CN102384908A - Device and method for checking internal defects of base plate - Google Patents

Device and method for checking internal defects of base plate Download PDF

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Publication number
CN102384908A
CN102384908A CN2010102689059A CN201010268905A CN102384908A CN 102384908 A CN102384908 A CN 102384908A CN 2010102689059 A CN2010102689059 A CN 2010102689059A CN 201010268905 A CN201010268905 A CN 201010268905A CN 102384908 A CN102384908 A CN 102384908A
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China
Prior art keywords
substrate
light
inherent vice
image
testing fixture
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CN2010102689059A
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Chinese (zh)
Inventor
周妍君
陈正锴
张仁明
李俞玺
林哲民
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Delta Electronics Inc
Delta Optoelectronics Inc
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Delta Optoelectronics Inc
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Priority to CN2010102689059A priority Critical patent/CN102384908A/en
Publication of CN102384908A publication Critical patent/CN102384908A/en
Pending legal-status Critical Current

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Abstract

The invention provides a device and a method for checking internal defects of a base plate. The device comprises at least one light source, an image pickup module and a light shading cover, wherein the light source is arranged at one side surface of the base plate, the light source emits a light ray capable of penetrating through the base plate towards the side surface, and an incident angle of the light ray relative to the side surface is limited to a first preset angle meeting the requirement that the light ray can be approximately transmitted in a full reflection mode in the base plate, the image pickup module is arranged above the base plate and is used for picking up images of the upper surface of the base plate, the light shading cover is arranged between the image pickup module and the base plate and is used for shading the edge of at least one side of the upper surface of the base plate. Therefore, when the internal defects are caused during the light ray transmission in the base plate, bright points can be formed at the defect parts, and the image pickup module can detect the positions of the defects. The invention also provides the method for checking internal defects of the base plate, and better image definition of the internal defects can be really improved.

Description

Substrate inherent vice testing fixture and method
Technical field
The present invention relates to a kind of substrate inherent vice testing fixture and method.
Background technology
In semiconductor technology, mainly be substrate to be carried out technology such as thin film deposition so that on substrate, form some electronic components, so the foreign matter of substrate itself, bubble, or what of inherent vice such as crackle often to influence the quality of electronic component fine or not.In addition, owing to substrate often need be carried, or, make that all substrate is easy to generate crackle through technologies such as high-temperature heat treatment or acid etchings.
Therefore, carrying out the inherent vice inspection to substrate is an indispensable nondestructive inspection project.Present modal crack detection mode be utilize one can send the light that penetrates substrate lighting source; By the substrate below this base lower surface is shone; And above substrate, utilize video camera to obtain the image of this upper surface of base plate; Because inherent vice can make light reflection, refraction or scattering, cause the light penetration rate of fault location to reduce, so the image lightness of inherent vice is compared obviously lower with other zone; Can be convenient to follow-uply carry out image analysing computer, with position and the size of recognizing inherent vice with manual work or computer installation.
Because the whether clear inspection effect and the follow-up analysis difficulty of concerning of inherent vice image, image therefore how correctly and clearly to obtain inherent vice is to press for one of problem of solution in the inspection flow process always.Yet above-mentioned inherent vice test mode has following shortcoming.At first, as shown in Figure 1, be a synoptic diagram of above-mentioned inherent vice test mode.Because not only inherent vice such as foreign matter or crackle 12 can influence the light penetration rate; Regular meeting is attached to the pollutant 11 at substrate 10 fronts or the back side or the superficial makings of substrate 10 also can influence the light penetration rate in technology; Therefore when 30 picked image of interpretation video camera; And can't effectively the dim spot in the image be divided into inherent vice 12 or surface contaminant 11, so that regular meeting has the situation generation of surface contaminant 11 erroneous judgements for inherent vice 12.
