TWM273713U - Quality inspection device of electronic component - Google Patents

Quality inspection device of electronic component Download PDF

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Publication number
TWM273713U
TWM273713U TW93218795U TW93218795U TWM273713U TW M273713 U TWM273713 U TW M273713U TW 93218795 U TW93218795 U TW 93218795U TW 93218795 U TW93218795 U TW 93218795U TW M273713 U TWM273713 U TW M273713U
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Taiwan
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electronic components
electronic component
item
several
workstation
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TW93218795U
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Chinese (zh)
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Yi-Hong Lin
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Nat Pingtung University Of Sci
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Priority to TW93218795U priority Critical patent/TWM273713U/en
Publication of TWM273713U publication Critical patent/TWM273713U/en

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M273713 創作說明(1) 【新型所屬之技術領域】 本創作係關於一種電子元件之品質檢測裝置,特別是關 於利用工作站的檢測模式,分站各自執行各種瑕疵檢測功 月匕之品質檢測裝置。 【先前技術】 習用電子兀件之外觀尺寸及表面瑕疵的檢測項目,如第 1及2圖所示’就晶片電容〔chip capacitance〕而言,其 外觀尺寸包含晶片電容之全長^、電極長度D2、電極寬度 D3、素體長度D4、素體寬度D5#,及其表面瑕疵包含·· 1、明暗檢查,如污點、異物附著、表面刮痕;2、形狀檢 查,如割傷、缺角、電極小、電極大、全長大;及3、顏 色檢查,如電極變色、素體變色、電極無。在電子元件之 生產過程中,部份電子元件不可避免的產生上述外觀尺寸 及表面瑕疯’因此確實有必要進一步發展一檢測裝置,厂以 便精確篩選檢測電子元件,俾確保產品品質。 鍵::、 有鑑於此,本創作應用一振動供料機,並配合數台動態 攝衫機、數個動態影像操取卡及數個光學模組,同時利用 具雙CPU之電細及具備多執行序功能之軟體進行快速計算 及高速檢測’以篩選出電子元件之不良品,藉以達到準確 檢測及高檢測效率。 【新型内容】 本創作之主要目的係提供一種電子元件之品質檢測裝 置,其係以工作站的檢測,式,分站各自執行各種瑕疵檢 測,再擷取動態影像進行高速檢測,而使本創作具有提升M273713 Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a quality inspection device for electronic components, especially regarding the use of a workstation's detection mode, and each station performs various flaw detection functions. [Prior technology] As shown in Figures 1 and 2, the appearance dimensions and surface flaw detection items of conventional electronic components are shown in the figure. "In terms of chip capacitance, its appearance size includes the full length of the chip capacitor ^ and the electrode length D2. , Electrode width D3, element body length D4, element body width D5 #, and its surface flaws include ... 1. Brightness and darkness inspections, such as stains, foreign matter adhesion, surface scratches; 2. Shape inspections, such as cuts, missing corners, The electrode is small, the electrode is large, and the total length is large; and 3. Color inspection, such as electrode discoloration, element body discoloration, and electrode absence. In the production process of electronic components, some electronic components inevitably produce the above-mentioned appearance dimensions and surface defects. Therefore, it is indeed necessary to further develop a testing device so that the factory can accurately screen and detect the electronic components to ensure product quality. Key :: In view of this, this creation uses a vibrating feeder, and cooperates with several dynamic cameras, several dynamic image manipulation cards, and several optical modules. The software with multiple execution functions performs fast calculations and high-speed inspections to screen out defective electronic components to achieve accurate detection and high detection efficiency. [New content] The main purpose of this creation is to provide a quality inspection device for electronic components, which uses a workstation to detect various types of flaws, and then performs a variety of flaw detections, and then captures dynamic images for high-speed detection, so that this creation has Promote

