M283497 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種具散熱特性之裝置，尤指一種可使電 子元件達到快速組接，並同時於使用時具散熱之功效者。 【先前技術】 按，一般習用之電子元件，如Ic晶片、發光二極體（LED)、 電容、電阻、導線或開關···等元件於組裝時，今以光二極 體為例，其於組接時，通常係於電路板之所需位置處㈣有電 路及穿孔之後再將發光二極體之接腳插設於電路板之穿孔 中，以焊接之方式將發光二極體之接腳電性連接於電路板上， 以達導通發光之功效；或者是將發光二極體之接腳直接與導線 接觸，再以膠帶纏繞接腳與導線之連接處，藉以使該導線與外 部電源或電子設備連接，以達導通發光之功效。 雖然，以上述所提焊接或膠帶直接纏繞之方式，可將電子 兀件（發光二極體）與所需之電路板或導線加以連接，但是以焊 接之方式連接電子元件與電路板時，不但製作上較為複雜，且 田電子元件於運作產生熱源時，其熱源係直接傳導於電路板 上，而影響其他電子元件之運作；而以勝帶纏繞之方式連接電 子元件之接腳與導線時，雖手續簡便，但其手段較為粗糙，易 因膠帶之簡易纏繞、以及電子件運作發熱時將膠帶融炼等現 象，而影響電子元件之電氣特性。 【新型内容】 5 M283497 因此，本創作之主要目的係在於，可藉由電子載體上之多 數凹槽’配合散熱膠，使該電子元件於組接時，可快速固接於 電子載體上，並同時具有使用時散熱之功效。 為達上述之目的，本創作係一種具散熱特性之裝置，其包 含一依其連接線路之所需而預定處設置有多數凹槽之電子載 體；多數朗需以其接㈣置於凹射之好元件；以及可點 »又於凹槽中之散熱膠’以使各電子元件固接於電子載體上散熱 膠，且散熱膠係為非固態之散熱介質。 【實施方式】 明參閱『第一及第二圖』所示，係分別為本創作之立體 外觀示意圖及本創作之立體分解示意圖。如圖所示·本創作一 種具散熱特性之裝置，其係由一電子載體1、多數電子元件2 及散熱膠3所構成，可使電子元件於組接時，可快速固接於電 子載體上’並同時具有使用時散熱之功效。 上述所提之電子載體1上係依其連接線路丄丄之所需， 而於其電子載體1之預定處設置有多數凹槽1 2,且該電子載 體1係可為一電路板，或為一體成型且可導電之金屬板。 各電子元件2係依所需以其接腳2 1設置於上述電子載 體1之凹槽1 2中，而該電子元件2係為使用時會產生熱源之 元件。 ”亥政熱勝3係可點設於上述電子載體1之凹槽1 2中， 以使各電子元件2固接於電子載體1上，且散熱膠3係為非固 M283497 恶之散熱介質。如是，藉由上數之結構構成一全新之具散熱特 性之裝置。 凊參閱『第三圖』所示，係本創作之使用狀態剖面示意 圖。如圖所示：當本創作於運用時，係可將各使用時會產生熱 源之電子元件2，如1C晶片、光二極體（LED)、電容、電阻、 導線或開關·.·等電子元件2，以其上用以連接導通之接腳 21置放於為電路板或金屬板之電子載體1預定處所設之凹 槽1 2中，再依實際情況之所需同樣於該凹槽1 2中設置導線 4與所需之外部電子裝置，或其他電子元件連接，最後再於該 凹槽1 2中依所需點設適量之散熱膠3，使該散熱膠3注滿於 凹槽1 2中並同時將所需之電子元件2及導線4加以連接，且 固定於凹槽12之中；而由於該散熱膠3係具有散熱之特性， 因此，當電子元件2於運作產生熱源時，則可由該散熱膠3進 行散熱，如此，即可將電子元件2快速固接於電子載體丄上， 並同時利用散熱膠3使電子元件2於使用時具有散熱之功效。 綜上所述，本創作具散熱特性之裝置，可藉由電子載體 上之多數凹槽，配合散熱膠，使該電子元件於組接時，可快速 固接於電子載體上’並同時具有使用時散熱之功效，進而使本 創作之産生能更進步、更實用、更符合使用者之所須，確已符 合創作專利申請之要件，爰依法提出專利申請。 准以上所述者，僅為本創作之較佳實施例而已，當不能 以此限定本創作實施之範圍；故，凡依本創作t請專利範圍及 7 M283497 創作說明書内容所作之簡單的等效變化與修飾，皆應仍屬本創 作專利涵蓋之範圍内。 【圖式簡單說明】 第一圖，係本創作之立體外觀示意圖。 第二圖，係本創作之立體分解示意圖。 • 第三圖，係本創作之使用狀態剖面示意圖。 【主要元件符號說明】 電子載體1 連接線路11 凹槽1 2 , 電子元件2 接腳2 1 散熱膠3 導線4 8M283497 VIII. New type description: [Technical field to which the new type belongs] This creation is about a device with heat dissipation characteristics, especially a device that can achieve rapid assembly of electronic components and at the same time have the effect of heat dissipation during use. [Previous technology] According to the conventional electronic components, such as IC chips, light-emitting diodes (LEDs), capacitors, resistors, wires, or switches, etc. At the time of assembly, the photodiode is used as an example. When assembling, usually place the circuit and perforation at the desired position of the circuit board, and then insert the pins of the light-emitting diode into the holes of the circuit board, and solder the pins of the light-emitting diode. It is electrically connected to the circuit board to achieve the effect of turning on the light; or the pins of the light-emitting diode are directly contacted with the wire, and then the connection between the pin and the wire is wrapped with tape, so that the wire is connected to an external power source or The electronic equipment is connected to achieve the effect of turning on the light. Although the electronic component (light-emitting diode) can be connected to the required circuit board or wire by the above-mentioned welding or direct winding of the tape, when connecting the electronic component and the circuit board by welding, not only The production is more complicated. When Tian electronic components generate heat during operation, the heat source is directly transmitted to the circuit board, which affects the operation of other electronic components. When the pins and wires of electronic components are connected in a winding manner, Although the procedures are simple, the method is relatively rough, and it is easy to affect the electrical characteristics of electronic components due to the simple winding of the tape and the melting of the tape when the electronic parts are operating. [New content] 5 M283497 Therefore, the main purpose of this creation is that most of the grooves on the electronic carrier can be matched with heat-dissipating glue, so that the electronic component can be fastened to the electronic carrier when assembled, and At the same time, it has the effect of dissipating heat during use. In order to achieve the above purpose, this creation is a device with heat dissipation characteristics, which includes