M331139 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種水冷式散熱裝置，尤指一種可供複 數個發熱電子元件散熱用的水冷式散熱裝置。 【先前技術】 隨著科技的演進，電腦所要處理的運算工作日益繁 ^ 雜，故電子元件的内部電路設計亦日趨複雜，導致各電子 籲 元件在工作時均會產生廢熱；因此有廠商發展出一種水冷 式散熱裝置’其包括有複數水冷頭、一泵浦以及一散熱器， 其中該兩水冷頭内係裝填有冷卻液，並直接設置於對應的 發熱電子元件上，以直接吸取發熱電子元件所散發之廢 熱，又该兩水冷頭係分別透過導管而和該泵浦與散熱器連 通；如此一來，即可藉由該泵浦之運作而令冷卻液於兩水 冷頭内流動，藉此利用流經水冷頭的冷卻液對水冷頭所吸 —取之熱量進行熱交換，當吸取熱量的冷卻液流經散熱器將 ® 熱散逸後，即會再循環流回水冷頭進行熱交換。 由上述說明可知，有鑑於既有水冷頭均針對單一發熱 電子元件之尺寸而設計，故為確保主機板上之複數個發熱 電子元件均能達到散熱效果，上述水冷式散熱裝置即必須 具有複數個水冷頭，以分置於複數個發熱電子元件上·，然M331139 VIII. New Description: [New Technology Field] This paper is about a water-cooled heat sink, especially a water-cooled heat sink for heat dissipation of a plurality of heat-generating electronic components. [Prior Art] With the evolution of technology, the computing work that computers have to deal with is becoming more and more complicated, so the internal circuit design of electronic components is becoming more and more complicated, resulting in the waste heat generated by each electronic component during work; therefore, some manufacturers have developed A water-cooling heat dissipating device includes a plurality of water-cooling heads, a pump and a heat sink, wherein the two water-cooling heads are filled with a cooling liquid and directly disposed on the corresponding heat-generating electronic components to directly absorb the heat-generating electronic components. The waste heat is dissipated, and the two water cooling heads are respectively connected to the pump and the radiator through the conduit; thus, the cooling liquid can be flowed in the cold water head by the operation of the pump, thereby The heat flowing through the water-cooling head is used to exchange heat between the heat absorbed by the water-cooling head, and when the heat-absorbing coolant flows through the radiator to dissipate the heat, it is recirculated back to the water-cooling head for heat exchange. It can be seen from the above description that in view of the fact that both water-cooling heads are designed for the size of a single heat-generating electronic component, in order to ensure that a plurality of heat-generating electronic components on the motherboard can achieve a heat-dissipating effect, the water-cooling heat sink must have a plurality of Water-cooled head, placed on a plurality of heating electronic components,
而此舉卻也造成組裝上困擾，以及散熱裝置成本上的Z 加；因此’現有的水冷式散熱裝置尚有待進一 + ^之改進方 案0 M331139 【新型内容】 為此，本創作之主要目的在提供一種水冷式散熱襞 置，其可供複數個發熱電子元件散熱用。However, this move also causes assembly troubles and the Z-plus on the cost of the heat sink; therefore, the existing water-cooled heat sink has yet to be improved. The improvement scheme 0 M331139 [New content] For this reason, the main purpose of this creation is A water-cooled heat sink is provided which is capable of dissipating heat from a plurality of heat-generating electronic components.
