TWM261984U - Improvement of cooling fin - Google Patents

Improvement of cooling fin Download PDF

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Publication number
TWM261984U
TWM261984U TW93213865U TW93213865U TWM261984U TW M261984 U TWM261984 U TW M261984U TW 93213865 U TW93213865 U TW 93213865U TW 93213865 U TW93213865 U TW 93213865U TW M261984 U TWM261984 U TW M261984U
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TW
Taiwan
Prior art keywords
heat dissipation
fins
dissipation fins
improvement
heat
Prior art date
Application number
TW93213865U
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Chinese (zh)
Inventor
Jeng-Jr Li
Original Assignee
Ideal Elethermal Inc
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Publication date
Application filed by Ideal Elethermal Inc filed Critical Ideal Elethermal Inc
Priority to TW93213865U priority Critical patent/TWM261984U/en
Publication of TWM261984U publication Critical patent/TWM261984U/en

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  • Structures Of Non-Positive Displacement Pumps (AREA)

Description

M261984 八、新型說明: 【新塑所屬之技術領域】 本創作係〆種散熱鰭片之改良’其係一種將散熱鰭片以規則性排列成不等 高之設計,而使風扇之氣流容易進入其中,且可達到材料減重'降低成本及 當增加散熱鰭片彼此之間之密度時, 能者。 【先前技術】 使風扇風量更能進入散熱片中而增進效 按現今電腦運算功能更加強大且其速度亦迅 %知昇,而其整 體形狀、構造及與主機板連接方式更是突破傳統 ’u〈稟究,可謂是 電腦業界之重大改革,更由於新-代中央處理器扶帶超速之運算 功能,也使得中央處理器在處理運算指令時所產生、 一 之溫度更高, 故如何利用良好之散熱系統來使中央處理骞在 17 #丹所允許之溫度 下正常工作’已被業界視為極重要之課題。 而-般習用之散熱片’請參照第8圖所示,其結構為設有一 底座100 ’該底座100上設有複數片排列整齊且 且发卜夕吟献 雜片110’該等散熱縛片110之高度皆相同,且今 寻散熱鰭片110 邊緣係呈齊平狀,而在該等散熱鰭片11〇上安梦 衣有〜風扇120, 當風扇120轉動並吹送軸流風時,因其軸流風係直接向士关 而該等散熱縛片11 〇係作等高設計,所以,常會碑 、 k成軸流風已等 速相互撞擊而集中於散熱鰭片110之中央處,佶 、更件熱囤積於散熱 鰭片110中央,造成散熱效率不佳。 而為了改進上述習用結構之缺點, 即有另-種熱片結構出 M261984 現,請參照第9圖所示,其主要設有一底座2〇〇,該底座2〇〇上 設有複數片直立且排列整齊之散熱鰭片21〇,該等散熱鰭片21〇 遠離底座200 —端係呈波浪起伏狀,且該等散熱鰭片21〇上安裝 有一風扇220,如此,雖可令風扇22〇所吹送之軸流風,可從散 熱鰭片210向下凹之處流動,但也因散熱鰭片21〇向下凹之處與 風扇220間有一定距離,且每片散熱鰭片21〇之形狀完全相同, 所以,常會令風扇220所吹送之氣流還未到達散熱鰭片21〇,即 從散熱鰭片210與風扇220間之空隙向外流動,在使用效果亦不 佳0 【新型内容】 為改進上述習用裝置構造之各種缺點,創作人經過長久努力 研究與實驗,終於開發設計出本創作之散_片之改良。 本創作之-目的,在提供一種散熱鰭片之改良,該等散执 韓片以直立方式排列在一起’該等散熱錯片分別與相鄰之散❹ 片南度不相等’且該等散熱鰭片端緣上設有向内彎折之折片以 令該等散熱鰭片可藉折片保持—定距離,且該等散熱鰭片更進— :藉由固定件固定在一起,在該等散熱鰭片上則設有一風扇,俾 虽風扇轉動將氣流向散熱鰭片吹送時,可藉由㈣高度不— 熱籍片之排列,而使氣流衮县、 玲 熱目的。 吏一易進入散熱韓片’進而達到良好之散 鰭片 本創作之另一目的 因作不等高之設計, ,在提供一種散熱鰭片之改良 而使部分之散熱鰭片重量較輕 其散熱 不但可 M261984 k S知等同之散熱鰭片減少材料之浪費,且散熱效果亦較習知等 高之散熱鰭片佳。 本創作之又一目的,在提供一種散熱鰭片之改良,其因該等 散熱鰭片係作不等高之設計,而使該等散熱鑛片不但緊鄰併靠在 一起,且呈交互錯開狀,使本創作之散熱鰭片當排列之密度緊密 時,風扇風量更能進入散熱片中,在散熱時效果更良好。 【實施方式】 請參閱第1、2圖所示,本創作係一種散熱籍片之改良,其 係-種用於機板散熱用之散熱鰭片10,該等散熱縛片10係以直 立方式且互相平行排列在—起’且該等散_片1G分別與相鄰 之散熱鰭片10高度不相等,而使該等散熱鰭片1〇以不等高且具 有規則性之連續排列在―^,且該等散熱鰭片1Q端緣上分別設 有-向内f折且與散熱鯖片1G垂直之折# i卜該等折片^可 以彼扣或焊接方式而連接在―起,如此,不但可使該等散熱籍片 10固疋在一起’且可藉由折片n之阻檔’而使該等散熱鰭片w 與相鄰之散熱韓片10保持一定距離,又,該等散熱鰭片ι〇側邊 設有-岐件12’以使該等散熱錯片10可藉由以件12之連 接而確實穩固地結合在—起,此外’在該等散熱鰭片上則設 有一風扇20。 請參照第卜2、3、4圖所示,該等散熱韓片1〇係藉由連續 沖壓製作而成’且該等散熱_片1Q屬於高度較低之散熱鰭片10 之形狀可為U字型’該等高度較低之散熱_片iq並交錯排列在 M261984 问度車又间之散熱鰭片1G間(如第i圖所示)、或端緣成齊平狀, 而以二個或三個—組且高度逐漸增加之排列方式固定在—起(如 第3圖所不)、抑或為連續波浪起伏狀,而與高度較高之散熱轉 片10父錯排列(如第4圖所示)。 6、7圖所示,先將風扇2〇 、4圖所示),再將固定在一 組裝時,請參照第2、3、4、5 固定在散熱鰭片1〇上(如第1、2、 起之散熱鰭片U)安置在處理器或機板上(圖中未示),或將該等 轉動將氣流吹向該等散熱鰭片 1G中安裝—具或—具以上之導熱管30,抑或將風扇2〇 女置在5亥等散熱鰭片1〇 一側(如第6圖所示),如此當風扇別 10時’可因部分散熱鰭片10之高 度較部分散熱鰭# 10之高度低,且該等高度不等高之散熱韓片 係呈交錯排列’而使氣流容易進入熱源其中,並且不會很快 流出該等散熱縛片10’進而增加散熱效率;且因該等散熱籍片 10係作不等高之設計,而使部分之散_片重量較輕如此, 不但可較習知等高之散熱籍片減少材料之浪費,另外,因該等散 熱:片係將高度不相等之交錯排列,使該等之散熱錯片10排列 A度可㈣統更為緊密’在利用此種散熱錯片i G排列後,間 接的使風扇2G氣流更能到達熱源深處,而使該散熱效果更良好。 综上所述,賴作在物品形狀構造裳£上屬#先創作,且可 改良習用技術之各種缺點,在使用上能增進功效,合於實用充 饬符合新型專利要件,實為一理想之創作。 M261984 【圖式簡單說明】 第1圖:為本創作一實施例之立體分解示意圖。 第2圖:為本創作一實施例之立體圖。 第3圖··為本創作另一實施例之立體示意圖。 第4圖:為本創作又一實施例之立體示意圖。 第5圖:為本創作實施時之立體示意圖一。 第6圖:為本創作實施時之立體示意圖二。 第7圖:為本創作實施時之示意圖三 第8圖:為習用裝置示意圖。 第9圖:為另一習用裝置示意圖。 