an electronic carrier provided with a plurality of grooves at predetermined locations according to the needs of its connection lines; Good components; and the heat-dissipating glue in the groove can be clicked »so that each electronic component is fixed on the electronic carrier. The heat-dissipating glue is a non-solid heat-dissipating medium. [Embodiment] Please refer to the “First and Second Pictures”, which are the three-dimensional appearance diagrams of this creation and the three-dimensional exploded diagrams of this creation. As shown in the figure, this article creates a device with heat dissipation characteristics, which is composed of an electronic carrier 1, most electronic components 2 and heat-dissipating glue 3. When the electronic components are assembled, they can be fastened to the electronic carrier quickly. 'And also has the effect of heat dissipation during use. The aforementioned electronic carrier 1 is provided with a plurality of grooves 12 at predetermined positions of the electronic carrier 1 according to the requirements of its connection line 丄 丄, and the electronic carrier 1 may be a circuit board, or Integrally formed and conductive metal plate. Each electronic component 2 is set in the groove 12 of the above-mentioned electronic carrier 1 with its pin 21 as required, and the electronic component 2 is a component that generates a heat source during use. "Hai Zheng Resheng 3 series can be placed in the groove 12 of the electronic carrier 1 above, so that each electronic component 2 is fixed on the electronic carrier 1, and the heat-dissipating adhesive 3 is a non-solid M283497 evil heat dissipation medium. If so, a new device with heat dissipation characteristics is constructed by the above structure. 凊 Refer to the "third picture", which is a schematic sectional view of the use of this creation. As shown in the figure: When this creation is used, it is Electronic components 2 such as 1C chip, photodiode (LED), capacitors, resistors, wires or switches, etc., which will generate heat when used, can be used to connect the conductive pins 21 It is placed in the groove 12 provided in the predetermined place of the electronic carrier 1 for the circuit board or metal plate, and the conductor 4 and the required external electronic device are also provided in the groove 12 as required by the actual situation, or Connect other electronic components, and finally set an appropriate amount of heat-dissipating glue 3 in the groove 12 according to the required point, so that the heat-dissipating glue 3 is filled in the groove 12 and the required electronic components 2 and wires 4 are simultaneously filled. To be connected and fixed in the groove 12; Therefore, when the electronic component 2 generates a heat source during operation, heat can be dissipated by the heat-dissipating adhesive 3. In this way, the electronic component 2 can be quickly fixed to the electronic carrier 丄, and the heat-dissipating adhesive 3 can be used to make the electronic component. 2 It has the function of dissipating heat during use. In summary, the device with heat dissipation characteristics of this creation can use most grooves on the electronic carrier and cooperate with heat-dissipating glue, so that the electronic component can be fastened when assembled. 'On the electronic carrier', and at the same time, it has the effect of dissipating heat during use, so that the creation of this creation can be more advanced, more practical, and more in line with the needs of users. Those mentioned above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation; therefore, any simple equivalent made according to the scope of this creation and the scope of the patent and 7 M283497 creation instructions Changes and modifications should still fall within the scope of this creation patent. [Simplified illustration of the drawing] The first picture is a schematic diagram of the three-dimensional appearance of this creation. The second picture, A three-dimensional exploded view of this creation. • The third figure is a cross-sectional view of the use state of this creation. [Description of the main component symbols] Electronic carrier 1 Connection line 11 Groove 1 2, Electronic component 2 Pin 2 1 Thermal adhesive 3 Wire 4 8