M297608 八、新型說明： _【新型所屬之技術領域】 本新型係關於一種印刷電路板，尤指一種用於逆變器 之整合式印刷電路板。 【先前技術】 逆變H主要舰之—為將由直流供絲提供的錢電壓訊號 轉換為_的高壓脈衝，使燈管持續點亮，故該逆魏的雙面板 或多層板上佈置有直流健電路和高頻高壓電路，在工作過程 中，該高頻高壓電騎無直流健電路纽谓，影響逆變器 的! 生此，如.該高頻紐電路産生大量的電魏H彡響電路板 上其它電子元件的功能，甚者，該高頻高壓電路可能會發生意外 放電，燒壞其它電子元件。 -種傳統之解決方雜翻增加逆變^電路板層數，通過設 。十電路板電路的佈局，以使該高頻高壓電路與該直流低壓電路間 隔開，但此方案大大地增加逆變器電路板的成本。 另種傳統之解決方案係採用加大逆變器電路板尺寸，通過 重新佈局電路板上的高頻高壓電路和直流低壓電路，使該高頻高 壓電路與該直流低壓電路間隔開，雖此方案可有效地阻止該高頻 咼壓電路和違直流低壓電路之干擾，但該方案增加大了逆變器的 尺寸，使電子產品的空間利用率低，影響電子產品朝輕、薄、短、 小方向的發展。 M297608 【新型内容】 有鑒於此，有必要提供一種用於逆變器之整合式印刷 電路板，在保證電路適用的條件下，降低成本。 此外，還需提供一種帶有該整合式印刷電路板之逆變 器。 一種整合式印刷電路板，用於逆變器，該整合式印刷 電路板包括：一第一印刷電路板，包括複數第一導線，位 於第一印刷電路板之表面，用以提供電子元件間電性連 接；以及一第二印刷電路板，包括複數第二導線，位於第 二印刷電路板之表面，用以提供電子元件間電性連接；其 中，第二印刷電路板垂直設置於第一印刷電路板上，且第 一導線與第二導線電性連接。 一種逆變器，包括一整合式印刷電路板。該整合式印 刷電路板包括：一第一印刷電路板，包括複數第一導線， 位於第一印刷電路板之表面，用以提供電子·元件間電性連 接；以及一第二印刷電路板，包括複數第二導線，位於第 二印刷電路板之表面，用以提供電子元件間電性連接；其 中，第二印刷電路板垂直設置於第一印刷電路板上，且第 一導線與第二導線電性連接。 作為本新型之進一步改進，第二印刷電路板可選用一 高性能之電路板，第一印刷電路板可選用單面板，在電路 8 M297608 佈線時，以第-印刷電路板為主體，根據電路需要，將部 '分高頻高壓或複雜電路佈在第二印刷電路板上，其餘部分 .電路佈在第-印刷電路板，第=印刷電路板的寬度不大 於第一印刷電路板上的最高電子元件的高度。 採用此種結構之電路板組合可大幅降低成本，同時使 高頻高壓電路與低壓直流電路間隔分開，以減小高頻高壓 鲁 電路與低壓直流電路之干擾，提高電路之性能，而且，此 種結構不會增大該電子設备之體積。 【實施方式】 請參照圖1，為本新型之整合式印刷電路板之一實施 方式不意圖。整合式印刷電路板包括：一第一印刷電路板 100及一第二印刷電路板200。第二印刷電路板2〇〇垂直設 置於第一印刷電路板100之表面。 % 在本實施方式中，第一印刷電路板100為一單面板， 第二印刷電路板200為一多層板。第一印刷電路板ioo包 括複數第一導線102，位於其表面，用以提供電子元件間 之電性連接。第二印刷電路板200包括複數第二導線202, 位於其兩表面，用以提供電子元件間之電性連接。第二印 刷電路板更設有複數導孔（圖未示），導孔的内側壁電鍍有 金屬層，用於使兩表面的第二導線102及各層間的導線（圖 未示）可以彼此電性連接。為了使第一導線102與第二導線 9 M297608 202電性連接，整合式印刷電路板更包括至少一焊盤300， 设置於第一印刷電路板100的表面，並與第一導線102電 性連接。通過在焊盤（pad) 300和第二導線202間填充焊 料320 ’使焊盤（pad) 300和第二導線202電性連接。這 樣，第一導線102與第二導線202之間就可彼此電性連接。 第一導線102和第二導線202可為印刷電路板表面經過蝕 刻處理後之銅箔。 採用本實施方式之整合式印刷電路板，可將逆變器之 部分複雜或高頻高壓的電路佈在第二印刷電路板2〇〇上， 將其餘部分電路佈在第一印刷電路板100上。由於第一印 刷電路板100為價格低廉的單面板，並在佈電路時以第一 印刷電路板100為主體，僅將部分必要的複雜或高頻高壓 電路佈在多層板即第二印刷電路板200上。因此，此種整 合式印刷電路板，不僅可以取代傳統之必須使用多層板才 能符合要求之電路佈線，而且第二印刷電路板2〇〇可根據 具體應用的需要’盡可此選用尺寸較小的印刷電路板，本 實施方式中，第二印刷電路板200的寬度不大於第一印刷 電路板100上的最高電子元件的高度。這樣，不僅不會增 大整合式印刷電路板的體積，而且可加大高頻高壓電路與 一般電路或電子元件之間隔，以防止其相互干擾，保證電 路穩定工作。同時，可以在不影響電路性能的條件下，大 幅降低生產成本。 M297608 请參照圖2，為本新型之整合式印刷電路板之另一實 施方式示意圖。本實施方式之第一印刷電路板1〇〇之第一 導線102與第二印刷電路板200之第二導線2〇2的電性連 接方式與第一實施方式的電性連接方式區別在於，本實施 方式之第一印刷電路板100之第一導線1〇2與第二印刷電 路板200之第二電線2〇2之間是採用金屬絲400連接，該 金屬絲400之兩端可採用釺焊方式焊接於第一導線1〇2和 弟二導線202。 請參照圖3，為本新型之整合式印刷電路板之又一實 施方式示意圖。本實施方式之第一印刷電路板1〇〇之第一 導線102與第二印刷電路板200之第二導線202的電性連 接係通過連接器實現。本實施方式中，第一印刷電路板1〇〇 包括一第一連接器104，設置於第一印刷電路板100之上 表面，與第一導線1〇2電性連接。第二印刷電路板200包 括一第二連接器204，設置於第二印刷電路板2⑻之一表 面，與第二導線202電性連接。第二印刷電路板200垂直 組合於第一印刷電路板100，同時，第二連接器204以平 行於第一印刷電路板100的方向插入第一連接器104 ’使 得第一印刷電路板100的第一導線1〇2與第二印刷電路板 200的第二導線202電性連接。 請參照圖4,為本新型之整合式印刷電路板之又一實 施方式示意圖。本實施方式之第一印刷電路板之第一 11 M297608 導線102與第二印刷電路板200之第二導線202的電性連 接方式與上一實施方式相同，區別在於，第二印刷電路板 200垂直組合於第一印刷電路板100時，第二連接器204 以垂直於第一印刷電路板100的方向插入第一連接器 104’使得第一印刷電路板1〇〇的第一導線1〇2與第二印刷 電路板200的第二導線2〇2電性連接。 在本新型以外的其他實施方式中，可根據電路佈線的 需要’第一印刷電路板100的選擇不局限於上述實施方式 所選用的單層板，還可選擇無導孔之雙面板、有導孔之雙 面板或多層板；第二印刷電路板200的選擇也不局限於多 層板’還可選擇單層板，無導孔之雙面板或有導孔之雙面 板。第一印刷電路板100與第二印刷電路板200間的電性 連接方式，除了可採用上述實施方式外，也可採用上述各 種實施方式之任意組合，均玎達成本新型之目的。 本新型雖以較佳實施例揭露如上·，然其並非用以限定 本新型。惟，任何熟悉此項技藝老，在不脫離本新型之精 神和範圍内，當可做稍許更動與潤飾，因此本新型之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1係為本新型之整合式印刷電路板之一實施方式示意圖。 圖2係為本新型之整合式印刷電路板之另一實施方式示意 12 M297608 圖。 胃 圖3係為本新型之整合式印刷電路板之又一實施方式示意 圖。 圖4係為本新型之整合式印刷電路板之又一實施方式示意 圖。 【主要元件符號說明】 第一印刷電路板 100 第二印刷電路板 200 第一導線 102 第一連接器 104 第二導線 202 第二連接器 204 焊盤 300 焊料 320 金屬絲 400 13M297608 VIII. New description: _[New technical field] This new type relates to a printed circuit board, especially an integrated printed circuit board for inverters. [Prior Art] Inverter H main ship - in order to convert the money voltage signal provided by the DC supply wire into a high voltage pulse of _, the lamp is continuously lit, so the DC is placed on the double-panel or multi-layer board of the reverse Wei Circuit and high-frequency high-voltage circuit, in the working process, the high-frequency