M281391 八、新型說明： 【新型所屬之技術領域】 本創作主要係關於一肖具透氣孔之散&器，尤指一種 具有良好且快速之散熱作用’而能提昇散熱效率之散熱器 者。 【先前技術】 近年來因電腦產業的迅速發展，1以曰片的尺寸愈來 愈^，功能愈來愈強，相對的運作時所產生的熱量亦愈來 ^同所以一般於1 C晶片上通常會設置散熱器，使I C 晶片能在一定的溫度下運作，以達成即定的作用及功能。 現有的散熱器主要係於一基板之一側面上設置有多數 個散熱鰭片，將基板的另侧面貼附於晶片上後，可讓晶片 =作時所產生的熱量傳導至基板上，再透過散熱鰭片將熱 量散發至周圍環境，來達到降低晶片運作溫度的效果，又 為使散熱器固定地貼附在晶片上，散熱器基板底面與晶片 間常會以膠體粘合。 然而’由於現有散熱器基板的底面係為一平面，所以 膠體會直接#合在基板底面與晶片之間，如此晶片便未能 與基板直接接觸，而因膠體的阻隔，降低了晶片與基板間 的熱傳遞效率，進而降低了現有散熱器的散熱效率。 同時，因晶片運作時所產生的熱量會直接傳遞至膠體 再傳導至政熱器上，如此膠體在長期受熱的情況下容易產 生變貝或溶化等不良影響，而使散熱片發生鬆脫等現象， 更降低了散熱器整體的散熱作用。 5 M281391 【新型内容】 因此本創作人有鑑於現有散熱器結構及使用上的不 足”缺失肖經過不斷的試驗與&良，終於發展出一種能 改進習用缺失之本創作。 本創作之主要目#，在於提供一種具透氣孔之散熱器 其可讓政熱器與晶片直接接觸，並藉由透氣孔的排熱作 用，避免夥體因受熱而發生變質或溶化等不良情形，來達 到長1昇散熱器散熱效率之目的者。 w為達上述目的，本創作主要係提供一種具透氣孔之散 熱器’其主要設置有-基板，於基板頂面凸設形成有多數 個散熱籍片’於基板底端則凹設有一凹槽，而使基板位於 凹槽外圍處位置形成有一可塗附膠體的粘合區，並於基板 位於凹槽周圍處設置有多數個透氣孔。 藉由上述的技術手段，本創作可達到下列功效上的增 進： θ 1 ·本創作之散熱器可將晶片容置於凹槽内，以避免 晶片與膠體接觸，使晶片運作時所產生的熱量能直接傳導 至基板上，而能藉此提高散熱器的散熱效率。 2 ·本創作可避免膠體直接吸收晶片運作時所產生的 熱量’並藉由透氣孔讓晶片所產生的熱量直接排至周圍環 土兄’來防止膠體因長期受熱而產生變質或溶化等不良狀況 使政熱益此穩固地組合在晶片上’以使散熱器能提供良 好的散熱作用者。 【實施方式】 6 M281391 本創作主要係提供—種具透氣孔之散熱器，請配合參 看第一、一圖，由圖中可看到，本創作之散熱器 主要係設置有-基板（12)，於基板（12)頂面凸設 形成有多數個散熱鰭片（14)，於基板（1 2)底面則 凹設有-凹槽（16)，其中凹槽（16)係配合晶片的 形狀可為方形，且位於基板（12)底面的中央位置處， 而使基板（1 2 )位於凹槽（1 6 )外圍位置形成有一可 塗附膠體（19)(如第四圖所示者）的粘合區㈠？） ’並於基板（12)位於凹槽（16)周圍處設置有多數 個透氣孔（1 8 )。 請再參看第三、四®，當將散熱器（1 0 )組合於! C 2 6 的封裝體或電路板等物品相互粘合 組設在晶片（2 0 )上。 晶片（2 〇 )上時，可讓晶片（2 0 )容置於基板（工 )底面的凹槽（1 6)内，而透過塗佈在位於凹槽（1 )外圍粘合區（1 7 )上的膠體（工9 )與晶片（2 〇 可將散熱器（1 〇M281391 8. Description of the new type: [Technical field to which the new type belongs] This creation is mainly about a diffuser with ventilation holes, especially a radiator with good and fast heat dissipation function, which can improve heat dissipation efficiency. [Previous technology] In recent years, due to the rapid development of the computer industry, the size of tablets has become more and more ^, and the functions have become stronger and stronger, and the heat generated during relative operation has also increased. Therefore, it is generally used on 1 C chips. A heat sink is usually provided to enable the IC chip to operate at a certain temperature to achieve the intended function and function. The existing heat sink is mainly provided with a plurality of heat dissipation fins on one side of a substrate. After the other side of the substrate is attached to the wafer, the heat generated during the operation of the wafer can be transmitted to the substrate and then transmitted. The radiating fins radiate heat to the surrounding environment to achieve the effect of reducing the operating temperature of the chip. In order to attach the heat sink to the wafer fixedly, the bottom surface of the heat sink substrate and the wafer are often glued together. However, since the bottom surface of the existing radiator substrate is a flat surface, the colloid will be directly bonded between the bottom surface of the substrate and the wafer, so that the wafer cannot directly contact the substrate, and the gap between the wafer and the substrate is reduced due to the barrier of the colloid. Heat transfer efficiency, which in turn reduces the heat dissipation efficiency of existing radiators. At the same time, the heat generated during the operation of the chip will be directly transferred to the colloid and then transmitted to the thermal heater. In this way, the colloid is prone to produce adverse effects such as melting or melting under long-term heating conditions, and the heat sink will become loose and other phenomena. , Further reducing the overall heat dissipation effect of the radiator. 