M266489 八 新型說明： 【新型所屬之技術領域】 本新型疋有關於一種散熱片，特別是指一種用於晶片 封裝（package)的散熱片。 【先前技術】 一般，如圖1所示之散熱片丨是用於晶片1〇〇的封裝 ，並配合晶片100封裝成如圖2所示之封裝件2〇〇 (在此以 BGA為例說明），以供後續電連結於一電子產品之電路板（ 圖未示出）上使用，並在封裝於封裝件2〇〇内的晶片1〇〇 作動運算時，將晶片1〇〇產生的熱導離封裝件2⑼而至外 界，使得晶片100不因週遭工作溫度過高而無法正常作動 運算。 參閱圖1，目前的散熱片i包含一散熱體u，及一自散 熱體11周緣ill向外且向下延伸的支撐體12。 該散熱體11成一圓形平板態樣。 該支撐體12大致可區分成四支撐部121，每一支撐部 121具有一自散熱體u周緣lu向外延伸的延伸區122、一 了與封j件200之基板300相連結的連結區223、一分別連 、、、口延伸區122與連結區123的支撐區124，及複數灌膠孔 125，在本例及圖示中，以二較小之灌膠孔125及一較大且 略成長條狀的灌膠孔125,為例說明，其中二較小的灌膠孔 125相間隔地形成在延伸區122，較大的灌膠孔125，形成在 一#乂小的/瞿膠孔125之間並自延伸區122延伸至支撐區J24 M266489 配合參閱圖2，當每一支撐部121連結區123與封裝件 200之基板300表面相連結時，散熱體u藉由每一支撐區 124的高度而與基板300表面相間隔一預定距離，而形成可 供曰曰片100及電連接晶片100與基板3〇〇的金線4〇〇容置 的空間13，且，同時每一支撐部丨2丨之延伸區丨22部分底 緣也與基板300表面相間隔一灌膠間隙14，使當進行後續 的灌模製程（molding)而欲成形封裝膠體5〇〇時，液態的 封裝膠體500可以經由灌膠間隙14、及複數灌膠孔125、 125’容填滿容置晶片1〇〇與金線4〇〇的空間13以及部分周 邊區域，並使散熱體U表面是裸露於封裝膠體5〇〇之外而 與外界接觸。 而當封裝完成、封裝件200電連接於電子產品的電路 板上工作時，晶片1〇〇作動運算產生的熱，可藉由散熱片^ 之散熱體11導引排放至外界，以維持晶# i⑼週遭的工作 /m度，使晶片i 〇〇可以穩定、正確的作動運算。 上述散熱片1確實可將封裝件2〇〇内封裝之晶片 運算作動的熱導離封裝件_，而使“丨⑻在較低的工作 溫度中穩定的作動運算。 β、參閱圖3，但是，由於散熱片1的製作是以金屬薄板沖 ^成51的因此’在製造成型的過程中’散熱體U會因為 後續成型支撐體12的沖壓過程中殘留的應力影響而變形， 另幵乂成截面成-向上彎曲的弧凹態樣，也因此，在進行封 ^ ’會因為散熱片！之散熱體„的弧凹下陷，而使散熱 體η壓觸到電連接晶片100肖基板則的金線彻 M266489 ，也會在後續灌模製程後，在下凹弧狀的散熱體u上形成 殘膠600，而不合封裝規格（fail)，使得封裝整體良率降低 〇 因此，如何改進目前的散熱片1，以提昇整體封裝良率 、增加生產利潤，是業者努力研究的方向之一。 【新型内容】 因此，本新型之目的，即在提供一種用於晶片封裝之 散熱片，以提高封裝良率、增加利潤。 於是，本新型用於晶片封裝之散熱片，是與一封装件 半成品之一基板表面相連結，該散熱片包含一散熱體，及 一支撐體。 該散熱體之截面成往相反於基板表面方向彎曲的弧形 〇 A支撐體自该散熱體周緣向外且向該基板表面方向延 伸而可與该基板表面相連結，該支撐體、該散熱體與該基 板表面共同界定出一空間。 本新型用於晶片封裝之散熱片的創作㈣，在於以散 熱片之散熱體形成不會導致壓觸到封裝用之金線的足夠空 間，以提高封裝良率、增加封裝利潤。 【實施方式】 、有關本新型之刚述及其他技術内容、特點與功效，在 乂下配合參考圖式之_個較佳實施例的詳細說明中，將可 清楚的呈現。 多閱圖4與圖5’本新型用於晶片封裝之散熱片4與習 M266489 知之散熱片1相似，可配合晶片100封裝成如圖5所示之 封裝件200,（在此以BGA為例說明），以供後續電連結於 一電子產品之電路板（圖未示出）上使用，並在封褒Z封 裝件200’内的晶片100作動運算時，將晶片1〇〇產I的熱 導離封裝件200’而至外界，使得晶片1〇〇不因週遭工作溫 度過高而無法正常作動運算。 ^ 散熱片4包含一散熱體5、一自散熱體5周緣51向上 延伸的擋膠體6，及一自散熱體5周緣51向外且向下延伸 的支撐體7。 散熱體5周緣51成一圓形態樣，且截面成一往相反於 基板300表面方向彎曲的弧形，同時，通過散熱體$周緣 51之一第一假想平面81，與一平行於此第一假想平面81 且通過散熱體5之一相對最遠離散熱體5周緣51之頂點52 的第二假想平面82，兩者的距離不大於0 02公厘。 播膠體6成一圓環狀，自散熱體5周緣5ι向上延伸， 且通過擋膠體6頂面61之一第三假想平面83，與通過散熱 體5之頂點52的第二假想平面82彼此相重合。 支撐體7大致可區分成四支撐部71，每一支撐部71具 有自政熱體5周緣51向外延伸的延伸區711、一可血封 裝件200’之基板300相連結的連結區712、一分別連結延伸 區711與連結區712的支撐區713，及複數灌膠孔714,在 本例及圖示中，以二較小之灌膠孔714及一較大且略成長 條狀的灌膠孔714,為例說明，其中二較小的灌膠孔714相 間隔地形成在延伸區711，較大的灌膠孔714,形成在二較小 M266489 的灌膠孔714之間並自延伸區711延伸至支撐區713。 參閱圖5’當每一支撐部7ι之連結區712與封裝件 2〇〇’之基板300表面相連結時，散熱體5藉由每一支撐區 713的尚度而與基板3〇〇表面相間隔一預定距離，而形成可 供曰曰片100,及電連接晶片1〇〇與基板3〇〇的金線4〇〇容置 的玉間72，同時，由於散熱體5截面成往相反於基板则 表面方向彎曲的弧形，而使得散熱體5本身不會壓觸到金 線400，且，每一支撐部71之延伸區川部分底緣與基板 300表面相間隔一灌膠間隙，使當進行後續的灌模製程（ molding)而欲成形封裝膠體5〇〇時，液態的封裝膠體5⑼ 可以經由灌膠間隙、及複數灌膠孔714、714,填滿容置晶片 1〇〇與金線400的㈣72以及部分周邊區域，並使散熱體 5表面裸露於封裝膠體之外而與外界接觸。而當封裝完 成、封裝件200,電連接於電子產品的電路板上工作時，晶 片1〇〇作動運算產生的熱，可藉由散熱片4之散熱體5傳 導至外界，以維持日日日片_週遭的卫作溫度，使晶片_ 可以穩定、正確的作動運算。 由上述說明可知，本新型用於封裝之散熱片4，主要是 在以金屬薄板沖麼成型時，使散熱體5形成截面是向支撐 體7 f曲的弧形，同時在散熱體5周緣51向上形成環狀的 擋膠體6’藉此，不但可以改善殘留應力可能造成散孰片4 本身成型後再形變的困擾，並可在進行後續封裝時，因散 熱體5成截面向支撐體7彎曲的弧形，而與電連接晶片_ 與基板300的金線400保持較習知更大的距離，同時，藉 M266489 =播膠體6防止在後續灌模製程後，在散熱體$上形成殘 膠600 ’而可提商整體封裝良率，確實達到本新型創作之目 的0 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新㈣請專利 範圍及說明書内容所作之簡單的等效變化與修飾，皆仍屬 本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明一習知的散熱片； 圖2是一侧視示意圖，說明一用w i之散熱 成的封裝件； 、而 圖3是一側視不意圖，說明因圖1之散熱片導致 件不合封裝規格的態樣； '展 圖4是一立體圖，說明本新型用於晶片封裝之 的—較佳實施例；及 月…、片 圖5是一側視示意圖，說明一用途4之散熱 成的封骏件。 