TWM267455U - Improved structure of test fixture for circuit board - Google Patents

Improved structure of test fixture for circuit board Download PDF

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Publication number
TWM267455U
TWM267455U TW93216765U TW93216765U TWM267455U TW M267455 U TWM267455 U TW M267455U TW 93216765 U TW93216765 U TW 93216765U TW 93216765 U TW93216765 U TW 93216765U TW M267455 U TWM267455 U TW M267455U
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Taiwan
Prior art keywords
density
board
plate
test
circuit board
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TW93216765U
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Chinese (zh)
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Shu-Mei Chen
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Shu-Mei Chen
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Priority to TW93216765U priority Critical patent/TWM267455U/en
Publication of TWM267455U publication Critical patent/TWM267455U/en

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Description

M267455 八、新型說明: 【新型所屬之技術領域】 本創作是有關於電路板測試治具改良結構,特別是指 一種使用簡便、可適用於各種不同電路板測試且可有效降 低測試成本之測試治具結構。 【先前技術】 習見之電路板測試治具結構,乃如第一至三圖所示, 其主要係由一底座4及一針板5所組成,於該底座4之一 旁側設有一萬用密度板41,且其内設有複數貫穿頂、底 二側之導電元件4 1 1,並使各導電元件4 1 1經由導線 連接至萬用密度板4 1旁側預設之複數測試插槽4 2,可 供插接各測試儀器之插頭,針板5係依一預設待測電路板 6之電路上待測試之點而設有複數貫穿頂、底二側之探針 5 1 ;使該針板5固定於萬用密度板4 1上之定位,則可 使探針5 1與對應之導電元件4 1 1形成一導通,而該待 測電路板6則可固定於針板5上,利用各探針5 1接觸待 測電路板6上之待測試點’經由各導電元件4 1 1至測試 插槽4 2輸出至測試儀器而可形成一測試迴路。 然而,上述之電路板測試治具結構於應用上有下列缺 失: 由於萬用密度板41係於表面遍佈縱橫等中心距 (PITCH)之導電元件4 1 1,而該針板5之探針5 1係依待 測電路板6上之各待測試點位置而定,因此,該萬用密度 M267455 板4 1之選用係依待測電路板6之最小待測試點(即探針 5 1 )中心距而定,如此一來,萬用密度板4 1上其餘大 多數未與探針5 1接觸之導電元件4 1 1皆未被使用而形 成浪費,並不符合經濟效益。 由於萬用密度板41上各導電元件411密度設定係 依針板5之探針5 1中心距而定,而該針板5之探針5 1 1 則隨待測電路板6不同而改變,因此,測試各不同待測電 , 路板6之測試治具無法共用,而必須依各不同待測電路板 * 6設計各適用之之測試治具,不但增加產品開發時程,亦 增加品管測試之成本。 有鑑於習見之電路板測試治具結構有上述之缺點,創 作人乃針對該些缺點研究改進之道,終於有本創作產生。 【新型内容】 本創作旨在提供一種電路板測試治具改良結構,其主 修要係以一第二密度板墊設於針板下方,且該第二密度板上 具有極小中心距之導電元件1,可完全接觸於該針板上預 4 設測試待測電路板之探針,而於底座之萬用密度板上方設 ’ 有一第一密度板,該第一密度板上具有對應於萬用密度板 上導電元件較大中心距之導電元件,而於該第一、二密度 板之間則設有一電路轉換板,於該電路轉換板之上、下二 側面分別設有連通之銅箔線路,使該第二密度板之導電元 件與第一密度板之導電元件形成一銜接,藉以使該待測電 路板上之待測試點可經由針板、第二密度板、電路轉換板、 6 M267455 第一密度板而與底座之萬用密度板形成一導通,且由底座 之測試插槽對外銜接儀器加以測試,其於測試不同待測電 路板時,僅需更換相對應之針板與電路轉換板即可,而無 需變更底座之結構及設計,可有效降低測試治具變換之成 本及時間,此為本創作之主要目的。 依本創作之此種電路板測試治具改良結構,其藉由電 路轉換板將待測電路板上對應極密之測試中心距適當放 大,而可以中心距較大之萬用密度板承接,如此,可有效 降低底座之開發成本(中心距大之萬用密度板成本較低), 且相對的減少萬用密度板之測試空點,降低測試費用,此 為本創作之另一目的。 至於本創作之詳細構造、應用原理、作用與功效,則 參照下列依附圖所作之說明即可得到完全的瞭解: 【實施方式】 如第一至三圖所示,其為習見之電路板測試治具結 構,其主要構成以及其缺失,已如前所述,此處不再重複 欽述。 第四圖係本創作之構造分解圖,由該圖可以很明顯地 看出,本創作主要包括:第一密度板1、電路轉換板2及 第二密度板3等部份,其中該第一密度板1上貫設有縱、 橫等中心距之導電元件11 (可為探針、彈簧或其它銜接 之導體),可分別對應於一底座4上萬用密度板4 1較大間 距之導電元件4 1 1,且使各導電元件4 1 1經導線銜接 M267455 至萬用岔度板4 1旁側之測試插μ ^ % 4 2,可供預設之插頭 插接而連接至各測試儀器,而該繁_ 密度板3上則貫設有 縱、橫等中心距之導電元件3l . v可為探針、彈簧或其它 銜接之導體),該導電元件3 1係配人 3 一與待測電路板6上 待測試點接觸之針板5上探針5 Ί ^ 、·—___ 上而具有小於前述第一密 元件3 1,電路轉換 度板1之導電元件11中心距之導電 板2係設於前述第一、二密度板1 t 、3之間,於該電路轉 換板2之上、下二侧面設有相互連场 ^ 、之鋼镇線路2 1。 第五圖係本創作之組合示意圖 口 由其參照第六圖之组 合剖面圖’可知當該第一密度板]麥 夏於萬用密度板4Ί卜 之定位,各導電元件1 1係與導電元件 广枚4丄上 而第二密度板3係墊設於針板5下方1 1銜接導通’ 件3 1與探針5 1銜接導通,而設於’可使各導電元 3之間的電路轉換板2,可經由鋼箔 、—密度板1、 第二密度板3之各導電元件31食楚路21分別銜接該 、卑一密声;Ί … 元件1 1,使該待測電路板6上之待挪試又1之各導電 之探針5 1、第二密度板3之導電元件3點可鉍由針板5 2之銅箔線路21、第一密度板1夕權 1、電路轉換板 密度板41之導電元件411連通,再、 與萬用 外連接至測試儀器。 >#插槽42向 本創作上述結構中,藉由該電路轉換板2人 二密度板1、3之銜接,可將原本較密集中心配合第一、 路板6上待測試點(即探針51)適當放大,矩之待測電 至較稀疏中心距(成本較低廉)之萬用矣^: 4 、更於銜接 山度板41上各導 M267455 私 4丄,除可降低治具設備之開發費用及測試成本 卜亦可簡化測试產品變換之作業及時程,提昇整體測試 作業之效率。 由上所述可知,本創作電路板測試治具改良結構確實 /、有降低/η具d又備之開發費用及測試成本、提昇測試效率 之功效,確已具有產業上之利用性、新穎性及進步性。 惟以上所述者,僅為本創作之一較佳實施例而已,並 非用來限定本創作實施之範圍。即凡依本創作申請專利範 圍所作之均等變化與修飾,皆為本創作專利範圍所涵蓋。 【圖示簡單說明】 第一圖係習見電路板測試治具之結構分解圖。 第二圖係習見電路板測試治具之組合外觀圖。 第二圖係習見電路板測試治具之組合剖面圖。 第四圖係本創作之構造分解圖。 第五圖係本創作之組合示意圖。 第六圖係本創作之組合刮面圖。 【主要元件符號說明】 1 .....第一密度板 11、31、411. ·.導電元件 2 .....電路轉換板 21——銅箔線路 3 .....第二密度板 M267455 4 .....底座 41____萬用密度板 42.. ..測試插槽 5 .....針板 51.. ..探針 6 .....待測電路板M267455 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to the improved structure of circuit board test fixtures, especially a test fixture that is easy to use, can be applied to various circuit board tests, and can effectively reduce test costs. Structured. [Previous technology] The conventional circuit board test fixture structure is as shown in the first to third figures, which is mainly composed of a base 4 and a pin plate 5, and one universal side is provided on one side of the base 4. The density plate 41 is provided with a plurality of conductive elements 4 1 1 penetrating through the top and bottom sides, and each conductive element 4 1 1 is connected to the universal density plate 4 1 by a plurality of preset test slots on the side. 4 2. It can be used to connect the plugs of various