M270407 四、創作說明（1) 【新型所屬之技術領域】 本創作係有關一種光源結構，特別是有關一種具散熱 裝置之平面發光源結構。 【先前技術】 按’隨著科技的進步，從一般鎢絲燈發展至現今的冷 陰極螢光燈 f (Cold Cathode Fluorescent Lamp， CCFL) 及發光二極體（Light Emitting Diode，LED)，皆係朝向 體積縮小及扁平化的方向發展。 而目前CCFL因為體積幾乎是不能再縮小，而且CCFL在 升壓到6 0 0伏特電壓時會發生干擾，另外CCFL會造成汞污 染的問題，使得部份國家也將予以禁用。所以LED己漸漸 取代CCFL。然而現今的高亮度LED所產生的局部熱量巨 大，若要取代CCFL作為照明產品，則必須要有合適的散熱 設計，否則會造成LED發光效率降低及壽命縮短等問題， 所以現今LED封裝結構多利用金屬承載基板（Metal Core Print Circuit Board，MCPCB)作為散熱媒介，但 LED仍 無法以高密集度方式設置，原因在於散熱能力仍無法有效 突破，因此有關LED散熱問題部分，是目前業界亟需克服 的難題。 有鑑於.此，本創作係釙對上述之問題，提出一種具高 散熱效率之平面發光源結構，以有效解決上述問題。M270407 IV. Creation Description (1) [Technical Field to which the New Type belongs] This creation relates to a light source structure, especially a planar light source structure with a heat sink. [Previous technology] According to the advancement of technology, from the general tungsten filament lamp to the current cold cathode fluorescent lamp (Cold Cathode Fluorescent Lamp, CCFL) and light emitting diode (Light Emitting Diode, LED) are all Toward volume reduction and flattening. At present, the CCFL can hardly be reduced because of its volume, and the CCFL will interfere when it is boosted to 600 volts. In addition, the CCFL will cause the problem of mercury pollution, and some countries will also ban it. So LED has gradually replaced CCFL. However, today ’s high-brightness LEDs generate huge amounts of local heat. To replace CCFLs as lighting products, they must have a proper heat dissipation design, otherwise they will cause problems such as reduced LED luminous efficiency and shortened life. Therefore, today ’s LED packaging structures make more use of A metal carrier substrate (MCPCB) is used as a heat dissipation medium, but LEDs cannot be set in a high-density manner because the heat dissipation ability cannot be effectively broken. Therefore, the LED heat dissipation problems are currently urgently needed to be overcome in the industry. problem. In view of this, the author proposes a planar light source structure with high heat dissipation efficiency to solve the above problems in order to effectively solve the above problems.
第5頁 M270407 四、創作說明（2) 【新型内容】 本創作之主要目的，係在提供一種具散熱裝置之平面 發光源結構，能高效率且快速的將發光二極體產生之熱能 移除。 本創作之另一目的，係在提供一種具散熱裝置之平面 發光源結構，因能有效率的將發光二極體之熱能移除，進 而使發光二極體之密集度提高。 本創作之另一目的，係在提供一種具散熱裝置之平面 發光源結構，可藉由改變散熱光源結構之排列數量，使此 平面光源結構之大小得因應使用需求而改變之。 根據本創作，一種具散熱裝置之平面發光源結構，其 係由複數散熱光源結構所排列組成，而此種散熱光源結構 包括一基板，此基板具有第一表面及第二表面，而在基板 上設有複數孔洞，且此，第一表面上設有一相互連接之至 少二電極及一電路層；在基板之每一孔洞内分別嵌入發光 二極體，每一發光二極體具有發光面及接著面，嵌入時使 每一發光二極體之發光面朝上，而每一發光二極體之接著 面朝下，且每一發光二極體係與電路層形成電性連接，接 著在基板第二表面上設置一扁形熱導管，此扁形熱導管與 每一發光二極體之接著面相連接，用以吸收每一發光二極 體所散發之熱量，而在基板第二表面上蓋設一散熱鰭片， 此散熱鰭片具有一凹槽，此凹槽可將扁形熱導管包覆於其 内，用以移除扁形熱導管所吸收之熱量。 底下藉由具體實施例配合所附的圖式詳加說明，當更Page 5 M270407 IV. Creation instructions (2) [New content] The main purpose of this creation is to provide a planar light source structure with a heat sink, which can efficiently and quickly remove the heat generated by the light emitting diode. . Another purpose of this creation is to provide a planar light emitting source structure with a heat sink, which can efficiently remove the thermal energy of the light emitting diode, thereby increasing the density of the light emitting diode. Another purpose of this creation is to provide a planar light source structure with a heat dissipation device. The size of the planar light source structure can be changed according to the use requirements by changing the number of arrangement of the heat radiation source structure. According to this creation, a planar light source structure with a heat sink is composed of a plurality of heat sink light source structures, and this heat sink light source structure includes a substrate having a first surface and a second surface, and on the substrate A plurality of holes are provided, and at this time, at least two electrodes and a circuit layer are connected on the first surface; a light-emitting diode is embedded in each hole of the substrate, and each light-emitting diode has a light-emitting surface and Surface, the light-emitting surface of each light-emitting diode is facing up when it is embedded, and the bonding surface of each light-emitting diode is facing downward, and each light-emitting diode system is electrically connected to the circuit layer, and then the second A flat heat pipe is arranged on the surface, and the flat heat pipe is connected to the adhering surface of each light emitting diode to absorb the heat emitted by each light emitting diode, and a heat dissipation fin is arranged on the second surface of the substrate. The heat sink fin has a groove, and the groove can cover the flat heat pipe inside to remove the heat absorbed by the flat heat pipe. Detailed descriptions are given below with specific embodiments and accompanying drawings.