為達成前述目的所採取之主要技術手段係令前述水冷 式散熱裝置包括： V - 水〜頭，其内係裝填有冷卻液，並供設於一發熱電 ， 子元件上以吸取廢熱； • 一散熱片，係供設於另一發熱電子元件上以吸取廢熱； 同導熱官，係連接散熱片，並與水冷頭連通，以供 冷卻液流經，又該高導熱管的導熱係數高故具較佳之吸j 散熱能力； 一栗浦’係透過導管與該水冷頭連通；及 一散熱器，係透過導管分別與該泵浦和水冷頭連相互 連通。 - 利用上述技術手段，當本創作運用於散逸兩個發熱電 • 子元件的廢熱時，僅需使用一個水冷頭並配合該散熱片與 高導熱官，即可同時對該兩發熱電子元件進行水冷式散 熱，·如此一來，不但可減少使用一個水冷頭以降低二 更可減少導管的使用以簡化構件之間的連接。 ’ 該主機板（1 〇 【實施方式】 首先請參閱第一圖所示 設於一主機板（1〇)上， 本創作之水冷式散熱裝置係 上設有複數 5 M331139 ::熱電子元件’於本實施例中係以南橋和北橋晶片（1 熱片（二)舉：！明；而本創作係包括-水冷頭、-散 及教、一高導熱管（4 0 )、-泵浦（5 0 )以 及一政熱益（6 〇 )。 冷頭内係裝填有冷卻液，並供^於該北橋晶片 本與：’以吸取北橋晶片（1 2 )工作時之廢熱，·於 ^ β例中，該水冷頭係包含有·· 一本體 ΓΡι、 9. ζ1 )，其外侧底面係供設於該北橋晶片（工 且，ί二：本體（2 1 )内係包括兩容室（2 η )， 且该本體 ^丄）之内側底面於兩容室（2丄丄）内 形成有複數個散埶鰭月f 外側表面則形成有 ），而該本體（21)之 形成有四個液體流入/出口（ 2 1 3 )，且兮 四個液體流入/出口（ 3亥 11)^^; (213)係兩兩與對應之容室（2 隔板（2 2 )，係設於該本體（2 於該兩容室（211、 π i形成 1 )之間以將兩容室（2 1 1 )隔開。 /月，、、、片（3 〇 )之底面係供設於該南橋晶片（工 …及取廢熱；於本實施例中，該 包含一底板（3 1 ) *一固定拓μ Q、 ^ ◦)係 第二至四圖所示，其中、：固疋板（32) ’請進一步配合 -亥底板（3 1 )之底面係供與該南橋晶 上係形成有兩平行溝槽(31 "，且該底板(： 之兩側係進—步分設有複數散熱鰭片（ 又該底板（3 1、τ¥ I , 4 ’ 頂面位於各溝槽（3 i丄）與相鄰的散 M331139 熱鰭片（3 1 2 )之間係分別形成有複數螺孔（3 1 3 ); δ亥固疋板（3 2 )係設於該底板（3 1 )之了員面上， 且該固定板（3 2 )之底面對應該底板（3 1 )上溝槽（3 1 1 )處係分別形成有凹入部（3 2 1 )，以由該凹入部 (3 2 1 )與對應的溝槽（3 1 1 )之間形成一容置空間， 而該固定板（3 2 )對應該底板（3 1 )上螺孔（3 i 3 ) 亦形成有複數螺孔（3 2 2 )，以利用螺絲將固定板（3 2)螺合固定於該底板（3 1)上。The main technical means for achieving the above-mentioned purposes is that the water-cooling heat dissipating device comprises: a V-water-head, which is internally filled with a cooling liquid, and is provided on a heating element, a sub-element to absorb waste heat; The heat sink is provided on another heat-generating electronic component to absorb waste heat; and the heat-conducting officer is connected with the heat sink and communicates with the water-cooling head for the coolant to flow through, and the high heat-conducting tube has a high thermal conductivity. Preferably, the heat dissipation capability of the suction pump is connected to the water cooling head through a conduit; and a heat sink is connected to the pump and the water cooling head through the conduit. - Using the above-mentioned technical means, when the present invention is applied to dissipate the waste heat of two heat-generating electric components, only one water-cooling head is used together with the heat sink and the high heat-conducting officer, and the two heat-generating electronic components can be simultaneously water-cooled Heat dissipation, in this way, not only can reduce the use of a water-cooled head to reduce the second, but also reduce the use of the conduit to simplify the connection between the components. 'The motherboard (1 〇 [Implementation] First, please refer to the first figure shown on a motherboard (1〇). The water-cooled heat sink of this creation is equipped with a plurality of 5 M331139 :: Thermal Electronic Components' In this embodiment, the south bridge and the north bridge wafer are used (1 hot film (2): ming; and the creation system includes - water-cooled head, - scattered and taught, a high heat pipe (40), - pump ( 5 0 ) and Yizheng Thermal (6 〇). The cold head is filled with coolant and supplied to the North Bridge wafer and: 'to extract the waste heat from the North Bridge wafer (1 2), · ^ β In the