TWM242696U - Modular probe card with coaxial transmitter - Google Patents
Modular probe card with coaxial transmitter Download PDFInfo
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- TWM242696U TWM242696U TW91216882U TW91216882U TWM242696U TW M242696 U TWM242696 U TW M242696U TW 91216882 U TW91216882 U TW 91216882U TW 91216882 U TW91216882 U TW 91216882U TW M242696 U TWM242696 U TW M242696U
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- coaxial transmission
- circuit board
- printed circuit
- transmission device
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
M242696 五、創作說明(2) ----- 係具有連接端’該環形板係具有複數個通孔,每一通孔係 裝設有^微波連接器(microwave connector),該些微 波連接器係以同轴瘦線(c a X丨& 1 c & b 1 e )電性連接至探 針邛刀探針係以導線連接至該印刷電路板之連接端,以 供高f或低頻兩種信號之使用,另在環形板上係設有一具 有上蓋之平板’以密封該環形板内部並對無線電干擾 (RF')、及電磁波干擾(EM1 )加以屏蔽,使該同軸探測卡 可對微波f導體晶圓進行測試,然而非模組式之同轴探測 卡係無法簡易地組裝拆換,一但發生故障檢修係較為困 難。 【創作目的及概要】 ^本創作之主要目的在於提供一種具有同轴傳輸裝置之 模組式探測卡,其係在一第一印刷電路板與一第二印刷電 路板間模組式裝設有至少一同轴傳輸裝置,當需測試相同 電性功能而具不同焊墊分佈之半導體裝置時,係組裝另一 第一,刷電路板,該第二印刷電路板上係結合有一對應於 待測半導體裝置之探測頭,使該探測卡具有較佳之通用 性。 Λ本創作之次一目的在於提供一種具有同軸傳輸裝置之 模組式探測卡,該同軸傳輸裝置之同轴傳輸線兩端係分別 結合於一連接器,該些位於上下之連接器係集結固定該同 轴傳輸裝置之多條同軸傳輸線,並可插拔地連接第一印刷 ,,板與第二印刷電路板,故不會產生同轴傳輸線連接錯 誤等問題,且可迅速組裝探測卡。M242696 V. Creative Instructions (2) ----- It has a connection end. The ring plate has a plurality of through holes, and each through hole is provided with a microwave connector. The microwave connectors are Coaxial thin wire (ca X 丨 & 1 c & b 1 e) is electrically connected to the probe. The trowel probe is connected to the connection end of the printed circuit board with a wire for high f or low frequency. For the use of signals, a flat plate with an upper cover is provided on the ring plate to seal the inside of the ring plate and shield radio interference (RF ') and electromagnetic wave interference (EM1), so that the coaxial probe card can shield microwave f Conductor wafers are tested. However, non-modular coaxial probe cards cannot be easily assembled and replaced. Once a fault occurs, it is more difficult to repair and repair. [Creation purpose and summary] ^ The main purpose of this creation is to provide a modular detection card with a coaxial transmission device, which is modularly installed between a first printed circuit board and a second printed circuit board. At least one coaxial transmission device. When it is necessary to test semiconductor devices with different pad distributions for the same electrical function, another first, brush circuit board is assembled, and the second printed circuit board is combined with a corresponding one to be tested. The detection head of the semiconductor device makes the detection card have better versatility. Λ The second purpose of this creation is to provide a modular detection card with a coaxial transmission device. The two ends of the coaxial transmission line of the coaxial transmission device are respectively connected to a connector. The upper and lower connectors are assembled and fixed. Multiple coaxial transmission lines of the coaxial transmission device can be plugged and connected to the first printed circuit board, the second printed circuit board and the second printed circuit board, so there will be no problems such as coaxial transmission line connection errors, and the detection card can be quickly assembled.
