TWM269571U - Multi-chip-on-film package and the flexible multi-layer wiring board for the same - Google Patents

Description

M269571_ IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to a semiconductor package structure, and in particular to a multi-chip thin film package that is suitable for packaging Nanyi, and its number Flexible multilayer circuit board. '[Prior art] The conventional chip-on-film package (COF) is a common type of semiconductor package, which is used for flip chip bonding on flexible circuit boards ( Flexible circuit board (FPC) technology, which can drive the Ic and other electronic components directly on the film (with 11 „), in order to achieve lighter, thinner and shorter. Because today's electronic products are required to have strong functionality Therefore, the number of I / O terminals of the chip must be increased, and the connection pads of the flexible circuit board used to carry the chip must be increased with the number of I / O terminals of the chip. However, in the current technology, the distance between the connection pads is reduced. There is a limitation in its process capability. When the distance between the connection pads is less than 6〇111]], the arrangement is too dense and the short circuit is prone to occur. If the distance between the connection pads cannot be reduced, the length of the chip must be increased to With connection pads that cannot reduce the pitch: this, crystal breakage is easy to occur during wafer dicing and wafer packaging. Figure 2f, Figure 1, a conventional wafer thin film package 1 0 0 series package ^ nn \ RiRi film 120 and an underfill material 130, the electric coil is a layered circuit structure and includes-the substrate iu, a circuit layer dull layer 1 1 3, the circuit layer 丨 i 2 series is formed on one of the substrates

Page 6 M269571_ IV. Creation Instructions (2) Surface 11 1 a 'The protective layer 11 3 is formed on the circuit layer i 丨 2 to protect the circuit layer 11 2', where the circuit protective layer 丨 丨 3 has An opening 11 3 a is provided to expose the plurality of flip-chip pads 2 a of the circuit layer 11 2. The wafer 1 2 0 has an active surface 121 ′ and includes a plurality of bumps 122 (as shown in FIG. 2) formed on the active surface 121, which are electrically connected to the wafer 12 0 and the flip-chips.塾 112a. The underfill material 13 is formed between the circuit tape 丨 丨 0 and the wafer 120 to seal the active surface j 2 1 of the wafer 120 and the flip-chip pads 112a. Because in the conventional multi-chip thin film package structure, the chip i 2 0 is electrically connected to the circuit tape 11 by the flip-chip pads i 1 2 a, however, with the number of terminals of the chip 1 20 Increase, the number of bumps j 22 of the wafer 12 will increase, but due to the limitation of the process capability of the 2P array pads, the 2C pads will be limited if the array pitch is too small.丨 2 a There will be a short circuit problem, and it will increase the difficulty of the flip-chip pads 112 & in the manufacturing process. [New content] The main purpose of this creation is to provide a multi-chip thin-film package structure, which includes a flexible multilayer circuit board, a first chip, a plurality of bumps, a second chip, and a plurality of fresh wires. The flexible multilayer circuit board includes a first circuit layer, a plurality of wire bonding pads, a second circuit layer, and a plurality of flip-chip pads. The wire bonding pads are electrically connected to the first circuit layer. The flip-chip pads are electrically connected to the second circuit layer, the first chip is connected to the flip-chip pads through the bumps, and the bonding wires are connected to the second chip and the chip. These flexible multi-layer circuit boards are based on M269571__ IV. Creation instructions (3) The first circuit layer and the second wire and two chips can enhance the second-purpose system board of the polycrystalline book creation. It includes a substrate, a first circuit layer, and a plurality of circuit layers connected to the first circuit layer, the circuit layers, wherein the flip-chips are electrically connected to the Japanese chip, so the plurality of chips can be connected. To make as many thin wafers as possible. Layer circuit board with several bonding wires, the flexible multilayer circuit layer, a plurality of wire bonding pads, and pads, the substrate has an upper surface formed on the upper surface of the upper surface of the substrate and is electrically connected to the upper surface The two circuit layers formed on the lower surface of the substrate, the first chip includes the first solder pads of a plurality of wafers on the active surface and an active surface and includes a plurality of pads, the bonding wires It is connected to the first wire pad, which is suitable for packaging. [Embodiment] The circuit layer is electrically connected to the functionality of the first chip thin film package. The invention is to provide a flexible first circuit layer and a plurality of chip bonding pads. The chip bonding pads are electrically connected to the pads and the multi-layer printed circuit boards are flexible. Functional multi-chip thin film encapsulation package structure, which includes, a plurality of bumps, a second circuit board includes a substrate, a second circuit layer and a plurality of surfaces and a lower surface. The wire bonding pads expose the first circuit layer, the second, the flip-chip pads have an active surface and a first glow pad, and the bumps are the flip-chip pads. A plurality of second wafers with a plurality of second solder density terminals on the active surface. The chip is electrically connected to the first-layer circuit line pad, and the second line is provided for a plurality of load-bearing structures. A flexible chip and a plurality of first-line chip-on-chip circuit layers are connected to the substrate, the circuit layer system is connected to the first surface, and the first chip device is connected to the second solder and the plurality of printed circuits.

