TWM260073U - Positioning and pressing/bonding equipment for circuit board - Google Patents

Description

M260073 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to a printing mine

Surface Mm + τ u * MT * * * * QU 丨 J Thunder defeats the improvement of the board from a, ~ gy & system, that is, a thin printing 1; road board ( Including soft board) Positioning and pressing people, they are right-handed and guilty. They are also prepared (SMT product line auxiliary machine). I produce soft board) and connect the green main wire of different value. The ability of technology to improve the production line of transmission, charging, and charging, to improve performance and save production costs; Taiji ’s production efficiency and savings in production costs; individual machines of the current SMT production line are pulled, rebuilt and rebuilt ^ a ^ The mouth can still be used, and it can have low cost. ° The creation of fruit can be used in most SMT production line locations. ^ A soft and thin printed circuit board bonding equipment has-automatic technology production efficiency, etc. The two main features] single-chip thin printed circuit board via positioning # Early 槪 A, early hot glue ^, and then through the traditional M ☆ carrier board 卩 special resistance ^ ^ first, first surface adhesion technology production line, the electronic clothes are installed on the flexible board or thin printing Thunder through thin Printed circuit boards are not known to everyone for production or exhaustion. Failing to parallelize and reduce the early-discharging machines, save the peak [previous technology] Yang Bianli > "manual cost of changing sides and trimming. SMT production line volume The production method has been changed to 0 cards. You have a good job. You have a variety of printed circuit boards. In recent years, manufacturers have actively researched and constructed projects. The 2: 2 is used in the machine. Production line adjustment ability or year-end maintenance: Shrinking and improving production processes can be applied to various SMT assembly electric silkworms, which can reduce maintenance costs and man-hour costs, such as those with many small parts. Printed circuit board assemblies, ... Use

Page 5 M260073 IV. Creation instructions (2) The speed machine can avoid the change of mechanical performance, which means that the production process of the production process until the production of SMT machines is more expensive, and the improvement is in line with this tradition and general The place where the press board and the note-type surface are adhered to the electronics, because the production line is relatively short, the development of the process, the research and improvement of the business, as in the first picture of the production line, there is a heat-resistant tape to fix the edge of the circuit board. Thermal tapes make it difficult to arrange the production process, and it is possible to avoid the waste of many man-hours. Similarly, in terms of goodness, if the maintenance cycle of a certain work machine can be extended, the production cost can be reduced; At present, improvement can be said to be a very important improvement project, because the machinery made by precision industry is slightly changed / going forward, but it can be used in conjunction with the characteristics of the SMT machine to make a newly developed special machine for the surrounding process. The effect is similar to the theory of industrial engineering process improvement can come in handy. When assembling circuit boards, such as mobile phone boards, computer motherboards for digital cameras, video cards, and high-end sound card installation parts, there is a clear need for process changes. I = Heat-resistant tape to fix printed circuit boards. Then the surface sticking ^ = trivial process, which takes more time and has a large improvement. = Rowing and cooperating with production tools are also researched by various engineering manufacturers. G = production machine characteristics and reduction of man-hour costs are even more factories. I am not familiar with the known thin printed circuit board / flexible board assembly. 6 ^ Single-piece printed circuit board assembly, but the traditional 1 溥 type printed circuit board on the carrier (that is, the thin printed, thermal tape is attached The thin printed circuit board is on the carrier, and it is difficult to be replaced by mechanical automation), it is resistant and unsmooth when pasted and peeled off. Therefore, in order to adapt to the characteristics of the production process, Production 2 achieves the goal of efficient operation of SMT machines. According to the product's appearance, generally thin printed circuit boards are usually designed M260073 IV. Creation instructions (3) ί 2: bit But: the surface bonding technology production line needs to be rectangular before it can pass two ί must be designed on the edge of the printed circuit board, the surface is adhered After the "Life" production is completed, the alpha cutting machine cuts off the edge of the printed circuit board. However, the right printed circuit board that has been cut by the printed circuit board manufacturer can be positioned without using heat-resistant tape. Above the carrier, you can = surface adhesion technology | 'and no additional cutting and brushing of equipment and man-hours on the edge of the circuit board can greatly reduce equipment investment and man-hours. From the above description, we can get It is known that the SMT production line improves the special man-hour saving effect of the printed circuit board bonding on the carrier. This is a technology to be developed and requires the efforts of relevant manufacturers to develop. In addition, the above printed circuit board can also be a thin or flexible board. It is a generic name for similar items. But 'The newly developed heat-resistant adhesive has positioning ability and heat resistance. It is heat-resistant but not cured at high temperatures in the reflow furnace. It can be used to adhere printed circuit boards to carrier boards. Through the entire SMT production line, and the process of placing and removing the printed circuit board (PCB) is time-saving and easy. When using heat-resistant adhesive, the automatic pick-and-place auxiliary equipment design of the printed circuit board (PCB) is easily a desirable advantage. The SMT production system needs this kind of capability, cooperates with the further construction of peripheral equipment, and conforms to the principle of process arrangement of industrial engineering. Therefore, a more convenient technique has been found to enable this creation to have the ability to deal with various situations in various aspects, and for the operation The man-hour cost is low to develop a special dedicated automatic auxiliary machine, so this creation was developed to meet the above requirements.: New content] The main purpose of this creation is to provide an SMT production system architecture and a dedicated auxiliary machine for the SMT production process. Heat-resistant adhesive can fix printing