example, the water-cooled head system includes a body ΓΡι, 9. ζ1), and the outer bottom surface is provided on the north bridge wafer (working unit, ί2: body (2 1 ) includes two chambers (2 η), and the inner bottom surface of the body is formed in the two chambers (2丄丄) with a plurality of diffusing fins, and the outer surface of the body is formed), and the body (21) is formed with four liquids Inflow/outlet (2 1 3 ), and 兮 four liquid inflow/outlet (3 hai 11) ^^; (213) is a pair of two and corresponding chambers (2 partitions (2 2 ) The body is disposed between the two chambers (211, π i forming 1) to separate the two chambers (2 1 1 ). The bottom surface of the / month, the, and the sheets (3 〇) is provided The second bridge wafer is disposed in the south bridge (in the present embodiment, and includes a bottom plate (3 1 ) * a fixed extension μ Q, ^ ◦) is shown in the second to fourth figures, wherein: Plate (32) 'Please further cooperate - the bottom plate of the floor (3 1 ) is provided with two parallel grooves (31 ", and the bottom plate (: There are a plurality of heat dissipating fins (the bottom plate (3 1 , τ ¥ I , 4 ' top surface is located between each groove (3 i 丄) and the adjacent scatter M331139 hot fin (3 1 2 )) a plurality of screw holes (3 1 3 ); a δ海固疋 plate (3 2 ) is disposed on the surface of the bottom plate (31), and a bottom surface of the fixing plate (32) corresponds to the bottom plate (3 1 a recessed portion (3 2 1 ) is formed in the upper trench (3 1 1 ) to form an accommodating space between the recessed portion (3 2 1 ) and the corresponding trench (3 1 1 ), and The fixing plate (3 2 ) corresponds to the screw hole on the bottom plate (3 1 ) (3 i 3) A plurality of screw holes (3 2 2 ) are also formed to screw and fix the fixing plate (32) to the bottom plate (31).
上述高導熱管（4 0 )係為高導熱係數材料製成，由 其具有較佳之吸/散熱能力；又於本實施例中該高導熱省 (4 0 )係、呈一 ϋ字形，且其兩平行部係分別對應設於索 散熱片（3 0 )的溝槽（3丄工）上，又該高導熱管（^ 〇)之一端係連接該水冷頭上與其中一容室马 通之液體流入/出口（ 2 1 3 )，以访？外， ^ 1 ^ ；以與该水冷頭内該容室 U i )連通而供冷卻液流過，而另端則連接該水冷司 上與另-容室（2工丄）連通之液體流入/出口（ 2 ^ 3 )， 以與該水冷頭内另一容室（2 1 1 )連通。 上述泵浦（5 〇 )係透過導管（5】 盥复中一六—,^ 、0丄）與該水冷頭j …中#至（2 1 1 )連通之液體流入/出口 （ 2工3 、接，以與該水冷頭内之該容室（2 1 1 )連通。The high thermal conductivity tube (40) is made of a material having a high thermal conductivity, which has a better absorption/heat dissipation capability; and in the embodiment, the high thermal conductivity (40) is a U-shape, and The two parallel portions are respectively corresponding to the grooves (3) of the cable fins (30), and one end of the high heat pipe (^) is connected to the liquid on the water-cooling head and the one of the chambers. Incoming/exporting (2 1 3) to visit? In addition, ^ 1 ^ ; communicates with the chamber U i in the water-cooled head for the coolant to flow, and the other end connects the liquid in the water-cooled chamber to the other chamber (2 work). The outlet (2^3) is in communication with another chamber (2 1 1) in the water-cooled head. The above pump (5 〇) is a liquid inflow/outflow through the conduit (5) 盥复中一六—, ^, 0丄) and the water-cooling head j ... ## (1 1 1 ) (2 working 3, Connected to communicate with the chamber (21 1) in the water cooling head.