M242696 五、創作說明(3) 本創作之再一目的在於接供一播且士 riA 模組式探測卡’該探測卡係模組設K傳=置之 軸傳輸裝置之電性良好,不會導致=保同 且探測卡發生故障時檢修亦較為簡易。 產生, =作之具“㈣輸裝置之模^ 3有至少一同軸傳輸裝置、一第一卞ς係包 刷電路板及一探測且,=板、一第二印 接哭 咕 具笮該冋軸傳輸裝置係由一第一連M242696 V. Creation Instructions (3) Another purpose of this creation is to receive a broadcast and riA modular probe card 'The probe card is a module with a K-transmission axis transmission device which has good electrical properties and will not It is also easier to repair when the cause = Bao Tong and the probe card fails. Generated, = a model with "transmission device" 3 has at least one coaxial transmission device, a first brush circuit board and a detector, and = board, a second printed circuit board The shaft transmission device consists of a first
组i裝;:連2i複數條同軸傳輸線所組成,其係模 為ρ刷電路板與第二印刷電路板之間,以作 结人二m!:之傳輸路徑,該些同軸傳輸線之-端係 第二連接裝置,該*同轴傳輸線之另—端則係結合於該 弟:連接器,並對應可插拔地電性連接至第二印刷電路板 =了連接裝置,該第二印刷電路板係結合有探測頭,該 二測頭係電性連接至該第二印刷電路板,且其一表面係形 成有複數個探測接點,以供探觸一半導體裝置。 【創作詳細說明】 Μ參閱所附圖式’本創作將列舉以下之實施例說明: 、依本創作之第一具體實施例,如第1圖所示,一種模 組式探測卡1〇〇係供裝設於一測試頭17〇 (test head)並 電性連接至一測試機台1 8 0,用以在測試時電性接觸一半 導體裝置(如晶圓…等),該探測卡1〇〇係包含有一第一 印刷電路板 11〇 (printed circuit board,PCB)、一第Assembly i :: It is composed of a plurality of coaxial transmission lines of 2i, and its mode is between the ρ brush circuit board and the second printed circuit board to form the transmission path of the two m!:, The-end of these coaxial transmission lines. Is the second connection device, and the other end of the * coaxial transmission line is connected to the brother: connector, and is electrically connected to the second printed circuit board correspondingly pluggable = the connection device, the second printed circuit The board is combined with a detecting head, the two measuring heads are electrically connected to the second printed circuit board, and a plurality of detecting contacts are formed on one surface thereof for probing a semiconductor device. [Detailed description of creation] Please refer to the attached drawings. 'This creation will list the following embodiment descriptions: According to the first specific embodiment of this creation, as shown in Figure 1, a modular detection card 100 series The probe card 1 is provided in a test head 170 and is electrically connected to a test machine 180 for electrically contacting a semiconductor device (such as a wafer, etc.) during the test. 〇 system includes a first printed circuit board 11 (printed circuit board, PCB), a first
M242696 五、創作說明(4) 二印刷電路板120、一探測頭130 (pr〇be head )及至少一 · ,轴傳輸裝置1 40,其中該第一印刷電路板丨丨〇係作為測試 设備與探測卡之連接介面,可結合至測試設備之測試頭 〔test head〕,該第一印刷電路板11〇係形成有複數個第 一連接裝置111,如電性導接孔或插槽,用以插接同軸傳 輸裝置140之第一連接器HI,且該第一印刷電路板11〇内 部係具有多條導電線路(圖未繪出),以將第一連接裝置 1 U電性導通至該測試頭丨7 〇。第二印刷電路板丨2 〇係作為 探測頭130〔probe head〕與第一印刷電路板11〇之傳輸介 面,該第二印刷電路板丨2 〇係形成有複數個第二連接裝置 1 21,如電性導接孔或插槽,用以可插拔地連接同轴傳輸 裝置140之第二連接器143,在本實施例中,第二連接裝置 1 21係為電性導接孔,該些第二連接器丨43在第二印刷電路 板120上之排列密度係高於第一連接器14ι在第一印刷電路 板1 ίο上之排列密度,且該些第二連接裝置121係環設於探 測頭1 3 0之周邊,該探測頭1 3 〇係結合於該第二印刷電路板 1 2 0上,較佳地,該第二印刷電路板丨2 〇係形成有一凹穴 1 2 2,以容置固定該探測頭1 3 〇,該探測頭丨3 〇係為一石夕基 板,其一表面131係形成有複數個探測接點132,如探針 (probe needles)或凸塊(bumps)等,以供探觸一半導 體裝置之焊墊(圖未繪出),在本實施例中,如第3圖所 示,該探測頭130之表面131周邊係形成有複數個連接墊 1 3 3,該些連接墊1 3 3係電性導通至對應之探測接點丨3 2, 且該些連接墊133係以電性連接裝置15〇電性連接至第二印M242696 V. Creation instructions (4) Two printed circuit boards 120, a probe head 130 (prObe head) and at least one shaft transmission device 1 40, wherein the first printed circuit board 丨 丨 〇 is used as test equipment The connection interface with the probe card can be combined with the test head of the test equipment. The first printed circuit board 110 is formed with a plurality of first connection devices 111, such as electrical conductive holes or slots. The first connector HI of the coaxial transmission device 140 is inserted, and the first printed circuit board 110 has a plurality of conductive lines (not shown in the figure) to electrically connect the first connection device 1 U to the first connector HI. Test head 丨 7. The second printed circuit board 丨 20 is used as a transmission interface between the probe head 130 [probe head] and the first printed circuit board 110. The second printed circuit board 丨 20 