TWI901645B - 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件 - Google Patents

感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件

Info

Publication number
TWI901645B
TWI901645B TW110107078A TW110107078A TWI901645B TW I901645 B TWI901645 B TW I901645B TW 110107078 A TW110107078 A TW 110107078A TW 110107078 A TW110107078 A TW 110107078A TW I901645 B TWI901645 B TW I901645B
Authority
TW
Taiwan
Prior art keywords
preferred
group
groups
compounds
acid
Prior art date
Application number
TW110107078A
Other languages
English (en)
Chinese (zh)
Other versions
TW202146527A (zh
Inventor
山内晃
山﨑健太
榎本雄一郎
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202146527A publication Critical patent/TW202146527A/zh
Application granted granted Critical
Publication of TWI901645B publication Critical patent/TWI901645B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW110107078A 2020-03-02 2021-02-26 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件 TWI901645B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-034872 2020-03-02
JP2020034872 2020-03-02

Publications (2)

Publication Number Publication Date
TW202146527A TW202146527A (zh) 2021-12-16
TWI901645B true TWI901645B (zh) 2025-10-21

Family

ID=77613048

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110107078A TWI901645B (zh) 2020-03-02 2021-02-26 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件
TW114136002A TW202600668A (zh) 2020-03-02 2021-02-26 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW114136002A TW202600668A (zh) 2020-03-02 2021-02-26 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件

Country Status (3)

Country Link
JP (2) JP7506735B2 (https=)
TW (2) TWI901645B (https=)
WO (1) WO2021177263A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201543161A (zh) * 2014-03-27 2015-11-16 Fujifilm Corp 感光性樹脂組成物、硬化膜、硬化膜之製造方法及半導體裝置
TW201831995A (zh) * 2016-08-01 2018-09-01 富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、 積層體的製造方法及半導體元件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000131838A (ja) * 1998-10-26 2000-05-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、レリーフパターンの製造法及び半導体装置
JP2000356853A (ja) * 1999-06-15 2000-12-26 Hitachi Chemical Dupont Microsystems Ltd 塩基性水溶液現像用ネガ型感光性ポリイミド前駆体組成物及びそれを用いたパターン製造方法
JP2008122889A (ja) * 2006-10-18 2008-05-29 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、この感光性樹脂組成物を用いたパターン形成方法及び電子部品
JP2010224319A (ja) * 2009-03-24 2010-10-07 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP5571990B2 (ja) * 2009-06-04 2014-08-13 旭化成イーマテリアルズ株式会社 ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201543161A (zh) * 2014-03-27 2015-11-16 Fujifilm Corp 感光性樹脂組成物、硬化膜、硬化膜之製造方法及半導體裝置
TW201831995A (zh) * 2016-08-01 2018-09-01 富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、 積層體的製造方法及半導體元件

Also Published As

Publication number Publication date
WO2021177263A1 (ja) 2021-09-10
JP2024129038A (ja) 2024-09-26
TW202600668A (zh) 2026-01-01
JPWO2021177263A1 (https=) 2021-09-10
JP7506735B2 (ja) 2024-06-26
TW202146527A (zh) 2021-12-16

Similar Documents

Publication Publication Date Title
TWI908623B (zh) 硬化性樹脂組成物、樹脂膜、硬化膜、積層體、硬化膜的製造方法及半導體元件
TWI904169B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜之製造方法、及半導體器件
TWI841777B (zh) 硬化膜的製造方法、積層體的製造方法及電子元件的製造方法
TWI890798B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TWI875930B (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TWI860437B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TWI869552B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
TW202204475A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
TWI904246B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TW202125122A (zh) 圖案形成方法、感光性樹脂組成物、積層體的製造方法及半導體元件的製造方法
TW202208507A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜之製造方法及半導體器件
TWI912365B (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI893199B (zh) 複合圖案的製造方法、樹脂組成物、積層體的製造方法及半導體裝置的製造方法
TWI882163B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI912328B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體元件及熱硬化性樹脂
TWI904243B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI894341B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI886225B (zh) 感光性樹脂組成物、硬化膜、積層體、硬化膜之製造方法、及半導體器件
TWI901645B (zh) 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件
TWI912484B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI920232B (zh) 永久膜之製造方法、積層體之製造方法及半導體裝置之製造方法
TWI917593B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置
TWI902904B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI914402B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI920124B (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件