TWM243778U - Clearance cleaning machine for overlapped chips - Google Patents

Description

M243778 V. Creative Instructions (1) < Technical Field of New Type > This creation is related to the design of a multi-wafer gap cleaning machine, but refers to a multi-wafer gap cleaning machine which can fully clean and blow dry the gap of the multi-wafer. Structural design. < Previous technology > According to the conventional wafer cleaning machine (waferc 1 eaner) has a variety of different principles and equipment types, such as dry cleaning machines, wet cleaning machines, sealed container cleaning machines or high pressure chemical container cleaning equipment And so on, the principle, method and machine type of wafer cleaning are all different. The most common type is the so-called wet cleaning machine. Such machine modules usually include: central control system and wafer input terminal, tandem chemical acid tank and washing tank, robot arm or conveyor belt, detection system (Including flow detection, temperature detection side, acid tank chemical concentration calibration) and spin-drying or air-drying equipment. However, the traditional wet cleaning machine has a structural plan that only cleans the surface of a general single wafer. Therefore, for complex wafers with gaps, the effect of cleaning the gaps cannot be achieved, especially using high water and low pressure control. The module cannot effectively enter the gap, so the overall cleaning effect is not good. Secondly, the traditional wet cleaning machine uses spin-drying or drying equipment to separate the liquid from the wafer. The spin-drying mode is a passive type and must be performed in batches, which often causes the operation process to be suspended. After the wafer is cleaned, the drying equipment is used to dry it. Therefore, in addition to being unable to dry the gaps between the wafers, the drying speed is slow, which means that the operation procedure must be suspended from time to time, which affects the efficiency of its automation. And when the drying speed is slowed down, liquids and impurities can't be taken away quickly, often on the wafer surface.

Page 5 M243778 V. Creative Instructions (2) Residual water marks and impurities, which affect the quality of the wafer. For this reason, the creator of this case, based on his technology and experience in designing and manufacturing related equipment for the electronics industry, proposed a multi-wafer gap cleaning machine design in order to improve the shortcomings of the above wet cleaning machine. < New content > The main purpose of this creation is to provide a design of a multi-wafer gap cleaning machine, but by clever planning and setting of the cleaning mechanism and stroke, to achieve functions suitable for cleaning multi-wafers or single wafers, but special It has the effect of cleaning and blow drying of the gap of the compound wafer, which can make the automatic operation procedure fast and smooth, and fully clean and blow dry all parts of the compound wafer. According to the above purpose, this creation is mainly at the beginning of the travel of the mesh conveyor belt of a machine, and a cleaning area, a wind-cut area, and a blow-drying area are planned in order. The cleaning area is a plurality of waterjets and At least one liquid-cut cleaning mechanism is formed and arranged to clean the surface and gaps of the multi-wafer, and the wind-cut area is composed of at least one air-cut mechanism and set to blow-dry the multi-wafer gap. In this way, a high-pressure, low-volume compound wafer gap cleaning machine is constructed to sufficiently clean and quickly dry all parts of the compound wafer. The purpose of this creation is to provide a multi-wafer gap cleaning machine design. The liquid cutting cleaning mechanism and air cutting mechanism can be a hollow high pressure cylinder with a gap on one side; it can also be a hollow high pressure. The tube is formed by a plurality of tubular outlets arranged on one side to provide high pressure and low volume cleaning and drying effects. < Embodiment > In order for your review committee to understand the purpose, features, and effects of this creation,