C:\L0G0-5\FIVE C0NTINENTSNPK9631.ptd 第5頁 M273713 四、創作說明(2) 檢測準確度及檢測效率之功效。 2據二創作之電子元件之品質檢測裝置,其包含—置料 數個工作站、數台動態攝影機、數台電腦、數個動 悲衫像擷取卡及數個喷嘴排料機構。該置料轉盤用以運送 ::子:件依序經過各^作站。各動態攝影機分別用以擷 你:工乍站位置之電子70件的影像。肖電腦經由各動態影 像擷取卡分別處理各動態攝影機所擷取到的 $恭 腦判別任-工作站之電子元件具有瑕疵時,該工作 用该喷嘴排料機構吹氣排料,以去除電子元件之不。 若該電腦判別任-工作站之電子元件符合檢測時,= 轉盤將電子元件運送至下一工作站進行下一檢測。若—成 所有工作站之檢測,該電子元件則判別為良品。 兀 【實施方式】 為讓本創作之上述及其他目的、特徵、優點能更明 ,,下文特舉本創作之較佳實施例,並配合所附圖‘, 詳細說明如下: 作 :2第3及4圖所示,本創作之電子元件之品質檢 置係包含一振動供料機1、一置料轉盤2、數個工作站= S6、數台動態攝影機CCD1至“㈣、數台電腦至pc3、^ 個動態影像擷取卡C1至C6、數個喷嘴排料機構B1至⑽、 個不良品回收區F1至F6及一良品回收區p。本創作係數 工作站S1至S6方式,分站各自判斷是否一電子元件9〔 如晶片電容〕具有外觀尺寸或表面之瑕疵〔如第丨及2圖^ 不〕,而每一電子元件9必須經過所有工作站S1至S6經檢 第6頁 C:M0G0-5\FIVE C0NTINENTS\PK963J. ptd M273713 四、創作說明(3) ---- 驗合格’始能視為良品。$ 了達到高速檢測功能,本創作 更進一步利用具雙CPU之電腦PC1至PC3及具備多執行序功 月b之一軟體進行快速計算及高速檢測,以篩選出不良品, 藉以達到準確檢測及高檢測效率。 清再參照第3及4圖所示,本創作之振動供料機J可利用 離心力將電子元件9轉動排列至一送料道丨丨,再由該送料 道11處之閘門自動控制定時定量的將電子元件9導入該置 料轉盤2中。該置料轉盤2的適當方位配置6個該工作站s j 至S6,各工作站S1至S6分別具有6台該動態攝影機ccDl至 CCD6及6個喷嘴排料機構^至“。該動態攝影機“^至 CCD6可在隨機觸發取像時序上各自進行獨立取像,並將影 像傳送至6個該動態影像擷取卡ci至c 6。 清參照弟4圖所示’為了達成高速檢測功能,本創作採 用數台電腦PC1至PC3,該電腦PC1至PC3較佳係屬於具雙 CPU之電腦,同時該電腦pci至PC3必須安裝具備多執行;^ (Multithrend)功能之軟體,以便進行快速計算處理。本* 創作較佳採用三台該電腦PCI、PC2及PC3 ·· 〔 1〕、該電腦 PC 1專用於人機操作系統,其係連接於一控制機台丨〇及該 電腦PC2及PC3之間,該電腦PC1用以交互控制該控制機台 1 0及檢測系統,並將檢測狀態顯示於一螢幕Μ1 ;〔 2〕、 該電腦PC2搭配3個該動態影像擷取卡Cl至C3 ,其專用於第 一、二、三工作站S1至S3之檢測功能,並將檢測狀態顯示 於一螢幕M2 ;〔 3〕、該電腦PC3亦搭配3個該動態影像擷 取卡C4至C6,其專用於第四、五、六工作站S4至S6之檢測C: \ L0G0-5 \ FIVE C0NTINENTSNPK9631.ptd Page 5 M273713 4. Creation Instructions (2) The efficacy of detection accuracy and detection efficiency. 2 According to the quality detection device of the electronic components created by the second, it includes-loading, several workstations, several dynamic cameras, several computers, several moving shirt image capture cards and several nozzle discharge mechanisms. The loading carousel is used to transport :: child: pieces through each station in sequence. Each dynamic camera is used to capture you: 70 electronic images of the location of the station. The Xiao computer uses the motion image capture card to separately process the $ Gongnao discriminating task captured by each dynamic camera. When the electronic components of the workstation have defects, the job uses the nozzle discharge mechanism to blow and discharge the materials to remove the electronic components. No. If the computer judges that the electronic components of the Ren-Workstation meet the test, the turntable transports the electronic components to the next workstation for the next test. If it is tested at all workstations, the electronic component is judged to be a good product. [Embodiment] In order to make the above and other purposes, features, and advantages of this creation clearer, the following exemplifies the preferred embodiment of this creation and cooperates with the attached drawings', and the detailed description is as follows: 2nd 3rd As shown in Figure 4, the quality inspection of the electronic components of this creation consists of a vibrating feeder 1, a feeding turntable 2, several workstations = S6, several dynamic cameras CCD1 to "㈣, several computers to pc3" , ^ Dynamic image capture cards C1 to C6, several nozzle discharge mechanisms B1 to ⑽, one defective product recovery area F1 to F6, and one good product recovery area p. This creative factor workstation S1 to S6 method, each station judges Whether an electronic component 9 (such as a chip capacitor) has a defect in appearance or surface (as shown in Figures 丨 and 2 ^ No), and each electronic component 9 must pass through all workstations S1 to S6 and be inspected. Page 6 C: M0G0- 5 \ FIVE C0NTINENTS \ PK963J. Ptd M273713 IV. Creation Instructions (3) ---- Passing the test 'can be regarded as a good product. $ In order to achieve high-speed detection, this creation further uses computers with dual CPUs PC1 to PC3 and One software with multiple execution sequence functions b for fast calculation And high-speed inspection to screen out the defective products, so as to achieve accurate detection and high detection efficiency. Referring to Figures 3 and 4, the vibration feeder J of this creation can use the centrifugal force to rotate the electronic components 9 to a feed. Road 丨 丨, and then the gate at the feed channel 11 is automatically controlled to introduce the electronic component 9 into the loading carousel 2 at a fixed amount of time. The appropriate orientation of the loading carousel 2 is provided with six workstations sj to S6, and each workstation S1. To S6 have 6 sets of the dynamic cameras ccD1 to CCD6 and 6 nozzle discharge mechanisms ^ to ". The dynamic camera "^ to CCD6 can perform independent acquisition at random triggered acquisition timings, and transmit the image to six of the dynamic image acquisition cards ci to c 6. See Qingdi 4 as shown in Figure 4 'in order to achieve high speed Detection function, this creation uses several computers PC1 to PC3. The computers PC1 to PC3 are preferably computers with dual CPUs. At the same time, the computers pci to PC3 must be installed with software with multi-execution; ^ (Multithrend) functions in order to perform Fast calculation and processing. For this creation, three computers PCI, PC2, and PC3 are preferred. [1], the computer PC 1 is dedicated to the human-machine operating system, which is connected to a control machine 丨 〇 and the computer PC2 Between PC3 and PC3, the computer PC1 is used to interactively control the control machine 10 and the detection system, and display the detection status on a screen M1; [2], the computer PC2 is equipped with three of the dynamic image capture cards C1 to C3, which is dedicated to the detection function of the first, second, and third workstations S1 to S3, and displays the detection status on a screen M2; [3], the computer PC3 is also equipped with three of the dynamic image capture cards C4 to C6, It is dedicated to the fourth, fifth and sixth workstations S4 Detection of S6