And, shown in Fig. 2 A, Fig. 2 B, because light runs into meeting diffraction when stopping; Make the small inherent vice 12 in the image when the light luminance that provides is bright slightly, to disappear; That is the image width of inherent vice 12 can be inversely proportional to light luminance, therefore, when substrate 10 thickness thick slightly and need to improve light intensity when strengthening the lightness of image; After light intensity is promoted to a certain strength; The lifting again of light intensity can make that on the contrary the diffraction light intensity is strong excessively, causes the image definition of inherent vice 12 to descend, so that need the more expensive high-resolution camera of collocation could know shooting.And this situation often causes being difficult to determine a best light intensity and obtains best image running into substrate 10 thickness deviations own when big.In addition, shown in Fig. 3 A, Fig. 3 B, microscopic defect 12 is not under the situation for directional light at light, and the crackle width can reduce, that is can't strengthen the image definition of fine slight crack through multi-direction light.The photo of Figure 14 is the crackle image photo that the existing defect inspection mode of utilization is obtained.
Summary of the invention
In view of this, the present invention provides a kind of substrate means of illumination of particular design, solves an above-mentioned puzzlement industry difficult problem for a long time.The present invention utilizes light to transmit with the mode of total reflection in substrate inside; But the inherent vice of this substrate of direct illumination; And can strengthen the image definition of inherent vices such as the inner slight crack of substrate, hole, impurity, bubble, offset, can avoid effectively also that the surface is dirty waits the foreign matter imaging.Except that providing better inherent vice to detect the ability, also can solve substrate after surface working, the difficult problem that promptly can't detect substrate inside.
Therefore, a purpose of the present invention is to provide a kind of substrate inherent vice inspection method, and it can obtain the preferable image definition of substrate inherent vice.
For achieving the above object; Substrate inherent vice inspection method provided by the invention; In order to a substrate is carried out the inherent vice inspection, this substrate has a upper surface, and a plurality of sides that connect this upper surface; This substrate inherent vice inspection method provides a plurality of light sources; Be located at the place, respectively this side of this substrate respectively, respectively this light source can penetrate the light of this substrate towards this side-emitted one correspondence respectively, and make this light relatively the incident angle of this side be limited in one this light can be shown greatly in this substrate in first predetermined angular that the total reflection mode transmits; And an image extraction module is provided; Be located at the top of this substrate, and capture the image of the upper surface of this substrate, whereby; Make the side-emitted light of these a plurality of light sources in turn towards correspondence; And at arbitrary light source during,, and will these a plurality of half area images synthesize the complete image of this upper surface with half area image of the corresponding acquisition of this image extraction module near this upper surface of another opposite side towards the side-emitted light of correspondence.
In addition, another object of the present invention is to provide a kind of substrate inherent vice testing fixture, and it can obtain the preferable image definition of substrate inherent vice.
Substrate inherent vice testing fixture provided by the invention; In order to a substrate is carried out the inherent vice inspection, this substrate has a upper surface, and a plurality of sides that connect this upper surface; This substrate inherent vice testing fixture comprises at least one light source, an image extraction module, and a light shield.Light source is located at the place, a wherein side of this substrate; This light source can corresponding penetrate the light of this substrate towards this side-emitted one, and this light incident angle of this side relatively is limited in one this light can be shown greatly in this substrate in first predetermined angular that the total reflection mode transmits.Image extraction module is located at the top of this substrate, in order to the image of the upper surface that captures this substrate.Light shield is arranged between this image extraction module and this substrate, in order to the edge of at least one side of the upper surface that covers this substrate.
