制電路板2。的上、下表面，以爽持電路板 ，产升電路板之強度。因此’在濕製程期間，電路板2〇 輸达過程中，俾能防止卡板情形之發生。 綜上所述，本創作係於電路板進板方向之位置，加至 一使電路板加硬，X易裝卸之前導治具，此前導治且 電路板邊緣u㈣，以免阻礙電路板功能區 q丁，且此則導治具之凸出部以間隔方式箝制電路 板的上'T表面’以此料治具引導 此創作可降低報廢率，提升良率。扳於滾輪間剛進， 11 M307189 上述貫施例僅係為了方便說明而舉例而已，本創作所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 【圖式簡單說明】 意 路板之示 圖Η系本創作一較佳實施例之前導治具之示土回 圖2係本創作一較佳實施例中前導治具 圖。 寸电 10 【主要元件符號說明】 101 主板 102 凸出部 20 電路板 201 功能區 202 空曠區get on. f The process of the circuit board functional area 10 15 According to the above-mentioned creation of the clamp electric material is not limited, preferably a plate, wherein the metal plate can be a stainless steel plate according to the above-mentioned creation of the clamping electric number convex The configuration of the outlet is unrestricted on the long side of the motherboard. The guide plate is used for the guide plate, the front guide FR-4 substrate or the corrosion-resistant metal circuit board is used for the front guide, and the complex, preferably at equal intervals, is arranged 20 according to the above-mentioned central circuit board of the present invention. With the former guiding tool, the geometric condition of the protruding portion is not limited, for example, it may be a semicircular shape, a triangular shape, or a circular shape of two rectangular materials, as long as the shape of the circuit board can be clamped. The land system is rectangular, and the long side of the rectangular projection can be coupled to the main board and integrally formed with the main board. Further, the length of the rectangular projecting edge is not limited, and is preferably in the range of 1{) to 3G mm. The same type of outlet can be applied to the side of the main board connection regardless of the shape. In addition, the length of the broad side of the rectangular projection is substantially smaller than or exclusively for the length of the long side of the projection, preferably between 1 G and 2 mm of the width of the 7 M3 07189 clamping circuit board. The former guiding tool, wherein the front part is preferably a front guiding tool for holding the circuit board in the range of 〇.2 to 丨 mm, wherein the main, preferably between 400 and 6 mm According to the above invention, the clamping circuit board is previously guided, and the length of the wide side of the board is not limited, preferably 80 to 15 mm. Wherein, the distance between the projections is not limited 'preferably within the range of 40 to 60 mm. 15 inside. According to the above-mentioned creation, the thickness of the guide is not limited. 0 According to the length of the long side of the above-mentioned creation board, there is no limit. The scope of the main body In this creation, the guiding tool is mainly used to hold the circuit board, and more precisely, it is to hold an ultra-thin circuit board. The main reason is that because of the horizontal machine process (such as development, silver engraving, stripping or electroplating in the line forming process, or the development process in the green paint process), for the ultra-thin (U mm thin, the road plate often has Card board problem, because the sheet of the ultra-thin circuit board is too thin and too soft, the valley is easy to lighten the edge of the board due to the spray pressure of the wet process towel liquid, and the circuit board is stuck in the bath, resulting in a production line. Shutdown and reduce the production capacity. Because of the need, the special guides of this creation are needed to clamp the circuit board, thereby reducing the scrap rate and improving the performance. [Embodiment] 20 M307189 The following is a description of a specific embodiment 5 10 15 20 The human form of this skill can be revealed by this specification: Rong::: Understand the other advantages and effects of this creation. This creation can also be implemented or applied by means of the same embodiment. Various items can be applied to different viewpoints and applications, and they are not modified from the original creation. 3 砰 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 仃 为 为 为 为 为 为 为 为 为 为 为 为 为 轮 轮 轮 轮 轮This creation is produced. For example, the clamping device for the clamping circuit board 20 is used for the previous guiding tool. =, please refer to the drawing. The embodiment is a clamping circuit board:: a metallurgical tool. The front guiding tool mainly comprises: a main board m and a plurality of protrusions 1〇2. In the embodiment, the main board 101 is rectangular, and has a pair of long sides of the t-board and a pair of main sides of the main board, and the long side of the main board is larger than the wide side of the main board. The size of the previous guiding tool is not limited. ^And 'in order to cooperate with the working conditions during the wet process, the guiding tool provided in this embodiment' has the following definitions for the size of the main board 1G1. /, Let the length