M273713 四、創作說明(4) ------ 功此’且亦將檢測狀態顯示於該榮幕心。該電腦及… 將檢測結果分別傳送至該電腦ΡΠ,再由該電腦PC1控制一 控制機台1 〇進行排祖包从 . ^ 丁徘枓動作。若任一工作站S1至S6判別後確 涊具有任二瑕疵,則該喷嘴排料機構β1至㈣將立即吹氣排 ,,,由該不良品回收區η至?6回收該電子元件9之不良 口口。右该電子το件9通過所有工作站31至%的各種瑕疵檢 測檢驗合格後,則視為良品,並由該良品回收區p回收該 電子7L件9之良品。各工作站S1至56之檢測機構將於下文 進一步詳細說明。 請參照第5圖所示,本創作之第一工作站81使用一背光 呈像光學模組3,其包含一擴散板31及數個!^]) 32。該置 料轉盤2係由透光玻璃製成,並用以承載電子元件9。該 LED 32用以打光,使該擴散板31能提供動態取像高速攝影 所需的亮度。該擴散板31與置料轉盤2間隔一適當距離。 若該距離太近時,該電子元件9之邊緣取像將失真。若讀 距離太遠時,則導致光亮度不足。在該背光呈像光學模組 3提供背光光源後,由該動態攝像機CCD1擷取影像。在分 析時,該電腦PC2先二值化影像邊緣點追蹤,在所追蹤到 的點作進一步尋找次像數位置座標,最後將邊緣所得之次 像數位置帶入計算各項規範的邊與邊距離,並找出最大距 離。藉此,檢測電子元件9之電極寬度、電容全長、素體 寬度與外型缺陷等〔如第1圖所示〕。 如第3圖所示,若該第一工作站S 1判別後確認具有上述 特定瑕疵時,則該喷嘴排料機構B1將立即吹氣排料,並由M273713 IV. Creation Instructions (4) ------ Achieve this ’and also display the detection status in the heart of the glory. The computer and ... transmit the detection results to the computer PΠ, respectively, and then the computer PC1 controls a control machine 10 to perform the ancestor package removal operation. If any of the workstations S1 to S6 determines that they have any two defects, the nozzle discharge mechanism β1 to ㈣ will immediately blow out the air from the defective product recovery area η to? 6 Recover the bad mouth of the electronic component 9. Right after the electronic το component 9 passes all kinds of flaw detection inspections of 31 to%, it is regarded as a good product, and the good product of the electronic 7L component 9 is recovered from the good product recovery area p. The detection mechanisms of the workstations S1 to 56 will be described in further detail below. Please refer to FIG. 5, the first work station 81 of this creation uses a backlight rendering optical module 3, which includes a diffusion plate 31 and several! ^]) 32. The material turntable 2 is made of transparent glass and is used to carry electronic components 9. The LED 32 is used to illuminate, so that the diffuser plate 31 can provide the brightness required for high-speed photography of dynamic imaging. The diffusion plate 31 is spaced from the loading turntable 2 by an appropriate distance. If the distance is too close, the edge image of the electronic component 9 will be distorted. If the reading distance is too long, the brightness will be insufficient. After the backlight imaging optical module 3 provides a backlight light source, an image is captured by the dynamic camera CCD1. During analysis, the computer PC2 first binarizes the edge points of the image, further searches for the sub-image position coordinates at the tracked points, and finally brings the sub-image position obtained by the edge into the edges and edges of the calculation specifications. Distance and find the maximum distance. Thereby, the electrode width of the electronic component 9, the total length of the capacitor, the width of the element body, and appearance defects are detected [as shown in Fig. 1]. As shown in FIG. 3, if the first workstation S1 determines that it has the above-mentioned specific defect, the nozzle discharge mechanism B1 will immediately blow and discharge, and

