TWI884961B - 基板保持裝置及基板處理裝置 - Google Patents

基板保持裝置及基板處理裝置 Download PDF

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Publication number
TWI884961B
TWI884961B TW109119778A TW109119778A TWI884961B TW I884961 B TWI884961 B TW I884961B TW 109119778 A TW109119778 A TW 109119778A TW 109119778 A TW109119778 A TW 109119778A TW I884961 B TWI884961 B TW I884961B
Authority
TW
Taiwan
Prior art keywords
shafts
movable
shaft portions
substrate
shaft
Prior art date
Application number
TW109119778A
Other languages
English (en)
Chinese (zh)
Other versions
TW202104045A (zh
Inventor
柏木誠
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202104045A publication Critical patent/TW202104045A/zh
Application granted granted Critical
Publication of TWI884961B publication Critical patent/TWI884961B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW109119778A 2019-06-18 2020-06-12 基板保持裝置及基板處理裝置 TWI884961B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-112675 2019-06-18
JP2019112675 2019-06-18
JP2019-226437 2019-12-16
JP2019226437A JP7534084B2 (ja) 2019-06-18 2019-12-16 基板保持装置および基板処理装置

Publications (2)

Publication Number Publication Date
TW202104045A TW202104045A (zh) 2021-02-01
TWI884961B true TWI884961B (zh) 2025-06-01

Family

ID=73995499

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109119778A TWI884961B (zh) 2019-06-18 2020-06-12 基板保持裝置及基板處理裝置

Country Status (3)

Country Link
JP (1) JP7534084B2 (https=)
KR (1) KR102847016B1 (https=)
TW (1) TWI884961B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023095345A (ja) 2021-12-24 2023-07-06 株式会社荏原製作所 基板処理方法および基板処理装置
CN114619308B (zh) * 2022-03-29 2023-05-16 杭州众硅电子科技有限公司 一种晶圆抛光系统、装载方法及其使用方法
WO2024116731A1 (ja) 2022-12-02 2024-06-06 株式会社荏原製作所 基板処理方法、処理ヘッド、および基板処理装置
JP2024151796A (ja) * 2023-04-13 2024-10-25 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置、基板処理装置およびチャックピンの位置判定方法
CN117260515B (zh) * 2023-11-22 2024-02-13 北京特思迪半导体设备有限公司 抛光机的动态联动控制方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621459A (en) * 1984-04-23 1986-11-11 Timesavers, Inc. Segmented platen with diaphragm cylinder control
JP2007250783A (ja) * 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置
JP2014216391A (ja) * 2013-04-23 2014-11-17 株式会社荏原製作所 基板処理装置及び処理基板の製造方法
TW201501819A (zh) * 2013-03-15 2015-01-16 應用材料股份有限公司 對於以用於化學機械硏磨的晶圓及晶圓邊緣／斜角清洗模組清洗盤／墊的設計
TW201834789A (zh) * 2017-03-27 2018-10-01 日商荏原製作所股份有限公司 基板處理方法及裝置
TW201923877A (zh) * 2017-10-27 2019-06-16 日商荏原製作所股份有限公司 基板保持裝置、具備基板保持裝置的基板處理裝置、及基板處理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3990567B2 (ja) * 2001-12-18 2007-10-17 大日本スクリーン製造株式会社 ダイヤフラムバルブ、基板処理ユニットおよび基板処理装置
JP6672207B2 (ja) * 2016-07-14 2020-03-25 株式会社荏原製作所 基板の表面を研磨する装置および方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621459A (en) * 1984-04-23 1986-11-11 Timesavers, Inc. Segmented platen with diaphragm cylinder control
JP2007250783A (ja) * 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置
TW201501819A (zh) * 2013-03-15 2015-01-16 應用材料股份有限公司 對於以用於化學機械硏磨的晶圓及晶圓邊緣／斜角清洗模組清洗盤／墊的設計
JP2014216391A (ja) * 2013-04-23 2014-11-17 株式会社荏原製作所 基板処理装置及び処理基板の製造方法
TW201834789A (zh) * 2017-03-27 2018-10-01 日商荏原製作所股份有限公司 基板處理方法及裝置
TW201923877A (zh) * 2017-10-27 2019-06-16 日商荏原製作所股份有限公司 基板保持裝置、具備基板保持裝置的基板處理裝置、及基板處理方法

Also Published As

Publication number Publication date
JP7534084B2 (ja) 2024-08-14
KR102847016B1 (ko) 2025-08-20
TW202104045A (zh) 2021-02-01
JP2021002639A (ja) 2021-01-07
KR20200144486A (ko) 2020-12-29

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