Page 8 M269571 _ IV. Creation Instructions (4) With reference to the attached drawings, this creation will enumerate the following embodiment descriptions. According to the first embodiment of this creation, please refer to FIGS. 3 and 4. A multi-chip thin film package structure 200 includes a flexible multilayer circuit board 21, a first chip 220, a second chip 230 and a plurality of Bonding wires 240. The flexible multilayer circuit board 21 includes a substrate 21, a first circuit layer 2 1 2, a plurality of flip-chip pads 21 3, a second circuit layer 214, and a plurality of bonding wires.接 垫 215。 215 pads. The substrate 211 has an upper surface 21a and a lower surface 21 lb. The first circuit layer 212 is formed on the upper surface 211a of the substrate 21 1. The second circuit layer 214 is formed on the substrate. The lower surface 21 lb of the substrate 211 is provided with a plurality of wire bonding pads 2 15 exposed on the upper surface 211 a of the substrate 211 and electrically connected to the first circuit layer 2 丨 2, and a plurality of flip-chip contacts The pad 213 is exposed on the upper surface 2 1 ia of the substrate 211 and is electrically connected to the second circuit layer 21 4. In this embodiment, the flexible multilayer circuit board 20 includes a plurality of plated through holes 21 6, which are electrically connected to the flip-chip pads 21 3 and the second circuit layer 21 4. In addition, The distance between the flip-chip pads 21 3 may be greater than 60 / zm. Preferably, the flexible multilayer circuit board 21 includes a first protective layer 217 formed on the first circuit layer 212. The upper surface 211a of the substrate 211 has at least one opening 217a. The opening 217a exposes the flip-chip pads 21 3, and the opening 21 7a exposes the wire bonding pads 21 5. The flexible multilayer circuit board 2 10 further includes a second protective layer 218 formed on the lower surface 2 11 b of the first circuit layer 214 and the substrate 211 to protect the second circuit layer. 21 4. The first wafer 220 is flip-chip bonded to the upper surface 211a of the substrate 2U. The first wafer 220 has an active surface 221 and a back surface 222.

M269571 Fourth, creation instructions (5)

A plurality of first pads 223 are included on the active surface 221, and a plurality of bumps 224 are connected to the first pads 223 of the first wafer 220 and the flip-chip pads 2 1 3. In the embodiment, the opening 217 of the first protective layer 21 7 is larger than the active surface 221 of the first chip 220. Preferably, the multi-chip thin film packaging structure 200 includes an underfilling material 250. Between the first chip 220 and the flexible multilayer circuit board 210, the chip-on pads 2 1 3 and the active surface 221 of the first chip 220 are sealed. Alternatively, a corner bonding adhesive (corner bond) is formed between the first chip 220 and the flexible multilayer circuit board 21 o to seal the flip-chip connectors 213 and the bumps 224. To save glue volume. The second wafer 230 is stacked on the back surface 222 of the first wafer 220. The second wafer 230 has an active surface 231 and includes a plurality of second pads 232 on the active surface 231. The bonding wire 240 is connected to the first bonding pads 2 3 2 and the bonding pads 2 1 5 of the second chip 230. In this embodiment, the multi-chip thin film packaging structure 200 includes a colloid 26. It is formed on the upper surface 21 la of the substrate 21 1 to seal the first wafer 22, the second wafer 230 and the bonding wires 240. The sealing compound 26 () may be a liquid compound formed by spot coating.