of the long side of 'βHai motherboard 101, between 4〇〇 and 6(8) mm, in this case, use the 51〇mm long main board ι〇ι. The main board ι〇ι see the side The length ' is in the range of 80 to 15 mm. In this embodiment, the main board ι〇1 of 125 mm width is used. On the other hand, the plurality of projections 102 are disposed on the long side of the main board 1〇1. It is the side with a larger length on the periphery of the main board 101. Moreover, the projection 9 M 307189 and the main board 1G1 are the body guides before the body molding. In other words, in the real 1 on the 邛 〇 〇 2 and the main board 101 are part of the different parts of the lead fixture ^ / 岫 guide / cookware, although the main board 101 And in the plurality of protrusions 102, which are essentially body-formed. In addition, the 'bulge 胄1〇2 can be any shape: and the long side of the main board 1G1. In this embodiment, the protrusion #1 〇2 They are arranged at equal intervals in the long side of the main board 1G1, and the 'intervals between the plurality of protrusions 102 are in the range of 4 〇 to 6 〇 mm. In this embodiment, the interval is 50 mm. The geometrical condition of the protrusion 1〇2 is a rectangle in the embodiment, and the circumference has a long side of the pair of convex (four) 102 and a wide side of the pair of convex parts 1G2, and the long side of the convex (four) m is larger than the convex part. The wide side of it. The long side of the protruding portion 1〇2 is connected to the main board (8), that is, the long side is connected to the main board 1G1, and the front guiding fixture provided by the embodiment is integrated. In addition, the material fixture of this creation material has no limitation in size. In order to meet the working conditions during the wet process, the front guide provided in this embodiment has the following requirements for the size of the projections 102. Here, the length of the long side of the projection (10) is in the range of 10 to 3 mm. In this embodiment, the length of 2 mm is used. The length of the wide side of the projection 1 2 is in the range of 10 to 20 mm, and in this embodiment, the width of 15 mm is used. Regarding the overall thickness of the guiding tool before the present invention, the thickness thereof is large, and there is no limitation. In the present embodiment, the thickness of the leading fixture is in the range of 〇.2 to 1 氅. In addition, the material of the previous guiding tool is not limited in the present invention. In order to meet the working conditions during the wet process, it is preferable to use the material M307189 which is excellent in corrosion resistance. Therefore, in the present embodiment, the front guide is obtained by not forming a steel sheet. In this embodiment, a pre-guide jig for holding a circuit board is provided, and the mode of action and the manner in which the front jig is clamped to the circuit board can be advanced - the step guide is shown in FIG. 2 - Circuit board i The form and type of this board 不限 is not limited. In the present example, the circuit board 2 used is an ultra-thin circuit board including a functional area 201 and an open area 2〇2, and a hollow viewing area 2〇2 is located at the edge area of the circuit board 2G, and the functional area Add to the area outside the air zone 202. In other words, the present embodiment provides a front fixture that can be used to hold any type, type of circuit board 2〇. 10 15 20 These projections 1〇2 are arranged in a staggered manner on the surface of the circuit board plus the lower sides, and the projections 1〇2 only clamp the part of the circuit board 2 . Therefore, in the present embodiment, the front guides are held by the projections 102 so as to sandwich the circuit board 2''. Therefore, the present embodiment provides a conventional guide for holding the circuit board 20, which includes a main board 101 and a plurality of projections 1 and 2. And use this 2 out = wrong clamp circuit board 2. The upper and lower surfaces are used to cool the board and the strength of the board. Therefore, during the wet process, during the board 2 输 transmission, 俾 can prevent the card from occurring. In summary, the creation is in the direction of the board into the board, added to a hardened circuit board, X easy to load and unload the guide, before the guide and the edge of the board u (four), so as not to obstruct the board function area q D, and the bulge of the guiding fixture clamps the upper 'T surface' of the circuit board in a spaced manner, thereby guiding the creation to reduce the scrap rate and improve the yield. 11 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a front view of a preferred embodiment of the present invention. FIG. Inch 10 [Main component symbol description] 101 Main board 102 Projection 20 Circuit board 201 Function area 202 Open area
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