M276320 • , 八、新型說明： 【新型所屬之技術領域】 本案係關於-種LED燈具結構，尤指-種適用於具散熱結構之高功率 LED燈具。 【先前技術】 發光二極體(Light Emitting Diode，LED)係-種利用流通電流來發光的 PN二極體。在PN三極體中加上順向偏壓(P型部分為陽極，N型部份為陰 極）’那麼，P型半導體會流人電子，N型半導體的部份則流人電洞。此外二 Φ 在PN接合附近的電洞與電子會因為旺盛的給合而消失。此時，特定的半導 體，其流人的電子與電洞具村膽光_量。彻雜航喊生光源 者，即所謂之發光二極體。 ☆然而，不論是何翻型之發光二極體，其使用週期壽命及可靠度主要 受溫度的控制。以高功率GaN型發光二極體為例，當該二極體接受電能後， 會將10%的電能轉為光能而發散出來，其餘的9〇%則變為熱能逸散而出。 2以對GaN型發光二極體而言，該LED晶片接受之電能，幾乎都轉化為熱 能，也因此在高功率LED之散熱問駿成為一重要之課題，尤其對於由高、 功率LED組裝而成之燈具則更為重要。請參閱第—圖，其係為—習知之高 鲁神L^D燈具組合。其主要結構包含：一殼體基座n ; 一電路基板以，鎖 固於該殼體基座11 ± ;以及複數個高功率LED13，設置於該電路基板以 上三透過電源導線Η之導電，則該燈具組合便可提供足夠之光源。然而， 在實際使用時，該高功率LED13會產大量的熱能，但在此類構裝結構中， 僅可透過f源導線M或電路基板u與殼體基座u _處之傳導來 逸^其效果有限，則該高功率LED13將因熱量累積及溫度上昇而使其電 f生!^ $彡響。 職疋之故’申清人鐘於習知技術之缺失，乃經悉心試驗與研究，並一 本鎖而不捨之精神，終研發出本案之一種可避免因熱量累積而影響發光二 極體電性之散熱組裝結構。 M276320 • % 【新型内容】 本案之主要目的係為提供一種具散熱裝置之LED燈具組裝結構，其結 構簡單’組裝容易，並可避免因熱量累積而影響高功率LED之電性。 為達上述目的，本案提供一種高功率LE：D燈具之組裝結構，其結構至 少包含·一殼體基座，其具有一容置空間；一電路基板，設置於該容置空 間之上，至少一咼功率LE：D，設置於該電路基板之上；以及一散熱鰭片組， 環設於該殼體_之外緣，用以逸散該高功率LED所產生之熱量，避免因 熱量累積而影響其電性。 根據本案構想，其中該殼體基座與該電路基板間更具有一導熱膠層， 馨 用以黏合該殼體基座與該電路基板，並於其間導熱。 根據本案構想，其中該散熱鰭片組更包含複數個散熱對流孔，用以增 加散熱之功效。 根據本案構想，其中該散熱鰭片組與該殼體基座係一體成型。 根據本案構想，其中該殼體基座可由一導熱陶瓷材料所構成。 根據本案構想，其中該導熱陶瓷材料係為一氮化鋁材料。 根據本案構想，其中該散熱鰭片組可由一導熱金屬材料所構成。 根據本案構想，其中該導熱金屬材料係為一銅或鋁材料。 根據本案構想，邊咼功率led燈具之組裳結構，更包含一燈罩體，連 0 接該殼體基座，罩含該高功率LE1D，用以反射其光源。 根據本案另一態樣，本案更提供一種高功率LED燈具，其結構包含： 一殼體基座，其具有一容置空間；一透光上蓋，對應該殼體基座，用以封 閉該容置空間；一電路基板，設置於該容置空間内；至少一高功率LE：D，設 置於該電路基板之上；以及複數個散熱鰭片組，環設於該殼體基座之外緣， 用以逸散該高功率LE：D所產生之熱量，避免因熱量累積而影響其電性。 根據本案構想，其中該殼體基座與該電路基板間更具有一導熱膠層， 用以黏合該殼體基座與該電路基板，並於其間導熱。 根據本案構想，其中该散熱鳍片組更包含複數個散熱對流孔，用以增 加散熱之功效。 M276320 • % 根據本案構想，其中該散熱鰭片組與該殼體基座係一體成型。 根據本案構想，其中該殼體基座可由一導熱陶瓷材料所構成。 根據本案構想，其中該導熱陶瓷材料係為一氮化鋁材料。 根據本案構想，其中該散熱籍片組可由一導熱金屬材料所構成。 根據本案構想，其中該導熱金屬材料係為一銅或鋁材料。 一 4本案之再一目的為提供一種具散熱裝置之高功率LED燈具，其結構包: g成體基座，其具有—容置空間；—電路基板，設置於該容置空間内； 至少一高功率LED，設置於該電路基板之上；以及複數個散埶柱，設置 於該殼體基座之外緣，用以逸散該高功率LED所產生之熱量，避免因軌量 _ 累積而影響其電性。 ” 根據本案構想，其巾該殼體基座與該電路基板間更具有—導熱膠層， 用以黏合該殼體基座與該電路基板，並於其間導熱。 根據本案構想，其中該散熱柱更包含複數個散熱對流孔，用以增加散 熱之功效。 根據本案構想，其中該散熱柱與該殼體基座係一體成型。 根據本案構想，其巾該殼體基座可由—導熱陶諸料所構成。 根據本案構想，其中該導熱陶紐料係為—氮德材料。 根據本案構想，其中該散熱柱可由一導熱金屬材料所構成。 根據本案構想，其中該導熱金屬材料係為一銅或鋁材料。 根據本案構想，該高功率LED燈具之組震結構，更包含一燈罩體，連 接該殼體基座，罩含該高功率LE：D，用以反射其光源。 本案得藉由下列圖示與實施例說明，俾得一更清楚之了解。 【實施方式】 本案係為-種高功率LED燈具組裝結構，其特殊之散熱結構可將該高 功率LED所產生之熱量，迅速·構裝鐘畴，避免因熱量累積及溫度 上昇而使殼體内部之高功率LED之電性受到影響或造成損傷。以下將以實 施例進-步·本賴作之内容，然而可細本毅術之高功率㈣燈具 並不限於所提之實施例而已，其他任何適用本案技術之燈具組裝結構，在 M276320 此皆可併入參考。 ^閱第—圖，其_不本案—較佳實細之具散熱結構之高功率⑽ 二:、。如圖所不，其結構至少包含：-殼體基座2丨，其具有-容置空間m; 土板22 ’ 5又置於该容置空間211之上；至少一高功率led23，設置 於《路基板22之上；以及-散麟片組24，環設於該殼體基座21之外 緣、逸政^亥同功率LED23所產生之熱量，避免因熱量累積而影響其電 性。 其= 亥散熱H片組24與該殼體基座21可-體成型。然而為避免影響 電性又需提供高熱導值，該殼體基座21與該散熱鰭片組24則可由一導熱 φ 陶瓷材料，如氮化鋁所構成。在本案實施例中，該高功率LH)燈具之組裝 結構，更包含一燈罩體25，連接該殼體基座2卜罩含該高功率l鹏，用 以反射其光源。 叫參閱第二圖，其係揭示本案另一較佳實施例之具散熱結構之高功率 LED燈具。如圖所示，其結構包含：一殼體基座31，其具有一容置空間311 ; -電路基板32，設置於該容置空間311之上；至少一高功率_3，設置 於該電路基板32之上；以及複數個散熱鰭片組34，環設於該殼體基座31之 外緣，用以逸散該高功率LED33所產生之熱量，避免因熱量累積而影響其 電性。不同於前述實施例，本實施例之該複數個散熱鰭片組34係垂直且呈 放射狀環設於該殼體基座31之外圍，而該複數個散熱鰭片組34上更具有 ^ 複數個散熱對流孔341，穿透設置於其上，用以增加散熱之功效。 請參閱第四圖，其係揭示本案再一較佳實施例之具散熱結構之高功率 LE：D燈具。如圖所示，其結構包含：一殼體基座41，其具有一容置空間； 一透光上蓋45，對應該殼體基座41，用以封閉該容置空間；一電路基板42， 設置於該容置空間内；至少一高功率LED43，設置於該電路基板42之上； 以及複數個散熱鰭片組44，環設於該殼體基座41之外緣，用以逸散該高功 率LED43所產生之熱量，避免因熱量累積而影響其電性。其中該殼體基座 41與該電路基板42間更具有一導熱膠層46，用以黏合該殼體基座4丨與該 電路基板42，並於其間導熱。措此’該殼體基座41與該電路基板42亦得 以形成絕緣，則殼體基座41與該散熱鰭片組44則可由一導熱金屬材料， 7 M276320 # 、 · 如銅或鋁所構成。 請參閱第五圖，其係揭示本案又—較佳實施例之具散熱結構之高功率 led燈具。如圖所示，其結構包含··一殼體基座51，其具有一容置空間叫； 一電路基板52，設置於該容置空間511内；至少一高功率LED53，設置於 該電路基板52之上；以及複數個散熱柱54，設置於該殼體基座51之外緣， 用以逸散該高裤LED53所產生之熱量，避免賴量累躺辟其電性。 其中，該高功率LED燈具之組裝結構，t包含一燈罩體55，連接該殼體基 座51 ,罩含該高功率LED53，用以反射其光源。 根據本案之構想，本騎揭示德裝結構，不論是殼縣座、散熱讀 • 片組或是散齡結構，其製成觀之_必綱時做—職之考量，本創 :在殼體基座献散熱鰭片組之材料考量上，除了注重材料本身之機械性 質旦隔絕及導雜外，與溫度侧之親絲亦為賴作機·之基本 考$。