M241725 五、創作說明α) 【新型所屬之技術領域】 本創作係有關於一種可擴充型散熱裝置，特別是指一 種提供具多向接頭分配器以因應電腦内或主機板上的熱源 元件有新增加時，能利用分配器預留的管接頭連接散熱管 與新的熱源元件接觸，以對熱源元件進行高效率的散熱 者。 【先前技術】 按，電腦微處理器（CPU)的超頻極限，是現今科技 所討論的熱門話題，尤其微處理器運作時所產生的熱更是 影響到其超頻極限。目前對微處理器散熱方式一直遭遇技 術瓶頸，不僅影響電腦本身的穩定度，許多不明原因的當 機都是因為散熱問題無法解決所造成。早期運用於微處理 器的散熱方式不外乎有散熱片及風扇，因為其成本低廉已 普遍被採用。如所周知，習知散熱片所用的材料幾乎都採 用鋁合金，利用散熱片的表面積而使得熱得由空氣帶走， 藉以跟空氣接觸的面積越多，達到散熱效果越好。當然極 少數使用其他材料，不過導熱效果並不會因而相差太多。 而今，時下的電腦產品均往輕薄短小方向發展，且裡 面裝設的熱源元件（如：微處理器、硬碟、CR-ROM、電源 裝置、顯示器模組…等）也愈來愈多，甚又可依需求而增 加晶片組或其它會發熱的配件，所以對高品質散熱效果訴 求也愈來愈為明顯，而有再改良的必要。M241725 V. Creation instructions α) [Technical field to which the new type belongs] This creation relates to an expandable heat dissipation device, particularly to a distributor that provides a multi-directional connector to respond to new heat source components in the computer or on the motherboard. When it is added, the pipe joint reserved by the distributor can be used to connect the heat pipe to the new heat source element, so as to efficiently dissipate the heat source element. [Previous technology] Pressing, the overclocking limit of the computer microprocessor (CPU) is a hot topic discussed in today's technology, especially the heat generated when the microprocessor operates affects its overclocking limit. At present, the heat dissipation method of the microprocessor has always encountered technical bottlenecks, which not only affects the stability of the computer itself, but also many unexplained crashes are caused by the inability to solve the heat dissipation problem. In the early days, the heat dissipation methods used in microprocessors were nothing more than heat sinks and fans, because their low cost has been widely used. As is well known, almost all the materials used in the conventional heat sinks are aluminum alloys. The surface area of the heat sinks is used to remove the heat from the air. The more the area in contact with the air, the better the heat dissipation effect. Of course, very few other materials are used, but the thermal conductivity effect will not be much different. Today, computer products are developing in a thin, light, and short direction, and there are more and more heat source components (such as microprocessors, hard disks, CR-ROMs, power devices, display modules, etc.) installed in them. It is even possible to add chipsets or other components that can generate heat according to demand, so the demand for high-quality heat dissipation effects is becoming more and more obvious, and there is a need for further improvement.
第5頁 M241725 五、創作說明（2) 【新型内容】 本創作可擴充型散熱裝置主要目的，即在於改善主機 板或電細内。卩熱源的散熱問題，且，更用於提供可擴充式 液冷式的散熱積極效果。 為達到上述目的，本創作可擴充型散熱裝置主要特徵 在於政熱岌置具有複數個管接頭的分配器，可連接散 $效率高f散ί管’以對電腦内的熱源元件進行散熱外， •τΐϊίΐ巧管對新增熱源元件進行高效率的散熱，進而 可提升戎電腦的處理速度與功能者。 【實施方式】 請參閱第一圖 括有：一幫浦1、 散熱構造5及可配 在幫浦1輸出端11 的管接頭21上，再 個不同方向的管接 熱管3接連並使散 一個主散熱構造5 冷卻迴路，且在該 再如上述之散 定在一金屬體上製 設於該散熱單元6 當如上述裝置 ，其至少包 器2 、一主 3等構成， 2其中之一 中係具有四 可分別與散 上，再連接 端1 2以成一 水）。 的部份可固 散熱管3嵌 用時，則熱 ’本創作可擴充型散熱裝置 一具複數個管接頭21的分配 置到熱源元件4上之散熱管 以一散熱管3連接至分配器 以該分配器2 (在本實施例 頭21 )中之其它管接頭21， 熱管3緊貼在熱源元件4之 之後’再接回至幫浦1輸入 迴路内充填有冷媒液體（或 “、、貧3緊貼在熱源元件4上 作成一散熱單元6，使盤狀 之中者。 組裂於電腦内或主機板上使Page 5 M241725 V. Creative Instructions (2) [New Content] The main purpose of this creative expandable heat sink is to improve the motherboard or electronics.问题 The heat dissipation problem of the heat source is more used to provide the positive effect of the expandable liquid-cooled heat dissipation. In order to achieve the above purpose, the main feature of the expandable cooling device of this creation is that a distributor with a plurality of pipe joints is installed in the thermal system, which can be connected to a high-efficiency fan tube to dissipate heat sources in the computer. • τΐϊίΐ Smart pipe can efficiently cool the newly added heat source components, which can improve the processing speed and function of the computer. [Embodiment] Please refer to the first figure, which includes: a pump 1, a heat dissipation structure 5, and a pipe joint 21 that can be arranged on the output end 11 of pump 1, and a pipe with a heat pipe 3 in a different direction is connected and dispersed. The main heat dissipation structure 5 is a cooling circuit, and the heat dissipation unit 6 is made on a metal body as described