high-voltage electric riding has no DC circuit, which affects the inverter! This, for example, the high-frequency circuit generates a large amount of electrical Wei H The function of other electronic components on the circuit board, in particular, the high-frequency high-voltage circuit may accidentally discharge and burn out other electronic components. - A traditional solution to increase the number of inverters and circuit boards, through the design. The layout of the ten circuit board circuits is such that the high frequency high voltage circuit is separated from the direct current low voltage circuit, but this solution greatly increases the cost of the inverter circuit board. Another conventional solution is to increase the size of the inverter circuit board. By re-layout the high-frequency high-voltage circuit and the DC low-voltage circuit on the circuit board, the high-frequency high-voltage circuit is spaced apart from the DC low-voltage circuit, although this solution The interference between the high frequency rolling circuit and the DC low voltage circuit can be effectively prevented, but the solution increases the size of the inverter, makes the space utilization rate of the electronic product low, and affects the electronic product toward light, thin and short. The development of small direction. M297608 [New content] In view of this, it is necessary to provide an integrated printed circuit board for inverters, which can reduce the cost under the condition that the circuit is suitable. In addition, an inverter with the integrated printed circuit board is also required. An integrated printed circuit board for an inverter, the integrated printed circuit board comprising: a first printed circuit board comprising a plurality of first wires on a surface of the first printed circuit board for providing electrical communication between electronic components And a second printed circuit board comprising a plurality of second wires on the surface of the second printed circuit board for providing electrical connection between the electronic components; wherein the second printed circuit board is vertically disposed on the first printed circuit The board is electrically connected to the first wire. An inverter comprising an integrated printed circuit board. The integrated printed circuit board includes: a first printed circuit board including a plurality of first wires on a surface of the first printed circuit board for providing electrical connection between the electronic components; and a second printed circuit board including a plurality of second wires on the surface of the second printed circuit board for providing electrical connection between the electronic components; wherein the second printed circuit board is vertically disposed on the first printed circuit board, and the first wire and the second wire are electrically connected Sexual connection. As a further improvement of the present invention, the second printed circuit board can be selected from a high-performance circuit board, and the first printed circuit board can be selected from a single panel. When the circuit 8 M297608 is wired, the first printed circuit board is mainly used, according to the circuit requirements. , the part of the 'divided high-frequency high-voltage or complex circuit on the second printed circuit board, the rest. The circuit is laid on the first - printed circuit board, the = printed circuit board width is not greater than the highest electronic on the first printed circuit board The height of the component. The circuit board combination adopting such a structure can greatly reduce the cost, and at the same time, the high-frequency high-voltage circuit is separated from the low-voltage DC circuit to reduce interference between the high-frequency high-voltage Lu circuit and the low-voltage DC