上述散熱器（6 〇 )係透過兩導管 續沔、去,cr a & 、6 1 )分別連I …浦（5 〇)以及該水冷頭上與另一容 通之液體流入/出口 i 3) 211)工 作韌 m、 精由遠泵浦（5 0 ) ^ ，7 ♦部液可於該水冷頭、散熱片 7 M331139 ί (4〇)、栗浦（50)以及散熱器（go)中構成循 環水流。 請進一步參閱第一圖所示，當該泵浦（2 〇 )運作時， 即會令冷卻液於泵浦（5 0 )、散熱器（6 〇 )、水冷頭、 散熱片（30)、高導熱管（40)和導管（51) ( 0The heat sink (6 〇) is continuously vented through two conduits, and cr a & 6 1 ) is connected to I ... (5 〇) and the liquid inflow/outlet i 3) 211) Working tough m, fine by far pumping (50) ^, 7 ♦ part of the liquid can be formed in the water cooling head, heat sink 7 M331139 ί (4〇), Lipu (50) and radiator (go) Circulating water flow. Please refer to the first figure. When the pump (2 〇) is operated, the coolant will be pumped (50), radiator (6 〇), water-cooled head, heat sink (30), high. Heat pipe (40) and conduit (51) (0
1 )之間循環流動，藉此利用流經該水冷頭和高導熱管（4 0 )的冷卻液分別吸出水冷頭和散熱片（3 〇 )所吸取之 廢熱，當吸收廢熱的冷卻液流經散熱器（6 〇 )將廢熱散 逸後，即會再循環流回水冷頭和散熱片（3 〇 )對南北橋 晶片（11) (12)散熱。1) Circulating flow, whereby the waste water sucked by the water-cooling head and the heat sink (3 〇) is respectively sucked by the cooling liquid flowing through the water-cooling head and the high heat-conducting pipe (40), and the cooling liquid absorbing the waste heat flows through After the heat sink (6 〇) dissipates the waste heat, it will recirculate back to the water-cooled head and the heat sink (3 〇) to dissipate heat to the north-south bridge chip (11) (12).
由上述可知，本創作係藉 水冷頭而可同時吸取複數個發 且該散熱片上的散熱鰭片以及 整體之散熱效果；故相較於習 作不但可減少使用一個水冷頭 可簡化各構件之間的連接。 綜上所述，本創作實為一 作，且未見於刊物或公開使用， 爰依法提出申請。 由增設一散熱片，以配合一 熱電子元件所產生之廢熱， 該高導熱管又可進一步增加 用的水冷式散熱裝置，本創 ’而得以降低製作成本，更 極具進步性與實用性之佳 符合新型專利之申請要件， 南 【圖式簡單說明】 第-圖·係本創作一較佳實施例應用於 北橋晶片的俯視圖。 第二圖：係本創作一較佳實施例應用於 主機板上之 主機板上之 8 M331139 南北橋晶片的局部外觀圖。 第三圖：係本創作一較佳實施例應用於一主機板上之 南北橋晶片的前視暨局部剖視圖。 第四圖：係本創作一較佳實施例應用於一主機板上之 南北橋晶片的側視暨局部剖視圖。 【主要元件符號說明】 (1 2 )北橋晶片 (2 1 1 )容室 (2 1 3 )液體流入/出 (311)溝槽 (3 1 3 )螺孔 (3 2 2 )螺孔 (51)導管 (61)導管 (1〇)主機板 (1 1 )南橋晶片 (21)本體 (2 1 2 )散熱鰭片 (2 2 )隔板 (3 0 )散熱片 (3 1 )底板 (3 1 2 )散熱鰭片 (3 2 )固定板 (3 2 1 )凹入部 (4 0 )高導熱管 (5 0 )泵浦 (6 0 )散熱器It can be seen from the above that the creation of the water cooling head can simultaneously absorb a plurality of hair fins and the heat dissipation fins on the heat sink and the overall heat dissipation effect; therefore, compared with the practice, the use of a water-cooled head can be reduced to simplify the relationship between the components. connection. In summary, this creation is a work, and is not found in the publication or public use, 提出 apply in accordance with the law. By adding a heat sink to match the waste heat generated by a hot electronic component, the high heat pipe can further increase the water-cooling heat sink, which can reduce the production cost, and is more advanced and practical.佳 conforms to the application requirements of the new patent, South [Simple Description of the Drawings] - Figure - This is a top view of a preferred embodiment of the Northbridge wafer. The second figure is a partial appearance view of a preferred embodiment of the present invention applied to the 8 M331139 north-south bridge chip on the motherboard of the motherboard. Third: A front view and a partial cross-sectional view of a north-south bridge wafer applied to a motherboard on a preferred embodiment. Figure 4 is a side view and partial cross-sectional view of a north-south bridge wafer applied to a motherboard on a preferred embodiment. [Main component symbol description] (1 2) North bridge wafer (2 1 1 ) chamber (2 1 3 ) liquid inflow/out (311) groove (3 1 3) screw hole (3 2 2 ) screw hole (51) Catheter (61) Catheter (1〇) Motherboard (1 1) South Bridge Wafer (21) Body (2 1 2) Heat sink fin (2 2 ) Partition (3 0 ) Heat sink (3 1 ) Base plate (3 1 2 ) heat sink fin (3 2 ) fixed plate (3 2 1 ) recessed part (4 0) high heat pipe (50) pump (60) heat sink