M273713 四、創作說明(5) 該不良品回收區F1回收該電子元件9之不良品。若該電子 元件9通過該第一工作站s 1的特定瑕疵檢測檢驗合格後, 則視為良品,並由該置料轉盤2送至該第二工作站S 2進行 後續檢測。 請參照第6圖所示,本創作之第二工作站S2亦使用一背 光呈像光學模組4,其同樣包含一擴散板41及數個LED 42。該LED 42用以打光,並由該動態攝像機CCD2擷取影 像’以檢測素體高度、電極高度與外型缺陷〔如第1圖所 示〕。為了精確計算電子元件9之高度尺寸,該背光呈像 光學模組4同樣設置在該置料轉盤2中央之小圓空間内,如 此不致妨礙該置料轉盤2的旋轉,且能提供足夠空間的背 光面,以精確量測電子元件9在侧邊厚度的相關尺寸。 如第3圖所示,若該第二工作站s 2判別後確認具有上述 特定瑕疯時,則該喷嘴排料機構B2將立即吹氣排料,並由 遠不良品回收區F2回收該電子元件9之不良品。若該電子 元件9通過該第二工作站S 2的特定瑕蘇檢測檢驗合格後, 則視為良品,並由該置料轉盤2送至該第三工作站§ 3進行 後續檢測。 請參照第7圖所示’本創作之第三工作站33係採用一反 射光學模組5 ’該反射光學模組5包含數個反射鏡51及數個 LED 52。該LED 52低角度的由上下侧打光於電子元件9 上’影像透過該反射鏡51將上下面所呈的像整合在一起反 射後’則由该動悲攝像機CCD3掏取影像,以檢測電子元件 9之表面紋理差異性’如正面刮痕、異物附著、污點〔如M273713 4. Creation instructions (5) The defective product recovery area F1 collects defective products of the electronic component 9. If the electronic component 9 passes the specific flaw detection inspection of the first work station s1, it is regarded as a good product, and is sent from the loading carousel 2 to the second work station S2 for subsequent inspection. Please refer to FIG. 6, the second workstation S2 of this creation also uses a backlight imaging optical module 4, which also includes a diffusion plate 41 and a plurality of LEDs 42. The LED 42 is used for lighting, and an image is captured by the dynamic camera CCD2 to detect the height of the element body, the height of the electrode, and appearance defects [as shown in Fig. 1]. In order to accurately calculate the height dimension of the electronic component 9, the backlight is arranged in the small circular space in the center of the loading turntable 2 like the optical module 4, so as not to hinder the rotation of the loading turntable 2 and provide sufficient space. Backlight surface to accurately measure the relative dimensions of the thickness of the electronic component 9 on the side. As shown in FIG. 3, if the second workstation s 2 determines that it has the specific defect described above, the nozzle discharge mechanism B2 will immediately blow and discharge, and recover the electronic component from the remote defective product recovery area F2. 9 defective products. If the electronic component 9 passes the specific flaw detection test of the second work station S 2, it is regarded as a good product, and is sent from the loading turntable 2 to the third work station § 3 for subsequent detection. Please refer to FIG. 7. The third work station 33 of this creation uses a reflective optical module 5. The reflective optical module 5 includes a plurality of reflectors 51 and a plurality of LEDs 52. The low-angle LED 52 is illuminated by the upper and lower sides on the electronic component 9 'After the image is reflected through the mirror 51 and the upper and lower images are integrated and reflected', the moving camera CCD3 extracts the image to detect the electrons The surface texture of element 9 is different, such as front scratches, foreign matter adhesion, stains (such as