In addition; The present invention also provides another kind of substrate inherent vice testing fixture; In order to a substrate is carried out the inherent vice inspection, this substrate has a upper surface, and a plurality of sides that connect this upper surface; This substrate inherent vice testing fixture comprises at least one light source, a shading column, an image extraction module, and a transmission module.Light source is located at the place, a wherein side of this substrate; This light source can corresponding penetrate the light of this substrate towards this side-emitted one, and this light incident angle of this side relatively is limited in one this light can be shown greatly in this substrate in first predetermined angular that the total reflection mode transmits.Shading column is arranged between this light source and this substrate, forms a strip region in order to the upper surface at this substrate.Image extraction module is located at the top of this substrate, in order to capture the image of this strip region.Transmission module moves relative to this light shield in order to drive this substrate, and this strip region is moved at the upper surface of this substrate, so that the complete image of the upper surface of this this substrate of image extraction module fechtable.
The present invention is by getting in the substrate light, and in substrate, transmits with the total reflection mode, and light can't be reflected outside the substrate.When if light meets with inherent vice when in substrate, conducting; The light course is changed; And the change that produces opticpaths such as reflection, refraction or scattering, and can form bright spot in here, detect the position of this defective with image extraction module by the substrate top.This kind method can improve the preferable image definition of inherent vice really, and improves the recall rate of inherent vice.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is a synoptic diagram of existing substrate inherent vice testing fixture;
Fig. 2 A, Fig. 2 B carry out the synoptic diagram that substrate detects for existing substrate inherent vice testing fixture;
Fig. 3 A, Fig. 3 B carry out another synoptic diagram that substrate detects for existing substrate inherent vice testing fixture;
Fig. 4 is a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Fig. 5 is a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Fig. 6 A, Fig. 6 B are a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Fig. 7 is a curve map of relative signal of video signal width of light intensity and contrast;
Fig. 8 is a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Fig. 9 is a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Figure 10 A, Figure 10 B, Figure 10 C, Figure 10 D are each step synoptic diagram of substrate inherent vice inspection method of the present invention;
Figure 11 is a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Figure 12 is a synoptic diagram of substrate inherent vice testing fixture of the present invention;
Figure 13 is the opposite side synoptic diagram of the substrate inherent vice testing fixture of Figure 12;
The crackle image photo that Figure 14 is obtained for existing defect inspection mode;
Figure 15 is the crackle photo that the present invention obtained;
Figure 16 is the crackle photo of overexposure situation;
Figure 17 is provided with the crackle photo that captures behind the light shield;
Figure 18 is the crackle photo of another embodiment of the present invention acquisition;
Wherein, Reference numeral
Substrate 40 upper surfaces 41
411 metal electrode portions 412 of antireflection portion
Lower surface 42 sides 43,43 ', 43 "
Normal 431 bodies 44
Crackle 45 foreign matters 46
Foreign matter 47 defectives 48
Defective 49 light sources 50
Light 51 image extraction modules 60
Half zone 413 light shields 80
Center section 85 shading columns 90
Strip region 95 first predetermined angulars 1
Second predetermined angular
Embodiment
Relevant technology contents of the present invention and detailed description cooperate graphic explanation following:
Consult Fig. 4, be the synoptic diagram of a preferred embodiment of the present invention.This substrate inherent vice testing fixture is that a substrate 40 is carried out the inherent vice inspection.This substrate inherent vice testing fixture mainly comprises a light source 50, and an image extraction module 60.
This light source 50 is located at 43 places, a wherein side of this substrate 40, and can corresponding penetrate the light 51 of this substrate 40 towards these side 43 emissions one.Preferably, these light source 50 issued light lines are directional light, and promptly the issued light line has consistent direct of travel, can improve the ratio of the light of injecting substrate 40.In the present embodiment, this substrate 40 is a silicon chip, so this light source 50 need be used the infrared light supply of penetrable silicon chip.In other application, the selection of this light source 50 is not then as limit, and for example, when being glass as if substrate 40,50 of its light sources need to cooperate the selection visible light source.During practical application, light source 50 can be halogen light source collocation fibre-optic catheter and condenser, or light emitting diode matrix or diode laser matrix collocation condenser, to reach preferable directional light effect.
