TWM273032U - Assembling type liquid cooling heat dissipation device - Google Patents

Description

M273032 4. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to an integrated type, especially a liquid-cooled type, applied to a heating electronic component (a central mechanism. An integrated liquid-cooled heat dissipation mechanism, a central processor). Cooling [Previous technology] f 'today's computing functions are becoming more and more powerful,

, Improve, 整体 its overall shape, structure and connection with the motherboard; 疋 破 break the traditional nest 杲, can be described as a major reform in the computer industry, but also because of the new generation of central processing unit with super-speed computing functions, also makes the processor The temperature generated during processing of the operation instructions is more rampant, so how to use: a good heat conduction and heat dissipation system to make the central processor work at its allowed temperature has been regarded as a very important issue in the industry. Therefore, an industry has designed a water-cooled heat dissipation system. Please refer to the first figure shown in the figure. The water-cooled heat dissipation system 100a includes a heat sink 10a installed on the central processing unit 200a for heat dissipation. A water outlet 101a and a water inlet 102a are respectively provided at both ends of the base 10a. The water inlet i02a is connected to the water outlet 201 & of the water pipe 20a to the first water pump 20a, and the heat sink 1 The water outlet 10a of 〇a is then connected to the water inlet 30a of the cooling pipe 30a, and the cooling seat 30a may be composed of a plurality of heat sink fins 30a, the cooling seat 30. The water outlet 302a of a is connected to the water inlet 40a of the water tank 40a, and the water outlet of the water tank 40a is connected to the water inlet 402a of the water pump 2a. To form a water-cooled circulating heat dissipation system. During use, the water pump 20a sends cold water to the heat sink 10a for heat exchange and then flows out of hot water. The hot water then flows into the cooling seat 30a through the pipeline 104a for heat transfer. M273032 4. Creation Explanation (2) After the replacement, cold water is formed, and then flows back to the water tank 40a from the pipeline 304a to continuously perform the cyclic heat exchange and heat dissipation process. However, 'this type of water-cooled heat dissipation system 丨 〇〇a is composed of independent heat sink \ 〇a, water pump 20a, cooling seat 30a and water tank 40a, plus serial connection between each device The pipes 103a, 104a, 300a, and 4002a cause the volume of the entire water-cooled cooling system 100a to be huge and occupy a large amount of installation space. This is undoubtedly true for a thin and light computer host. It is another attempt to solve the problems caused by the above 4a. The creator of this case has actively studied ^ ^ k ^ with many years of experience and in the spirit of excellence. Institution ". [New content]

The purpose of this creation is to provide a system that integrates the integrated liquid-cooled heat dissipation mechanism system and cold plate module, and the liquid flows directly between them, which can accelerate the process. One of the characteristics of this creation is the integrated water cooling module It consists of a plurality of channels for heat dissipation, and an upper cover and a water flow driving module are formed at the lower side. The water flow is used. In addition, a heat-absorbing surface is installed at the lower cover, which can be connected with electronic components and water-cooled. An integrated liquid-cooled heat dissipation mechanism of a module and a cold plate module. The water-flow driven module and the water-cooled exhaust mold use a connected water flow channel to make the cooling cycle speed to increase the heat dissipation rate. The liquid-cooled heat dissipation mechanism includes a It consists of the upper and lower covers of the water cooling module, and a driving module is arranged at the upper cover to generate a cooling plate module with a cooling liquid, and the bottom surface of the cold plate module is in contact with each other. Water channel

Page 6 M273032 Description of the creation (3) This water flow channel enables the upper and lower parts of the fixed frame to be provided with a flow channel between the fixed frame and the lower cover to flow into the upper cover for heat exchange to form the work. In the body, an empty seat and an upper cover are arranged in the body and the lower part, and a leaf seat is recessed on the bottom surface. When the water flows, the fan seat seat is filled with water and the fan seat flows to the [implementation]. However, the attached feature restricts the cooling liquid. Another feature of the cooling liquid is the use of two hot water channels on both sides. The hot cooling liquid is further characterized by communication between the upper volume and the lower volume. The driving module is located in the fixed frame to the lower housing inside the upper cover. Each mold is located at the plurality of channel ends to drive water through the water flow and then pass through the 'reflow lies in the water injection space of the installation space. The circulating water-cooled drain module has a cooling fin and a cover moving module passing through the water flow drive and the lower capacity σ of the cover, and a guide seat is arranged in the water-cooled drain body at the place to separate the flow. The fixed frame and the cover are connected with the heat sink. When passing through the flow path, a body is provided with an on-line cover and a bottom. The plurality of channels and the lower cover have a drawing power of several heat sinks. Inside. The moving module is a packaging space. The upper accommodation space has a guide seat, and a bottom of the guide seat is pivotally provided with a module cover. When the water is insufficient, do not pass through the guide body. The detailed description of Dao Zuo and your + ^ L technology are included, and the diagrams are provided for reference only. The map is provided for reference only. It is not intended to be a "integrated liquid-cooled heat sink diagram" for the original creation. As shown, in this embodiment, the integrated liquid-cooled dispersing central processor 20 (as shown in the seventh figure) is used to dissipate heat. Please refer to the second thermal mechanism 10 as the middle, which is in order from bottom to top.