5 M281391 [New content] Therefore, in view of the shortcomings in the structure and use of existing radiators, the creator of the "Xiao Xiao", after continuous experiments and good practices, has finally developed a book that can improve the lack of custom. The main purpose of this creation # ， It is to provide a radiator with ventilation holes, which can directly contact the government heater and the chip, and use the heat dissipation effect of the ventilation holes to avoid the bad conditions such as deterioration or melting due to heating, so as to reach 1 For the purpose of improving the heat dissipation efficiency of the radiator. In order to achieve the above purpose, this creation is mainly to provide a heat sink with a vent hole, which is mainly provided with a base plate, and a plurality of heat dissipation sheets are formed on the top surface of the substrate. The bottom end of the substrate is recessed with a groove, and the substrate is formed at the periphery of the groove with a gel-coated adhesive area, and a plurality of ventilation holes are provided around the substrate at the periphery of the groove. Means, this creation can achieve the following enhancements in efficiency: θ 1 · The radiator of this creation can accommodate the chip in the groove to avoid the chip contacting with the colloid, so that the chip The heat generated during operation can be directly transmitted to the substrate, which can improve the heat dissipation efficiency of the heat sink. 2 · This creation can avoid the colloid directly absorbing the heat generated during the operation of the chip 'and let the chip generate through the ventilation holes The heat is directly discharged to the surrounding soil to prevent the colloid from being deteriorated or melted due to long-term heating, so that the political heat is firmly combined on the wafer, so that the heat sink can provide good heat dissipation. [Implementation Method] 6 M281391 This creation mainly provides a kind of radiator with ventilation holes. Please refer to the first and the first picture. As can be seen from the figure, the radiator of this creation is mainly provided with a base plate (12). The top surface of the substrate (12) is convexly formed with a plurality of heat dissipation fins (14), and the bottom surface of the substrate (12) is recessed with a-groove (16), wherein the shape of the groove (16) to match the wafer may be It is square and located at the center of the bottom surface of the base plate (12), and the base plate (12) is located at the periphery of the groove (16) to form an adhesive that can be coated with colloid (19) (as shown in the fourth figure)合 区 ㈠?) 'And in the substrate (12) There are many ventilation holes (1 8) located around the groove (16). Please refer to the third and fourth ® again, when the heat sink (1 0) is combined in the package of C 2 6 or the circuit board and other items The mutual bonding group is set on the wafer (20). When the wafer (20) is placed on the wafer (20), the wafer (20) can be accommodated in the groove (16) on the bottom surface of the substrate (work), and can be applied through the coating. The colloid (work 9) and the wafer (20) can be located on the peripheral bonding area (17) of the groove (1) and the heat sink (1 〇).