Specifically, as shown in Figure 5, the substrate 40 in the present embodiment is an example with a solar cell (solar cell) substrate, during actual enforcement then not as limit.This substrate 40 has a body 44, a upper surface 41 and a lower surface 42, and a plurality of sides 43 that connect this upper surface 41 and lower surface 42.This upper surface 41 comprises a plurality of antireflection portions that are crisscross arranged 411 and metal electrode portion 412, and antireflection portion 411 is a printing opacity, and 412 in metal electrode portion is light tight, and 42 of this lower surfaces are a lighttight metallic conduction portion.This a plurality of sides this upper surface 41 of 43 approximate vertical and this lower surface 42.
What need pay special attention to is; For effective inherent vice and External Defect with substrate distinguishes; As shown in Figure 4; The present invention is limited in the incident angle of light 51 relative these sides 43 of this light source 50 in one first predetermined angle theta 1, transmits so that light 51 is injected the mode that can show total reflection behind the substrate 40 greatly.This first predetermined angle theta 1 is relevant with the refractive index of the wavelength of light 51, substrate 40, and its habitual optical knowledge capable of using calculates to be learnt.
In must the incident angle of light 51 being limited in above-mentioned first predetermined angle theta 1; Because the actual (real) thickness of substrate 40 is mostly less than 1mm; And substrate 40 may produce skew more or less on the stationkeeping of relative light source 50; Therefore, for the light that does not cause light source 50 to be sent can't project on the substrate 40, the diameter of the general light source that adopts 50 is almost all greater than the thickness of substrate 40.Therefore, regular meeting make part irradiate light to substrate 40 upper surface 41 and produce scattering, and then the image that disturbs image extraction module 60 to be obtained.In order to avoid the contrast of the image that this stray light effects image extraction module 60 obtained as much as possible, the present invention also can be limited to the incident angle of these light 51 relative these sides 43 in one second predetermined angle theta 2.Second predetermined angle theta 2 is that first predetermined angle theta 1 is than one and half ones (1/2nd) away from this image extraction module 60.In this second predetermined angle theta 2 towards the light 51 of this substrate 40 emissions, can direct irradiation to upper surface 41, carry out total reflection on substrate 40 and upper surface in substrate 40 41 or the lower surface 42 and can get into, and can outside substrate 40, not reflect.
This image extraction module 60 can place substrate 40 above or below, in order to the image of the upper surface 41 that captures this substrate 40.In the present embodiment; Because the upper surface 41 of this substrate 40 comprises the antireflection portion 411 and the lighttight metal electrode portion 412 of printing opacity; And its lower surface 42 is a lighttight metallic conduction portion; Therefore, need this image extraction module 60 is located at the top of this substrate 40, the light 51 that is transmitted by the antireflection portion 411 of upper surface 41 so that detect that inherent vices such as running into crackle 45, foreign matter 46 produce after reflection, refraction or the scatterings.The pattern of this image extraction module 60 is not limit, and can be image detectors such as various forms of cameras, video camera.
Combine with, during with the side 43 of light 51 directive substrates 40, if when its incident angle drops in second predetermined angle theta 2, light 51 can get in the substrate 40 smoothly.Otherwise; In the time of outside light 51 incident angles drop on second predetermined angle theta 2, then only have fraction light can get in the substrate 40, most of light then can penetrate substrate 40 and cause the clear zone; Cause the confusion of image information and be difficult to interpretation; And this situation departs from second predetermined angle theta 2 when big more when light 51, and the light ratio that gets into substrate 40 is low more.
After light 51 gets in the substrate 40; Because light 51 overwhelming majority can be conducted in substrate 40 with the total reflection mode; If the even zero defect of substrate 40 inner materials; Then light 51 can't reflect outside the substrate 40, sustainablely conducts forward up to the energy full consumption to fall or penetrated by the another side of substrate 40 43.If in the process that light 51 transmits in substrate 40; When meeting with the inherent vice of material differences such as material interface such as crackle 45 or foreign matter 46, bubble, inner impurity; Light 51 courses are changed; And the change that produces opticpaths such as reflection, refraction or scattering, and can transmit formation bright spot outside the substrate 40 here in contiguous upper surface 41, just can detect the position of this defective by the image extraction module 60 of substrate 40 tops.The photo of Figure 15 is the crackle photo that utilizes the present invention to obtain, and compared to the crackle image photo that the defect inspection mode of Figure 14 is obtained, the crackle image that the present invention obtained is obviously comparatively clear.