【主要元件符號說明】 散熱鰭片 10 折片 11 固定件 12 風扇 20 散熱底座 30M261984 8. Description of the new type: [Technical field of Xinsu] This creation is an improvement of a type of heat dissipation fins, which is a design in which the heat dissipation fins are regularly arranged into unequal heights, so that the airflow of the fan is easy to enter Among them, it is possible to achieve weight reduction of materials, reduce costs, and increase the density of heat dissipation fins with each other. [Previous technology] Makes the fan's air volume more accessible to the heat sink and enhances the efficiency. According to the current computer computing function is more powerful and its speed is faster, and its overall shape, structure, and connection method with the motherboard are even more traditional. <Research, it can be described as a major reform in the computer industry, and because the new-generation central processing unit supports over-speed computing functions, it also makes the central processing unit generate higher temperatures when processing computing instructions, so how to make good use of it The cooling system to make the central processing unit work normally at the temperature allowed by # 17 丹 'has been regarded as a very important issue in the industry. And the general radiating fins' please refer to FIG. 8 and its structure is provided with a base 100 ′ The base 100 is provided with a plurality of fins arranged neatly and arranging various fins 110 ” The heights of 110 are all the same, and the edges of the heat-dissipating fins 110 are flush at the same time. On the heat-dissipating fins 110, Anmenyi has ~ fan 120. When the fan 120 rotates and blows axial wind, because of its Axial flow wind is directly directed to Shiguan and these heat dissipation fins 11 are designed as contours. Therefore, often the monument, k-axis axial wind has collided with each other at the same speed and concentrated on the center of the heat dissipation fin 110. Heat is accumulated in the center of the heat dissipation fins 110, resulting in poor heat dissipation efficiency. In order to improve the shortcomings of the above conventional structure, there is another type of hot plate structure M261984. Please refer to FIG. 9, which is mainly provided with a base 200. The base 200 is provided with a plurality of upright and Neatly arranged cooling fins 21o, these cooling fins 21o are far from the base 200-the ends are undulating, and a fan 220 is installed on the cooling fins 21o. Although this can make the fan 22o The blown axial wind can flow from the heat sink fins 210 to the recessed position, but also because the heat sink fins 21 and the recessed part have a certain distance from the fan 220, and the shape of each heat sink fin 21 is completely The same, therefore, the airflow blown by the fan 220 often does not reach the heat dissipation fin 21, that is, it flows outward from the gap between the heat dissipation fin 210 and the fan 220, and the use effect is also not good. 0 [New content] To improve The various shortcomings of the above-mentioned conventional device structure, after a long-term research and experiment by the creator, the author finally developed and designed an improvement of this creative film. The purpose of this creation is to provide an improvement of the heat dissipation fins, the fanciful Korean films are arranged in an upright manner, 'these heat sinking fins are not equal to the south of the neighboring fan fins,' and the heat dissipation The fin ends are provided with inwardly folded fins so that the radiating fins can be maintained by the folds-a certain distance, and the radiating fins are further advanced-fixed together by fixing members, There is a fan on the cooling fins. Although the fan rotates to blow the airflow to the cooling fins, the airflow can be set in the height of 衮, which can make the air flow 热 Xiang and Lingling. Li Yiyi enters the heat sink fins, and then achieves good loose fins. Another purpose of this creation is to make unequal height design, to provide an improvement of heat sink fins, and to make some of the heat sink fins lighter and to dissipate heat. Not only can the equivalent heat sink fins of M261984 k S be used to reduce the waste of materials, but also the heat dissipation effect is better than the conventional heat sink fins. Another purpose of this creation is to provide an improvement of the heat dissipation fins. Because the heat dissipation fins are designed with unequal heights, the heat sink ore fins are not only close to each other, but also alternately staggered. When the density of the heat dissipation fins of this creation is close, the fan's air volume can enter the heat sink more effectively, and the effect is better during heat dissipation. [Embodiment] Please refer to Figs. 1 and 2. This