test instruments. The needle plate 5 is provided with a plurality of probes 5 1 penetrating the top and bottom sides according to a preset test point on the circuit of the circuit board 6 to be tested; The pin plate 5 is fixed on the universal density plate 41 at a position, so that the probe 51 and the corresponding conductive element 4 1 1 can be connected to each other, and the circuit board 6 to be tested can be fixed on the pin plate 5 A test loop can be formed by using each of the probes 51 to contact the point to be tested on the circuit board 6 to be tested through the conductive elements 4 1 1 to the test slot 4 2 and output to the test instrument. However, the above-mentioned circuit board test jig structure has the following defects in application: Because the universal density board 41 is a conductive element 4 1 1 whose surface is covered with vertical and horizontal equal center distances (PITCH), and the probe 5 of the needle board 5 1 is determined by the positions of the test points on the circuit board 6 to be tested. Therefore, the universal density M267455 board 4 1 is selected based on the center of the minimum test point of the circuit board 6 (ie, the probe 5 1). Depending on the distance, in this way, most of the remaining conductive elements 4 1 1 on the universal density board 41 which are not in contact with the probe 51 are not used and waste is formed, which is not economical. Because the density setting of each conductive element 411 on the universal density board 41 is determined by the center distance of the probe 51 of the needle board 5, and the probe 5 1 1 of the needle board 5 changes with the circuit board 6 to be tested. Therefore, the test fixtures of the circuit board 6 cannot be shared when testing different powers to be tested. Instead, each test fixture must be designed according to the different circuit boards * 6 to be tested, which not only increases product development time, but also increases quality control. The cost of testing. In view of the above-mentioned shortcomings of the conventional circuit board test fixture structure, the creator researched and improved these shortcomings, and finally created this creation. [New content] The purpose of this creation is to provide an improved structure of circuit board test fixtures. The main focus is to use a second density board pad under the needle board, and the second density board has a conductive element with a very small center distance. 1, can be fully contacted with the probe board. The probe for testing the circuit board to be tested is set on the base, and there is a first density board above the universal density board on the base. A conductive element with a larger center distance of the conductive element on the density board, and a circuit conversion board is provided between the first and second density boards, and copper foil lines are provided on the upper and lower sides of the circuit conversion board. To form a connection between the conductive element of the second density plate and the conductive element of the first density plate, so that the test point on the circuit board to be tested can pass the needle board, the second density board, the circuit conversion board, 6 M267455 The first density board is connected to the universal density board of the base, and the test socket of the base is connected to the external device for testing. When testing different circuit boards to be tested, only the corresponding pin board and circuit switch need to be replaced. Plate can, without need to change the structure and design of the base, can effectively reduce the primary object of converting it into a test fixture and the present time, this present Creation. This circuit board test fixture based on this innovation has an improved structure, which appropriately enlarges the correspondingly dense test center distance of the circuit board under test by a circuit conversion board, and can accept a universal density board with a larger center distance. It can effectively reduce the development cost of the base (the cost of the universal density board with a large center distance is lower), and relatively reduce the test empty point of the universal density board, and reduce the test cost. This is another purpose of the creation. As for the detailed structure, application principle, function and effect of this creation, you can get a complete understanding by referring to the following descriptions with reference to the drawings: [Embodiment] As shown in the first to third figures, it is a conventional circuit board test rule. The structure, its main composition and its absence have