According to the multi-chip thin-film package structure 2000 created by this creation, since the first chip 220 and the second chip 230 are disposed on the flexible multilayer circuit board wo, and individually through the wire bonding pads 214, the The flip-chip pads 213 are electrically connected to the flexible multilayer circuit board 200 so as to be suitable for packaging high-density terminals. The chip-pads 213 or wiring pads 215 can solve the deficiency Problems, which in turn reduces the size of the product, and

Page 10 M269571___ IV. Creative Instructions (6) Functionality of the product. In this creation, the installed wafer can be adjusted appropriately. In the second embodiment of this creation, another multi-chip thin film packaging structure can be provided with a plurality of wafers on different surfaces of a reel, please refer to FIG. 5 A multi-chip thin-film package structure 300 includes a flexible multilayer circuit board 310, a first chip 320, a plurality of bumps 330, a second chip 350, and a plurality of bonding wires 360. The flexible multilayer circuit The board 310 includes a substrate 311, a first circuit layer 312, a plurality of wiring pads 313, a second circuit layer 314, and a plurality of flip-chip pads 315. The substrate 3 11 has an upper surface 31a. With the lower surface 311b, the first circuit layer 312 is formed on the upper surface 311a of the substrate 3 11, and a plurality of wire bonding pads 313 are exposed on the upper surface 311 a of the substrate 3 11 and are electrically connected to the upper surface 311 a. The first circuit layer 312 and the second circuit layer 314 are formed on the lower surface 311b of the substrate 311, and a plurality of flip-chip contacts 315 are exposed on the lower surface 311b of the substrate 311. The flip-chip pads 3 1 5 are electrically connected to the second circuit layer 3 丨 4, preferably The flexible multilayer circuit board 3 1 0 includes a plurality of adhesive layers 3 丨 6, which are formed on the upper surface 3 lla and the lower surface 311b of the substrate 311 to respectively bond the first circuit layer. 312 and the second circuit layer 314 are on the substrate 311. In this embodiment, the flexible multilayer circuit board 3 1 0 includes a first protective layer 3 1 7 and a second protective layer 3 1 8, and the first protective layer 3 1 7 is formed on the first The circuit layer 312 and the upper surface 311a of the substrate 311, the second protective layer 318 is further formed on the second circuit layer 314 and the lower surface 311b of the substrate 311 and has a plurality of exposed crystals The opening 3i8a of the pad 315. The first wafer 320 is bonded to the flexible multilayer circuit board 3 i ◦ M269571 on page 11. Fourth, the lower surface 311b of the creative description (7), the first wafer 320 has an active surface 321 and Containing a plurality of first pads 322 on the active surface 321, the first pads 322 are connected to the flip-chip pads 315 through a plurality of bumps 330, preferably a corner joint adhesive 340 ( corner bond) is formed between the flexible multilayer circuit board 3 1 0 and the first wafer 3 2 0 to seal the flip-chip pads 315, the bumps 330 and the first wafer 320. Active surface 321. The second wafer 3 50 is disposed on the upper surface 311 a of the substrate 3 11, and the second wafer 350 has an active surface 351 and includes a plurality of second pads 352 on the active surface 351. . The plurality of bonding wires 360 are electrically connected to the second bonding pads 352 of the second chip 350 and the bonding pads 31 3. In this embodiment, a sealant 370 formed by curing the liquid glue is formed on the upper surface 3 11 a of the substrate 3 11 to seal the second wafer 3 50 and the bonding wires 360. — '

In the multi-chip thin-film package structure 300, in order to increase its functionality, the first chip 320 is made by the wire bonding pads 3 of the flexible multilayer circuit board 310 and the flip-chip pads 315. 2. The second chip 350 and the flexible multilayer circuit board 3100 are electrically connected. Therefore, the distance between the flip-chip pads 3 and 3 can be greater than 60 / zm to avoid the occurrence of a short circuit. In addition, It is possible to prevent the first wafer 320 or the second wafer 350 from being cracked due to the length of the first wafer 320 or the second wafer 350 to increase the yield of the product. The scope of protection of this creation shall be determined by the scope of the attached patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of this creation shall fall within the scope of protection of this creation. .

M269571 — Simple illustration ^ ------ 1-[Simplified illustration] Figure 1 ·· Sectional schematic diagram of the conventional wafer thin film packaging structure; Figure 2 ·· One of the conventional wafer thin film packaging structures Bottom view; (not mentioned in the text) Figure 3: A cross-sectional view of a multi-chip thin film package structure according to the first specific embodiment of the present invention; Figure 4 · According to the first specific embodiment of the present invention, the Overhead view of a flexible multilayer circuit board; and '

FIG. 5 is a schematic cross-sectional view of a multi-chip thin film package structure according to a second embodiment of the present invention.