creation is an improvement of a heat dissipation sheet, which is a kind of heat dissipation fins 10 for heat dissipation of a board. The heat dissipation fins 10 are in an upright manner. And are arranged in parallel to each other, and the scattered fins 1G are not equal in height to the adjacent heat dissipation fins 10, so that the heat dissipation fins 10 are continuously arranged at unequal heights and regularity in ― ^, And the fins 1Q end edges are respectively provided with a fold-inward fold and a fold perpendicular to the radiating mackerel 1G # i 卜 These folds ^ can be connected in a buckle or welding manner, so Not only can the heat sinks 10 be fixed together, and the heat sink fins w can be kept at a certain distance from the adjacent heat sinks 10 by the resistance of the fold n, but also Radiating fins are provided with -Q pieces 12 'on the sides so that the radiating fins 10 can be firmly and securely connected together by the connection of the pieces 12, and in addition, a radiating fin is provided on the fins. Fan 20. Please refer to Figures 2, 3, and 4. As shown in Figures 2, 3, and 4, the heat sinking fins 10 are made by continuous stamping, and the heat sinking fins 1Q belong to the lower height heat sinking fins 10. The shape can be U Fonts: These lower-level cooling fins iq are staggered between the cooling fins 1G of the M261984 interrogation car (as shown in Figure i), or the edges are flush, and two Or three—groups with a gradual increase in height are fixed at the beginning or end (as shown in Figure 3), or they are continuous waves, and they are arranged in a wrong arrangement with the heat sink 10 with a higher height (as shown in Figure 4). As shown). As shown in Figures 6 and 7, the fan is shown in Figures 20 and 4 first), and then fixed in an assembly, please refer to Nos. 2, 3, 4, and 5 to the heat sink fin 10 (as shown in Figure 1, 2. The radiating fins U) are installed on the processor or the board (not shown in the figure), or these rotations are used to blow the airflow to the fins 1G. 30, or the fan 20 is placed on the side of the cooling fins 10 such as 5H (as shown in Figure 6), so when the fan is not 10, the height of some of the cooling fins 10 may be higher than that of some of the cooling fins # The height of 10 is low, and the radiating Korean fins of different heights are arranged in a staggered pattern, so that the airflow easily enters the heat source, and does not quickly flow out of the radiating fins 10 ', thereby increasing the heat dissipation efficiency; The heat-dissipating sheet 10 is designed to be unequal in height, so that some of the scattered sheets are lighter in weight. This not only reduces the waste of materials compared to the conventional heat-dissipating sheets, but also because of the heat dissipation: The staggered arrangement of unequal heights can make these heat sinking faults 10 arranged A degrees more tightly. After the slices i G are arranged, the fan 2G airflow can reach the depth of the heat source indirectly, so that the heat dissipation effect is better. In summary, Lai Zuo created the clothes in the shape of the article. 上 上 # Created first, and can improve the various shortcomings of conventional technology. It can improve the efficiency in use. It is suitable for practical use and meets the requirements of new patents. It is an ideal. creation. M261984 [Schematic description] Figure 1: A three-dimensional exploded view of an embodiment of the present invention. Figure 2: A perspective view of an embodiment of the present invention. Fig. 3 is a three-dimensional schematic view of another embodiment of the creation. FIG. 4 is a three-dimensional schematic diagram of another embodiment of the present invention. Figure 5: This is the first three-dimensional schematic diagram of the creative implementation. Figure 6: This is a three-dimensional schematic diagram of the creation. Fig. 7: Schematic diagram 3 during the implementation of this creative work. Fig. 8: Schematic diagram of conventional equipment. Figure 9: Schematic diagram of another conventional device. [Description of Symbols of Main Components] Cooling Fin 10 Folding 11 Fixing 12 Fan 20 Cooling Base 30