M270407 四、創作說明（3) 容易瞭解本創作之目的、技術内容、特點及其所達成之功 效。 【實施方式】 本創作係一種具散熱裝置之平面發光源結構，請參閱 第一圖至第三圖所示，此種具散熱裝置之平面發光源結構 係由複數散熱光源結構1 0所排列組合而成，而此散熱光源 結構1 0係包括一基板1 2，此基板1 2係選自印刷電路板 (Printed circuit board，PCB);基板 12具有第一表面 14 及第二表面1 6，而在基板1 2上設有複數孔洞1 8，且在基板 1 2的第一表面1 4上設有一相互連接之至少二電極2 0及一電 路層22，此電路層2 2係使用電鍍方式設置在第一表面14 上，且此電路層2 2材質係為銅金屬且其表面鍍以鎳金，以 方便打線作業；在基板1 2的第二表面1 6下設置一扁形熱導 管3 0，基板1 2與扁形熱導管3 0的第二表面1 6係利用環氧樹 脂3 4或其他黏著貼片（adhesion tape )做接合，接著在基 板1 2的每一孔洞1 8内分別膠著上發光二極體2 4，此發光二 極體2 4具有一發光面2 6及一接著面2 8，而發光二極體2 4在 分別設置在每一孔洞1 8時，使每一發光二極體2 4之發光面 2 6朝上，而每一發光二極體2 4之接著面2 8朝下，膠著的方 式是利用導熱膠3 2使每一發光二極體2 4的接著面2 8與扁形 熱導管3 0做相互黏結，此導熱膠3 2係為銀膠，其中每一發 光二極體2 4係利用打線方式做為發光二極體2 4彼此之間的 連接，並且每一發光二極體2 4與基板1 2上的電路層2 2電性M270407 IV. Creation Instructions (3) It is easy to understand the purpose, technical content, characteristics, and effects of this creation. [Embodiment] This creation is a planar light emitting source structure with a heat sink, please refer to the first to third figures. Such a planar light source structure with a heat sink is arranged and combined by a plurality of heat sink light source structures 10 The heat dissipation light source structure 10 includes a substrate 12 which is selected from a printed circuit board (PCB); the substrate 12 has a first surface 14 and a second surface 16 and A plurality of holes 18 are provided on the substrate 12, and at least two electrodes 20 and a circuit layer 22 connected to each other are provided on the first surface 14 of the substrate 12. The circuit layer 2 2 is provided by electroplating. On the first surface 14, and the circuit layer 22 is made of copper metal, and its surface is plated with nickel and gold to facilitate wire bonding operations; a flat heat pipe 30 is provided under the second surface 16 of the substrate 12, The substrate 12 and the second surface 16 of the flat heat pipe 30 are bonded with epoxy resin 34 or other adhesive tapes, and then light-emitting on each of the holes 18 of the substrate 12 respectively. Diode 2 4 which has a light-emitting surface 2 6 One surface 2 8 is attached, and when the light-emitting diodes 24 are respectively disposed in each hole 18, the light-emitting surface 2 6 of each light-emitting diode 2 4 faces upward, and each light-emitting diode 2 4 The bonding surface 2 8 faces downward, and the bonding method is to use a thermally conductive adhesive 32 to bond the bonding surface 2 8 of each light-emitting diode 2 4 and the flat heat pipe 30 to each other. The thermally conductive adhesive 3 2 is a silver glue. Each of the light-emitting diodes 24 is connected to each other using a wire bonding method, and each light-emitting diode 2 4 is electrically connected to the circuit layer 2 2 on the substrate 12
M270407 四、創作說明（4) ' 一 -- t接方式也係採用打線方式，另外在此使用的爲形敎導管 3 〇:、為蒸氣循環型式之熱導管或均熱板，卩快速吸一 極體2/所散發之熱最後將-組散熱Μ 36設置 ^基板12的第二表面16下方，此散熱H片36具有-凹槽 38,此凹槽38可將爲形熱導管3〇包覆在散熱轉片 =移除熱導管30所吸收之熱量，而且在散熱韓片3二 =熱導官30之間更可設—金屬鎔接層4〇，此金屬層* =點合金焊料’且此金屬錄接層4。係利用錄接溫度介 度之間的低溫銲料設置在散熱縛片‘ p = ”、、V官之間，此金屬鎔接層40可使散熱鰭片36盥扁 Ξ =管3Λ達到更?固的接同8夺，亦可獲得更佳的、： : 冑政m 3 “快迷移除扁形熱導管3 g之敎量。 :外基板的第-表面14上可設置一層透明保護】 $ =透=護層42之材f為環氧樹5旨或”等半導體封 t材Γ透明保護層42將每-發光二極體24的發光面 …電路層22包覆住，可防^氣干擾及碰撞受^九面 ::本創作在使用日寺’可先將每一散熱光源結 iL需ί予以組合’亦是將每-散熱光源結構Η排列成: 塬二接者將每一散熱光源結構1〇的二電@ 20連接電 Ϊ二二入電力後使每—發光二極體26發亮，而 透速吸收並在熱導管内將熱源均句分散開來: ==片36將扁形熱導，3Q所 本創作能高效率且快速的將發光二極體之熱能移二Γ 而M270407 IV. Creation Instructions (4) 'A-The t-connection method also uses a wire bonding method. In addition, the shape of the duct is used in this case. 