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M273713 四、創作說明(6) 第2圖所示〕。上述影像整合之優點在於可強化外型 (Morphology)影像處理、提高解析度、降低系統使用動態 攝影機CCD3與影像取像卡C3的數量,且降低整體系統整合 的複雜度。 ^第3圖所示,若該第三工作站S3判別後確認具有上述 特定瑕疵時,則該喷嘴排料機構B3將立即吹氣棑料,並由 該不良品回收區F3回收該電子元件9之不良品。若該電子 το件9通過該第三工作站S3的特定瑕疵檢測檢驗合格後, 則視為良品’並由該置料轉盤2送至該第四工作站S4進行 後績檢測。 请參照第8及9圖所示,本創作之第四工作站S4採用一反 射光學模組6 ’該反射光學模組6包含數個反射鏡6 1及數個 無影光源62,該無影光源62係在一罩體621之一端設置一 開口 622 ’在該開口 622之内周面設置數個LED 623及一反 射折射鏡624,該罩體621内部另設一弧面反射鏡625。藉 此i該無影光源62產生適當光源,投射至該電子元件9, 再將影像經由該開口 6 2 2上傳及經由該反射鏡61送至該動 態攝像機CCD4擷取影像,以檢測電子元件9之正面、電極 變色、素體變色、素體長度、電極長度、電極有無及電極 外形〔如第2圖所示〕。藉由該無影光源62之特殊結構光 源’可將針對電極外型與素體長度予以標準化,減少模糊 性’進而穩定檢測。 如第3圖所示,若該第四工作站s 4判別後確認具有上述 特定瑕龜時,則該喷嘴排料機構B4將立即吹氣排料,並由M273713 IV. Creation Instructions (6) (shown in Figure 2). The advantages of the above image integration are that it can enhance Morphology image processing, improve resolution, reduce the number of dynamic camera CCD3 and image acquisition card C3 used by the system, and reduce the complexity of the overall system integration. ^ As shown in FIG. 3, if the third workstation S3 determines that it has the above-mentioned specific defects, the nozzle discharge mechanism B3 will immediately blow air and collect the electronic component 9 from the defective product recovery area F3. Defective. If the electronic component 9 passes the specific flaw detection inspection of the third work station S3, it is regarded as a good product 'and sent from the loading turntable 2 to the fourth work station S4 for post-performance inspection. Please refer to FIG. 8 and FIG. 9. The fourth workstation S4 of this creation uses a reflective optical module 6 ′. The reflective optical module 6 includes a plurality of mirrors 61 and a plurality of shadowless light sources 62. 62 is provided with an opening 622 at one end of a cover body 621. A plurality of LEDs 623 and a reflective refractive mirror 624 are provided on the inner peripheral surface of the opening 622, and an arc-shaped reflector 625 is provided inside the cover 621. With this, the shadowless light source 62 generates an appropriate light source, projects it to the electronic component 9, and uploads the image through the opening 6 2 2 and sends it to the dynamic camera CCD4 through the mirror 61 to capture the image to detect the electronic component 9 Front, electrode discoloration, element body discoloration, element body length, electrode length, presence or absence of electrode, and electrode shape [as shown in Figure 2]. With the special structured light source 'of the shadowless light source 62, the electrode shape and the length of the element body can be standardized to reduce the ambiguity' and the detection can be stabilized. As shown in FIG. 3, if the fourth workstation s 4 determines that it has the above-mentioned specific defect, the nozzle discharge mechanism B4 will immediately blow and discharge,

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該不良品回收_回收該電子^件9之不良&。若該電子 元件9通過省第四工作站S4的特定瑕疵檢測檢驗合袼 則視為良品,並由該置料轉盤2送至該第五工 ° 後續檢測。 Μ進打 清參照第1 0圖所示,本創作之第五工作站S5亦採用一反 射光學杈組7,該反射光學模組7設有數個斜面鏡71及一無 影光源72。該斜面鏡71設置在該電子元件9之二側,其設、 置角度為47。。該無影光源72之構造相同於該第四工作站 S4之無影光源62。在此架設下,該電子元件9之二側面貼 在該置1轉盤2的死角面可經由47度之斜面鏡71適當呈、 見同日寸利用上方之無影光源7 2來補光,以便該動態攝影 機CCD5擷取影像,以檢測電子元件9之側面的電極變色、 素體變色、電極外形〔如第2圖所示〕。 ^第3圖所示,若該第五工作站S5判別後確認具有上述 特定瑕疵時,則該喷嘴排料機構B5將立即吹氣排料,政」由 該不良品回收區F5回收該電子元件9之不良品。若該電子 元件9通過為第五工作站s 5的特定瑕疯檢測檢驗合格後, 則視為良品,並由該置料轉盤2送至該第六工作站S6進行 後續檢測。 請參照第11圖所示,本創作之第六工作站36採用一反射 光學模組8,該反射光學模組8設有數個斜面鏡81及數個 LED 82。該LED 82係設置於該置料轉盤9下,以提供低角 度光源突顯電子元件9之侧刮痕、異物、附著污點〔如第2 圖所示〕,以便由該動態攝像機CCD6擷取影像,以利強化The defective product recovery_recover the defective & of the electronic part 9. If the electronic component 9 passes the specific defect detection inspection of the fourth workstation S4 in the province, it is regarded as a good product, and is sent by the loading turntable 2 to the fifth worker for subsequent inspection. As shown in FIG. 10, the M work-in-process shows that the fifth work station S5 of this creation also employs a reflective optical branch group 7. The reflective optical module 7 is provided with a plurality of beveled mirrors 71 and a shadowless light source 72. The beveled mirror 71 is disposed on two sides of the electronic component 9, and its setting and setting angle is 47. . The structure of the shadowless light source 72 is the same as the shadowless light source 62 of the fourth workstation S4. Under this erection, the dead side of the two side of the electronic component 9 attached to the turntable 2 can be appropriately presented through a 47-degree beveled mirror 71. See the same day, use the shadowless light source 7 2 above to fill the light, so that The dynamic camera CCD5 captures images to detect electrode discoloration, element body discoloration, and electrode shape on the side of the electronic component 9 [as shown in FIG. 2]. ^ As shown in FIG. 3, if the fifth workstation S5 determines that the above-mentioned specific defect is identified, the nozzle discharge mechanism B5 will immediately blow and discharge, and the electronic component 9 will be recovered by the defective product recovery area F5. Bad product. If the electronic component 9 passes the specific flaw detection test for the fifth work station s5, it is regarded as a good product, and is sent from the loading carousel 2 to the sixth work station S6 for subsequent detection. Please refer to FIG. 11, the sixth workstation 36 of this creation uses a reflective optical module 8. The reflective optical module 8 is provided with a plurality of bevel mirrors 81 and a plurality of LEDs 82. The LED 82 is arranged under the loading turntable 9 to provide a low-angle light source to highlight the side scratches, foreign objects, and stains on the electronic component 9 (as shown in FIG. 2), so as to capture images by the dynamic camera CCD6. To strengthen