is formed with a plurality of second connection devices 121. For example, the electrical connection hole or slot is used to pluggably connect the second connector 143 of the coaxial transmission device 140. In this embodiment, the second connection device 1 21 is an electrical connection hole. The arrangement density of these second connectors 43 on the second printed circuit board 120 is higher than the arrangement density of the first connectors 14 ι on the first printed circuit board 1, and the second connection devices 121 are arranged in a ring. Around the probe head 130, the probe head 130 is coupled to the second printed circuit board 120, and preferably, the second printed circuit board 2 is formed with a cavity 1 2 2 The probe head 130 is fixed and accommodated. The probe head 301 is a stone substrate, and a surface 131 of the probe head 132 is formed with a plurality of probe contacts 132, such as probe needles or bumps. ), Etc., for contacting a pad (not shown) of a semiconductor device, in this embodiment, as in the third As shown, a plurality of connection pads 1 3 3 are formed around the surface 131 of the probe head 130. The connection pads 1 3 3 are electrically connected to the corresponding detection contacts 3 2, and the connection pads 133 are Electrically connected to the second seal with the electrical connection device 15
M242696M242696
刷電路板120之第二連接裝置121,該些電性連接裝置15〇 係可為金屬導線(bonding wire)或軟性電路板 (flexible printed circuit ),在本實施例中,該些電 性連接裝置1 5 0係採用軟性電路板,其主要包含有一軟性 絕緣層151,如聚亞醢胺(p〇iyimide,PI)等等,該軟性 絕緣層151之一表面係形成有金屬線路152,以電性連接探 測頭130之連接墊133與第二印刷電路板120之第二連接裝 置121,另在該金屬線路152上覆蓋有保護層153 (⑶ver layer ),以強化電性連接裝置15〇之結構。 如第1及2圖所示,在本實施例中,第一印刷電路板 11 0與第二印刷電路板1 2 〇之間係設有複數個同軸傳輸裝置 1 4 0 ’以作為該探測卡1 〇 〇測試電路之傳輸路一 傳輸裝置U0係由一第一連接器141、一第二連接:143门及轴 複數條同軸傳輸線145所組成,第一連接器141或第二連接 器143係可為插頭連接器〔piUg c〇nnect〇r〕,插針式接 合或插卡式接合,而該些同轴傳輸線145係可有效防止因 法拉第效應(Faraday,s iaw)產生之訊號干擾,而完全 阻撓因電路過度密集或高頻測試等因素所產生之串音 (cross-talk )現象,在本實施例中,該第一連接器141 與該第二連接器143係呈弧形,其中該第一連接器141之一 表面係形成有複數個插針142,該些同轴傳輸線145之一端 係固定結合於第一連接器丨4 1且電性連接至對應之插針 142,該第二連接器143係形成有複數個插針144或插卡, 該些同軸傳輸線145之另一端係結合於第二連接器143且電The second connection device 121 of the circuit board 120 is brushed. The electrical connection devices 15 can be metal wires or flexible printed circuits. In this embodiment, these electrical connection devices The 150 series uses a flexible circuit board, which mainly includes a flexible insulating layer 151, such as polyimide (PI), etc. A metal circuit 152 is formed on one surface of the flexible insulating layer 151. The connection pad 133 of the probe 130 is connected to the second connection device 121 of the second printed circuit board 120, and the metal circuit 152 is covered with a protective layer 153 (⑶ver layer) to strengthen the structure of the electrical connection device 15 . As shown in FIGS. 1 and 2, in this embodiment, a plurality of coaxial transmission devices 1 4 0 ′ are provided between the first printed circuit board 110 and the second printed circuit board 120 as the detection card. The transmission circuit of the 100 test circuit. A transmission device U0 is composed of a first connector 141 and a second connection: 143 gates and a plurality of coaxial transmission lines 145. The first connector 141 or the second connector 143 is It can be a plug connector [piUg c〇nnect〇r], pin type or card type, and these coaxial transmission lines 145 can effectively prevent signal interference caused by the Faraday effect (s iaw), and It completely obstructs cross-talk phenomena caused by excessively dense circuits or high-frequency tests. In this embodiment, the first connector 141 and the second connector 143 are arc-shaped, where the A plurality of pins 142 are formed on one surface of the first connector 141, and one end of the coaxial transmission lines 145 is fixedly coupled to the first connector 41 and electrically connected to the corresponding pins 142. The second The connector 143 is formed with a plurality of pins 144 or a card. The other end of the coaxial transmission line 145 is coupled to the second connector 143 and is electrically connected.