Page 6 M243778 V. Creation Instructions (3) The following specific examples and the accompanying drawings are used to explain this creation in detail, as explained below: As shown in the first figure, this creation is "Multi-wafer gap cleaning machine" design, the gap cleaning machine is composed of a machine 1, a conveying equipment 2 and other control systems and devices, among which: machine 1 (refer to the first picture) It is provided with a structure base on which the conveying equipment 2 is arranged, and a central control system, a chemical tank, a washing tank, a detection system and the like are provided at the selected place. However, the structure and equipment of the machine 1 are conventional. The application of technical principles is not redundant; the conveying equipment 2 (refer to the first figure) is a device for conveying multiple wafers on the machine 1 and includes an upper conveying belt 21 and a lower conveying device. The belt 22 is formed, wherein the upper and lower conveyor belts 21 and 22 are mesh-shaped endless belts, and the shaper is supported by a plurality of rollers 23, and the selected rollers 23 are connected to the driving equipment, thereby constituting On the upper and lower conveyor belt 2 1 The structure and function of the conveyance of 2 clamped multiple wafers; however, this creation is mainly selected at the beginning of the 2 stroke of the conveying equipment, and a cleaning zone 3, a wind cutting zone 4 and a blow drying zone 5 are planned in order to form a complex Wafer gap cleaning machine, to further achieve the effect of cleaning and drying the gaps of the multiple wafers, and obtain the fast, smooth, and fully automatic cleaning process of the various parts of the multiple wafers, including: a cleaning zone 3, ( (As shown in the first figure) is composed of a plurality of water jets 3 1 and at least one liquid cutting cleaning mechanism 3 2 installed at the beginning of the stroke of the conveying equipment 2 and used for high-pressure spraying of specific liquids or pure liquids. Those cleaning the wafers with water; the liquid-cut cleaning mechanism 32 may be a hollow high pressure

Page 7 M243778 V. Creation instructions (4) The tube is provided with a slit outlet 3 1 1 (as shown in the second figure) on the side, or a hollow high-pressure tube is provided with a plurality of tubular outlets 3 1 2 arranged on one side; Therefore, a plurality of water jets 31 are selected and arranged at selected positions between the upper and lower conveyor belts 2 1 and 22, respectively, so that they are aligned with the multi-wafer conveying stroke; and on the upper and lower conveyor belts, 2 1 、 2 2 At the selected side of the stroke, there is at least one liquid cutting cleaning mechanism 3 2 (as shown in the fourth and fifth figures), and the gap exit 3 1 1 or the tubular exit 3 1 2 is exactly Align the gap position of the multiple wafers 10 during the conveying stroke; if so, connect several waterjets 31 and at least one liquid cutting cleaning mechanism 32 to the liquid supply equipment, which can be synchronized to be flushed and moved at the conveying equipment 2 The structure of the cleaning area 3 on the surface and the gap of the complex wafer; a wind cutting area 4, which is provided with a wind cutting mechanism capable of spraying wind pressure 41. It is located at the side of the middle of the stroke of the conveying equipment 2 or other appropriate places. Dry-recovering device for wafer gap, the air cutting mechanism 41 is the same as the liquid cutting cleaning Structure 3 2 (as shown in the second and third figures) can be a hollow high-pressure cylinder provided with a slit outlet 4 1 1 or a tubular outlet 4 1 2 on the side; thereby, at least one liquid cut is selected. The mechanism 41 is set at the selected side of the stroke of the upper or lower conveyor belt 2 1 and 2 2 (as shown in the fourth and fifth figures), so that the gap exit 411 or the tubular exit 412 is aligned with the rest of the conveying stroke. The chip 10 has a gap position, and is connected to the wind pressure equipment that provides high wind pressure and low air volume, that is, a wind cutting area 4 structure that can be dried and located in the gap of the wafer while the conveying device 2 is moving; It is a device set at the end of the 2 stroke of the conveying equipment to dry the surface of the complex wafer with low pressure and high air volume. It mainly uses several