否則不當之材料選用，可能該發光二極體組裝結構之殼體，在溫度 不斷變化下產生質變、劣化甚至龜裂等現象。 綜上所述，本案提供一種高功率LED燈具組裝結構，可避免因熱量累 積而影響高功率LED電性。該高功率LED所產生之熱量，可藉由散熱鰭片 組結構，迅速排㈣殼體_，避免因歸_及溫紅昇而使該其内之 =率LED之電性受影響。相較於習知技藝，本案所提之高功率㈣燈具 藝 、、且口，V入了散熱鰭片組及殼體基座結合之概念，能有效地將高功率LEI) 所產生之熱能由電路基板處向外逸散，而使該處熱能不易累積，故本案之 結構可同時組構更多數量之LED，提供更為明亮之照明燈具 ，此為習知技藝 無法達成者。故本案實為該領域範細^可多得之創作。縱使本創作已由 上述之實施顺細敘述而可由誠本技#之人士任紐思而為諸般修飾， 然皆不脫如附申請專利範圍所欲保護者。 【圖式簡單說明】 第一圖：其係揭示一習知高功率LED燈具之構裝組合。 第=圖：其係揭示本案第一較佳實施例具散熱結構之高功率匕拉^燈具。 第二圖·其係揭不本案第二較佳實施例具散熱結構之高功率LED燈具。 M276320M276320 •, 8. Description of the new type: [Technical field to which the new type belongs] This case is about one kind of LED lamp structure, especially one kind of high power LED lamp with heat dissipation structure. [Prior Art] Light Emitting Diode (LED) is a type of PN diode that uses current to emit light. If a forward bias is added to the PN transistor (the P-type part is the anode and the N-type part is the cathode) ', then the P-type semiconductor will flow into the electrons, and the N-type semiconductor will flow into the holes. In addition, the holes and electrons near the Φ junction will disappear due to the vigorous feeding. At this time, the electrons and holes of a specific semiconductor have a bile intensity. Those who utterly call out light sources are so-called light-emitting diodes. ☆ However, no matter what type of light-emitting diode is turned over, its service life and reliability are mainly controlled by temperature. Taking a high-power GaN light-emitting diode as an example, when the diode receives electrical energy, it converts 10% of the electrical energy into light energy and emits it, and the remaining 90% becomes thermal energy and escapes. 2 For GaN-type light-emitting diodes, almost all of the electrical energy received by the LED chip is converted into thermal energy. Therefore, heat dissipation in high-power LEDs has become an important issue, especially for the assembly of high-power LEDs. A successful fixture is even more important. Please refer to the figure-it is-the learned Gao Lushen L ^ D lamp combination. Its main structure includes: a housing base n; a circuit substrate to be fixed to the housing base 11 ±; and a plurality of high-power LEDs 13, which are arranged above the circuit substrate and are conductive through the power conductor Η, then The luminaire combination can provide sufficient light source. However, in actual use, the high-power LED 13 will generate a large amount of thermal energy, but in such a structure, it can only be escaped through the conduction of the f source wire M or the circuit substrate u and the housing base u_ The effect is limited, so the high-power LED 13 will generate electricity due to heat accumulation and temperature rise! ^ $ 彡 响. The reason for the occupational affair 'is that the lack of knowing technology of the people in Shenqing was carefully tested and researched, and the spirit of perseverance was finally developed. One of the cases in this case can avoid the influence of heat accumulation on the light-emitting diode. Electrical heat dissipation assembly structure. M276320 •% [New content] The main purpose of this case is to provide an LED lamp assembly structure with a heat sink, which has a simple structure and is easy to assemble, and avoids affecting the electrical properties of high-power LEDs due to heat accumulation. In order to achieve the above purpose, the present invention provides an assembly structure of a high-power LE: D lamp, the structure of which includes at least a housing base, which has an accommodation space; a