Yet the foreign matter 47 of the upper surface 41 of substrate 40 does not almost influence in substrate 40 inner transmission for light 51.For instance, the foreign matter 47 of upper surface 41 possibly comprise dust, plastic particles, greasy dirt, water stain, refer to trace etc.But can not penetrate foreign matter when reaching foreign matter 47 places owing to the light 51 in the substrate 40; Therefore can the transmission of light 51 not impacted; Also not having light transmits substrate 40 from here and is captured by image extraction module 60; Therefore, in the judgement of image, can not obscure with the inherent vice generation of substrate 40.In addition, the light transmission amount that is caused like the etched small superficial makings of soda acid of the upper surface 41 of substrate 40 is also very little, and image extraction module 60 can not detect this kind defective, and also unlikely inherent vice with substrate 40 produces to be obscured.
Consult Fig. 6 A, Fig. 6 B,, therefore can improve the sharpness of image with the mode that improves light intensity because the present invention adopts the interface scattering principle to make inherent vice form the bright spot signal.Fig. 6 A is the lower situation of light intensity, and comparatively speaking, Fig. 6 B then is the light intensity condition with higher, and inherent vice 48 can produce the signal of video signal of wider width when light intensity is higher, so can be used to the minimum material interfaces such as crackle that detect.As shown in Figure 7; For light intensity to the width of signal of video signal and the curve map of overall image contrast; The signal of video signal width that shows crackle among the figure can and become big along with the light intensity raising, and the decline of the contrast of overall image is limited, so can help the interpretation of image.
As shown in Figure 8; Be another embodiment of the present invention; A plurality of light sources 50 also can be provided so that respectively by a plurality of sides 43,43 ', 43 of substrate 40 " light of emission one penetrable this substrate 40, with the image brilliance and the width of the inherent vice 49 in the further increase substrate 40.These a plurality of light sources 50 can be wire, and parallel these a plurality of sides 43,43 ', 43 respectively " the bearing of trend setting.Because inherent vice 49 possibly have directivity; As shown in the figure; Because the bearing of trend and side 43 approximate vertical of inherent vice 49, in the case, the inherent vice image brilliance that is produced by side 43 light inlets can not show a candle to the inherent vice image brilliance that the side 43 ' light inlet by adjacency is produced.As shown in Figure 9, go into the light time by multi-direction, with the light inlet of inherent vice 49 bearing of trend approximate vertical, can effectively improve the deration of signal of the inherent vice in the image really.
By a plurality of sides 43,43 ', 43 from substrate 40 " light inlet, the stackable multi-direction image light intensity that provides can be eliminated the transmission light quantity problem of smaller that the directivity of inherent vice 49 causes; improve the brightness of inherent vice 49; so for minute crack, can effectively improve the image identification rate, therefore can significantly reduce the required ultimate resolution of image extraction module 60; except that can reducing cost, also can not receive the restriction of the ultimate resolution of commercially available existing image extraction module.
In addition, owing to the marginal portion of substrate 40 maybe be because of producing light leak near light source 50, so that the image of this marginal portion possibly have the situation generation of overexposure, shown in the photo of Figure 16, and can't detect inherent vice.Therefore, shown in figure 10 in order further to improve 60 picked image quality of image extraction module, the present invention also adopts a kind of circulation illuminating method to come substrate 40 is shone.
