TWI901645B - 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件 - Google Patents
感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件Info
- Publication number
- TWI901645B TWI901645B TW110107078A TW110107078A TWI901645B TW I901645 B TWI901645 B TW I901645B TW 110107078 A TW110107078 A TW 110107078A TW 110107078 A TW110107078 A TW 110107078A TW I901645 B TWI901645 B TW I901645B
- Authority
- TW
- Taiwan
- Prior art keywords
- preferred
- group
- groups
- compounds
- acid
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Structural Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Architecture (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-034872 | 2020-03-02 | ||
| JP2020034872 | 2020-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202146527A TW202146527A (zh) | 2021-12-16 |
| TWI901645B true TWI901645B (zh) | 2025-10-21 |
Family
ID=77613048
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110107078A TWI901645B (zh) | 2020-03-02 | 2021-02-26 | 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件 |
| TW114136002A TW202600668A (zh) | 2020-03-02 | 2021-02-26 | 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW114136002A TW202600668A (zh) | 2020-03-02 | 2021-02-26 | 感光性樹脂組成物、圖案的製造方法、感光膜、硬化物、積層體及元件 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7506735B2 (https=) |
| TW (2) | TWI901645B (https=) |
| WO (1) | WO2021177263A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201543161A (zh) * | 2014-03-27 | 2015-11-16 | Fujifilm Corp | 感光性樹脂組成物、硬化膜、硬化膜之製造方法及半導體裝置 |
| TW201831995A (zh) * | 2016-08-01 | 2018-09-01 | 富士軟片股份有限公司 | 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、 積層體的製造方法及半導體元件 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000131838A (ja) * | 1998-10-26 | 2000-05-12 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、レリーフパターンの製造法及び半導体装置 |
| JP2000356853A (ja) * | 1999-06-15 | 2000-12-26 | Hitachi Chemical Dupont Microsystems Ltd | 塩基性水溶液現像用ネガ型感光性ポリイミド前駆体組成物及びそれを用いたパターン製造方法 |
| JP2008122889A (ja) * | 2006-10-18 | 2008-05-29 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、この感光性樹脂組成物を用いたパターン形成方法及び電子部品 |
| JP2010224319A (ja) * | 2009-03-24 | 2010-10-07 | Fujifilm Corp | 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板 |
| JP5571990B2 (ja) * | 2009-06-04 | 2014-08-13 | 旭化成イーマテリアルズ株式会社 | ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置 |
-
2021
- 2021-02-26 TW TW110107078A patent/TWI901645B/zh active
- 2021-02-26 TW TW114136002A patent/TW202600668A/zh unknown
- 2021-03-02 JP JP2022504373A patent/JP7506735B2/ja active Active
- 2021-03-02 WO PCT/JP2021/007806 patent/WO2021177263A1/ja not_active Ceased
-
2024
- 2024-06-14 JP JP2024096388A patent/JP2024129038A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201543161A (zh) * | 2014-03-27 | 2015-11-16 | Fujifilm Corp | 感光性樹脂組成物、硬化膜、硬化膜之製造方法及半導體裝置 |
| TW201831995A (zh) * | 2016-08-01 | 2018-09-01 | 富士軟片股份有限公司 | 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、 積層體的製造方法及半導體元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021177263A1 (ja) | 2021-09-10 |
| JP2024129038A (ja) | 2024-09-26 |
| TW202600668A (zh) | 2026-01-01 |
| JPWO2021177263A1 (https=) | 2021-09-10 |
| JP7506735B2 (ja) | 2024-06-26 |
| TW202146527A (zh) | 2021-12-16 |
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