C:\L0G0-5\FIVE C0NTINENTS\PK9631.ptd 第11頁 M273713 四、創作說明(8) 外型〔Morpho 1 ogy〕影像,進而穩定檢測。 如第3圖所示,若該第六工作站S 6判別後確認具有上述 特定瑕疵時,則該喷嘴排料機構B6將立即吹氣排料,並由 該不良品回收區F6回收該電子元件9之不良品。若該電子 凡件9通過該第六工作站S6的特定瑕疵檢測檢驗合格後, 則視為良品,並由該良品回收區p回收。 雖然本創作已利用上述較佳實施例揭示,然其並非用以 限^本創作,任何熟習此技藝者,在不脫離本創作之精 t範圍之内,當可作各種更動與修改,因此本創作之^ 犯圍當視後附之申請專利範圍所界定者為準。 ” uC: \ L0G0-5 \ FIVE C0NTINENTS \ PK9631.ptd Page 11 M273713 IV. Creative Instructions (8) The shape [Morpho 1 ogy] image, and then the detection is stable. As shown in FIG. 3, if the sixth workstation S 6 determines that it has the above-mentioned specific defects, the nozzle discharge mechanism B6 will immediately blow and discharge, and the electronic component 9 will be recovered by the defective product recovery area F6. Bad product. If the electronic component 9 passes the specific flaw detection inspection of the sixth workstation S6, it is regarded as a good product and recovered by the good product recovery area p. Although this creation has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the creation of this work. Any person skilled in this art can make various changes and modifications without departing from the scope of this work. The creation of the crime is subject to the scope of the attached patent application. "U

M273713 圖式簡單說明 【圖式簡單說明】 第1圖:習用電子元件〔晶片電容〕之外觀尺寸之正面 示意圖。 第2圖:習用電子元件〔晶片電容〕之表面瑕疵之側面 示意圖。 第3圖:本創作電子元件之品質檢測裝置之機構與檢測 系統架構之示意圖。 第4 圖 本 創 作 之 檢 測 與 控 制 系 統 架 構 之 示意圖。 第5 圖 本 創 作 之 第 一 站 檢 測 區 之 示 意 圖 〇 第6 圖 本 創 作 之 第 二 站 檢 測 區 之 示 意 圖 〇 第7 圖 本 創 作 之 第 三 站 檢 測 區 之 示 意 圖 〇 第8 圖 本 創 作 之 第 四 站 檢 測 區 之 示 意 圖 〇 第9 圖 本 創 作 之 無 陰 影 光 源 結 構 之 示 意 圖0 第1 0圖:本創作之第五站檢測區之示意圖。 第11圖:本創作之第六站檢測區之示意圖。 【主要元件符號說明】 1 振動供料機 10 控制機台 11 送料道 2 置料轉盤 3 背光呈像光學模組 31 擴散板 32 LED 4 背光呈像光學模組 41 擴散板 42 * LED 5 反射光學模組 51 反射鏡 52 LED 6 反射光學模組M273713 Schematic description [Schematic description] Figure 1: Front view of the external dimensions of conventional electronic components [chip capacitors]. Fig. 2: A schematic diagram of a side surface defect of a conventional electronic component [chip capacitor]. Fig. 3: Schematic diagram of the mechanism and detection system architecture of the quality inspection device for the creation of electronic components. Figure 4 Schematic diagram of the detection and control system architecture of this creation. Fig. 5 Schematic diagram of the first station detection area of the creation of this picture. 6 Fig. 6 Diagram of the second station detection area of the creation. Schematic diagram of the third station of the creation area. Schematic diagram of the station detection area. Figure 9 Schematic diagram of the shadowless light source structure of this creation. 0 Figure 10: Schematic diagram of the fifth station detection area of this creation. Figure 11: Schematic diagram of the sixth station detection area of this creation. [Description of Symbols of Main Components] 1 Vibration feeder 10 Control machine 11 Feeding channel 2 Feeding turntable 3 Backlight imaging optical module 31 Diffusion plate 32 LED 4 Backlight imaging optical module 41 Diffusion plate 42 * LED 5 Reflective optics Module 51 Mirror 52 LED 6 Reflective Optical Module