Claims (1)

M261984 九、申請專利範圍: 1、 一種散熱鰭片之改良,其包括有: 一片以上之散熱鰭片,該等散熱鰭片與相鄰之散熱鰭片高 度不相等’而使該等散熱鰭片以不等高作連績規則性之交錯排 列,且該等散熱鰭片端緣分別設有折片,該等折片可使該等散熱 鰭片保持一定距離; 一風扇’其係與散熱座相連接; 藉上述構件之組合,令風扇轉動將氣流吹向散熱鰭片時, 可因部分散熱鰭片之高度較部分散熱鰭片之高度低,且該等高度 不等面之散熱縛片係呈交錯排列,而使氣流容易進入其中,進而 增加散熱效率。 2、 如申請專利範圍第1項所述之散熱鰭片之改良,其散熱 座南度較低之散熱鰭片可呈齊平狀。 3、 如申請專利範圍第1項所述之散熱鰭片之改良,其散熱 座南度較低之散熱韓片可呈u型。 4如申晴專利範圍第1項所述之散熱鰭片之改良,其散熱 座同度較低之散熱鰭片可呈波浪起伏狀。 5、如申請專利範圍第1項所述之散熱鰭片之改良,其風扇 可安置在散熱座上。 甲請專利範圍第1項所述之散熱鰭片之改良,其風扇 可安置在散熱座側邊上。M261984 9. Scope of patent application: 1. An improvement of heat dissipation fins, including: More than one heat dissipation fin, the height of these heat dissipation fins is not equal to the height of the adjacent heat dissipation fins, so that the heat dissipation fins The staggered arrangement of consecutive performances with unequal heights, and the fins are respectively provided with fins at the edges, which can keep the fins at a certain distance; a fan 'which is connected to the radiating base; With the combination of the above components, when the fan is rotated to blow the airflow to the heat dissipation fins, the height of some heat dissipation fins is lower than the height of some heat dissipation fins, and the heat dissipation fins of different heights are staggered. , So that the airflow easily enters it, thereby increasing heat dissipation efficiency. 2. According to the improvement of the heat dissipation fins described in item 1 of the scope of the patent application, the heat dissipation fins with a lower south degree of the heat sink can be flush. 3. According to the improvement of the heat dissipation fins described in item 1 of the scope of the patent application, the heat sink Korean fins with a lower degree of heat sink may be U-shaped. 4 As the improvement of the heat dissipation fins described in item 1 of Shen Qing's patent scope, the heat dissipation fins with the same degree of heat sink base can be wave-shaped. 5. As for the improvement of the heat dissipation fins described in item 1 of the scope of patent application, the fan can be placed on the heat sink. For the improvement of the heat dissipation fin described in item 1 of the patent, the fan can be placed on the side of the heat sink.
TW93213865U 2004-09-01 2004-09-01 Improvement of cooling fin TWM261984U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371700B2 (en) * 2009-04-21 2013-02-12 Young Optics Inc. Heat dissipation module and projection apparatus using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371700B2 (en) * 2009-04-21 2013-02-12 Young Optics Inc. Heat dissipation module and projection apparatus using the same

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