circuit substrate, which is disposed on the accommodation space, at least A stack of power LE: D is disposed on the circuit substrate; and a heat dissipation fin group is arranged on the outer edge of the housing _ to dissipate the heat generated by the high-power LED to avoid heat accumulation. And affect its electrical properties. According to the idea of the present case, a thermally conductive adhesive layer is further provided between the case base and the circuit substrate, and is used for bonding the case base and the circuit substrate and conducting heat therebetween. According to the idea of the case, the heat dissipation fin group further includes a plurality of heat dissipation convection holes for increasing the heat dissipation effect. According to the idea of the present case, the heat dissipation fin group is integrally formed with the housing base. According to the idea of the present case, the housing base may be made of a thermally conductive ceramic material. According to the idea of the present case, the thermally conductive ceramic material is an aluminum nitride material. According to the idea of the present case, the heat dissipation fin group may be composed of a thermally conductive metal material. According to the idea of the present case, the thermally conductive metal material is a copper or aluminum material. According to the concept of the present case, the group structure of the edge-powered LED lamp further includes a lamp cover connected to the shell base, and the cover contains the high-power LE1D to reflect its light source. According to another aspect of the present case, the present case further provides a high-power LED lamp, the structure of which includes: a housing base having a receiving space; a transparent cover corresponding to the housing base to close the housing A circuit substrate disposed in the accommodation space; at least one high-power LE: D disposed on the circuit substrate; and a plurality of heat dissipation fin groups arranged on the outer edge of the housing base It is used to dissipate the heat generated by the high power LE: D and avoid its influence on electricity due to heat accumulation. According to the idea of the present case, a thermally conductive adhesive layer is further provided between the case base and the circuit substrate, which is used to bond the case base and the circuit substrate and conduct heat therebetween. According to the idea of the case, the heat dissipation fin group further includes a plurality of heat dissipation convection holes for increasing the heat dissipation effect. M276320 •% According to the idea of the present case, the heat dissipation fin group is integrally formed with the housing base. According to the idea of the present case, the housing base may be made of a thermally conductive ceramic material. According to the idea of the present case, the thermally conductive ceramic material is an aluminum nitride material. According to the idea of the present case, the heat-dissipating sheet set may be composed of a thermally conductive metal material. According to the idea of the present case, the thermally conductive metal material is a copper or aluminum material. A further object of this case is to provide a high-power LED lamp with a heat dissipation device. The structural package includes: a g-body base having an accommodation space; and a circuit substrate disposed in the accommodation space; at least one The high-power LED is disposed on the circuit substrate; and a plurality of scattered pillars are disposed on the