C:\L0G0-5\FIVE CONTINENTS\PK9631. ptd 第13頁 M273713 圖式簡單說明 61 反射鏡 62 無影光源 621 罩體 622 開口 623 LED 624 反射折射鏡 625 弧面反射鏡 7 反射光學模組 71 斜面鏡 72 無影光源 8 反射光學模組 81 斜面鏡 82 LED 9 電子元件 D1 全長 D2 電極長度 D3 電極寬度 D4 素體長度 D5 素體寬度 B1至B6喷嘴排料機構 CCD1至CCD6 動態攝像機 F1至F6 不良品回收區C: \ L0G0-5 \ FIVE CONTINENTS \ PK9631. Ptd Page 13 M273713 Brief description of the diagram 61 Reflector 62 Shadowless light source 621 Housing 622 Opening 623 LED 624 Reflective refraction mirror 625 Arc reflector 7 Reflective optical module 71 Beveled mirror 72 Shadowless light source 8 Reflective optical module 81 Beveled mirror 82 LED 9 Electronic components D1 Full length D2 Electrode length D3 Electrode width D4 Element length D5 Element width B1 to B6 Nozzle discharge mechanism CCD1 to CCD6 Dynamic cameras F1 to F6 Defective Product Recycling Area

Ml、M2 螢幕 P 良品回收區 PCI、PC2、PC3 電腦 S1至S6 工作站Ml, M2 screen P Good product recycling area PCI, PC2, PC3 Computer S1 to S6 Workstation

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Claims (1)