Simple explanation of component symbols: 100-chip thin-film package structure 110 tape 111 substrate 111a surface 112 circuit layer 112a flip-chip pad 113 protective layer 113a opening 120 chip 121 active surface 122 bump 130 underfill material 200 multi-chip thin film package structure 210 Flexible multilayer circuit board 211 substrate 211a upper surface 211b lower surface 212 first circuit layer 213 flip-chip pad 214 first-circuit layer 215 wiring connection 216 plated through hole 217 first protective layer 217a opening

Page 13 M96QS71 Schematic description

Page 14 218 Second protective layer 220 First wafer 221 Active surface 222 Back surface 223 First fresh pad 224 Bump 230 Second wafer 231 Active surface 232 Second welding 240 Welding wire 250 Underfill 260 Sealant 300 Multi wafer film Package structure 310 Flexible multilayer circuit board 311 Substrate 311a Upper surface 311b Lower surface 312 First circuit layer 313 Wire bonding pads 314 Second circuit layer 315 Chip-on-chip pads 316 Adhesive layer 317 First protective layer 318 Second protection Layer 318a, opening 320, first wafer 321, active surface 322, first solder 330, bump 340, fillet bonding adhesive 350, second wafer 351, active surface 352, second welding 360, welding line 370, and sealant

Claims (1)

