M280076 ^、創作說明（1) 【新型所屬之技術領域】 本創作係與裁切基板之切割裝置相 於该壓膜機後方製程之半自動裁切裝置 切之基板前後施以拉撐力，俾利於切膜 【先前技術】 按，一般基板（如軟性電路板），為 在製造加工上必須在其表面貼覆有一層 身具有相當之可撓性度及形變，因此多 膜機對貼覆有膜料之基板進行壓膜作業 i：及可使該膜料平貼於該基板表面者。 當該基板經過該壓膜機進行壓膜作 切作業，俾能將該基板裁切為適當尺寸 產業來說，都係利用人工的方式，藉由 平，再對该基板施以裁切作举； 惟’利用人工徒手的方式進行裁切 事亦浪費成本，且若遇到需要大量、快 無法符合要求。 爰此’本案係能研發出一種裝設於 丨半自動裁切裝置，可對該基板進行半自 月匕有效的減少人工成本，亦可符合大量 【新型内容】 本創作之主要目的，係在提供一種 切裝置’係為貼覆有膜料之基板後續之 有上下一對壓輪，可將基板導入於一裁 關，尤指一種裝設 ’其可將輸入欲裁 刀裁斷。 其後續製程需求， 膜料，由於基板本 數業者係利用一壓 ’俾防止該基板形 業後，則需進行裁 ’而以目前壓膜機 徒手先將該基板拉 作業，不僅費時費 速的製程時，根本 壓膜機後方製程之 動裁切作業，不僅 、快速的產能。 壓膜機之半自動裁 裁切作業，其包括 切機構内’該裁切M280076 ^ Creation description (1) [Technical field to which the new type belongs] This creation is based on the cutting force of the semi-automatic cutting device of the cutting device in the process behind the laminating machine. Film cutting [Previous technology] According to the general substrate (such as flexible circuit boards), in order to manufacture and process, it must be covered with a layer of body with considerable flexibility and deformation, so the multi-film machine has a film for the film. Laminating operation of the substrate of the material i: and the film material can be flatly adhered to the surface of the substrate. When the substrate passes through the laminating machine to perform laminating and cutting operations, the substrate can be cut to an appropriate size for the industry. All of these methods use manual methods to flatten the substrate and then cut the substrate. However, 'cutting by hand by hand is also a waste of cost, and if it needs a large amount, it can't meet the requirements quickly.爰 This' is a case where a semi-automatic cutting device installed on the substrate can be developed to reduce the labor cost of the substrate. It can also meet a large number of [new content] The main purpose of this creation is to provide A cutting device is a pair of upper and lower pressing wheels followed by a substrate covered with a film material, which can introduce the substrate into a cutting gate, especially a device that can cut the input knife to be cut. For its subsequent process requirements, the film material, because the substrate manufacturer uses a press to prevent the substrate from forming, you need to cut it, and the current laminator is used to pull the substrate by hand, which is not only time-consuming and fast. During the manufacturing process, the cutting operation of the basic process behind the laminator is not only a fast production capacity. The semi-automatic cutting operation of the laminator includes the cutting mechanism
M280076 ^、創作說明（2) ，，，二—位於該基板上方之切膜組，及位於該基板下方 jΐ姓切膜組之切膜刀可向下而將基板裁斷，以及在 j裁：=前後各設一組上下相對之滾輪，藉由該兩滾輪 3 =擬土T將該基板擇拉，使該基板平直，俾利於該切膜 刀向下裁斷，可得精確之尺寸。 【實施方式] I a ί俾^貴審查委員對本創作之目的、特徵及功效得 又至更加深入之瞭解與認同，茲列舉一較佳實施例並配合 圖式說明如后： 士清參考【第1圖】所示，本創作壓膜機之半自動裁切 衣置，係為貼覆有膜料於一基板丨2上下表面之後續裁切 業，其包括有： 、 上、下一對壓輪11，該對壓輪11可將該基板12滾壓以 導入於一裁切機構2 〇内。 該裁切機構2 0係包含：一位於該基板丨2上方之切膜組 2 1 ’及位於該基板1 2下方之一刀座2 2，該切膜組2 1縱向設 一切膜刀211，該切膜刀211可朝該刀座22向下而將橫向輸 入之該基板1 2裁斷’以及於該裁切機構2 〇前、後位置各設 ❶一組上、下相對之滚輪23a、23b，其中前侧上、下兩滾輪 2 3 a相鄰間隙恰可將该基板1 2壓合導向後方，該基板1 2輸 經切膜組21，而後側之兩滾輪23b可將該基板12壓合朝向 滾輪23b後方導出。 一動力源30(如馬達），係位於該兩組滾輪23a、23b下 方，該動力源30側向凸伸出一下轉輪31及一上轉輪32，一M280076 ^, creation description (2) ,,, two-the film cutting group located above the substrate, and the film cutting knife of the film cutting group located below the substrate can cut the substrate downward, and cut at j: = A set of rollers facing each other is arranged on the front and back, and the substrate is pulled by the two rollers 3 = pseudo soil T, so that the substrate is straight, which is favorable for the film cutter to cut down and obtain accurate dimensions. [Implementation] I a ^ 俾 ^ Your reviewing committee has a deeper understanding and approval of the purpose, features and effects of this creation, and hereby lists a preferred embodiment and illustrates it with drawings as follows: Shi Qing Reference [第Figure 1] shows the semi-automatic cutting clothes of this creative laminator, which is a subsequent cutting industry covered with film on a substrate 丨 2 upper and lower surfaces, which includes:, upper and next pair of pressing wheels 11. The pair of pressing wheels 11 can roll the substrate 12 to be introduced into a cutting mechanism 200. The cutting mechanism 20 includes: a cutting film group 2 1 ′ above the substrate 丨 2 and a knife holder 22 below the substrate 12. The film cutting group 21 is provided with all film knives 211 in a longitudinal direction. The film cutting knife 211 can cut the substrate 12 input in the lateral direction toward the knife seat 22, and set a set of upper and lower rollers 23a, 23b at the front and rear positions of the cutting mechanism 20, respectively. The adjacent gaps between the upper and lower rollers 2 3 a on the front side can precisely guide the substrate 12 to the rear. The substrate 12 passes through the film cutting group 21, and the two rollers 23b on the rear side can press the substrate 12 together. It leads out to the rear of the roller 23b. A power source 30 (such as a motor) is located below the two sets of rollers 23a and 23b. The power source 30 protrudes laterally from the runner 31 and the upper runner 32.
