TWI855291B - 用於化學機械平坦化（ｃｍｐ）墊之窗及ｃｍｐ墊 - Google Patents
用於化學機械平坦化（ｃｍｐ）墊之窗及ｃｍｐ墊 Download PDFInfo
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- TWI855291B TWI855291B TW111102850A TW111102850A TWI855291B TW I855291 B TWI855291 B TW I855291B TW 111102850 A TW111102850 A TW 111102850A TW 111102850 A TW111102850 A TW 111102850A TW I855291 B TWI855291 B TW I855291B
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Links
- 239000000126 substance Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 claims description 67
- 230000008569 process Effects 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 13
- 238000007788 roughening Methods 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000005498 polishing Methods 0.000 abstract description 38
- 238000012544 monitoring process Methods 0.000 abstract description 18
- 238000001514 detection method Methods 0.000 abstract description 14
- 238000011065 in-situ storage Methods 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 36
- 238000001746 injection moulding Methods 0.000 description 28
- 230000005540 biological transmission Effects 0.000 description 25
- 238000003754 machining Methods 0.000 description 23
- 239000010410 layer Substances 0.000 description 14
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- 238000010586 diagram Methods 0.000 description 7
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 239000002318 adhesion promoter Substances 0.000 description 4
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- 238000007517 polishing process Methods 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
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- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163141368P | 2021-01-25 | 2021-01-25 | |
| US63/141,368 | 2021-01-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202235212A TW202235212A (zh) | 2022-09-16 |
| TWI855291B true TWI855291B (zh) | 2024-09-11 |
Family
ID=82494411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111102850A TWI855291B (zh) | 2021-01-25 | 2022-01-24 | 用於化學機械平坦化（ｃｍｐ）墊之窗及ｃｍｐ墊 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20220234167A1 (de) |
| EP (1) | EP4281249A4 (de) |
| JP (1) | JP7608623B2 (de) |
| CN (1) | CN117098632A (de) |
| TW (1) | TWI855291B (de) |
| WO (1) | WO2022159810A1 (de) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1442840A1 (de) * | 2003-02-03 | 2004-08-04 | Rodel Holdings, Inc. | Anti-Streu-Beschichtung für Fenster von Polierkissen |
| JP2004343090A (ja) * | 2003-04-22 | 2004-12-02 | Jsr Corp | 研磨パッドおよび半導体ウェハの研磨方法 |
| US20050090187A1 (en) * | 2003-10-22 | 2005-04-28 | Wen-Chang Shih | Polishing pad having grooved window therein and method of forming the same |
| US20070037488A1 (en) * | 2005-08-10 | 2007-02-15 | Saikin Alan H | Polishing pad having a window with reduced surface roughness |
| US20070054602A1 (en) * | 2005-09-06 | 2007-03-08 | Freescale Semiconductor, Inc. | Platen endpoint window with pressure relief |
| TWI276504B (en) * | 2003-09-19 | 2007-03-21 | Cabot Microelectronics Corp | Polishing pad with recessed window |
| JP5918254B2 (ja) * | 2010-11-18 | 2016-05-18 | キャボット マイクロエレクトロニクス コーポレイション | 透過性領域を含む研磨パッド |
| WO2019031788A1 (ko) * | 2017-08-07 | 2019-02-14 | 에스케이씨 주식회사 | 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드 |
| CN110076684A (zh) * | 2013-12-20 | 2019-08-02 | 应用材料公司 | 具有受控孔隙率的打印化学机械抛光垫 |
| TW201936881A (zh) * | 2018-01-09 | 2019-09-16 | 美商卡博特微電子公司 | 可得到經改善之表面形狀的鎢大量拋光方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3431115B2 (ja) * | 1995-03-28 | 2003-07-28 | アプライド マテリアルズ インコーポレイテッド | ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法 |
| US6716085B2 (en) * | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
| EP1176630B1 (de) * | 1999-03-31 | 2007-06-27 | Nikon Corporation | Polierkörper, poliermaschine, poliermaschinenjustierverfahren, dicken- oder endpunkt-messverfahren für die polierte schicht, herstellungsverfahren eines halbleiterbauelementes |