above. When the device is as described above, it is composed of at least a container 2 and a main 3, and one of the 2 is a system. There are four can be separated and scattered, and then connected to the end 12 to form a water). When part of the solid heat pipe 3 is embedded, the heat pipe of this creative expandable heat sink device is provided with a plurality of pipe joints 21 and the heat pipe is arranged on the heat source element 4. A heat pipe 3 is connected to the distributor to The other pipe joints 21 in the distributor 2 (head 21 of this embodiment), and the heat pipe 3 is immediately after the heat source element 4 'and then connected back to the pump 1 input circuit filled with a refrigerant liquid (or ",, lean 3 is closely attached to the heat source element 4 to form a heat dissipation unit 6 to make the disk shape. The group is split in the computer or the motherboard
第6頁 M241725 五、創作說明（3) 源元件4所產生的熱量將由與 浦1的轉動，以使散熱管3内 迴路中循環流動，以將熱能快 到主散熱構造5 (如機殼或具 散熱體等），達到預期之快速 請再參閱第二圖所示，其 用於膝上型電腦之實施例示意 之熱源元件4至少包括有：微 4C、電源裝置4d、顯示器模組 刀配為2之一管接頭2 1連接散 件上再接回幫浦1 ，以形成一 達到散熱目的。又當該一電腦 元件時’本創作之裝置得由在 2 1再連接另一散熱管3至新增 分配器2接回幫浦1端以另成 吸附傳送至只散熱裝置5進行 達到可擴充散熱效果。 綜上所述，本創作可擴充 目的，符合專利要件，惟，以 實施例而已，大凡依據本創作 包含於本專利申請範圍内。 其緊貼的散熱管3 ，且經幫 部的冷媒液體被強制在整個 速帶離開熱源元件4而傳送 風扇之散熱器或外接之其它 政熱效果。 係本創作所述之散熱裝置應 圖’如圖中所示，該電腦中 處理器4a、硬碟4b、CR-ROM 4e···等，本創作實施時係於 熱管3依序繞過各個熱源元 散熱迴路，而能如前段所述 内部增設其它會發熱的熱源 分配器2中未使用的管接頭 的熱源元件上，或再增添一 一迴路，而能很快的將熱量 更有效的散熱，致使本創作 型散熱裝置確能達到創作之 上所述者僅為本創作之較佳 所為之各種修飾與變化仍應Page 6 M241725 V. Creation instructions (3) The heat generated by the source element 4 will be rotated by the pump 1 to circulate the internal circuit of the heat pipe 3, so that the heat energy will reach the main heat dissipation structure 5 (such as the case or With a heat sink, etc.), to achieve the expected speed, please refer to the second figure. The heat source element 4 shown in the example for a laptop computer includes at least: micro 4C, power supply device 4d, and display module. One of the two pipe joints 2 1 is connected to the spare part and then connected to the pump 1 to form a heat dissipation purpose. When it is a computer component, the device of this creation can be expanded by connecting another heat pipe 3 at 2 1 to the new distributor 2 and returning to the pump 1 end to transfer to another heat sink 5 only to achieve expansion. heat radiation. In summary, the creation can be expanded for purposes and meets the patent requirements. However, it is only an example. Anyone who is based on this creation is included in the scope of this patent application. Its close to the heat pipe 3, and the refrigerant liquid passing through the helper is forced to leave the heat source element 4 in the entire speed belt to transfer the fan's radiator or other external thermal effects. The heat dissipation device described in this creation should be shown in the figure. As shown in the figure, the processor 4a, hard disk 4b, CR-ROM 4e, etc. in this computer are implemented by the heat pipe 3 in order to bypass each of them. The heat source element has a heat dissipation circuit, and as described in the previous paragraph, other unused pipe joints in the heat source distributor 2 which can generate heat can be internally added to the heat source elements, or a loop can be added to quickly dissipate the heat more effectively. , So that this creative cooling device can indeed achieve the above-mentioned creations. The various modifications and changes that are only better for this creation should still be
M241725 圖式簡單說明 第一圖為本創作可擴充型散熱裝置的立體分解圖。 第二圖為本創作之裝置運用於手提電腦實施例圖。 【主要部分的代表符號】M241725 Brief description of the diagram The first picture is an exploded perspective view of the creative expandable heat sink. The second figure is a diagram of an embodiment of the creative device applied to a laptop computer. [Representative symbols for main parts]
幫浦 1 分配器 2 散熱管 3 熱源元件 4 主散熱構造 5 散熱單元 6 輸出端 11 輸入端 12 管接頭 21 微處理器 4a 硬碟 4b CR-ROM 4c 電源裝置 4d 顯示器模組 4ePump 1 Distributor 2 Radiator 3 Heat source element 4 Main heat dissipation structure 5 Radiator unit 6 Output 11 Input 12 Pipe connector 21 Microprocessor 4a Hard disk 4b CR-ROM 4c Power supply unit 4d Display module 4e
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