outer edge of the base of the housing to dissipate the heat generated by the high-power LED and avoid the accumulation due to the amount of rail _ Affects its electrical properties. According to the concept of the present case, there is a thermally conductive adhesive layer between the case base and the circuit substrate, which is used to bond the case base and the circuit substrate and conduct heat therebetween. According to the concept of the present case, the heat dissipation column It also includes a plurality of heat dissipation convection holes to increase the effect of heat dissipation. According to the idea of the case, the heat dissipation column and the shell base are integrally formed. According to the idea of the case, the shell base of the towel can be made of heat conductive ceramic materials. According to the concept of the case, the thermally conductive ceramic material is a nitrogen material. According to the concept of the case, the heat dissipation column may be composed of a thermally conductive metal material. According to the concept of the case, the thermally conductive metal material is copper or Aluminum material. According to the idea of this case, the seismic structure of the high-power LED luminaire further includes a lamp cover connected to the housing base, and the cover contains the high-power LE: D to reflect its light source. The illustration and the description of the examples have made it clearer. [Embodiment] This case is a kind of high-power LED lamp assembly structure, and its special heat dissipation structure can Use the heat generated by the LED to quickly and construct the clock domain to prevent the electrical properties of the high-power LED inside the housing from being affected or damaged due to heat accumulation and temperature rise. The following will be taken as an example. However, the high-power ㈣ lamps that can be used in this book are not limited to the mentioned embodiments, and any other lamp assembly structure that applies the technology of this case can be incorporated in M276320 for reference. ^ See the figure— Its _ not this case-better and more compact high power with heat dissipation structure 散热 2: As shown in the figure, its structure includes at least:-housing base 2 丨, which has-accommodation space m; soil plate 22 '5 is also placed on the accommodation space 211; at least one high-power LED 23 is disposed on the road substrate 22; and-a Sanlin sheet group 24 is disposed on the outer edge of the housing base 21, The heat generated by the same power LED23 should not be affected by the heat accumulation. Its = The heat sink H sheet group 24 and the housing base 21 can be formed in one body. However, in order to avoid affecting the electrical performance, it is necessary to provide High thermal conductivity, the housing base 21 and the heat dissipation fin group 24 can be made of a thermally conductive φ ceramic Material, such as aluminum nitride. In the embodiment of this case, the assembly structure of the high-power LH) lamp further includes a lamp cover 25, which is connected to the housing base 2 and the cover contains the high-power lpeng, for Reflect its light source. Refer to the second figure, which is a high-power LED lamp with a heat dissipation structure that reveals another preferred embodiment of the present case. As shown in the figure, its structure includes: a housing base 31, which has a capacity Placement space 311;-a circuit substrate 32 provided above the accommodation space 311; at least one high power _3 is provided above the circuit substrate 