TWM265760U - Structure for wafer inspection apparatus - Google Patents

Description

M265760 Creative Instructions (1) The new type of technical field] This creative is related to a detector, especially the number of defective wafers and the area of the wafer inspection is a structure of a detectable detection device. Crystal [Previous technology] According to 'there is still 3% of the light area as a whole along with the microfabrication process and method', "deposition area" and "test area, any one of the process described in the process is complete, etc. Can use the artificial circle to pick out the shave, there is no efficiency, because there are few defective wafers or the problem of how to know the defective crystals in the cost of the process to be solved. In view of the advantages of the structure of this detection device, the product is defective. Rate, in the district "," expansion "and other process areas, and these are based on the detection of non-visual ways on the color and this is to choose the bad as the industry itself, which is a waste of less bad, the number of films and the electronics industry are bad Decreasing the rate and implanting of electronic wafers on the manufacturing area. 'These defective rates may cause defective wafers to meet the specifications of good wafer customers.' The work of those defective wafers is not to control the area of a wafer. Therefore, in the area where the defective wafer is improved, the volume is continuously increased and the general area is increased. "It can be scratched or there is a little ink. Some of the shortcomings on the wafer are the yield rate. At present, the author is tackling the above problems ^ effectively solving the above problems. Proposed seed chip M265760

[New content] The main purpose of this creation is to provide a wafer inspection device structure 'receive the reflected light from the wafer by a photosensitive device, use $ to calculate the number and area of defective wafers, and then remove the defective process. More convenient. Another purpose of Rinnai's installation of the Gen2 is to provide a wafer inspection device structure. By knowing the number and area of defective wafers on the wafer, the industry can better understand the causes of defective wafers during the wafer manufacturing process. , And the yield increases. According to the author of this article, a wafer is a cavity for detecting defective wafers on a circle. Here, it is a device junction and position composed of a plurality of wafers in the cavity. This wafer is provided with a platform for placing crystals in the cavity. Indoor and on this platform, a structure is used to detect a detection device. The first light source can be adjusted at an angle to emit on a first circle. The wafer line light reflects out of the device and is used to access the data transmission wheel. After receiving this data, it is easy to understand that each wafer of this effect 0 receives the first light to be reflected by each wafer in the cavity and located in the crystal harvester. The photosensitive device and its processing are converted into specific embodiments. The purpose of the attached drawing, the technical content, and the special second connection are to convert the light above the circle and calculate the detailed addition point of the wafer and its structure including the circle. The wafer end is pivotally connected to the light to The crystal sets a light for a second light and converts it into a light for receiving data. Explain that when more

M265760

4. Creation Description (3) [Embodiment] This creation is a structure of a wafer inspection device. Referring to the first figure, a wafer 10 is provided to be placed in this wafer inspection device structure. This wafer 10 has Multiple wafers 12, and this wafer inspection device structure can detect the number and location of defective wafers on the wafer 10, the wafer inspection device structure includes a chamber 13, and a cavity 14 is provided in the chamber 13 A first light source 16 is pivotally connected to one end of the platform 14. The first light source 16 is a Cold Cathode Fluorescent Lamp (CCFL), a Light Emitting Diode (LED), or an optical fiber guided cold light source ( Luminescent Optical Fiber); the first light source 16 can adjust the angle between 10 degrees and 80 degrees, for emitting a first light onto the wafer 10, the wafer 10 receives the first light It is converted into a second light and reflected out, and a second light source 18 is set under the platform 14 and located in the cavity 13, and the light emitted by the second light source 18 can pass between each wafer J 2 Gaps so that each of the wafers The wafers 2 are separated from each other, and the second light source 18 is composed of a cold cathode tube, a light emitting diode, or a fiber-guided cold light source; and a photosensitive device is provided in the chamber 13 and above the wafer ι. 2 0 'is used to receive the second light reflected from each wafer on the wafer, and convert it into a data data transmission wheel. The photosensitive device 20 is a charge-coupled device , CCD) and a complementary metal semiconductor sensor (CMOS Sensor), and then this photo-sensitive device 20 is connected to a calculation located outside the chamber 13 by means of a line = set 22 'this computing device 22 is A computer to receive this data " and process it into a bad chip data to display on the computer screen