藉此’因晶片（2 0 )係容置於凹槽（丄6 )内，且 於凹槽（1 6 )内並未塗佈有膠體（丄9 )，所以晶片（ 2〇)會與基板（12)表面直接接觸，故晶片（2〇) 運作時所產生的熱量會直接傳導至基板（i 2 )上，再透 過散熱鰭“ i 4 )發散至周圍環境中如此可提高基板 (")與晶片（2 0 )間的熱傳熱效率進而能提昇散 熱器（10)的散熱效率。 其次’因膠體（1 9 )未與晶片（2 〇 )直接接觸， M281391 所以不會直接吸收晶片（2 〇 )運作時所產生的熱量，同 時配合透氣孔（1 8 )的設置，亦可讓晶“ 2:)所產 生的熱量直接經由透氣1 (1 8)排至關環境，以避免 傳遞至膠體（19)，如此除可加速晶片（2Q)熱量的 排散效率外，更可防止膠體（19)目長期受熱而產生變 質或溶化等不良狀況’使散熱器（丨Q )㊣制地組合在 晶片（20)上，來提供良好的散熱作用。With this, because the wafer (20) is accommodated in the groove (丄 6), and the colloid (丄 9) is not coated in the groove (16), the wafer (20) will contact the substrate. (12) The surface is in direct contact, so the heat generated during the operation of the chip (20) will be directly transmitted to the substrate (i 2), and then dissipated to the surrounding environment through the heat dissipation fin “i 4”, which can improve the substrate (" ) And the chip (20) can improve the heat transfer efficiency of the heat sink (10). Secondly, because the colloid (19) is not in direct contact with the chip (20), M281391 will not directly absorb the chip (2) The heat generated during the operation, in conjunction with the setting of the ventilation holes (1 8), can also allow the heat generated by the crystal "2:" to be discharged directly to the environment through the ventilation 1 (18) to avoid transmission To the colloid (19), in addition to accelerating the heat dissipation efficiency of the wafer (2Q), it can also prevent the colloid (19) from being heated for a long time and causing bad conditions such as deterioration or melting. Combined on the chip (20) to provide good heat dissipation.
請再參看第五圖，由圖中可看到，於基板（12 ‘） 之兩相對角處可分別延伸形成有一耳片（13)，於各尊 片（1 3 )上則設置有-穿1 ( 1 3 2 )，如此可將一嫘 栓等固定件在穿過耳片（13)上的穿孔（132)後， 固定在電路板上相對應的孔洞中，而可進—步提高散熱器 (1 0 ’）與晶片結合的穩固性。 綜上所述，本創作確可改進習用散熱器結構及使用上 的不足與缺失’實為—極具進步性之佳作，且本創作未見 於刊物或公開使用，符合新型專利之申請要件，妥具文依 法提出申請。 【圖式簡單說明】 第一圖係本創作之立體外觀圖。 第二圖係本創作之底視圖。 第三圖係本創作與晶片之立體分解圖。 第四圖係本創作與晶片組合之局部剖面圖。 第五圖係本創作另一實施例之立體外觀圖。 【主要元件符號說明】 M281391 (1 ο )散熱器 (1 2 )基板 (13)耳片 (1 4 )散熱鰭片 (1 7 )粘合區 (1 9 )膠體 (1 0 ‘）散熱器 (12 ‘）基板 (1 3 2 )穿孔 (16)凹槽 (18)透氣孔 (2 0 )晶片Please refer to the fifth figure again. It can be seen from the figure that ear pieces (13) can be respectively formed at two opposite corners of the base plate (12 '), and -wearing is provided on each piece (1 3). 1 (1 3 2), so that a fixing member such as a bolt can be fixed in a corresponding hole in a circuit board after passing through the hole (132) on the ear piece (13), and the heat dissipation can be further improved. (1 0 ') and the stability of the wafer. In summary, this creation can indeed improve the structure and use of conventional radiators. It is indeed a highly progressive work, and this creation has not been seen in publications or public use. It meets the requirements for new patent applications. Filed an application according to law. [Schematic description] The first picture is the three-dimensional appearance of this creation. The second picture is the bottom view of this creation. The third picture is a three-dimensional exploded view of the creation and the wafer. The fourth figure is a partial cross-sectional view of the combination of this creation and the wafer. The fifth diagram is a three-dimensional appearance diagram of another embodiment of the present invention. [Description of main component symbols] M281391 (1 ο) heat sink (1 2) substrate (13) ears (1 4) heat sink fins (1 7) adhesive area (1 9) gel (1 0 ') heat sink ( 12 ') Substrate (1 3 2) Perforated (16) Groove (18) Vent hole (2 0) Wafer
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