M286956 17607twf.doc/r 八、柯型說明： 【新型所屬之技術領域】 本創作是有關於一種散熱結構，且特別是有關於 具有多方向散熱功能的散熱結構。 、種 【先前技術】 产不隨著電腦科技的娜進，使得電腦之運作速 亦不斷地攀升，為了預防電腦主機内部:二牛=率 而導致電子元件發生暫時性或永久性的失效子戶 足 夠的散熱效能至電腦内部的電子元件將變得非 、-产處！ 度一旦超出其正常的工作 ^ 料生運算錯誤，或 地失效，如此料致㈣主機當機。此外， 身的溫度遠遠超過其正常的工作溫度^ 有可能損壞中央處理單元内部的電晶體，因而 V致中央處理單元永久性失效。 圖。圖1 ’其緣示習知之—種散熱結構的立體示意 二二放熱結構100包括—風罩110、一風扇120以及 U 130。其中，風罩11〇具有一出風口 ιΐ2與一相 徂 八114。風扇120鎖固於風罩110上，且適於提 ^氣流Α’使得氣流Α經由入風口 114^流向出風口 、+此外’散熱器13〇包括多數個鰭片132與一底座134。 Μ鰭片132配置於風罩11〇内，並同向排列在底座134 M286956 ]7607twf.doc/r 以提高散熱器130之散熱面積。 上 一然而，習知散熱結構觸只用來幫助中央 繪不）散熱’對於其他位於中央處、 70 (未 並無法提供_散_。㈣,Hm；； 遭之電子元件的升温現象無央 此升μ現象極易導致電腦無法正常運-習知散熱結構100實有改進之必要。 甶上述可知， 【新型内容】 本創作的目的就是在提供-種散熱結 散熱以及提請熱效率。 稱Μ夕方向 構，it W的或其他目的’本創作提出一種散熱結 f其包括一風罩、一散熱器以及一擔風片。風罩具有一 —風口及對應出風口之一風扇連接部’而風扇連接部設有 入，口此外’政熱$包括—底座、多數個鰭片及至少 …、s 等鰭谷置於風勒，而熱管穿設該等鰭 餘二，熱管固定連接於底座上。此外，擋風片連接於該等 .、、、盲月最底端之一韓片。 依照本創作的一實施例所述，上述之風罩之底部設有 至少一垂直的側板，且侧板設有至少一出風孔。 依照本創作的-實施例所述，上述之風罩之底部設有 至少-側板’且側板具有—傾斜角度的折邊，該折邊設有 至少一出風孔。 依照本創作的-實施例所述，上述之散熱器進一步包 括固疋板，分別連接熱管及底座。其中，固定板例如以 M286956 】7607twf.doc/r 焊接方式連接熱管及底座。 ^依照本創作的一實施例所述，上述擋風片焊接該等鰭 片最底端之鰭片，或是為該等鰭片最底端之鰭片垂 部份。 依照本創作的-實施例所述，上述之散熱結構進一步 匕括一風扇，其配置於風扇連接部上。 槿ίίΐ述目的或其他目的，本創作提出—種散熱結 f ’其包括-風罩…散熱器以及—播風片。風罩且有— f風口及對應以π之-風扇連接部，而風扇連接部設有 2細。此外，散熱器包括-底座、多數個鰭片及至少 Μ , θ ^ ^ π ^ ^而熱官穿設該等鰭 二且熱官固疋連接於底座上。另外，擋 ;側。依照本創作的-實施例所述，上述風罩之:部3 至> —垂直的側板，且該側板設有至少_出風孔 依照本創作的一實施例所述，上述風罩° 〆一側板，且該侧板具有一傾斜角产 &口h又有至 至少-出職。 、㈣度的折邊，該折邊設有 括實施例所述，上述之散熱器進-步包 谭接方:==管及底座。其中’固定板例如以 罩兩:照所述，上述之擔風片焊接於風 包括二 上述之散熱結構進-步 M286956 17607twf.doc/r 基於上述，本創作之散熱結構的擋風片讓部分第一氣 流轉向至巧孔而形成第二氣流，使得熱關遭的其他電 子7G件可因第二氣流的對流作用而將電子元件所產生的熱 較為快速地傳遞至周圍環境巾，因此，本翁之散熱結才籌 具有多方向散熱與提升散熱效率的優點。 為讓本創作之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 清簽考圖2至圖4，本實施例之散熱結構200適於配 置於一熱源F (例如為中央處理單元）上。此散熱結構2〇〇 包括一風罩210、一風扇220以及一散熱器24〇，其中： 風罩210近似门型，故具有兩處缺口，一為出風口 212、另一處缺口則自風罩210周緣延伸設置一方型之風扇 連接部C，風扇連接部C中央穿設有一大面積的入風口 214，又風罩210底部分別設置與之垂直的側板218，該等 侧板218各穿設有至少一出風孔216 (圖2例如緣示共§ 個出風孔216); ' 風扇220例如是以螺絲鎖固的方式配置於風扇連接部 C上’以提供冷卻氣流； 散熱器240包括一固定板248、一底座244、數個依序 堆疊的鰭片242、一底座244與至少一熱管246，底座244 用以與熱源F接觸，鰭片242配置於風罩210内，熱管246 平行穿设該等散熱鰭片242，且熱管246連接於底座244 M286956 17607twf.doc/r 上（可以知接方式）配置於該等鰭片242與熱源f之間， 此外，熱管246則平行穿設該等散熱鰭片242，並可將藉 由一固定板248置於熱管246弧形部位上端並分別以焊接 方式固定設於熱管246及底座244上，加強熱管246安聲 上的固定，且底座244具有適於與熱源！7相接觸之一接觸 面244a’至於隶底部之鰭片242a則垂直延伸一撞風片230 (鰭片242a或以焊接等方式達成與擔風片230的連接）。 熱管246可為U型熱管、柱型熱管或其他形式。 以下針對本實施例之散熱結構的運作過程作一說明。 請再參考圖3 ’就氣流流動方向而言，風扇220提供第一 氣流A1，而第一氣流A1經由入風口 214流向出風口 212。 此外，部分第一氣流A1受擋風片230之阻擋而通往出風 孔216，以形成第二氣流A2，而第一氣流A1大致上垂直 於第二氣流A2。 就散熱功能而言，底座244的接觸面244a將熱源F 所產生的熱以傳導的方式傳遞至該等熱管246。由於這些 熱官246罪近底座244處裝有液態的物質（例如為水或是 其他具有高比熱及易揮發的物質），此液態物質在吸熱後 由液態轉為氣態而上升至熱管246上方，同時熱亦傳導至 周遭的鰭片242上，此時，風扇220所提供之第一氣流A1 吹入，便將熱管246與鰭片242所吸收的熱量吹至出風口 212 ’將廢熱帶走。 此外，部分第一氣流A1受到擋風片230的阻擋迫使 通在出風孔216 ’而形成第二氣流A2，便順道將熱源f周 M286956 17607twf.doc/r 迻的電子元件（未繪不）產生的熱以對流的方式帶走，並 if遞至周圍環境中，同時將周圍環境的熱帶走。如此，本 實施=散熱結構2GG即可達到多方向吹風散熱的目的。 请芬考圖5，其繪示本創作另一實施例之散熱結構的 立體組合示意圖。本實施例與上述實施例不同處在於，摇 風片330非自鰭片242a延伸而出，乃為風罩21〇本身所延 伸或將擋風片330以螺絲鎖固方式與風罩21〇相連接，其 功效同上所述，用以阻擋部份氣流使其通往出風孔⑽， 至於相關構件之說明，在此不再贅述。 -立請參考圖6’讀示本創作又—實施例之風罩的立體 :意圖’各侧板219靠近風罩21〇處具有一折邊21%，而 出風孔216則分別配置折邊219a上。由於折邊⑽之設 叶造成側板219具有-傾斜角度夾角θ，因此第二氣流A2 =出至出風孔216時，會側向下吹至熱源F附近之電子元 件（未纟會示）。 