| DE10084915C2 (de) * | 1999-08-27 | 2003-12-24 | Asahi Chemical Ind | Polierkissen und Poliervorrichtung |
| US20040213974A1 (en) * | 2001-11-16 | 2004-10-28 | Thomas Hicks | Textured window film |
| US6399501B2 (en) * | 1999-12-13 | 2002-06-04 | Applied Materials, Inc. | Method and apparatus for detecting polishing endpoint with optical monitoring |
| US6476921B1 (en) * | 2000-07-31 | 2002-11-05 | Asml Us, Inc. | In-situ method and apparatus for end point detection in chemical mechanical polishing |
| JP2002170799A (ja) * | 2000-11-30 | 2002-06-14 | Nikon Corp | 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス |
| KR100541545B1 (ko) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | 화학기계적 연마 장비의 연마 테이블 |
| KR20050051094A (ko) * | 2003-11-27 | 2005-06-01 | 삼성전자주식회사 | 연마 패드 및 이를 포함하는 화학적 기계적 연마 장치 |
| US7182670B2 (en) * | 2004-09-22 | 2007-02-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a streamlined windowpane |
| KR20070018711A (ko) * | 2005-08-10 | 2007-02-14 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 표면 요철이 감소된 창을 구비한 연마 패드 |
| TWI379734B (en) * | 2005-08-10 | 2012-12-21 | Rohm & Haas Elect Mat | Polishing pad having a window with reduced surface roughness |
| US7621798B1 (en) * | 2006-03-07 | 2009-11-24 | Applied Materials, Inc. | Reducing polishing pad deformation |
| WO2011008499A2 (en) * | 2009-06-30 | 2011-01-20 | Applied Materials, Inc. | Leak proof pad for cmp endpoint detection |
| US10043946B2 (en) * | 2009-08-25 | 2018-08-07 | Soraa, Inc. | Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening |
| US9017140B2 (en) * | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| US8257545B2 (en) * | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
| US9259820B2 (en) * | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
| US11633830B2 (en) * | 2020-06-24 | 2023-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad with uniform window |
-
2022
- 2022-01-24 EP EP22743319.0A patent/EP4281249A4/de active Pending
- 2022-01-24 TW TW111102850A patent/TWI855291B/zh active
- 2022-01-24 CN CN202280011551.0A patent/CN117098632A/zh active Pending
- 2022-01-24 US US17/582,667 patent/US20220234167A1/en active Pending
- 2022-01-24 WO PCT/US2022/013511 patent/WO2022159810A1/en not_active Ceased
- 2022-01-24 JP JP2023544514A patent/JP7608623B2/ja active Active
-
2023
- 2023-01-30 US US18/103,135 patent/US20230166380A1/en not_active Abandoned
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1442840A1 (de) * | 2003-02-03 | 2004-08-04 | Rodel Holdings, Inc. | Anti-Streu-Beschichtung für Fenster von Polierkissen |
| JP2004343090A (ja) * | 2003-04-22 | 2004-12-02 | Jsr Corp | 研磨パッドおよび半導体ウェハの研磨方法 |
| TWI276504B (en) * | 2003-09-19 | 2007-03-21 | Cabot Microelectronics Corp | Polishing pad with recessed window |
| US20050090187A1 (en) * | 2003-10-22 | 2005-04-28 | Wen-Chang Shih | Polishing pad having grooved window therein and method of forming the same |
| US20070037488A1 (en) * | 2005-08-10 | 2007-02-15 | Saikin Alan H | Polishing pad having a window with reduced surface roughness |
| US20070054602A1 (en) * | 2005-09-06 | 2007-03-08 | Freescale Semiconductor, Inc. | Platen endpoint window with pressure relief |
| JP5918254B2 (ja) * | 2010-11-18 | 2016-05-18 | キャボット マイクロエレクトロニクス コーポレイション | 透過性領域を含む研磨パッド |
| CN110076684A (zh) * | 2013-12-20 | 2019-08-02 | 应用材料公司 | 具有受控孔隙率的打印化学机械抛光垫 |
| WO2019031788A1 (ko) * | 2017-08-07 | 2019-02-14 | 에스케이씨 주식회사 | 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드 |
| TW201936881A (zh) * | 2018-01-09 | 2019-09-16 | 美商卡博特微電子公司 | 可得到經改善之表面形狀的鎢大量拋光方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4281249A1 (de) | 2023-11-29 |
| JP7608623B2 (ja) | 2025-01-06 |
| JP2024505191A (ja) | 2024-02-05 |
| US20230166380A1 (en) | 2023-06-01 |
| TW202235212A (zh) | 2022-09-16 |
| CN117098632A (zh) | 2023-11-21 |
| EP4281249A4 (de) | 2024-12-25 |
| WO2022159810A1 (en) | 2022-07-28 |
| US20220234167A1 (en) | 2022-07-28 |
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