才攻而 10 M266489 【主要元件符號說明】 100 …· 晶片 4…· …散熱片 200… 封裝件 5…· …散熱體 200,… 封裝件 51… …周緣 300 ···· 基板 52… …頂點 400 — 金線 6 .… …擋膠體 500… 封裝膠體 61… …頂面 600 ·… 殘膠 7 ·.·. …支撐體 1 ....... 散熱片 71… …支撐部 11…… 散熱體 711 · …延伸區 m…· 周緣 712 · …連結區 12…… 支撐體 713 * …支撐區 121 ·… 支撐部 714 · …灌膠孔 122 ·… 延伸區 714, …灌膠孔 123 ·… 連結區 72..· …空間 124 .··· 支撐區 81… …第 假想平面 125… 灌膠孔 82·.. …第二假想平面 125,… 灌膠孔 83··· …第三假想平面 13…… 空間 14…… 灌膠間隙 11M266489 VIII New type description: [Technical field to which the new type belongs] This new type does not refer to a heat sink, especially a heat sink for a chip package. [Previous technology] Generally, the heat sink shown in FIG. 1 is used for packaging of the chip 100, and is packaged with the chip 100 to form a package 200 as shown in FIG. 2 (BGA is used as an example here. ) For subsequent use on a circuit board (not shown) electrically connected to an electronic product, and when the chip 100 packaged in the package 200 operates, the heat generated by the chip 100 is calculated. It is conducted away from the package 2 to the outside, so that the chip 100 cannot operate normally due to the high ambient temperature. Referring to FIG. 1, the current heat sink i includes a heat sink u and a support 12 extending outward and downward from the periphery 11 of the heat sink 11. The heat sink 11 is in the shape of a circular flat plate. The support body 12 can be roughly divided into four support portions 121. Each support portion 121 has an extension area 122 extending outward from the periphery lu of the heat sink u, and a connection area 223 that is connected to the substrate 300 of the sealing member 200. , A support region 124 which is connected to the mouth extension region 122 and the connection region 123, and a plurality of glue holes 125, in this example and the illustration, two smaller glue holes 125 and a larger and slightly Growing strips of glue holes 125 are illustrated as an example. Two smaller glue holes 125 are formed at an interval in the extension area 122, and the larger glue holes 125 are formed in a # 乂 小 / QU glue hole. 125 and extending from the extension area 122 to the support area J24 M266489. As shown in FIG. 2, when each support portion 121 is connected to the connection area 123 and the surface of the substrate 300 of the package 200, the heat sink u passes through each support area 124. And a predetermined distance from the surface of the substrate 300 to form a space 13 capable of accommodating the wafer 100 and the gold wire 400 for electrically connecting the wafer 100 to the substrate 300, and at the same time, each support portion丨 2 丨 Extended area 丨 22 Part of the bottom edge is also spaced from the surface of the substrate 300 by a glue gap 14 so that when When the encapsulation colloid 500 is to be formed by a continuous molding process (molding), the liquid encapsulation colloid 500 can be filled with the wafer 100 and gold through the encapsulation gap 14 and a plurality of encapsulation holes 125 