A plurality of light sources 50 are located at respectively these 43 places, side of this substrate 40 respectively, and respectively this light source 50 can penetrate the light of this substrate 40 towards this side 43 emissions one correspondence respectively, and borrows the image of the upper surface 41 of these image extraction module 60 these substrates 40 of acquisition.At this moment, shown in Figure 10 A, Figure 10 B, Figure 10 C, Figure 10 D, make the side 43 emission light of these a plurality of light sources 50 in turn in regular turn towards correspondence; And at arbitrary light source 50 towards corresponding side during 43 emission light, with the images of these image extraction module 60 corresponding acquisitions, because this half zone 413 is away from the side 43 that receives light source 50 irradiations near half zone 413 of another opposite side 43; Therefore, the image in this half zone 413 does not have the problem of overexposure, and; Images in this a plurality of half zone 413 with all at last; With image treatment method, synthesize the complete image of this upper surface 41, whereby; The problem of overexposure can be effectively avoided, the complete image of this upper surface 41 can be obtained again.
Perhaps, possibly have the situation of overexposure to the image of marginal portion, the present invention provides another kind of solution again.Shown in figure 11, a light shield 80 is provided, be arranged between this image extraction module 60 and this substrate 40, be not limited near this image extraction module 60 or near this substrate 40, can be in order to the marginal portion of the upper surface 41 that covers this substrate 40.Whereby, retaining trimming edge part, the center section 85 that the edge part branch of only getting centers on, the situation of avoiding image possibly have overexposure takes place.In the present embodiment, this light shield 80 be a ring-type and cover this substrate 40 upper surface 41 all edges, visual actual conditions change during actual enforcement, cover the marginal portion of at least one side of the upper surface 41 of this substrate 40.In addition, need explain that the quantity of light source 50 is not limited to illustrated four, gets final product more than one.The quantity of light shield 80 also is not limited to one, can be a plurality of.Shown in the photo of Figure 17, the crackle of substrate 40 is high-visible.
Like Figure 12 and shown in Figure 13, be another embodiment of the present invention, compared to the foregoing description, this embodiment also comprises a load bearing seat 70 and two shading columns 90 in order to bearing substrate 40.And the image extraction module 60 of present embodiment is the line style image extraction module.Load bearing seat 70 comprises a base 71 and and is arranged on the transmission module 72 on the base 71.Be positioned at the image extraction module 60 of these substrate 40 tops, then in order to capture the image of the strip region 95 on this substrate 40.Shading column 90 is arranged between this light source 50 and this substrate 40, and the corresponding respectively two ends that are positioned at this strip region 95.Because the marginal portion in the strip region 95 is stopped by this shading column 90 and can't receive the stronger light of intensity that is sent by light source 50 forwards; Only can receive the oblique light of the wide-angle that light source 50 sends; Therefore; The marginal portion of strip region 95 just can overexposure, shown in the photo of Figure 18.What need explanation is, in the present embodiment two shading columns 90 is separately positioned on the two ends of this strip region 95, can be only during actual enforcement in an end of this strip region 95 shading column 90 be set.
These transmission module 72 these substrates 40 of drive direction of arrow in this light shield 90 edge figure of arranging in pairs or groups moves; This strip region 95 is moved at the upper surface 41 of this substrate 40; And make image extraction module 60 when predetermined apart from the image that captures this strip region 95 intermittently; Just can the image of intermittently obtaining be synthesized the complete image of the upper surface 41 of this substrate 40, and not receive the influence of marginal portion overexposure.
In addition, present embodiment can be integrated with the equipment at Wiring technology, so that before being applied to technology, in the technology, or detects after the technology.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.