32; and a plurality of heat dissipation fin groups 34 are arranged in a circle on the housing The outer edge of the base 31 is used to dissipate the heat generated by the high-power LED 33 so as to avoid affecting its electrical properties due to heat accumulation. Unlike the previous embodiment, the plurality of heat dissipation fin groups 34 in this embodiment are vertical A radial ring is arranged on the periphery of the casing base 31, and the plurality of heat dissipation fin groups 34 further have a plurality of heat dissipation convection holes 341 penetratingly disposed on the heat dissipation fin group 34 to increase the heat dissipation effect. Please refer to the fourth figure, which discloses a high power LE: D lamp with a heat dissipation structure according to yet another preferred embodiment of the present invention. As shown in the figure, its structure includes: a housing base 41 having an accommodation space; a light-transmitting upper cover 45 corresponding to the housing base 41 to close the accommodation space; a circuit substrate 42, Is disposed in the accommodating space; at least one high-power LED 43 is disposed on the circuit substrate 42; and a plurality of heat dissipation fin groups 44 are looped around the outer edge of the housing base 41 to dissipate the The heat generated by the high-power LED 43 avoids affecting its electrical properties due to heat accumulation. A thermally conductive adhesive layer 46 is further provided between the case base 41 and the circuit substrate 42 to adhere the case base 4 and the circuit substrate 42 and conduct heat therebetween. As a result, the case base 41 and the circuit substrate 42 can also be insulated, and the case base 41 and the heat dissipation fin group 44 can be made of a thermally conductive metal material, such as copper or aluminum. . Please refer to the fifth figure, which discloses a high power led lamp with a heat dissipation structure according to yet another preferred embodiment of the present invention. As shown in the figure, its structure includes a housing base 51 having a receiving space; a circuit substrate 52 provided in the receiving space 511; and at least one high-power LED 53 provided in the circuit substrate. 52; and a plurality of heat-dissipating posts 54 are disposed on the outer edge of the housing base 51 to dissipate the heat generated by the high-pants LED53, avoiding to rely on the amount of electricity to lie down. Among them, the assembly structure of the high-power LED lamp, t includes a lamp cover body 55 connected to the housing base 51, and the cover contains the high-power LED 53 for reflecting its light source. According to the idea of this case, Benqi revealed the German-made structure, whether it is a shell county seat, a heat-reading film group, or a scattered-age structure. In terms of the material considerations of the fin set provided by the base, in addition to focusing on the mechanical properties of the material itself to isolate and guide impurities, the affinity with the temperature side is also the basic test of the machine. Otherwise, improper selection of materials may cause the shell of the light-emitting diode assembly structure to undergo qualitative changes, deterioration or even cracking under constant temperature changes. To sum up, this case provides a high-power LED lamp assembly structure, which can avoid the high-power LED's electrical properties due to heat accumulation. The heat generated by the high-power LED can quickly dissipate the shell through the structure of the heat