M280076 四、創作說明（3) 皮帶33係繞經位於該基板12下方之該滾輪23a、23b，及該 下轉輪31與上轉輪32，使驅動該兩組滾輪23a、23b產生 旋轉。 藉由上述之結構’當已貼覆有膜料之該基板1 2，經由 上、下轉輪32、31之壓合導入而朝向兩滾輪23a輸送時 ，則藉由該兩組滾輪2 3 a、2 3 b模擬人手的方式，將具有持 曲性之基板1 2撐拉，使該基板1 2平直，俾利於該切膜刀 211向下裁斷，可得精確之基板12尺寸。 ' 而所謂該模擬人手的方式進行裁初作業，係指該基板 讀112經由上下相對之兩滾輪23a壓合往切膜組21輸送，再被 上下相對之兩滾輪23b壓合而朝後導出，由於該基板12輸 •經上下兩滾輪23a位置，該兩滾輪2 3a會施予基板丨2 一麼合 •夾制力量’同理位於該切膜組21後方之上下兩滾" 會施予該部位之基板1 2 —股壓合夾制的力量，換:之介於 切膜組21前後之兩滾輪23a及滾輪23b，可將位於^^兩 組滾輪23a、23b間之基板12施予前後拉撐作用，使切膜組 2 1之切膜刀2 11縱向而下朝向刀座2 2時，將可緊拉該基板、 1 2再裁切成兩段，如此可避免切膜刀2丨i朝下同時向$扯 ♦.Ltt1、:恭f ί基板12被截切之位置不精確，並可防止 土板12被截切處產生捲勉者。 據此’藉由本創作壓膜機 於該壓膜機後方製程的位置， 動裁切作業，不僅可有效的減 、快速的製程要求。 之半自動裁切装置，其裝設 因此可對該基板1 2進行半自 少人工成本，且能符合大量M280076 IV. Creation instructions (3) The belt 33 is wound around the rollers 23a, 23b, and the lower roller 31 and the upper roller 32 below the base plate 12, so that the two sets of rollers 23a, 23b are driven to rotate. With the above-mentioned structure, when the substrate 12 with the film material pasted thereon is conveyed toward the two rollers 23a through the pressure introduction of the upper and lower rollers 32 and 31, the two sets of rollers 2 3a are used. In the way of simulating a human hand, 2 3 b is used to stretch the substrate 12 with flexibility, so that the substrate 12 is straight, which is favorable for the film cutter 211 to cut downward, and the precise substrate 12 size can be obtained. 'And the so-called artificial hand to carry out the preliminary cutting operation means that the substrate reading 112 is conveyed to the film cutting group 21 by pressing the two rollers 23a facing up and down, and then is led backward by the two rollers 23b facing up and down. Since the substrate 12 loses the position of the two rollers 23a, the two rollers 2 3a will be applied to the substrate 丨 2 is a combination • the clamping force is similarly located above and behind the film cutting group 21 and two rollers will be applied The substrate 1 2 at this part — the force of the clamping and clamping. For the two rollers 23a and 23b located between the front and rear of the film cutting group 21, the substrate 12 located between the two groups of rollers 23a and 23b can be applied. When the film cutter 2 11 of the film cutting group 21 is oriented vertically and downwardly toward the knife holder 22, the substrate can be pulled tightly, and then cut into two sections, so that the film cutter 2 can be avoided.丨 I pull down at the same time to $ .Ltt1 ,: Gong f ί The position where the base plate 12 is cut is not accurate, and it can prevent the curling of the soil plate 12 where it is cut. Based on this, by using the original laminating machine at the position of the process behind the laminating machine, the dynamic cutting operation can not only effectively reduce the rapid process requirements. Semi-automatic cutting device, its installation can therefore semi-automatically reduce the labor cost of the substrate 12, and can meet a large number of
M280076 圖式簡單說明 【圖式簡單說明】 第1圖，係本創作實施例之平面示意圖 【主要元件符號說明】 11 12 20 21 211 22 • 23a 30 31 32 33 壓輪 基板 裁切機構 切膜組 :切膜刀 刀座 、23b :滾輪 動力源 下轉輪 上轉輪 皮帶M280076 Schematic illustration [Schematic illustration] Figure 1 is a schematic plan view of this creative embodiment. [Description of the main component symbols] 11 12 20 21 211 22 • 23a 30 31 32 33 Film cutting mechanism : Film cutting knife holder, 23b: Roller power source Lower runner Upper runner belt
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