Claims (15)

1. substrate inherent vice inspection method, in order to a substrate is carried out the inherent vice inspection, this substrate has a upper surface, and a plurality of sides that connect this upper surface, it is characterized in that, and this substrate inherent vice inspection method comprises:
A plurality of light sources are provided; Be located at respectively this place, side of this substrate respectively; Respectively this light source penetrates the light of this substrate towards this side-emitted one correspondence respectively, and make this light relatively the incident angle of this side be limited in one and make in first predetermined angular that this light transmits with the total reflection mode in this substrate; And
One image extraction module is provided, is located at the top of this substrate, and capture the image of the upper surface of this substrate,
Whereby; Make the side-emitted light of these a plurality of light sources in turn towards correspondence; And at arbitrary light source during towards the side-emitted light of correspondence; With half area image of the corresponding acquisition of this image extraction module, and will these a plurality of half area images synthesize the complete image of this upper surface near this upper surface of another opposite side.
2. substrate inherent vice inspection method according to claim 1 is characterized in that, make this light be directional light inject this side.
3. substrate inherent vice inspection method according to claim 1; It is characterized in that; The incident angle of relative this side of this light is limited in one second predetermined angular, and this second predetermined angular is that first predetermined angular is than the half territory away from this image extraction module.
4. substrate inherent vice testing fixture, in order to a substrate is carried out the inherent vice inspection, this substrate has a upper surface, and a plurality of sides that connect this upper surface, it is characterized in that, and this substrate inherent vice testing fixture comprises:
At least one light source; Be located at the place, a wherein side of this substrate; This light source penetrates the light of this substrate towards this side-emitted one correspondence, and this light incident angle of this side relatively is limited in one and makes in first predetermined angular that this light transmits with the total reflection mode in this substrate;
One image extraction module is located at the top of this substrate, in order to the image of the upper surface that captures this substrate; And
One light shield is arranged between this image extraction module and this substrate, in order to the edge of at least one side of the upper surface that covers this substrate.
5. substrate inherent vice testing fixture according to claim 4 is characterized in that this light is directional light.
6. substrate inherent vice testing fixture according to claim 4; It is characterized in that; This light incident angle of this side relatively is limited in one second predetermined angular, and this second predetermined angular is that first predetermined angular is than the half territory away from this image extraction module.
7. substrate inherent vice testing fixture according to claim 4 is characterized in that, this substrate inherent vice testing fixture comprises a plurality of light sources, and these a plurality of light sources are penetrated the light of this substrate respectively by these a plurality of side-emitted one.
8. substrate inherent vice testing fixture according to claim 4 is characterized in that these a plurality of light sources are wire, and the bearing of trend setting of parallel these a plurality of sides respectively.
9. substrate inherent vice testing fixture according to claim 4 is characterized in that the width of this light source is greater than the width of this side.
10. substrate inherent vice testing fixture according to claim 4 is characterized in that, this light shield is a ring-type and covers all edges of the upper surface of this substrate.
11. a substrate inherent vice testing fixture, in order to a substrate is carried out the inherent vice inspection, this substrate has a upper surface, and a plurality of sides that connect this upper surface, it is characterized in that, this substrate inherent vice testing fixture comprises:
At least one light source; Be located at the place, a wherein side of this substrate; This light source penetrates the light of this substrate towards this side-emitted one correspondence, and this light incident angle of this side relatively is limited in one and makes in first predetermined angular that this light transmits with the total reflection mode in this substrate;
One image extraction module is located at the top of this substrate, in order to capture the image of the strip region on this substrate;
One shading column is arranged between this light source and this substrate, and a corresponding end that is positioned at this strip region; And
One transmission module moves relative to this image extraction module in order to drive this substrate, and this strip region is moved at the upper surface of this substrate, so that the complete image of the upper surface of this this substrate of image extraction module acquisition.
12. substrate inherent vice testing fixture according to claim 11 is characterized in that this light is directional light.
13. substrate inherent vice testing fixture according to claim 11; It is characterized in that; This light incident angle of this side relatively is limited in one second predetermined angular, and this second predetermined angular is that first predetermined angular is away from 1/2nd of this image extraction module.
14. substrate inherent vice testing fixture according to claim 11 is characterized in that these a plurality of light sources are wire, and the bearing of trend setting of parallel these a plurality of sides respectively.