综上所述，本創作之散熱結構㈣風 向至出編形成第二氣流，使得熱源周遭二； 弟一氣流的對流作用而將電子元件所產生的埶 ：：為快速地傳遞·_境中，因频關相電子元i j溫度可以控制在其正常運作範圍内而不致失效電細由上 I:點本創作之散熱結構具有多方向散熱與提升賴效 限定創交佳實施例揭露如上’然其並非用以 疋本創作，任何熟習此技藝者，在不脫離本創作之精神 10 M286956 17607twf.doc/r 和範圍内，當可作些許之更動與潤飾，因此本創作之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1繪示習知之一種散熱結構的立體示意圖。 圖2繪示本創作一實施例之一種散熱結構的立體分解 示意圖。 • 圖3繪示圖2之散熱結構的立體組合示意圖。 圖4緣示圖2之散熱結構的組合正視示意圖。 圖5繪示本創作另一實施例之散熱結構的立體組合示 意圖。 圖6繪示本創作又一實施例之風罩的立體示意圖。 【主要元件符號說明】 100、200 :散熱結構 110、210 :風罩 112、212 :出風口 114、214 :入風口 # 120、220 ·•風扇 130、240 ··散熱器 132、242、242a :鰭片 ' 134、244 :底座 134a、244a :接觸面 216 :出風孔 218、219 :侧板 219a :折邊 M286956 17607twf.doc/r 230、330 :擋風片 246 : U型熱管 248 :固定板 A :氣流 A1 :第一氣流 A2 ··第二氣流 C :風扇連接部 F :熱源 Θ :夾角M286956 17607twf.doc/r VIII. Description of the type: [New technical field] This creation is related to a heat dissipation structure, and in particular to a heat dissipation structure having a multi-directional heat dissipation function. [Previous technology] The production does not follow the advancement of computer technology, so that the speed of the computer is constantly rising, in order to prevent the temporary or permanent failure of the electronic components caused by the internal computer: Enough heat dissipation to the electronic components inside the computer will become non-productive! Once the degree exceeds its normal work ^ the raw operation error, or the ground fails, so the (4) host crash. In addition, the temperature of the body far exceeds its normal operating temperature ^ It is possible to damage the transistor inside the central processing unit, and thus the V causes the central processing unit to permanently fail. Figure. Fig. 1 'A schematic view of a conventional heat dissipation structure. The two-second heat release structure 100 includes a hood 110, a fan 120, and a U 130. The hood 11 has an air outlet ιΐ2 and a phase 八8 114. The fan 120 is locked to the hood 110 and is adapted to raise the airflow Α so that the airflow 流 flows to the air outlet through the air inlet 114, and the heat sink 13 includes a plurality of fins 132 and a base 134. The fins 132 are disposed in the hood 11〇 and are arranged in the same direction on the base 134 M286956]7607twf.doc/r to increase the heat dissipation area of the heat sink 130. Previously, the conventional heat-dissipation structure touch was only used to help the central painting not to dissipate heat for the other centrally located, 70 (not available and can not provide _ _ _ (4), Hm;; the temperature rise phenomenon of the electronic components The phenomenon of rising μ is very likely to cause the computer to fail to operate properly. The conventional heat dissipation structure 100 is necessary for improvement. 甶The above can be seen, [new content] The purpose of this creation is to provide a kind of heat dissipation and heat efficiency. Structure, it W or other purposes 'This creation proposes a heat sink which includes a hood, a radiator and a wind blade. The hood has a tuyere and a fan connection corresponding to the outlet vent and the fan is connected The Ministry has an entrance, and the 'relationship' includes: the base, the plurality of fins, and at least... the fins are placed in the wind, and the heat pipes are provided with the fins, and the heat pipes are fixedly attached to the base. The windshield