M273032

4. Creation instructions (4) Cold plate module 1, water cooling module 2 and water flow driving module 3 are assembled, and a water flow channel is connected between these right groups. In this creation, the water-cooled exhaust module 2 has a box 21, and the upper and lower sides of the box 2 are formed with an upper 2 and a middle 2 respectively. A plurality of cooling chambers are provided with a flow channel 25, and a flow channel 25, The two phases communicate with each other. In this embodiment, the two flow channels 25 at the middle of the upper cover are used to convey water to the sewage, as shown in the two flows at the two sides. The cover body 22 and the lower cover body 23, and the coolant system in the upper cover body 22 and the lower cover body 23 2 at the ends of the plurality of heat sinks 24 and the upper cover body 22 and the lower cover body 22 respectively at the box piece 24 ', and The hot channel 25 located in the lower cover body 23 is conveyed into the upper cover body 22 (as shown in the second, third, and fourth figures, please refer to the second, third, and fourth figures), the water flow driving module 3 includes a body 31, and the body 31 is partitioned into an upper part. The accommodating space 311 and the lower accommodating space 3 1 2 are provided with a water injection port 32 communicating with the lower accommodating space 3 丨 2 on the body 31, and a coil holder 33 and an upper cover 34 are provided in the upper accommodating space 311. A guide seat 35 is provided at the lower accommodation space 312. A flow channel 351 is recessed on the bottom surface of the guide seat 35, and a fan seat 36 is pivotally provided at the bottom of the guide seat 35. When the module 3 is installed on the water-cooled drain module 2, the fan seat 36 is located in the upper cover 2 2 of the fixed frame 21. When the water is insufficient, the water is injected from the iron I water injection port 32 to the lower volume. Place it in the space 3 1 2 and then flow into the upper cover 2 2 through the runner 3 5 1 and the fan seat 3 6 of the guide base 3 5. Please refer to the first picture 'The cold plate module 1 again It is installed in the lower cover 23 of the water cooling module 2 and includes a cold plate η. The middle of the bottom surface of the cold plate η is a heat absorption surface 1 2 (as shown in the seventh figure). The heat absorption surface 12 is attached to The central processing is 20 'and a plurality of channels are arranged side by side on the top surface of the cold plate 11.

M273032

的 热 片 13。 The heat sink 13. Cold plate 1 1 Bolt Module 1 Body direct water drive Set in fan seat Module 3 Cold row mold

At the time of this creative assembly, there is a loose gasket 14 at the bottom of the box 21 and the cold plate. The water cooling module 2 is placed on the cold plate module ，, and the heat sink on the cold plate 11 is placed. 13 is located in the lower cover 23, and the element 15 locks the cold plate 11 at the bottom of the lower cover 23, and the space formed after the cold plate is assembled in the lower cover 23 can make the coolant impact the cold plate 11 On the heat sink 1 3. Alas, a sealing gasket 37 is also placed between the top of the box 2 and the moving module 3, so that the upper part 22 of the water cooling module 2 of the water flow driving module 3 and the 36 on the water driving module 3 It is located in the upper cover 22, and then the water flow drive is locked on the top of the phase body 21 by using the bolt element 38, so that the water flow drive module 3, the water group 2 and the cold plate module 1 are integrated.

+ In this creation, after integrating the water flow driving module 3, the water cooling module 2 and the A plate branch group 1, the flow channel 35i of the water flow driving module 3, the flow channel 25 of the water cooling branch group 2 and The cold plate module} 's multiple heat sinks 丨 the three channels are connected to form a water flow channel (such as the area through which the arrow in Figure 7 passes). The water flow channel is used to enable the cooling liquid to flow between the modules. Productive flow. "% ≫ π brothers five and six, in this creation, a fixed frame 4 is locked at the bottom of the cold plate module, and an opening 41 is formed in the middle of the fixed frame 4 so that the bottom of the cold plate 11 The heat absorbing surface 12 protrudes from the opening 41, and can be attached to the central processing unit 20, and the two opposite sides of the fixing frame 4 are respectively provided with locking pieces 42 for locking outwards. The fixing piece 42 is locked on the central processing unit fixing seat 201 (as shown in the seventh figure).