15. substrate inherent vice testing fixture according to claim 11 is characterized in that the width of this light source is greater than the width of this side.
CN2010102689059A 2010-09-01 2010-09-01 Device and method for checking internal defects of base plate Pending CN102384908A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103105403A (en) * 2013-01-21 2013-05-15 合肥知常光电科技有限公司 Method and device for detecting surface defect of transparent optical component
CN103592311A (en) * 2013-11-26 2014-02-19 英利集团有限公司 Infrared detection apparatus for detecting defects in silicon block, and detection method thereof
CN104359923A (en) * 2014-12-04 2015-02-18 合肥鑫晟光电科技有限公司 Detection device and detection method
CN108548825A (en) * 2018-03-16 2018-09-18 天津大学 A kind of transparent plate defect detecting device and method based on two-dimentional illumination
CN109283197A (en) * 2018-08-27 2019-01-29 杭州元色科技有限公司 The detection method and detection device of clear sheet surface and internal flaw
CN109884085A (en) * 2019-02-14 2019-06-14 德淮半导体有限公司 Assembly detection apparatus and its working method, semiconductor equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08210985A (en) * 1995-02-01 1996-08-20 Sony Corp Detecting method for particle in film, and detecting device therefor
CN101055256A (en) * 2006-04-10 2007-10-17 奥林巴斯株式会社 Defect inspection apparatus
CN101151522A (en) * 2005-03-28 2008-03-26 芝浦机械电子株式会社 Method and device for inspecting surface of distorted silicon wafer
CN101286012A (en) * 2007-04-13 2008-10-15 株式会社Orc制作所 Projection exposure apparatus
CN101441182A (en) * 2007-11-22 2009-05-27 优志旺电机株式会社 Pattern checking apparatus
WO2010028353A1 (en) * 2008-09-08 2010-03-11 Rudolph Technologies, Inc. Wafer edge inspection

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08210985A (en) * 1995-02-01 1996-08-20 Sony Corp Detecting method for particle in film, and detecting device therefor
CN101151522A (en) * 2005-03-28 2008-03-26 芝浦机械电子株式会社 Method and device for inspecting surface of distorted silicon wafer
CN101055256A (en) * 2006-04-10 2007-10-17 奥林巴斯株式会社 Defect inspection apparatus
CN101286012A (en) * 2007-04-13 2008-10-15 株式会社Orc制作所 Projection exposure apparatus
CN101441182A (en) * 2007-11-22 2009-05-27 优志旺电机株式会社 Pattern checking apparatus
WO2010028353A1 (en) * 2008-09-08 2010-03-11 Rudolph Technologies, Inc. Wafer edge inspection

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103105403A (en) * 2013-01-21 2013-05-15 合肥知常光电科技有限公司 Method and device for detecting surface defect of transparent optical component
CN103592311A (en) * 2013-11-26 2014-02-19 英利集团有限公司 Infrared detection apparatus for detecting defects in silicon block, and detection method thereof
CN103592311B (en) * 2013-11-26 2016-09-07 英利集团有限公司 For detecting infrared detection device and the detection method of silico briquette internal flaw
CN104359923A (en) * 2014-12-04 2015-02-18 合肥鑫晟光电科技有限公司 Detection device and detection method
CN108548825A (en) * 2018-03-16 2018-09-18 天津大学 A kind of transparent plate defect detecting device and method based on two-dimentional illumination
CN109283197A (en) * 2018-08-27 2019-01-29 杭州元色科技有限公司 The detection method and detection device of clear sheet surface and internal flaw
CN109884085A (en) * 2019-02-14 2019-06-14 德淮半导体有限公司 Assembly detection apparatus and its working method, semiconductor equipment
CN109884085B (en) * 2019-02-14 2021-11-30 德淮半导体有限公司 Equipment detection device, working method thereof and semiconductor equipment

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