第10頁 Ά £ M242696Page 10 Ά £ M242696
五、創作說明(7) 不需要裝配個別同軸傳輸線145於第一印刷電路板11〇或第 二印刷電路板1 2 0,使探測卡1 〇 〇之故障檢修簡易及組^迅 速’由於複數條同轴傳輸線145係有第一連接器141與第一 連接器143之定位,不會產生同轴傳輸線丨45連接錯^等& 題0 依本創作之第二具體實施例,如第4圖所示,一種模 組式探測卡200係供裝設於一測試頭260並電性連接至一測 試機台2 7 0,用以在測試時電性接觸一半導體裝置,該探^ 測卡200係包含有一第一印刷電路板21〇、一第二印刷電路 板220、一探測頭230及至少一同轴傳輸裝置24〇,其中該 第一印刷電路板210係形成有複數個第一連接裝置2'n,~用 以插接同轴傳輸裝置240之第一連接器241,如插針式插頭 連接器,該第二印刷電路板2 2 0係形成有複數個第二連接 裝置221,如插槽,用以插接同轴傳輸裝置24〇之第二連接 器243,在本實施例中,該探測頭2 3〇係為一多層陶瓷電路 板,其係結合並由其連接墊233電性導通至該第二印刷電 路板220,而該探測頭230之一表面231係形成有複數個探 測接點232,以供探觸一半導體裝置之焊墊。 如第4及5圖所示,在本實施例中,第一印刷電路板 21 0與第二印刷電路板2 2 〇之間係設有一同轴傳輸裝置 2 4 0,以作為該探測卡2 〇 〇測試電路之傳輸路徑,該同轴傳 輸裝置240係由一第一連接器241、一第二連接器243及複 f條同軸傳輸線2 4 5所組成,在本實施例中,該第一連接 器241與該第二連接器243係呈環形或其它,其中該些同轴V. Creation instructions (7) It is not necessary to assemble individual coaxial transmission lines 145 on the first printed circuit board 11 or the second printed circuit board 120, making the troubleshooting and repair of the probe card 100 easy and quick. The coaxial transmission line 145 has the positioning of the first connector 141 and the first connector 143, and no coaxial transmission line 丨 45 connection error ^ etc. & Question 0 According to the second specific embodiment of this creation, as shown in FIG. 4 As shown, a modular probe card 200 is provided on a test head 260 and is electrically connected to a test machine 270 for electrically contacting a semiconductor device during a test. The probe card 200 The system includes a first printed circuit board 21, a second printed circuit board 220, a probe 230, and at least one coaxial transmission device 24. The first printed circuit board 210 is formed with a plurality of first connection devices. 2'n, ~ the first connector 241 for inserting the coaxial transmission device 240, such as a pin-type plug connector, the second printed circuit board 2 2 0 is formed with a plurality of second connection devices 221, such as Slot for inserting the second connector 243 of the coaxial transmission device 24 In this embodiment, the probe head 230 is a multilayer ceramic circuit board, which is coupled and electrically connected to the second printed circuit board 220 by its connection pad 233, and a surface of the probe head 230 231 is formed with a plurality of detection contacts 232 for contacting a pad of a semiconductor device. As shown in FIGS. 4 and 5, in this embodiment, a coaxial transmission device 2 4 0 is provided between the first printed circuit board 21 0 and the second printed circuit board 2 2 0 as the detection card 2 The transmission path of the test circuit. The coaxial transmission device 240 is composed of a first connector 241, a second connector 243, and a plurality of f coaxial transmission lines 2 4 5. In this embodiment, the first The connector 241 and the second connector 243 are circular or other, and the coaxial