M265760 Fourth, the creation description (4) 24, the area of this bad wafer. In this work, I used 14 adjustments to adjust the bad crystals on each of the good wafers and the sensitive light was out of the bad area. The difference in strength is good and the chip can better control the scope of the invention. Features and patents: The first light-light source 16 wafers 12 and the reverse surface of the wafer are different due to the difference between the wafer and the good device 20 wafer data. Therefore, the original process is different. The calculation process is more difficult to explain than the above description. When using the range of the spirit, firstly, a source with an irradiation angle of 16 and the second light, the second light that is emitted is damaged when the wafer is reflected, and the reflection of the received wafer is converted into a data including a bad wafer. It is convenient for the bad crystals to form bad wafers, and the examples of the reasons for good wafers are only for the purpose of implementation, and they are implemented based on this. The creative application specifically changes and the piece data includes the number of bad wafers and the number of bad wafers on this wafer. Wafer placement of wafers on the platform source 1 8? And adjust the brightness, so that the photosensitive device 20 can receive the influence of the incomplete or diffused in the plurality of wafers 12, which causes a difference in the intensity of the two light rays, and the second light, the first light The second data 'is calculated by the computing device 22 and the number and area of the second light reflected by the bad wafer and the good wafer on the wafer, so that the removal cannot make the industry in the wafer manufacturing process' and thus the wafer yield is increased. The preferred embodiment of this creation is intended to enable those skilled in the art to use it. The structure, shape, and modification described in Li Fan Yuan, which is not intended to limit the implementation of this creation, should be included in this creation application.

M265760 Schematic description [Schematic description] The first image is a three-dimensional schematic drawing of the creation. The second picture is a schematic cross-section of the creation. [Description of main component symbols]

10 wafer 12 wafer 13 chamber 14 platform 16 first light source 18 second light source 20 light sensing device 22 computing device

Claims (1)

M265760 5. Scope of patent application 1. A wafer inspection device structure for detecting the number and location of defective wafers on a wafer. The wafer inspection device structure includes: a cavity to 'it is provided with a platform' for placing the wafer The wafer is composed of a plurality of wafers. A first light source is disposed in the chamber, and the first light source is dragged on one end of the platform. The first light source can be adjusted to emit an first light. On the wafer, each wafer of the wafer receives the first light and converts it into a second light. The light is reflected out; a photosensitive device is disposed in the chamber and above the wafer for receiving. The second light reflected by each of the chips is converted into a data file for transmission; and a computing device connected to the light sensing device for receiving the data data and converting the data data into a bad one Wafer data. 2. The wafer inspection device structure described in item 1 of the scope of the patent application, wherein a second light source is further provided in the chamber and under the platform to separate each of the wafers. 3. The wafer inspection device structure described in item 2 of the scope of patent application, wherein when the second light source is set under the platform, the platform is a light-transmissive material. 4. The structure of the wafer detection device as described in item 2 of the scope of the patent application, wherein the second light source is a cold light source of a cold cathode tube, a light emitting diode, or a fiber optic bow. 5. The structure of the wafer inspection device as described in item 1 of the scope of the patent application, wherein the first light source is a cold cathode tube, a light emitting diode, or a fiber optic bow. Page 10 M265760 V. Patent application scope Cold light source 6 According to the wafer inspection device described in item 1 of the patent application scope, the adjustment angle of the first light source is 10 degrees to 80 degrees. ~ ’One of its semiconductor inductors. As described in item 1 of the scope of the patent application, the wafer inspection structure is described, and the defective wafer data is the data of the < day-to-day and on-wafer defective 7. The wafer inspection device structure according to item 1, wherein the photosensitive device is selected from the group consisting of a charge-coupled element and a complementary metal oxide wafer.