already been described previously, and will not be repeated here. The fourth picture is an exploded view of the structure of this creation. It can be clearly seen from this figure that the creation mainly includes: the first density board 1, the circuit conversion board 2 and the second density board 3, among which the first The density plate 1 is provided with conductive elements 11 (which can be probes, springs or other connected conductors) that have a center-to-center distance, and can correspond to a large-area conductive plate on the base plate 4 Element 4 1 1 and each conductive element 4 1 1 is connected by a wire M267455 to the universal test plate 4 1 at the side of the test plug μ ^% 4 2 which can be preset plugs to connect to each test instrument And the conventional _ MDF 3 is provided with conductive elements 3l, v, etc. with center-to-center distances. V may be a probe, a spring or other connected conductors). The probe 5 on the pin board 5 on the circuit board 6 which is in contact with the point to be tested has a smaller distance than the aforementioned first dense element 3 1 and the conductive element 2 of the center distance of the conductive element 11 of the circuit conversion plate 1 It is located between the aforementioned first and second density plates 1 t and 3, and a phase is arranged above and below the circuit conversion plate 2 Interconnection field ^, Zhigang Town Line 2 1. The fifth picture is the combination diagram of this creation. From the reference to the sixth section of the combined cross-section view 'you can know when the first density board] Mai Xia's positioning on the universal density board 4Ί, each conductive element 11 and the conductive element On the large piece 4 丄, the second density plate 3 is arranged below the needle plate 5 1 1 is connected and connected, and the piece 3 1 and the probe 51 are connected and connected, and is provided to 'allow the circuit conversion between each conductive element 3' The plate 2 can be connected to each other through the conductive elements 31 of the steel foil, the density plate 1 and the second density plate 3, and the sound path 21, respectively; 、… the component 1 1 makes the circuit board 6 to be tested To be tested, each of the conductive probes 5 1 and 3 of the conductive elements of the second density plate 3 can be made of bismuth from the needle plate 5 2 of the copper foil circuit 21, the first density plate 1 and the circuit conversion plate 1 The conductive element 411 of the density plate 41 is in communication, and is further connected to the test equipment with the universal. ># Slot 42 To the above structure of this creation, through the connection of the circuit conversion board 2 people two density boards 1 and 3, the original denser center can be matched with the first and test points on the circuit board 6 (that is, the probe Needle 51) is properly enlarged, and the universal electric power to be measured is sparsely centered (lower cost). 矣 ^: 4, it is connected to each guide M267455 on the mountain plate 41, which can reduce the fixture equipment. The development cost and test cost can also simplify the operation and schedule of test product conversion and improve the efficiency of the overall test operation. It can be known from the above that the improved structure of the creative circuit board test fixture has indeed improved the development cost and test cost, and has the effect of improving the test efficiency. It has indeed had industrial applicability and novelty. And progressive. However, the above is only one of the preferred embodiments of this creation, and is not used to limit the scope of implementation of this creation. That is, all equal changes and modifications made in accordance with the scope of the patent application for this creation are covered by the scope of the invention patent. [Brief description of the diagram] The first picture is an exploded view of a circuit board test fixture. The second picture is a combination of conventional circuit board test fixtures. The second picture is a combined sectional view of a circuit board test fixture. The fourth picture is an exploded view of the structure of this creation. The fifth picture is a combination diagram of this creation. The sixth picture is the combined scraping picture of this creation. [Description of Symbols of Main Components] 1 ..... First density board 11, 31, 411. ·. Conductive element 2 ..... Circuit conversion board 21-Copper foil circuit 3 ..... Second density Board M267455 4 ..... base 41____ universal density board 42 ... test slot 5 ..... pin board 51 .. .. probe 6 ..... test board