and 125 '. The space 13 of the line 400 and a part of the peripheral area, and the surface of the heat sink U is exposed outside the packaging gel 500 and is in contact with the outside world. When the package is completed and the package 200 is electrically connected to the circuit board of the electronic product, the heat generated by the operation of the chip 100 can be discharged to the outside through the heat sink 11 of the heat sink ^ to maintain the crystal. The work / m degree around i⑼ enables the chip 〇〇 to operate stably and accurately. The above-mentioned heat sink 1 can surely conduct the thermal operation of the wafer packaged in the package 200 away from the package _, so that “丨 ⑻ can operate stably at a lower operating temperature. Β, see FIG. 3, but Since the heat sink 1 is made of a thin metal sheet 51, the heat sink U will be deformed 'in the process of manufacturing and molding' due to the residual stress in the subsequent stamping process of the support 12 and deformed. The cross-section is an arc-concave state curved upward. Therefore, during the sealing process, the arc recess of the heat sink „causes the heat sink to sink, and the heat sink η is pressed against the gold of the electrical connection chip 100 substrate. Through M266489, after the subsequent injection molding process, a residual adhesive 600 is formed on the concave arc-shaped heat sink u without conforming to the package specification, which reduces the overall yield of the package. Therefore, how to improve the current heat sink 1. To improve the overall package yield and increase production profits, it is one of the research directions that the industry is working hard. [New content] Therefore, the purpose of this new model is to provide a heat sink for chip packaging to improve package yield and increase profits. Therefore, the novel heat sink for chip packaging is connected to a substrate surface of a package semi-finished product, and the heat sink includes a heat sink and a support. The cross section of the heat sink is an arc that is curved in a direction opposite to the surface of the substrate. The AA support body extends outward from the periphery of the heat sink and extends toward the substrate surface to be connected to the substrate surface. The support, the heat sink A space is defined with the substrate surface. The creation of the new type of heat sink for chip packaging is to form a sufficient space for the heat sink of the heat sink without causing contact with the gold wire for packaging, so as to improve the yield of the package and increase the profit of the package. [Embodiment] The new description and other technical contents, features, and effects will be clearly presented in the detailed description of one preferred embodiment with reference to the drawings below. Read more about Figure 4 and Figure 5 'The heat sink 4 used for chip packaging is similar to the heat sink 1 known by Xi M266489. It can be packaged with the chip 100 into a package 200 as shown in Figure 5, (BGA is used as an example here. (Explained), for subsequent use on a circuit board (not shown) electrically connected to an electronic product, and when the operation of the wafer 100 in the sealed Z package 200 'is operated, the wafer 100 produces I heat. It is conducted away from the package 200 'to the outside, so that the chip 100 cannot operate normally due to the excessively high operating temperature around the chip. ^ The heat sink 4 includes a heat sink 5, a rubber block 6 extending upward from the periphery 51 of the heat sink 5, and a support 7 extending outward and downward from the periphery 51 of the heat sink 5. The peripheral edge 51 of the heat sink 5 has a circular shape, and the cross section is an arc curved in a direction opposite to the surface of the substrate 300. At the same time, a first imaginary plane 81, which is one of the periphery 51 of the heat sink, is parallel to the first imaginary plane. 81, and through a second imaginary plane 82 which is relatively farthest from the apex 52 of the perimeter 51 of the heat sink 5 relative to one of the heat sinks 5, the distance between the two is not more than 0.02 mm. The soaking body 6 is formed into a circular ring shape, extending upward from the periphery 5m of the heat sink 5 and passing through a third imaginary plane 83 of the top surface 61 of the heat blocking body 6 and a second imaginary plane 82 passing through the vertex 52 of the heat sink 5 . The support body 7 can be roughly divided into four support portions 71, each support portion 71 having an extension area 711 extending outward from the peripheral edge 51 of the thermal heating body 5, a connection area 712 connected to the substrate 300 of the blood-sealable package 200 ', A support area 713 that connects the extension area 711 and the connection area 712, and a plurality of glue holes 714. In this example and the illustration, two smaller glue holes 714 and a larger and slightly elongated hole are filled. Glue holes 714, for example, where two smaller glue holes 714 are formed at an interval in the extension area 711, and larger glue holes 714 are formed between the two smaller holes 714 of M266489 and self-extend. The region 711 extends to the support region 713. Referring to FIG. 5 ′, when the connecting region 712 of each support portion 7m is connected to the surface of the substrate 300 of the package 2000 ′, the heat sink 5 is in contact with the surface of the substrate 300 by the degree of each support region 713. A predetermined distance is formed to form a jade 72 which can be used for receiving the film 100, and the gold wire 400 for electrically connecting the wafer 100 and the substrate 300. At the same time, the cross section of the heat sink 5 is opposite to The substrate is curved in the surface direction, so that the heat sink 5 itself does not touch the gold wire 400, and the bottom edge of the extending portion of each support portion 71 is spaced from the surface of the substrate 300 by a glue gap. When the subsequent molding process (molding) is performed to form the packaging gel 500, the liquid packaging gel 5⑼ can fill the containing wafer 100 and gold through the filling gap and the