M243778 V. Creation instructions (5) The air duct 51 is set at the selected place between the upper and lower conveyor belts 2 1 and 22, respectively, so that its air outlet is aligned with the multi-wafer conveying stroke and is related to the wind pressure equipment. The connection is constituted. Based on the above-mentioned conveying equipment 2, it is planned that the structure and the combination relationship design of a cleaning area 3, a wind cutting area 4 and a blow drying area 5 are sequentially planned, and the liquid supply equipment and The wind pressure equipment forms a high-hydraulic (wind pressure), low-liquid (low-air volume) cleaning and blow drying mode, that is, a multi-wafer gap cleaning machine is formed to further achieve the multi-wafer gap cleaning and high-speed blow drying effects. Secondly, (as shown in Figures 6 and 7), the liquid cutting cleaning mechanism 3 2 and air cutting mechanism 4 1 used for high pressure cleaning or drying of the gap 10 of the wafer can be implemented separately in the conveying equipment. 2 Both sides of the upper or lower conveyor belt 2 1, 2 2 (so there are two liquid cutting cleaning mechanisms or air cutting mechanisms), so that one side of the gap exit 3 1 1, 4 1 1 or tubular exit 3 1 2, 4 1 2 Align the position of the wafer gap during the conveying stroke to improve the high-pressure cleaning and high-pressure blow drying effect of the wafer gap; and (as shown in Figures 8 and 9) the liquid cutting cleaning mechanism 3 2 and The wind cutting mechanism 4 1 can also be provided on both sides of the upper and lower conveyor belts 2 1, 2 2 of the conveying equipment 2 (so there are a total of four liquid cutting cleaning mechanisms or air cutting mechanisms), so that there is a slit exit on one side 3 1 1, 41 1 or tubular outlets 312, 412 are aligned with the position of the gap 10 of the multiple wafer in the conveying stroke, which further enhances the high-pressure cleaning and high-pressure blow-drying effect of the multiple wafer gap; thus, the alignment described in this creation Liquid cutting cleaning mechanism 3 2 and air cutting mechanism 4 1 with a gap of 10 wafers are not limited to installation One or two sides, even according to the actual needs, also selectively provided

M243778 V. Creation instructions (6) Set the direction of the gap, the same washing and blow drying work, a picture moves 3 1 The mold washing is filled with compound crystals, the south wind is blown by a 5-face force meter, and the miscellaneous materials are quickly sent to the application. ), It is at least the formula, that is, the conveying pressure of the cleaning tablets is lowered, and the low of 1 is that the dryness that can be filled with the remaining dryness can be π 3 1 or reverse energy. The creation of a compound crystal can first pass a compound crystal wind pressure that can synchronize the compound crystal to the wind-cut air volume; the minute will be left to compound the wafer so that 1,411 or the tubular outlets 312,412 are in The direction of the conveying device 2 is the same as that with the above-mentioned clear wafers. According to the liquid cutting, the wafers are blown dry and transported to the south wind. By cleaning and maintaining the cleaned polycrystalline parts described in the original gap sequence, the pattern is sent to Measure the wind and blow the compound crystal position to obtain 3 pieces of surface on the upper and lower washing area of the washing machine, and can automatically cut off the final dry-mode cutting area 4 away. In addition to the quality of the piece, avoid the complete set of conveying 3, 2 and the seam saving control complex crystal blow-drying, combined with the extra energy, no need to count in practice, with 2 using high water gap to enter the water wind to slice its area 5 effective for blow-drying can also be drying pause (please 1, its re-pressurization If the mechanism gap is clear, the compound area 5 can avoid re-referring due to high procedures. 2 2 Several low-water washing results. The residue of 4 1 is based on the rules. See the wind pressure must be temporarily changed. Hold The water knife is clear and clear, and when water is used to add air, the water mark mode is set to stop the loss. To sum up, the structural design of the "multi-wafer gap cleaning machine" for this creation has been practical and creative. The use of its means is also novel and undoubted, and the efficacy and design purpose are indeed in line with it. It has been said that reasonable progress has been made. To this end, a new patent application has been submitted in accordance with the law. To the sense of virtue.