Claims (1)

M267455 九、申請專利範圍: 1 ·一種電路板測試治具改良結構,其至少包括: 一第一密度板,設置於一底座之萬用密度板上, 該第一密度板上貫設有複數導電元件對應銜接於該萬 用密度板之導電元件,而該萬用密度板之各導電元件 可經導線銜接至測試插槽,以供預設之插頭插接而連 接至各測試儀器; 一第二密度板,墊設於一針板下方,該第二密度 板上貫設有複數導電元件,可完全承接該針板上預設 接觸於待測電路板之探針; 一電路轉換板,設於該第一、二密度板之間,於 該電路轉換板之上、下二侧面分別設有連通之銅箔線 路,可分別接觸導通該第一、二密度板之各對應導電 元件,藉以使該待測電路板上之待測試點可經由針 板、第二密度板、電路轉換板、第一密度板而與底座 之萬用密度板形成一導通,並經由底座之測試插槽對 外銜接儀器。 2·如申請專利範圍第1項所述之電路板測試治具改良結 構,其中該第一密度板上各導電元件之中心距大於該 第二密度板上各導電元件之中心距。 3·如申請專利範圍第1或2項所述之電路板測試治具改 良結構,其中該導電元件係探針。 4·如申請專利範圍第1或2項所述之電路板測試治具改 良結構,其中該導電元件係彈簧。M267455 9. Scope of patent application: 1. An improved structure of a circuit board test fixture, which at least includes: a first density plate, which is arranged on a universal density plate on a base, and the first density plate is continuously provided with a plurality of conductive The component corresponds to the conductive component connected to the universal density board, and each conductive component of the universal density board can be connected to the test slot through a wire for a preset plug to connect to each test instrument; a second The density plate is arranged under a needle plate, and a plurality of conductive elements are continuously arranged on the second density plate, which can completely receive the probes which are preset to contact the circuit board to be tested on the needle plate; a circuit conversion plate is arranged on the Between the first and second density plates, copper foil lines are respectively provided on the upper and lower sides of the circuit conversion board, and the corresponding conductive elements of the first and second density plates can be contacted and conducted respectively, so that the The test point on the circuit board to be tested can be connected to the universal density board of the base through the pin board, the second density board, the circuit conversion board, and the first density board, and the external tester can be connected through the test slot of the base. . 2. The improved structure of the circuit board test fixture according to item 1 of the scope of the patent application, wherein the center distance of each conductive element on the first density plate is greater than the center distance of each conductive element on the second density plate. 3. The improved structure of the circuit board test fixture according to item 1 or 2 of the scope of the patent application, wherein the conductive element is a probe. 4. The improved structure of the circuit board test fixture as described in item 1 or 2 of the scope of patent application, wherein the conductive element is a spring.
TW93216765U 2004-10-21 2004-10-21 Improved structure of test fixture for circuit board TWM267455U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100543437C (en) * 2005-09-30 2009-09-23 日月光半导体制造股份有限公司 Fall impacting device and method of testing thereof
CN103207290A (en) * 2012-01-12 2013-07-17 瑞统企业股份有限公司 Improved test fixture structure of circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100543437C (en) * 2005-09-30 2009-09-23 日月光半导体制造股份有限公司 Fall impacting device and method of testing thereof
CN103207290A (en) * 2012-01-12 2013-07-17 瑞统企业股份有限公司 Improved test fixture structure of circuit board

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Legal Events

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