M269571 5. Scope of patent application [Scope of patent application] 1. A multi-chip thin film package structure including: a flexible multilayer circuit board including: a substrate having an upper surface and a lower surface; a first circuit Layer, which is formed on the substrate on the top surface of the plurality of wire bonding pads, which is exposed on the substrate, the upper connection to the first circuit layer; a second circuit layer, which is formed on the substrate The following table includes a plurality of flip-chip pads, which are exposed on the substrate and are connected to the second circuit layer. The first chip is provided with a plurality of first plurality of convex bumps. The second and second wafers of the crystal bonding pads have a second bonding pad; a plurality of soldering pads are soldered 2. If the application is dedicated, the flexible connection of the flip-chip bondings 3, such as the application of a special film 'its The flip chip is bonded to the substrate with an active surface and a back surface and is included in the pad; the block 'is connected to the first wafers of the first wafer and is disposed on the back of the first wafer An active face and a plurality of active faces and faces Surface and electrical surface; and surface and electrical surface, a pad and a surface on the active surface, the first plurality of lines' which are connected to the second pads of the second chip and the range described in the first item The multi-wafer film-sealed multilayer circuit board includes a plurality of plated through holes, a pad, and the second circuit layer. The multi-chip thin-film package structure described in item 1 of the scope of interest is an electrically connected structure. 'Page 15 M269571 5. The scope of the patent application also includes an underfilling material, which is formed on the first chip and Between the flexible multilayer circuit boards. 4. The multi-chip thin-film package structure described in item 丨 of the patent application scope, further comprising a corner corner bonding adhesive, which is formed between the corner chip and the flexible multilayer circuit board. 5. The multi-chip thin film package as described in item 丨 of the patent application, wherein the distance between the flip-chip pads is greater than 60 # m. 6. The multi-chip thin film package as described in item 丨 of the patent application scope, wherein the flexible multilayer circuit board includes a first protective layer on the upper surface of the first circuit layer and the substrate. . "" 7. The multi-wafer thin film encapsulation described in item 6 of the scope of the patent application, wherein the first protective layer has at least one opening, which exposes the ^ crystal pad. 2. 8. As described in item 7 of the patent scope of Shenqing In the multi-chip thin film package, the opening of the first protective layer is larger than that of the first wafer. 9. The multi-chip thin film package described in item 8 of the stated patent scope also includes the first protective layer of the The opening system is more revealing. Polycrystalline as described in item i or 6 of the scope of this patent application ;; = structure; t; flexible multilayer circuit board system includes-a second protective layer, which is formed on the second circuit layer And the bottom surface of the substrate. 12: = Fan: The multi-chip thin film packaging structure described in item 1, and another sealant is formed on the top surface of the substrate to seal the first substrate. A chip, the second chip and the bonding wires. Human teaching 12, such as the multi-chip thin film package structure described in item i of the patent scope, ΙΗ Page 16 M269571 V. Patent application scope Flex: The circuit board system includes a plurality of adhesive layers, which form a ίίϊΐ surface and the lower surface ', which are used to bond the first circuit layer and the first circuit layer respectively. The substrate. 2. A kind of reversible multilayer circuit board package suitable for multi-chip thin film packaging, which includes a substrate and an upper surface and a lower surface; a first circuit layer formed on the upper surface of the substrate; Wire bonding pads, which are electrically connected to the first and second circuit layers, are formed on the lower surface of the substrate & a plurality of flip-chip pads, which are electrically connected to the second Line layer. 14 2. The flexible multilayer circuit board as described in item 13 of the scope of patent application, wherein the pitch of the flip-chip pads is greater than 60 ”m. Ί 5. The flexible as described in item 13 of the scope of patent application The multilayer circuit board includes: a first-layer circuit board including a first protective layer, which forms a ^ Λ, '· layer and the upper surface of the substrate and exposes the wire connections. The flexible multilayer circuit board described in item 15, the first protective layer has an opening, which exposes the flip-chip connections. The flexible multilayer circuit board described in item 15 of the scope of patent application. The flexible multilayer circuit board includes a second protective layer which is formed on the lower surface of the second circuit layer and the substrate. 8. As claimed, flexible as described in item 13 or 16 of the patent scope A multilayer multilayer circuit, wherein the second protective layer has an opening which exposes the flip-chips M269571 Pad. 19. The flexible multilayer circuit according to item 13 of the scope of patent application, wherein the flip-chip pads are exposed on the upper surface of the substrate. 20. The flexible multilayer circuit board as described in item 19 of the scope of the patent application, further comprising a plurality of plated through holes for electrically connecting the flip-chip pads and the second circuit layer. 21. The flexible multilayer circuit board as described in item 13 of the scope of application for patents, wherein the flip-chip pads are exposed on the lower surface of the substrate. 22. The flexible multilayer circuit board as described in item 13 of the scope of the patent application, wherein the flexible multilayer circuit board comprises a plurality of adhesive layers formed on the upper surface of the substrate and the substrate. The lower surface is used for the circuit layer and the second circuit layer on the substrate, respectively. Digreen 23. A multi-chip thin film package structure comprising: a flexible multilayer circuit board comprising: a substrate having an upper surface and a lower surface; a first circuit layer formed on the substrate The upper surface; a plurality of wire bonding pads that are exposed on the upper surface of the substrate and are connected to the first circuit layer; a second circuit layer that is formed on the lower surface of the substrate; And a plurality of flip-chip pads, which are exposed on the lower surface of the substrate and are electrically connected to the second circuit layer; a first chip 'which is a flip-chip bonded to the lower surface of the substrate, the The first sheet is a plurality of first pads having an active surface and included on the active surface; Page M269571 _ V. Patent Application Scope I — — a plurality of bumps, which are connected to the first solder and the flip-chip pads of the first wafer; a second wafer, which is arranged on the base The upper surface of the material, the second wafer has an active surface and includes a plurality of second pads on the active surface; and a plurality of fresh wires connected to the second wafers of the second wafer The solder pads and the wire bonding pads of the second circuit layer. 〃 24. The multi-chip thin film encapsulation structure described in item 23 of the scope of the patent application ’further includes an underfilling material, which A system is formed between the first chip and the flexible multilayer circuit board. 25. The multi-chip thin film package structure described in item 23 of the scope of the patent application further includes a corner bond, which is formed between the first chip and the flexible multilayer circuit board. 26. The multi-chip thin film encapsulation structure described in item 23 of the scope of the patent application, wherein the pitch of the flip-chip pads is greater than 60 v m. 27. The multi-chip thin film package structure according to item 23 of the scope of the patent application, wherein the flexible multilayer circuit board includes a first protective layer formed on the first circuit layer and the substrate. The wire pads are exposed on the surface. / 28. The multi-wafer film sealing as described in the scope of the patent application No. 23 or 27_ Structure 'wherein the Hai Hai multilayer circuit board includes' a second protective layer, which is formed on the second The circuit layer is on the lower surface of the substrate. 2, 29. The multi-chip thin film encapsulation structure described in item 28 of the patent application scope, wherein the second protective layer has at least one opening, which exposes these M269571 30. The multi-wafer thin film encapsulation according to item 29 of the scope of patent application, wherein the opening of the second protective layer is larger than the first surface. Yueyue's initiative 3 1. The multi-chip thin-film encapsulation as described in item 23 of the patent application scope, further comprising a colloid formed on the top surface of the substrate, sealing the second wafer and the Some fresh lines.乂 32. The multi-chip thin-film package structure according to item 23 of the scope of the patent application, wherein the flexible multilayer circuit board includes a plurality of adhesive layers formed on the upper surface and the lower surface of the substrate Is used to respectively knot the third circuit layer and the second circuit layer on the substrate.