Page 10) t) ίι '') / M243778 Schematic illustration The first picture is a schematic diagram of the overall composition of the creation. The second figure is a perspective view of the embodiment of the liquid-cutting cleaning mechanism and the wind-cutting mechanism provided with a slot outlet. The third figure is a perspective view of another embodiment of a liquid-cutting cleaning mechanism and a wind-cutting mechanism provided with a tubular outlet. The fourth figure is a sectional view of an embodiment in which at least one liquid-cut cleaning mechanism or air-cut mechanism is provided. The fifth figure is a partial plan view of an embodiment in which at least one liquid-cut cleaning mechanism or air-cut mechanism is provided. The sixth figure is a cross-sectional view of an embodiment in which two liquid-cutting cleaning mechanisms or air-cutting mechanisms are provided in the creation. The seventh figure is a partial top view of an embodiment in which two liquid-cutting cleaning mechanisms or air-cutting mechanisms are provided in the creation. The eighth figure is a cross-sectional view of an embodiment in which four liquid-cutting cleaning mechanisms or air-cutting mechanisms are provided. The ninth figure is a partial plan view of an embodiment in which four liquid-cutting cleaning mechanisms or air-cutting mechanisms are provided. < Simplified description of drawing number > 1 ———— —— · Doujilou > 2 ———— • β · Feeding device 2 1 ··· • · · Jl feed 2 2 ··· 2 3 ··· Wheels, 3 ··· · • · • • Washing area 9

Page 11 M243778 Schematic description

3 12 4 · 4 1 · 4 11 4 12

Waterjet Liquid-cut cleaning mechanism, slit exit; tubular exit; wind-cut zone, air-cut mechanism; slit exit; tubular exit; blow-drying zone; air duct; compound wafer;

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Claims (1)

M243778 VI. Application for Patent Scope 1. A wafer cleaning machine with multiple wafers, which has a machine, a conveying equipment and other control devices. The machine is provided with a base for conveying equipment. The conveying equipment is for conveying multiple wafers. The device is characterized in that, starting from the stroke of the selected conveying equipment, a sequence is planned in order: A cleaning area is selected by using a plurality of liquid jet water jets to be set at the selected location of the conveying equipment, so that the outlet is aligned with the conveyance of the wafer surface At the stroke; and at the side of the conveying equipment, there is at least one liquid-cutting cleaning mechanism capable of ejecting liquid, so that its outlet is aligned with the position of the multiple wafer gap in the conveying stroke, and each liquid-cutting cleaning mechanism is connected to the liquid supply equipment A wind-cutting area is located at the side of the conveying equipment. At least one wind-cutting mechanism capable of spraying wind pressure is provided, so that its outlet is aligned with the position of the gap between the multiple wafers in the conveying stroke, and the wind-cutting mechanism is connected with the wind. The pressure equipment is turned on. In the blow-drying area, several air outlet pipes are selected at the end of the stroke of the conveying equipment so that the air outlet is aligned with the complex. It is connected to the wind pressure equipment; the cleaning zone can be used to clean the surface and gap of the wafer simultaneously. The air-cutting zone can dry the gap of the wafer, and the blow-drying area can clean the gap of the wafer. machine. 2. The compound wafer gap cleaning machine as described in item 1 of the scope of patent application, wherein the liquid-cut cleaning mechanism and air-cut mechanism may be a hollow high-pressure cylinder provided with a slit or water outlet on the side. 3. The compound wafer gap cleaning machine as described in item 1 of the scope of patent application, wherein the liquid cutting cleaning mechanism and air cutting mechanism can be a hollow high pressure cylinder on the side M243778 6. Scope of patent application A plurality of tubular outlets for water or air are arranged along the side. 4. The multi-wafer gap cleaning machine described in item 1 of the scope of the patent application, wherein the liquid cutting cleaning mechanism and the wind cutting mechanism can be selected on two sides of the conveying equipment. 5. The multi-wafer gap cleaning machine described in item 1 of the scope of patent application, wherein the liquid cutting cleaning mechanism and the wind cutting mechanism can be selected from four positions respectively arranged above and below the conveying equipment. 6. The compound wafer gap cleaning machine described in item 1 of the scope of patent application, wherein the conveying equipment is composed of an upper conveying belt and a lower conveying belt, and the upper and lower conveying belts are mesh endless belts, and a plurality of Each roller is supported and formed, thereby clamping the wafer carrier between the upper and lower conveyor belts. Page 14