circuit, thereby improving the performance of the circuit, and The structure does not increase the size of the electronic device. [Embodiment] Referring to Fig. 1, an embodiment of an integrated printed circuit board of the present invention is not intended. The integrated printed circuit board includes a first printed circuit board 100 and a second printed circuit board 200. The second printed circuit board 2 is vertically disposed on the surface of the first printed circuit board 100. % In the present embodiment, the first printed circuit board 100 is a single panel, and the second printed circuit board 200 is a multilayer board. The first printed circuit board ioo includes a plurality of first conductors 102 on its surface for providing electrical connections between the electronic components. The second printed circuit board 200 includes a plurality of second conductors 202 on both surfaces for providing electrical connections between the electronic components. The second printed circuit board is further provided with a plurality of via holes (not shown). The inner sidewall of the via hole is plated with a metal layer for making the second wires 102 on the two surfaces and the wires between the layers (not shown) electrically connected to each other. Sexual connection. In order to electrically connect the first wire 102 and the second wire 9 M297608 202 , the integrated printed circuit board further includes at least one pad 300 disposed on the surface of the first printed circuit board 100 and electrically connected to the first wire 102 . . The pad 300 and the second wire 202 are electrically connected by filling the solder 320' between the pad 300 and the second wire 202. In this way, the first wire 102 and the second wire 202 can be electrically connected to each other. The first wire 102 and the second wire 202 may be copper foils whose surface of the printed circuit board has been etched. With the integrated printed circuit board of the present embodiment, a part of the inverter or a high frequency and high voltage circuit of the inverter can be disposed on the second printed circuit board 2, and the remaining part of the circuit is disposed on the first printed circuit board 100. . Since the first printed circuit board 100 is a low-cost single-panel and the first printed circuit board 100 is mainly used in the circuit, only a part of the necessary complicated or high-frequency high-voltage circuit is disposed on the second printed circuit board. 200 on. Therefore, such an integrated printed circuit board can not only replace the conventional circuit board which must use the multi-layer board to meet the requirements, and the second printed circuit board 2 can be selected according to the needs of the specific application. In the present embodiment, the width of the second printed circuit board 200 is not greater than the height of the highest electronic component on the first printed circuit board 100. In this way, not only does the volume of the integrated printed circuit board increase, but also the interval between the high-frequency high-voltage circuit and the general circuit or electronic component can be increased to prevent mutual interference and ensure stable operation of the circuit. At the same time, the production cost can be greatly reduced without affecting the performance of the circuit. M297608 Please refer to FIG. 2, which is a schematic diagram of another embodiment of the integrated printed circuit board of the present invention. The electrical connection manner between the first conductive line 102 of the first printed circuit board 1 and the second conductive line 2 2 of the second printed circuit board 200 is different from the electrical connection of the first embodiment. The first wire 1〇2 of the first printed circuit board 100 of the embodiment and the