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4. Creation instructions (4) The thin printed circuit board (including flexible board) positioning and pressing equipment (SMT product line auxiliary machine) produced by brushing the circuit board structure can provide low-cost and high-quality effects. M In order to achieve the above purpose, this creation will improve the conventional printed circuit board (p C β, print circuit board) heat-resistant tape-adhesive SMT production system to become a PCB that is bonded to a carrier board with thermal adhesive, which is more economical. It defines the thin printed circuit board (including flexible board pressing equipment (SMT product line auxiliary machine)) that is beneficial to practical application, and the know-how and value. ; Movement; holding the holding device to send the belt 'the ability to lose; and pressure to have the moving hand from the circuit board stack of the incoming and rotating belt die connection. In order to make ^ ^ π muscle opening clothes on clothes Surface sticking J: end connection capability; feeding module with circuit board stack with positioning mechanism, can move the circuit board to the y-arm module, with vertical movement ability, and can be partially; The mobile arm module is equipped with the ability to suck and carry the circuit board, h and other devices. The tribute has an entrance side, an outlet θ θ θ ^, and a transmission module, which has a compression through w transport carrier board. Pressing_Place down and replace, stand on The ability of the upper arm module of the belt feeding module and the holding module phase mf; The second factory after the positioning module is transported in the overlapping area: the ability to p the circuit board material module, the positioning module uuf board, and the net The 4 series direct or indirect blood machine and holding module /, and the bar module module mutual mechanical joint review committee members can further understand the characteristics of this creation and

M260073 IV. Creative Instructions (5) For the technical contents, please refer to the following detailed descriptions of this creative work. However, the contents are provided for reference and explanation only, and are not intended to add $ to this creative work. Implementation [Embodiment] Refer to the following for the process and operation principle related to this creation. Fuzhong's creation is to use heat-resistant adhesive to fix the thin printed circuit board (PCB) on the board and the board (the board on which the PCB is placed). The above principle (that is, the point-shaped heat-resistant adhesive is connected between the printed circuit board and the carrier), so that the heat-resistant adhesive through the ^ line 4 of the SMT part will not be cured when encountering the reflow furnace, so the pcb will be on the carrier board. 1 word is easy to place and pick up, coupled with peripheral auxiliary equipment, can save man-hours = meaning SMT production system that is beneficial to practical applications. Refer to the second picture for the status of the embodiment of the SMT production line. 1. t ί! 丨 After the heat-resistant adhesive is installed on the carrier board, the configuration of the SMT production line is too common. ） Positioning and pressing equipment can be implemented as (circuit board positioning and pressing equipment) — (solder paste printing machine) — (front side catch machine) _ (front side SMT universal machine) _ (reflow oven), such an arrangement The method type should be a single piece of PCB (it can also be completed by connecting multiple small pieces with a single edge on the single piece. The assembly production line can pass through the production line to make the main PCB assembly display the positioning and pressing of the creative circuit board (including the flexible board) Refer to the third and fourth figures for the combined equipment, which includes: the capacity of the rack module 1; Huai μ * U 'has a positioning machine connected to the front end of the production line of the surface bonding technology group 2 and has a circuit board stacking area 2 1; positioning module 3, with the ability to move the circuit board to a standard position;

