M263732 、創作說明（1) 【技術領域】 本創作係 以錫、銦、叙 端作披覆，其 達到快速導熱 面設有風扇增 佳，且無溢出 產效率及作業 導熱片與發熱 度°C故可得較 提供一種無 及微量元素 結合附著效 效果，該金 加其散熱效 污染產品問 便利性，並 元件之共晶 佳導熱係數 【先前技術】 的2五圖所*，傳統中 均S於散教55 + A式贩u…'底部塗抹導 =勝片含鉛’其導 上傳統導熱膏A、脒：： ，導熱膏A塗佈於 篁難以控置，易造成分佈 溢出污染產品，導：：： 導致作業 衔困# 如何排除上述 術困難點之所在。 < 鉛低溫共晶相變金屬導熱片，係 於金屬導熱片之銅泊基材上下兩 果較傳統導熱膏均勻且密實，可 屬導熱片上方設置散熱器於上端 果，金屬披覆結構，其散熱效果 題’可快速與散熱片結合提高生 可節省作業時間，再者，該金屬 相變溫度範圍在五十度。c至七十 效果者。 央電腦處理器為達成散熱目的， 熱貧A或膠片，惟大部份導熱膏 數較金屬差，導熱係數不佳，加 可重複使用影響散熱效果，而傳 時’因以手工塗抹，使得塗抹用 不均勻問題，若塗抹過多時則會 效率不佳等嚴重製作問題； 問題缺失，即本案所欲解決之技 【内容】 —圖及第三圖所示，本創作係提供一種無M263732, Creation Instructions (1) [Technical Field] This creation is covered with tin, indium, and succinctane. It has a fast heat transfer surface and is equipped with a fan to improve the production efficiency. Therefore, it can be compared to provide a non-trace element binding effect, the gold plus its heat dissipation effect to pollute the convenience of the product, and the eutectic component of the component has a good thermal conductivity [prior technology] in the two or five pictures *, the traditional average S Yu Sanjiao 55 + A-type vendor u ... 'Bottom smear guide = Winner containing lead' on the traditional thermal paste A, 脒 ::, Thermal paste A is difficult to control when applied to 篁, which is likely to cause distribution and spill pollution products, Guide ::: Leading to job difficulty # How to troubleshoot the above-mentioned technical difficulties. < The lead low temperature eutectic phase change metal thermal conductive sheet, which is attached to the copper substrate of the metal thermal conductive sheet, is more uniform and denser than the traditional thermal conductive paste. It can be a heat sink with a heat sink on the top end and a metal coating structure. The problem of heat dissipation effect 'can be quickly combined with heat sinks to improve health and save operating time. Moreover, the metal phase transition temperature range is 50 degrees. c to seventy effects. For the purpose of heat dissipation, the central computer processor is heat-poor A or film. However, most of the thermal conductive pastes are inferior to metal and the thermal conductivity is not good. Plus, it can be reused to affect the heat dissipation effect. The use of uneven problems, if it is smeared too much, it will cause serious production problems such as poor efficiency; the problem is lacking, which is the technique to be solved in this case [Content] —As shown in the figure and the third figure, this creative system provides a
第一圖、繁_ M263732 四、創作說明（2) 鉛低溫共晶相變金屬導熱片，係以錫、銦、鉍及微量元素 所組合一金屬基材片2、3於金屬導熱片1上下兩端作披 覆，主要結構包括：一金屬導熱片1 、一金屬基材片2、 3、一散熱器4及風扇5所組成； 一金屬導熱片1 ，係設置於散熱器4下方，並於該金 屬導熱片1上下兩面彼覆金屬基材片2 、3作彼覆，而達 到快速導熱效果； 一金屬基材片2、3 ，披覆於金屬導熱片1上下兩端 面，其中一端面金屬基材片2、3彼覆於金屬導熱片1上 端，另一端面金屬基材片2、3彼覆於金屬導熱片1下端 接合者； 一散熱器4，係設置於金屬導熱片1上方，用以散熱 器4與金屬導熱片1中間之金屬基材片2作散熱；以及一 風扇，設置於該散熱器4上方，用以散發該散熱器4上之 熱能。 【實施方式】 本創作係提供一種無鉛低溫共晶相變金屬導熱片，請 參閱第四圖所示，本創作實施例示意圖，係以彼覆金屬導 熱片1上作一低溫導熱作用，完全以金屬基材片2 、3而 達到快速導熱效果，其中金屬基材包含有錫、銦、鉍及微 量元素，以披覆作用可與金屬導熱片1形成一體，當金屬 導熱片1實施於電路板6上之發熱元件時，共晶相變溫度 範圍在五十度°C至七十度°(：之間，藉以金屬基材片2、3The first picture, Fan_ M263732 IV. Creation instructions (2) Lead low temperature eutectic phase change metal thermal conductive sheet, which is composed of tin, indium, bismuth and trace elements, a metal substrate sheet 2, 3 above and below the metal thermal conductive sheet 1 The two ends are covered, and the main structure includes: a metal thermal conductive sheet 1, a metal base sheet 2, 3, a radiator 4 and a fan 5; a metal thermal conductive sheet 1, which is arranged below the radiator 4, and The metal heat-conducting sheet 1 is covered with metal substrate sheets 2 and 3 on the upper and lower sides to achieve rapid heat conduction. A metal substrate sheet 2 and 3 are covered on the upper and lower ends of the metal heat-conducting sheet 1, one of which is an end surface. The metal substrate sheets 2 and 3 are covered on the upper end of the metal thermal conductive sheet 1, and the other end metal substrate