second wire 2〇2 of the second printed circuit board 200 are connected by a wire 400, and the ends of the wire 400 can be soldered. The method is soldered to the first wire 1〇2 and the second wire 202. Please refer to FIG. 3, which is a schematic diagram of still another embodiment of the integrated printed circuit board of the present invention. The electrical connection between the first wire 102 of the first printed circuit board 1 of the present embodiment and the second wire 202 of the second printed circuit board 200 is achieved by a connector. In this embodiment, the first printed circuit board 1 includes a first connector 104 disposed on the upper surface of the first printed circuit board 100 and electrically connected to the first conductive line 1〇2. The second printed circuit board 200 includes a second connector 204 disposed on one of the surfaces of the second printed circuit board 2 (8) and electrically connected to the second wire 202. The second printed circuit board 200 is vertically combined with the first printed circuit board 100, while the second connector 204 is inserted into the first connector 104' in a direction parallel to the first printed circuit board 100 such that the first printed circuit board 100 A wire 1〇2 is electrically connected to the second wire 202 of the second printed circuit board 200. Please refer to FIG. 4, which is a schematic diagram of still another embodiment of the integrated printed circuit board of the present invention. The first 11 M297608 wire 102 of the first printed circuit board of the present embodiment is electrically connected to the second wire 202 of the second printed circuit board 200 in the same manner as the previous embodiment, except that the second printed circuit board 200 is vertical. When combined with the first printed circuit board 100, the second connector 204 is inserted into the first connector 104' in a direction perpendicular to the first printed circuit board 100 such that the first conductor 1〇2 of the first printed circuit board 1〇〇 The second wires 2〇2 of the second printed circuit board 200 are electrically connected. In other embodiments than the present invention, the selection of the first printed circuit board 100 may not be limited to the single-layer board selected in the above embodiment, and the double-panel without guide holes may be selected according to the needs of the circuit wiring. The double-panel or multi-layer board of the hole; the selection of the second printed circuit board 200 is not limited to the multi-layer board 'you can also select a single-layer board, a double-sided panel without a guide hole or a double-panel with a guide hole. The electrical connection between the first printed circuit board 100 and the second printed circuit board 200 can be achieved by using any combination of the above various embodiments in addition to the above embodiments. Although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. However, any person who is familiar with the skill of the art can make minor changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the patent application scope. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing one embodiment of the integrated printed circuit board of the present invention. 2 is a schematic view of another embodiment of the integrated printed circuit board of the present invention, 12 M297608. Stomach Figure 3 is a schematic view of yet another embodiment of the novel integrated printed circuit board of the present invention. Fig. 4 is a schematic view showing still another embodiment of the integrated printed circuit board of the present invention. [Main component symbol description] First printed circuit board 100 Second printed circuit board 200 First wire 102 First connector 104 Second wire 202 Second connector 204 Pad 300 Solder 320 Wire 400 13