plurality of filling holes 714 and 714. The ridge 72 of the wire 400 and a part of the peripheral area make the surface of the heat sink 5 exposed to the outside of the encapsulant and contact the outside. When the package is completed and the package 200 is electrically connected to the circuit board of the electronic product, the heat generated by the operation of the chip 100 can be conducted to the outside through the heat sink 5 of the heat sink 4 to maintain the day by day. The temperature of the wafer _ around the wafer makes the wafer _ stable and accurate operation calculation. From the above description, it can be known that the heat sink 4 for packaging of the new type is mainly formed by forming a thin metal plate, and the heat sink 5 is formed into an arc with a cross section curved toward the support body 7 at the same time. By forming a ring-shaped blocking body 6 ′ upwardly, not only can the residual stress be improved, which may cause the deformation of the scattered sheet 4 itself, and then it can be deformed, and during subsequent packaging, the heat sink 5 is bent to the support 7 in cross section. It has an arc shape, and is electrically connected to the chip. It keeps a larger distance from the gold wire 400 of the substrate 300 than at the same time. At the same time, M266489 = glue glue 6 prevents the formation of residual glue on the heat sink $ after the subsequent injection molding process. 600 ', but the overall packaging yield of the merchant can indeed achieve the purpose of the creation of the new model. 0 However, the above is only the preferred embodiment of the new model. When the scope of the implementation of the new model cannot be limited, The simple equivalent changes and modifications made to the scope of the patent and the contents of this specification are still covered by the new patent. [Brief description of the drawings] FIG. 1 is a perspective view illustrating a conventional heat sink; FIG. 2 is a schematic side view illustrating a package made of heat dissipated by Wi; and FIG. 3 is a side view not intended, Describe the appearance of parts that do not meet the package specifications due to the heat sink in Figure 1. 'Figure 4 is a perspective view illustrating the new type of chip packaging-the preferred embodiment; and Figure 5 is a side view Schematic diagram illustrating a heat-sealed seal piece used for application 4. Cai Gong 10 M266489 [Description of Main Component Symbols] 100… · Wafer 4… ·… Heat Sink 200… Package 5…… Heat Sink 200,… Package 51… Circumferential 300… Base Plate 52…… Vertices 400 — Gold wire 6...… Gel colloid 500. Encapsulation gel 61.… Top surface 600... Adhesive residue 7 ..... Support 1... Heat sink 71... Radiator 711 ··· extension area m ··· peripheral 712 ··· connection area 12 …… support body 713 * · support area 121 ··· support part 714 · · filling hole 122 ··· extension area 714,… filling hole 123 · … Connecting area 72 ..… space 124 ...... support area 81… imaginary plane 125… glue hole 82…… second imaginary plane 125,… glue hole 83… third imaginary Plane 13 ... Space 14 ... Filling gap 11