〇 :, a heat pipe or a soaking plate of the steam circulation type. The heat radiated by the polar body 2 will finally set the group of heat sinks 36 under the second surface 16 of the substrate 12. This heat sink 36 has a groove 38, which can be shaped as a heat pipe 3 pack. Overlay the heat transfer sheet = remove the heat absorbed by the heat pipe 30, and more can be set between the heat sink 32 = the heat conductor 30-a metal bonding layer 40, this metal layer * = point alloy solder ' And this metal recording layer 4. The low-temperature solder between the recording temperature and the intermediary temperature is used to set between the heat dissipation fins 'p =', V, and this metal bonding layer 40 can make the heat dissipation fins 36 wash flat = the tube 3Λ is more solid. Following the 8 wins, you can also get a better:: 胄 政 m 3 “Fan removes 3 g of flat heat pipe. : A layer of transparent protection may be provided on the first surface 14 of the outer substrate.] $ = Transparent = The material of the protective layer 42 is an epoxy resin or the like. The transparent protective layer 42 will cover each of the light-emitting diodes. The light-emitting surface of 24 ... covered by the circuit layer 22, which can prevent gas interference and collisions. Nine surfaces :: This work uses Risi's first to combine each heat-dissipating light source and iL. -The heat radiation light source structure is arranged as follows: 塬 The second person connects each of the heat radiation light source structures 10 to 20 @ 20 electricity. After the 22 power is input, each light-emitting diode 26 is illuminated, and the transmissive absorption and The heat source is evenly dispersed in the heat pipe: == piece 36 will flat heat conduction, 3Q's original creation can efficiently and quickly shift the heat energy of the light-emitting diode by two Γ and
M270407 四、創作說明（5) 使發光二極體設置的密集度提高，而且可藉由改變散熱光 源結構1 0之排列數量，使該平面光源結構之大小得因應使 用需求而改變之。 以上所述係藉由實施例說明本創作之特點，其目的在 使熟習該技術者能暸解本創作之内容並據以實施，而非限 定本創作之專利範圍，故，凡其他未脫離本創作所揭示之 精神所完成之等效修飾或修改，仍應包含在以下所述之申 請專利範圍中。M270407 IV. Creative Instructions (5) The density of the light-emitting diodes is increased, and the size of the planar light source structure can be changed by changing the arrangement number of the heat-dissipating light source structure 10 to meet the needs of use. The above is the description of the characteristics of this creation through the examples. The purpose is to enable those skilled in the art to understand the content of this creation and implement it, not to limit the scope of patents for this creation. Therefore, all others do not depart from this creation. Equivalent modifications or modifications made by the disclosed spirit should still be included in the scope of patent application described below.
第9頁 M270407 圖式簡單說明 【圖式簡單說明】 第一圖為本創作之立體示意圖。 第二圖為本創作單一散熱光源結構立體分解圖。 第三圖為本創作散熱光源結構剖面分解示意圖。 【主要元件符號說明】Page 9 M270407 Simple illustration of the drawing [Simple illustration of the drawing] The first picture is a three-dimensional schematic drawing of the creation. The second picture is a three-dimensional exploded view of the structure of a single heat sink. The third figure is an exploded schematic diagram of the structure of the creative heat sink light source. [Description of main component symbols]
第ίο頁 10 散 执 4 光 源 結構 12 基 板 14 第 一 表 面 16 第 二 表 面 18 孔 洞 20 電 極 22 電 路 層 24 發 光 二 極 體 26 發 光 面 28 接 著 面 30 扁 形 献 4 導 管 32 導 軌 膠 34 環 氧 樹 脂 36 散 敎 4 鰭 片 38 凹 槽 40 金 屬 鎔 接 層 42 透 明 保 護 層 44 電 源 線Page 10 Scattering 4 Light source structure 12 Substrate 14 First surface 16 Second surface 18 Hole 20 Electrode 22 Circuit layer 24 Light-emitting diode 26 Light-emitting surface 28 Next surface 30 Flat donation 4 Conduit 32 Rail glue 34 Epoxy resin 36 Scatter 4 fins 38 grooves 40 metal bonding layer 42 transparent protective layer 44 power cord