sheets 2 and 3 are covered on the lower end of the metal thermal conductive sheet 1. A heat sink 4 is disposed above the metal thermal conductive sheet 1. The heat sink 4 and the metal base sheet 2 between the metal heat conducting sheet 1 are used for heat dissipation; and a fan is disposed above the heat sink 4 to dissipate heat energy on the heat sink 4. [Embodiment] This creative system provides a lead-free low-temperature eutectic phase-change metal thermal conductive sheet. Please refer to the fourth figure. The schematic diagram of this creative example is based on the metal thermal conductive sheet 1 covered with a low-temperature thermal conductive effect. The metal substrates 2 and 3 achieve fast thermal conduction effect. The metal substrate contains tin, indium, bismuth and trace elements. It can be integrated with the metal thermal conductive sheet 1 by coating. When the metal thermal conductive sheet 1 is implemented on a circuit board For the heating element on 6, the eutectic phase transition temperature range is from 50 ° C to 70 °° (:, with the metal substrate sheet 2, 3
四、創作說明（3) 片1以提高散熱效果’排除傳統導熱膏溢 省作業時:; 快速與散熱片結合提高生產效率及節 即杓Ϊ:ί:述Γ為本創作之一較佳可行實施例’非因此 1":限本創作之專利範’故舉凡運用本創作說明書及圖示 、谷所為之等效結冑，直接或間接運用於其它相關技術領 域者，均同理皆理應包含於本創作之精神範疇的範圍内， 合予陳明。 為使本創作更加顯現出其進步性與實用性，茲與習用 作一比較分析如下： 差 金 輟 J5· 數。 係用 熱使 導複 其重 氣可 含不 片片, \ 膏貪 熱熱 導導 失統統 缺傳傳 用、、 習1 2 M263732Fourth, the creation instructions (3) film 1 to improve the heat dissipation effect 'excludes the traditional thermal paste to save the time of the operation :; quickly combined with the heat sink to improve production efficiency and save: The embodiment 'not because of this 1 ": the patent scope of this limited creation', so the use of this creative description and illustrations, the equivalent of Gu's equivalent results, directly or indirectly applied to other related technical fields, should be included in the same reason Within the scope of the spirit of this creation, Chen Ming was united. In order to make this creation show its progressiveness and practicability, a comparative analysis with conventional usage is as follows: The heat is used to guide the compound, and its weight can be contained in the film.
本創作優點 以錫、銦、鉍及微量元素作 完全以金屬作基材包括 披覆。 2、 快速導熱。 3、 結合散熱片，適作為媒介充填導熱。 4、 彼覆結構作均勻導熱，散熱效果ί。 5 、無溢出污染產品問題。 6、 可快速與散熱片結合達作業便利及生產效率。 7、 節省作業時間，具進步性。 達 性 綜上所述，本創作在突破先前之技術結構下， 到所欲增進之功效，且也非熟悉該項技藝者所 再者，本創作申請前未曾公開，其所具之進步 ，顯已符合新型專利之申請要件，爱依法提出新 確實已 於思及 、實用 型申請The advantages of this creation are based on tin, indium, bismuth and trace elements. Completely based on metal, including coating. 2. Fast heat conduction. 3. Combined with a heat sink, it is suitable as a medium for filling and conducting heat. 4. The covering structure is uniformly conducting heat, and the heat dissipation effect is ί. 5, no spill pollution products. 6. It can be quickly combined with heat sink to achieve convenient operation and production efficiency. 7. Save operation time and be progressive. As mentioned above, this creation breaks through the previous technical structure and achieves the desired effect. It is also not familiar to those skilled in the art. This creation has not been disclosed before the application, and its progress is significant. It has met the application requirements for new patents, and the new application according to the law has indeed been considered and practical.
第8頁 M263732 圖式簡單說明 第一圖係本創作之分解圖。 第二圖係本創作之組合圖。 第三圖係本創作之剖視圖。 第四圖係本創作之實施例圖。 第五圖係習知散熱片實施例圖。 【圖號】Page 8 M263732 Schematic Description The first picture is an exploded view of this creation. The second picture is the combined picture of this creation. The third picture is a sectional view of this creation. The fourth picture is an embodiment diagram of this creation. The fifth figure is a diagram of a conventional heat sink embodiment. [Picture number]
金屬導熱片1 金屬基材片2 、3 散熱器4 風扇5 電路板6 導熱膏AMetal heat conductive sheet 1 Metal base sheet 2, 3 Radiator 4 Fan 5 Circuit board 6 Thermal paste A