is connected to the Korean film of the bottom end of the blind moon. According to an embodiment of the present invention, the bottom of the windshield is provided with at least one vertical side plate, and the side plate is provided. Have at least one air outlet According to the present invention, the bottom of the windshield is provided with at least a side panel and the side panel has a bevel of an oblique angle, and the flange is provided with at least one air outlet. According to the present invention - the embodiment The heat sink further includes a fixing plate connected to the heat pipe and the base respectively, wherein the fixing plate is connected to the heat pipe and the base by, for example, M286956] 7607twf.doc/r welding. According to an embodiment of the present invention, The windshield is welded to the fins at the bottom end of the fins, or to the fins of the bottommost fins of the fins. According to the embodiment of the present invention, the heat dissipation structure is further included. A fan, which is disposed on the fan connection portion. 创作 ίί ΐ 目的 目的 或 本 本 本 本 本 本 本 本 本 本 本 本 本 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 散热 散热Corresponding to the π-fan connection portion, and the fan connection portion is provided with 2 thin. Further, the heat sink includes a base, a plurality of fins and at least Μ, θ ^ ^ π ^ ^ and the heat officer wears the fins and The hot official is attached to the base. In addition, According to the present invention, the hood is: a portion 3 to a vertical side panel, and the side panel is provided with at least an air outlet. According to an embodiment of the present invention, the wind a cover ° a side plate, and the side plate has a slant angle production & the mouth h has at least - a job, a (four) degree of hem, the hem is provided in the embodiment, the above-mentioned heat sink into - Step package Tan joint: == tube and base. Among them, 'fixed plate, for example, with cover two: according to the above, the above-mentioned wind blade is welded to the wind, including the above-mentioned heat dissipation structure, step-by-step M286956 17607twf.doc/r based on In the above, the windshield of the heat dissipation structure of the present invention causes a portion of the first airflow to be diverted to the aperture to form a second airflow, so that other electronic 7G components that are thermally blocked may be generated by the electronic component due to the convection of the second airflow. The heat is transmitted to the surrounding environment towel relatively quickly. Therefore, the heat dissipation of the Weng has the advantages of multi-directional heat dissipation and improved heat dissipation efficiency. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] The heat dissipation structure 200 of the present embodiment is adapted to be disposed on a heat source F (for example, a central processing unit). The heat dissipation structure 2 includes a hood 210, a fan 220, and a heat sink 24, wherein: the hood 210 is approximately a door type, so that there are two gaps, one for the air outlet 212 and the other for the wind. A fan-shaped connecting portion C is formed on the periphery of the cover 210, a large-area air inlet 214 is disposed in the center of the fan connecting portion C, and a side plate 218 perpendicular to the bottom of the windshield 210 is disposed, and the side plates 218 are respectively disposed. There is at least one air outlet 216 (FIG. 2, for example, a total of § air outlets 216); 'the fan 220 is disposed on the fan connection C, for example, in a screw-locking manner' to provide a cooling airflow; the heat sink 240 includes A fixing plate 248, a base 244, a plurality of sequentially stacked fins 242, a base 244 and at least one heat pipe 246, the base 244 is in contact with the heat source F, the fins 242 are disposed in the windshield 210, and the heat pipes 246 are parallel. The heat dissipation fins 242 are disposed, and the heat pipes 246 are connected to the base 244 M286956 17607twf.doc/r (which can be connected) between the fins 242 and the heat source f, and the heat pipes 246 are parallelly disposed. The heat dissipation fins 242 can be supported by a fixing plate 24 8 is placed on the upper end of the arc portion of the heat pipe 246 and fixedly fixed on the heat pipe 246 and the base 244 by welding, and the fixing of the heat pipe 246 is enhanced, and the base 244 is suitable for heat source! One of the 7-contact one-contact surface 244a' extends to the bottom fin 242a to vertically extend a wind deflector 230 (the fin 242a or the connection to the wind-bearing sheet 230 by welding or the like). Heat pipe 246 can be a U-shaped heat pipe, a column heat pipe, or other form. The following describes the operation process of the heat dissipation structure of this embodiment. Referring again to FIG. 3', in terms of the flow direction of the airflow, the fan 220 provides the first airflow A1, and the first airflow A1 flows to the air outlet 212 via the air inlet 214. In addition, a portion of the first airflow A1 is blocked by the windshield 230 to the air outlet 216 to form a second airflow A2, and the first airflow A1 is substantially perpendicular to the second airflow A2. In terms of the heat dissipation function, the contact surface 244a of the base 244 transfers the heat generated by the heat source F to the heat pipes 246 in a conductive manner. Since these hot officials are equipped with liquid substances (such as water or other substances having high specific heat and volatile substances) near the base 244, the liquid substance rises from the liquid state to the gaseous state after the heat absorption, and rises above the heat pipe 246. At the same time, the heat is also transmitted to the surrounding fins 242. At this time, the first airflow A1 provided by the fan 220 is blown in, and the heat absorbed by the heat pipes 246 and the fins 242 is blown to the air outlet 212' to take the waste tropical. In addition, part of the first airflow A1 is blocked by the windshield 230, forcing the second airflow A2 to pass through the air outlet 216', and the electronic component of the heat source f-week M286956 17607twf.doc/r is moved (not drawn). The heat generated is taken away in a convective manner and passed to the surrounding environment while walking the tropical