第12頁 圖式簡單說明 【圖式說明] 第1 第2 1¾¾ · 圖·圖: 依本創作之第 裝置之模組式 依本創作之第 之立體圖; 一具體實施例中 探測卡之截面圖 一具體實施例中 η 第3圖·依本創作之第 开菔貫施例 之局部放大圖, =本創作之第二具體實施例中, 裝置之模組式探測卡之截面圖; 依本創作之第二具體實施例中, 之立體圖。 【圖號說明】 1 〇 〇探測卡 第4圖 第5圖 具有同轴傳輸 同轴傳輸裝置 模組式探測卡 具有同轴傳輸 同轴傳輸裝置 11 〇第一印刷電路板 ln第一連接裝置 120第二印刷電路板 121第二連接裝置122凹穴 1 3 〇探測頭 131表面 140同軸傳輸裝置 141第一連接器 143第二連接器 150電性連接裝置 151軟性絕緣層 1 3 2探測接點 142插針 144插針 1 5 2金屬線路 133 145 連接墊 同轴傳輸線 153保護層 M242696 圖式簡單說明 1 8 0 測試機台 1 6 0 殼體 1 7 0 測試頭 2 0 0 探測卡 2 1 0第一印刷電路板 2 11第一連接裝置 2 2 0第二印刷電路板 221第二連接裝置 2 3 0 探測頭 233連接墊 245同軸傳輸線 270 測試機台 2 31 表面 2 3 2探測接點 240同轴傳輸裝置 241第一連接器 243第二連接器 2 5 0 殼體 2 6 0 測試頭Brief description of the drawings on page 12 [Illustration of the drawings] 1st 2nd 2 ¾¾ · Figures · Figures: Modular model of the device according to the present invention, perspective view of the first module according to the present invention; sectional view of the detection card in a specific embodiment In a specific embodiment η FIG. 3 · A partial enlarged view of the first embodiment of the present invention, = a cross-sectional view of a modular detection card of the device in the second embodiment of the present invention; A perspective view of the second embodiment. [Illustration of the drawing number] 1 00 Probe card Figure 4 Figure 5 has coaxial transmission coaxial transmission device Modular probe card has coaxial transmission coaxial transmission device 11 The first printed circuit board ln the first connection device 120 Second printed circuit board 121 Second connection device 122 Cavity 1 3 〇 Surface of probe 131 140 Coaxial transmission device 141 First connector 143 Second connector 150 Electrical connection device 151 Soft insulating layer 1 3 2 Detection contact 142 Pin 144 Pin 1 5 2 Metal line 133 145 Connection pad Coaxial transmission line 153 Protective layer M242696 Simple illustration of the drawing 1 8 0 Test machine 1 6 0 Housing 1 7 0 Test head 2 0 0 Probe card 2 1 0 A printed circuit board 2 11 First connection device 2 2 0 Second printed circuit board 221 Second connection device 2 3 0 Probe head 233 Connection pad 245 Coaxial transmission line 270 Test machine 2 31 Surface 2 3 2 Probing contact 240 Coaxial Transmission device 241 First connector 243 Second connector 2 5 0 Housing 2 6 0 Test head
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW91216882U TWM242696U (en) | 2002-10-18 | 2002-10-18 | Modular probe card with coaxial transmitter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91216882U TWM242696U (en) | 2002-10-18 | 2002-10-18 | Modular probe card with coaxial transmitter |
Publications (1)
Publication Number | Publication Date |
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TWM242696U true TWM242696U (en) | 2004-09-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW91216882U TWM242696U (en) | 2002-10-18 | 2002-10-18 | Modular probe card with coaxial transmitter |
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2002
- 2002-10-18 TW TW91216882U patent/TWM242696U/en not_active IP Right Cessation
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