$ 9 pages M260073 Fourth, creation instructions (6) Arm module 4, with vertical movement holding module 5, set in the mobile hand and up and down movement of round 4; holding device can carry the thin φ module 4 It is equipped with a holding device 51, which has the ability of conveying the belt 61, the wheel *, and the road board 8; the belt conveyor module 6, which has the ability to convey the carrier board 9 ^ with the entrance side 62 and the exit side 63, with), with a pressing device 7 1, imitation ^^ module 7 (please refer to the pressing device 7 1 shown in the fourth figure to press down all the way; above the rain belt module 6, there is a pressing device The ability to move the arm module 4 and suck the anti-thin printed circuit board 8; the ability to transport the circuit board 21 from the circuit board stacking area 21 to the fruit / and 5 has the ability to move the circuit board 21; the feed; the position 3 Then it is transported to a carrier board 9 ^ ^ ^ M ^ ^ MF f ^ ^ 4 is mechanically connected to the rack module 1 / ... special or direct or indirect mode ϊ y = arm module 4 and Suction i ^ vbAT / s; ri P brush the circuit board 8 and transport it to the heat-resistant adhesive 9 Λ ί ίΛί / ΛΤ press down to the thin printed circuit board H, which is the closest to the thin printed circuit that is sent by the conveyor module 6 Board 8 with / 、 9 enters the SMT production line to assemble electronic parts. Another embodiment of the M f case can also be an optical positioning device (set at the original location, and location, which can be an optical camera setup) as Position a knife of the module 3 to fine-tune the mobile arm module (another rotation or translation mechanism is provided) to achieve M260073 4. Creation instructions (7) The same effect as the original implementation. The following describes the embodiments of the present invention. Item change: wherein the carrier board 9 is provided with heat-resistant adhesive 92 at a predetermined position to position the thin printed circuit board 8 thereon; wherein the positioning mechanism 31 of the positioning module 3 is in the form of a mechanical push circuit The plate is slid to a specific position (such as a cylinder with a special push-pull mechanism); the heat-resistant adhesive 92 can be composed of sillcon, toluene, and resin; where The moving arm module 4 can be a slide rail with a longitudinal movement capability: the suction device 51 in the form of a vacuum suction; the suction 2 φ two first suction cup group and the second suction cup Group for separate handling (1). Thin = The circuit board 8 is moved from the feeding module 2 to the positioning module level (2). The thin printed electrical ^ 8 is moved from the positioning module 3 to the conveyor belt module 6, and wait for two routes; where = and; = 65 ' And the adjusting side 65 can be adjusted into rr Μ. The width further includes the carrier board feeding module 9 (moved into 3 m in the middle and thin printed electric 5 " only 8 positioning adjustment module 6 5 & lf Module 6, the carrier board 9 is moved from the carrier board feed module 9 at the entrance side 62 to the conveyor module 6. 2 The circuit board positioning and pressing equipment of this creative circuit has the following 'can also be used for printed circuit boards , Not limited to thin printed circuit boards): Tongcai i. 2 o '' low, output value increased: i point is replaced by heat-resistant adhesive glue, ..., glue τ, so that artificial economic effects can be achieved. 2 · Reduced manpower: The dedicated machine reduces manpower naturally. 3. Can be mass-produced for a long period of time: the benefit of special machine production. The above description is only a good and feasible embodiment of this creation, not because of this. M260073 IV. Creation Instructions (8) The patent scope of this creation is limited. Therefore, the equivalent chemical structure changes for the application of this creation description or the contents of the drawings Both are included in the scope of this creation to protect the rights and interests of the creator.

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Brief description of the drawings [Simplified description of the drawings] The first picture: a schematic illustration of a conventional thin printed circuit board assembly production line. The second picture is a schematic diagram of the thin printed circuit board assembly production line of the preferred embodiment of the creation; the third picture: this The schematic diagram of the embodiment of the authoring circuit board positioning and pressing equipment; and the fourth figure: a schematic diagram of the structure of the embodiment of the authoring circuit board positioning and pressing equipment.

% Symbol description] Rack module 1 Feeding module 2 Positioning module 3 Moving arm module 4 Holding device 51 Carousel 61 Exit side 63 Adjusting side 65 Compression device 71 Plant board 9 Heat-resistant adhesive 92 Body 11 Circuit board stacking area 21 Positioning mechanism 31 Holding module 5 Conveyor module 6 Entrance side 62 Fixed side 64 Crimp module 7 Thin printed circuit board / FPC 8 Carrier board feed module 90

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Claims (1)

M260073 5. Scope of patent application 1. A circuit board positioning and pressing device, which includes a rack module, which has a body and has the ability to be connected to the front end of a production line with surface adhesion technology; '' a feed module with a circuit Board pile worry area; positioning module with positioning mechanism, capable of moving the circuit board to a standard position; $ mobile arm module, with vertical movement ability, and can be partially moved up and down on the module, with holding device, The conveyor belt has an entrance side, an exit and a position above the conveyor belt module, and has the ability of a circuit board on the board; the combination has the ability to transport the circuit board to a carrier board, move the arm module, The holding mold is directly or indirectly located at a predetermined position with the circuit board positioning and pressing equipment of the rack module, so that the electric holding module is provided in the mobile arm holding device capable of conveying the circuit board. Belt module with conveyor belt, mouth side, and ability to transport carrier board; Compression module, with compression clamp, capable of pressing the compression device down and moving it = Constant suction arm module and the two towns force conveyed by the circuit board to the stacking zone; m Series group wherein the feed module, positioning L, the belt modules, such as module and dust together J mechanically connected to each other. 2. As described in item 1 of the scope of patent application, where the carrier board has an anti-adhesive circuit board positioned thereon. Poisonous glue, such as the circuit board positioning and pressing equipment described in item 1 of the scope of patent application im IB Page 14