surroundings. Thus, the present embodiment = heat dissipation structure 2GG can achieve the purpose of multi-directional hair blowing heat dissipation. Please refer to FIG. 5, which illustrates a three-dimensional combination diagram of a heat dissipation structure of another embodiment of the present invention. The difference between this embodiment and the above embodiment is that the wind deflector 330 does not extend from the fin 242a, and the windshield 21 itself extends or the windshield 330 is screwed to the windshield 21 The connection has the same function as above, and blocks part of the airflow to the air outlet hole (10). For the description of the related components, no further details are provided herein. - Please refer to FIG. 6' to read the three-dimensional shape of the windshield of the present invention. The intention is that each side plate 219 has a flange 21% near the windshield 21, and the air outlet 216 is respectively provided with a flange. On 219a. Since the side plate 219 has an inclination angle θ due to the setting of the flange (10), the second air flow A2 = when it exits the air outlet hole 216, the electronic component near the heat source F is blown down to the side (not shown). In summary, the heat dissipation structure of the creation (4) wind direction to the second airflow, so that the heat source is surrounded by two; the convection of the airflow and the convection caused by the electronic component: the rapid transmission of the _ environment, Due to the frequency-off phase, the electron element ij temperature can be controlled within its normal operating range without causing failure. The heat dissipation structure of the present invention has multi-directional heat dissipation and improved efficiency. The embodiment is disclosed as above. It is not intended to be used for the creation of this work. Anyone who is familiar with this skill can make some changes and refinements without departing from the spirit of this creation. Therefore, the scope of protection of this creation is attached. The scope of the patent application is subject to change. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a conventional heat dissipation structure. 2 is a perspective exploded view of a heat dissipation structure according to an embodiment of the present invention. FIG. 3 is a schematic perspective view of the heat dissipation structure of FIG. 2 . FIG. 4 is a schematic front view showing the heat dissipation structure of FIG. 2. Fig. 5 is a perspective view showing the heat dissipating structure of another embodiment of the present invention. 6 is a perspective view of a windshield according to still another embodiment of the present invention. [Description of main component symbols] 100, 200: heat dissipation structure 110, 210: hood 112, 212: air outlet 114, 214: air inlet # 120, 220 · fan 130, 240 · · radiator 132, 242, 242a: Fins '134, 244: base 134a, 244a: contact surface 216: air outlet holes 218, 219: side plate 219a: flange M286956 17607twf.doc/r 230, 330: windshield 246: U-shaped heat pipe 248: fixed Plate A: Air flow A1: First air flow A2 · Second air flow C: Fan connection F: Heat source Θ: Angle