TWI854617B - 球狀銀粉、球狀銀粉的製造方法、球狀銀粉的製造裝置及導電性膏 - Google Patents

球狀銀粉、球狀銀粉的製造方法、球狀銀粉的製造裝置及導電性膏 Download PDF

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Publication number
TWI854617B
TWI854617B TW112115760A TW112115760A TWI854617B TW I854617 B TWI854617 B TW I854617B TW 112115760 A TW112115760 A TW 112115760A TW 112115760 A TW112115760 A TW 112115760A TW I854617 B TWI854617 B TW I854617B
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TW
Taiwan
Prior art keywords
silver powder
spherical silver
producing spherical
producing
conductive paste
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TW112115760A
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English (en)
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TW202346609A (zh
Inventor
大迫将也
中野谷太郎
高橋哲
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日商同和電子科技股份有限公司
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Priority claimed from JP2022075428A external-priority patent/JP2023164095A/ja
Application filed by 日商同和電子科技股份有限公司 filed Critical 日商同和電子科技股份有限公司
Publication of TW202346609A publication Critical patent/TW202346609A/zh
Application granted granted Critical
Publication of TWI854617B publication Critical patent/TWI854617B/zh

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TW112115760A 2022-04-28 2023-04-27 球狀銀粉、球狀銀粉的製造方法、球狀銀粉的製造裝置及導電性膏 TWI854617B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-075428 2022-04-28
JP2022075428A JP2023164095A (ja) 2022-04-28 2022-04-28 球状銀粉、球状銀粉の製造方法、球状銀粉製造装置、及び導電性ペースト

Publications (2)

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TW202346609A TW202346609A (zh) 2023-12-01
TWI854617B true TWI854617B (zh) 2024-09-01

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019117234A1 (ja) 2017-12-15 2019-06-20 Ｄｏｗａエレクトロニクス株式会社 球状銀粉

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019117234A1 (ja) 2017-12-15 2019-06-20 Ｄｏｗａエレクトロニクス株式会社 球状銀粉

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