M273713 五、申請專利範圍 1、 一種電子元件之品質檢測裝置,其包含: 一置料轉盤’其用以運送一電子元件; 數個工作站’其分別設有一動態攝影機,各動態攝影 機分別用以擷取各工作站位置之電子元件的影像,以 供分站檢測電子元件之各種瑕;庇; 數台電腦,其分別設有數個動態影像擷取卡,經由各 動悲景彡像類取卡分別處理各動態攝影機所擷取到的各 站之電子元件影像;及 數個喷嘴排料機構,若該電腦判別任一工作站之電子 元件具有瑕疵時,該工作站即利用該喷嘴排料機構 氣排料,以去除電子元件之不良品;若該電腦判別 一工作站之電子元件符合檢測時,該置料轉盤將電 元件運送至下一工作站進行下一檢測;若完成所千 作站之檢測,該電子元件則判別為良品。 工 2、 依申請專利範圍第!項所述之電子元件之品質檢虛 置,其中該工作站之一採用一背光呈像光學模組,'又 包含一擴散板及數個led,以供檢測電子元件'之、,其 寬度、電容全長、素體寬度與外型缺陷。 極 3、 依申請專利範圍第丨項所述之電子元件之品質檢 置,其中該工作站之一採用一背光呈像光學模組,、^ ,含一擴散板及數個LED ,以供檢測電子元件之 ,、 高度、電極高度與外型缺陷。 、體 4、 依申請專利範圍第i項所述之電子元件之品質 置,其中該工作站之一採用一反射光學模組,其M273713 V. Application for Patent Scope 1. A quality inspection device for electronic components, which includes: a loading carousel 'which is used to transport an electronic component; several workstations' which are respectively provided with a dynamic camera, and each dynamic camera is used for capturing Take the images of the electronic components at the workstations for sub-stations to detect various defects of the electronic components; shelter; several computers, each of which is equipped with several dynamic image capture cards, which are processed separately by each dynamic sorrowful image capture card The electronic component images of each station captured by each dynamic camera; and several nozzle discharge mechanisms. If the computer judges that the electronic components of any workstation have defects, the workstation uses the nozzle discharge mechanism to discharge gas. To remove the defective parts of the electronic components; if the computer determines that the electronic components of a workstation meet the test, the loading turntable transports the electrical components to the next workstation for the next test; if the testing of all the thousand stations is completed, the electronic component It is judged as good. Work 2. According to the scope of patent application! The quality inspection of the electronic components described in the above item is false, in which one of the workstations uses a backlight imaging optical module, which also includes a diffusion plate and several LEDs for detecting electronic components, its width, capacitance Full length, body width and appearance defects. Pole 3. The quality inspection of the electronic components according to item 丨 of the patent application scope. One of the workstations uses a backlight imaging optical module, ^, including a diffuser and several LEDs for testing electronics. Components, height, electrode height and appearance defects. Body 4. According to the quality of electronic components described in item i of the scope of patent application, one of the workstations uses a reflective optical module. M273713 申請專利範圍 數個反 理差異 5、 依申請 置,其 光學模 電子元 電極長 6、 依申請 置,其 數個斜 的電極 7、 依申請 裝置, ,在該 該罩體 8、 依申請 置,其 數個斜 、異物 9、 依申請 置,其 10、依申請 置,其 便進行 射鏡及 性、正 專利範 中該工 組包含 件之正 度、電 專利範 中該工 面鏡及 變色、 專利範 其中該 開口之 内部設 專利範 中該工 面鏡及 、附著 專利範 中該電 專利範 中該電 快速計 數個LED 面到痕、 圍第1項 作站之一 數個反射 面、電極 極有無、 圍第1項 作站之一 一無影光 素體變色 圍第5或6 無影光源 内周面設 有一孤面 圍第1項 作站之一 數個LED, 污點。 圍第1項 腦係屬於 圍第1項 腦安裝具 算處理。 ,以供檢測電子元件之表面紋 異物附著、污點。 所述之電子元件之品質檢測裝 採用一反射光學模組,該反射 1¾及數個纟影《源、,以供檢測 變色、素體變色、素體長度、 電極外形。 所述之電子元件之品質檢測裴 採用一反射光學模組,其設有 源’以供檢測電子元件之側面 、電極外形。 項所述之電子元件之品質檢測 係在一罩體之一端設置一開口 置數個LED及一反射折射鏡, 反射鏡。 所述之電子元件之品質檢測裝 採用一反射光學模組,其設有 以供檢測電子元件之侧刮痕 所述之電子元件之品質檢測裝 具雙CPU之電腦。 所述之電子元件之品質檢測骏 備多執行序功能之一軟體,以M273713 patent application scope several counter-intuitive differences 5, according to the application, its optical mode electronic element electrode length 6, according to the application, its oblique electrodes 7, according to the application device, in the cover 8, according to the application Several oblique, foreign objects 9, according to the application, 10, according to the application, and then the lens and the sex, the positive degree of the working group included in the patent, the electric mirror and the mirror and Discoloration, patent, where the inside of the opening is provided with the face mirror in the patent, and the electric patent in the attached patent, the electricity quickly counts the LED surface to the mark, several reflective surfaces around one of the first station, With or without electrodes, one of the stations in item 1 is a shadowless photochromic body. The inner peripheral surface of the shadowless light source is provided with a number of LEDs and stains in one of the stations in item 1 of the shadowless light source. The 1st item of the brain system belongs to the 1st item of the brain installation calculation. For detecting foreign matter adhesion and stain on the surface of electronic components. The quality detection device of the electronic component adopts a reflective optical module, and the reflection 1¾ and a plurality of shadow sources are provided for detecting discoloration, element body discoloration, element body length, and electrode shape. The quality detection of the electronic components described above uses a reflective optical module, which is provided with a source 'for detecting the sides of the electronic components and the shape of the electrodes. The quality detection of the electronic component described in the item is to set an opening at one end of a cover, and place a plurality of LEDs, a reflective mirror, and a reflective mirror. The quality detection device of the electronic component adopts a reflective optical module, which is provided with a side CPU for detecting scratches of the electronic component. The quality detection device of the electronic component is equipped with a dual CPU computer. The above-mentioned electronic component quality testing software is one of multiple execution sequence functions. M273713 五、申請專利範圍 11、依申請專利範圍第1項所述之電子元件之品質檢測裝 置,其中至少一台該電腦專用於人機操作系統,其係 連接於一控制機台及其餘該電腦之間;及其餘該電腦 則各自搭配數個該動態影像擷取卡,以分別專用於各 工作站之各種檢測功能。 1 2、依申請專利範圍第1項所述之電子元件之品質檢測裝 置,其中該電子元件係為晶片電容。M273713 V. Patent application scope 11. The quality inspection device for electronic components according to item 1 of the patent application scope. At least one of the computers is dedicated to a man-machine operating system, which is connected to a control machine and the rest of the computer. Between; and the rest of the computer are each equipped with a plurality of the dynamic image capture cards to be dedicated to various detection functions of each workstation. 1 2. The quality inspection device for electronic components according to item 1 of the scope of patent application, wherein the electronic components are chip capacitors. C:\L0G0-5\FIVE CONTINENTS\PK9631.ptd 第17頁C: \ L0G0-5 \ FIVE CONTINENTS \ PK9631.ptd Page 17
TW93218795U 2004-11-23 2004-11-23 Quality inspection device of electronic component TWM273713U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI702384B (en) * 2019-07-04 2020-08-21 和碩聯合科技股份有限公司 Optical derection device
TWI726672B (en) * 2020-04-06 2021-05-01 台灣電容器製造廠股份有限公司 Capacitor appearance detection device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI702384B (en) * 2019-07-04 2020-08-21 和碩聯合科技股份有限公司 Optical derection device
TWI726672B (en) * 2020-04-06 2021-05-01 台灣電容器製造廠股份有限公司 Capacitor appearance detection device and method

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