Page 9 IV. Explanation (6) The side of the water cooling module 2 is virtually locked with a cooling fan 5 and a fan filter 5: bolt elements 26 can be used to improve the entire water cooling module 2 埶 = When the original creation of the cooling fan 5 is assembled, the integrated n-rate is made. Above the central processing unit 20, and using bolt elements 43 :; mechanism] 0 is placed in the middle 42 and fixed on the central processing unit mounting base 201 so that the locking plate heat dissipation mechanism 10 of the fixing frame 4 is installed in the central processing Above the device 20: For the entire integrated liquid cooling, please refer to the seventh figure, this creation two. The middle two flow channels 25 at the upper cover 22 are downward: that is, the cooling liquid is directly driven from the radiating fins 13 at the lower cover 23 to = 23, and the hot water after the heat exchange is driven by the water flow. ： 口 ： 3 进 ： 丁 热 交 1 and then flow through the plurality of channels through the flow channels 25 on both sides ~ :::: Then a cooling liquid is formed, and then flows to the upper part ..., the film advances the order ... The father changes the heat dissipation. In the upper body 22, the continuous circulation of diligent work 2 is due to the integrated liquid-cooled heat dissipation mechanism 1 0, which is integrated by water flow drive 2 and cold plate module 1, and directly used: 利用 Γ: channel Make the cooling liquid flow between them, and can accelerate the circulation speed, in order to improve the heat dissipation rate of juice. In summary, the "隹 丄 ,, > integrated liquid-cooled heat-dissipating mechanism" of this creation can indeed achieve the stated effect through the structure disclosed above. And this creative application has not been seen in publications or used publicly before, and it has already met the requirements of the new patent and progress of new patents. 'However, the drawings and descriptions disclosed above are only examples of this creation, and are not intended to limit the examples of this creation; anyone who is familiar with the art M273032

Page 11 M273032 Brief description of the drawings [Simplified description of the drawings] The first picture is the conventional water-cooled scatter, and the second picture is the external appearance of the integrated '^ ,,' of this creation. The second three-dimensional exploded view of the liquid cooling mechanism @ 系 太 ## v #. The first picture is from the original creation of the water pump and the fourth picture is from the original creation of the water pump. The fifth picture is a three-dimensional exploded view of the integration of the present invention. It is a button-shaped three-dimensional appearance drawing. The cooling and cooling mechanism is to be assembled with the fixing frame and the cooling air. = The liquid-cooled cooling mechanism is assembled with the fixing frame and the cooling fan. [Representative Symbols of Components] < Knowledge > 2 0 0a Radiating Block 10a 20a Cooling Block 3 0 3 3 0 3a Water Tank 40a 101a, 201a, 3 0 2a 102a, 2 0 2a, 301a, 401a 103a, 104a, 304a, 40 2a Water-cooled heat dissipation system 1 0 0 a Central processor water pump cooling fin water outlet π Water inlet pipe < this creation > Fixing seat 201 2-type liquid-cooled heat dissipation mechanism 10 Central processor 2〇

Page 12 M273032

Schematic description on page 13 Cold plate module 1 Cold plate 11 Heat absorbing surface 12 Heat sink 13 Gasket 14 &37; Water cooling module 2 Box 21 Upper cover 22 Lower cover 23 Heat sink 24 Flow channel 25 151 Water current driving phase: group 3 body 31 upper storage space 311 lower storage space 312 water injection port 32 coil seat 33 upper cover 34 guide seat 35 fan seat 36 fixing frame 4 opening 41 locking piece 42 cooling fan 5 fan filter 51 Bolt element 15 ^ 26

Claims (1)

M273032 5. Scope of patent application — 1. An integrated liquid-cooled heat-dissipating mechanism for rapidly dissipating the heat emitted by an electronic component through a cooling liquid cycle, and quickly sending heat to a water-cooled exhaust module. An upper cover and a lower cover are respectively formed on the upper and lower sides of the water cooling module; a water flow driving module is used to cause the cooling liquid to flow when the water cooling module is actuated, and the water flow driving module is connected to the water cooling module. Set the upper cover of the row module; A cold plate module whose bottom surface is a heat-absorbing surface for contacting the electronic component. The upper edge of the cold plate module is assembled with the lower cover of the water-cooled row module; The channel is connected between the water flow driving module, the water cooling drain module and the cold plate module, and when the water flow driving module is activated, the cooling liquid is circulated between the modules. Person 7'2. The integrated liquid-cooled heat sink as described in item 1 of the scope of patent application, wherein the water flow driving module has a water injection port. 3. The integrated liquid-cooled heat-dissipating mechanism according to item 1 of the scope of the patent application, wherein the cold plate module is further provided with a fixing frame. 4. The integrated liquid-cooled heat-dissipating mechanism as described in item 1 of the scope of the patent application, wherein the water-cooled exhaust module is provided with a cooling fan. 5. The integrated liquid-cooled heat sink as described in item 1 of the scope of the patent application, wherein the upper surface of the cold plate module is formed with a plurality of heat sinks. 6. The integrated fluid as described in item 5 of the scope of patent application; ^ heat dissipation mechanism 'wherein the heat sinks are located in the space formed after the lower cover and the cold plate module are assembled. 1 Si _