EP4281249A4 - Endpunktfenster mit gesteuerter texturoberfläche - Google Patents

Endpunktfenster mit gesteuerter texturoberfläche Download PDF

Info

Publication number
EP4281249A4
EP4281249A4 EP22743319.0A EP22743319A EP4281249A4 EP 4281249 A4 EP4281249 A4 EP 4281249A4 EP 22743319 A EP22743319 A EP 22743319A EP 4281249 A4 EP4281249 A4 EP 4281249A4
Authority
EP
European Patent Office
Prior art keywords
texture surface
endpoint window
controlled texture
endpoint
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22743319.0A
Other languages
English (en)
French (fr)
Other versions
EP4281249A1 (de
Inventor
Paul Andre Lefevre
Dustin Miller
Gary Snider
Carlos Barros
Anthony GALTO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
CMC Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CMC Materials LLC filed Critical CMC Materials LLC
Publication of EP4281249A1 publication Critical patent/EP4281249A1/de
Publication of EP4281249A4 publication Critical patent/EP4281249A4/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP22743319.0A 2021-01-25 2022-01-24 Endpunktfenster mit gesteuerter texturoberfläche Pending EP4281249A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163141368P 2021-01-25 2021-01-25
PCT/US2022/013511 WO2022159810A1 (en) 2021-01-25 2022-01-24 Endpoint window with controlled texture surface

Publications (2)

Publication Number Publication Date
EP4281249A1 EP4281249A1 (de) 2023-11-29
EP4281249A4 true EP4281249A4 (de) 2024-12-25

Family

ID=82494411

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22743319.0A Pending EP4281249A4 (de) 2021-01-25 2022-01-24 Endpunktfenster mit gesteuerter texturoberfläche

Country Status (6)

Country Link
US (2) US20220234167A1 (de)
EP (1) EP4281249A4 (de)
JP (1) JP7608623B2 (de)
CN (1) CN117098632A (de)
TW (1) TWI855291B (de)
WO (1) WO2022159810A1 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070037488A1 (en) * 2005-08-10 2007-02-15 Saikin Alan H Polishing pad having a window with reduced surface roughness
CN103222034A (zh) * 2010-11-18 2013-07-24 嘉柏微电子材料股份公司 包含透射区域的抛光垫

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431115B2 (ja) * 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US6716085B2 (en) * 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
EP1176630B1 (de) * 1999-03-31 2007-06-27 Nikon Corporation Polierkörper, poliermaschine, poliermaschinenjustierverfahren, dicken- oder endpunkt-messverfahren für die polierte schicht, herstellungsverfahren eines halbleiterbauelementes
DE10084915C2 (de) * 1999-08-27 2003-12-24 Asahi Chemical Ind Polierkissen und Poliervorrichtung
US20040213974A1 (en) * 2001-11-16 2004-10-28 Thomas Hicks Textured window film
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6476921B1 (en) * 2000-07-31 2002-11-05 Asml Us, Inc. In-situ method and apparatus for end point detection in chemical mechanical polishing
JP2002170799A (ja) * 2000-11-30 2002-06-14 Nikon Corp 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス
US6676483B1 (en) * 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
KR100541545B1 (ko) * 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
KR20050051094A (ko) * 2003-11-27 2005-06-01 삼성전자주식회사 연마 패드 및 이를 포함하는 화학적 기계적 연마 장치
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드
TWI379734B (en) * 2005-08-10 2012-12-21 Rohm & Haas Elect Mat Polishing pad having a window with reduced surface roughness
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
US7621798B1 (en) * 2006-03-07 2009-11-24 Applied Materials, Inc. Reducing polishing pad deformation
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US10043946B2 (en) * 2009-08-25 2018-08-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8257545B2 (en) * 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
KR101945874B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드
US20190211228A1 (en) * 2018-01-09 2019-07-11 Cabot Microelectronics Corporation Tungsten bulk polishing method with improved topography
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070037488A1 (en) * 2005-08-10 2007-02-15 Saikin Alan H Polishing pad having a window with reduced surface roughness
CN103222034A (zh) * 2010-11-18 2013-07-24 嘉柏微电子材料股份公司 包含透射区域的抛光垫

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2022159810A1 *

Also Published As

Publication number Publication date
EP4281249A1 (de) 2023-11-29
JP7608623B2 (ja) 2025-01-06
JP2024505191A (ja) 2024-02-05
US20230166380A1 (en) 2023-06-01
TW202235212A (zh) 2022-09-16
CN117098632A (zh) 2023-11-21
WO2022159810A1 (en) 2022-07-28
TWI855291B (zh) 2024-09-11
US20220234167A1 (en) 2022-07-28

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Owner name: CMC MARERIALS LLC

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