dissipation fins, so as to avoid the electrical impact of the LED within the rate due to the return and the temperature rise. Compared with the conventional technology, the high-power ㈣ lamp technology mentioned in this case, and the mouth, V incorporates the concept of the combination of the heat dissipation fin group and the shell base, which can effectively convert the thermal energy generated by the high-power LEI) from The circuit substrate escapes outwards, making it difficult for heat to accumulate there. Therefore, the structure in this case can form a larger number of LEDs at the same time to provide brighter lighting fixtures. This is a skill that cannot be achieved by conventional techniques. Therefore, this case is indeed a rare creation in this field. Even if this creation has been described in detail through the above implementation and can be modified by any person who is honest in this technology, it is not inferior to those who want to protect the scope of patent application. [Brief description of the diagram] The first picture: It reveals the structure and assembly of a conventional high-power LED lamp. Fig. = It is a high power dagger ^ lamp with a heat dissipation structure disclosed in the first preferred embodiment of the present invention. The second figure is a high-power LED lamp with a heat dissipation structure, which is not the second preferred embodiment of this case. M276320
第四圖··其係揭林案第三較佳實 第五® m揭林絲四較佳實 施例具散熱結構之高功率 施例具散熱結構之高功率 LED燈具。 LED燈具。 【主要元件符號說明】 11 ·殼體基座 12 :電路基板 13 :高功率LED 14 :電源導線 21 ·殼體基座 211 :容置空間 22 :電路基板 23 :高功率LED 24 :熱鰭片組 25 :燈罩體 31 :殼體基座 311 :容置空間 32 :電路基板 33 :尚功率LED 34 :散熱ϋ片組 341 :散熱對流孔 35 :燈罩體 41:殼體基座 42 :電路基板 43 :高功率LED 44 :散熱縛片組 45 :透光上蓋 46 :導熱膠層 51 :殼體基座 511 :容置空間 52 :電路基板 53 :高功率LED 54 =散熱柱 55 :燈罩體 、申請專利範圍： 1. 一種高功率led燈具之組裝結構，其結構包含： 一殼體基座，其具有一容置空間； 一電路基板，設置於該容置空間之上； 至少一高功率LED，設置於該電路基板之上;以及 一散熱鰭片組，環設於該殼體基座之外緣，用以逸散該高功率LED所產 生之熱量，避免因熱量累積而影響其電性。 2·如申請專利範圍第1項所述之高功率LED燈具之組裝結構，其中該殼體 基座與該電路基板間更具有一導熱膠層，用以黏合該殼體基座與該電路 9Figure 4 ·· It is the third best implementation of the Jielin case. Fifth ® m Jielinsi is the fourth best embodiment. High-power LED lamps with heat-dissipating structure. LED lamps. [Description of main component symbols] 11 · Housing base 12: Circuit board 13: High-power LED 14: Power supply wire 21 · Housing base 211: Receiving space 22: Circuit board 23: High-power LED 24: Thermal fins Group 25: lamp housing 31: housing base 311: accommodating space 32: circuit board 33: power LED 34: heat sink plate group 341: heat dissipation convection hole 35: lamp housing 41: housing base 42: circuit board 43: High-power LED 44: Heat-dissipating fin group 45: Light-transmitting cover 46: Thermally conductive adhesive layer 51: Housing base 511: Receiving space 52: Circuit board 53: High-power LED 54 = Heat-dissipating column 55: Lamp housing, Patent application scope: 1. An assembly structure of a high-power LED lamp, the structure includes: a housing base having a receiving space; a circuit substrate disposed on the receiving space; at least one high-power LED And is disposed on the circuit substrate; and a heat dissipation fin group is arranged on the outer edge of the housing base to dissipate the heat generated by the high-power LED to avoid affecting its electrical properties due to heat accumulation . 2. The assembly structure of the high-power LED luminaire as described in item 1 of the scope of patent application, wherein a thermally conductive adhesive layer is further provided between the housing base and the circuit substrate to bond the housing base and the circuit 9