TWI854607B - 晶圓加工裝置、半導體晶片之製造方法及半導體晶片 - Google Patents

晶圓加工裝置、半導體晶片之製造方法及半導體晶片 Download PDF

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Publication number
TWI854607B
TWI854607B TW112114666A TW112114666A TWI854607B TW I854607 B TWI854607 B TW I854607B TW 112114666 A TW112114666 A TW 112114666A TW 112114666 A TW112114666 A TW 112114666A TW I854607 B TWI854607 B TW I854607B
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TW
Taiwan
Prior art keywords
wafer
section
unit
cutting
wafers
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TW112114666A
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English (en)
Chinese (zh)
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TW202347483A (zh
Inventor
鈴木芳邦
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日商山葉發動機股份有限公司
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Publication of TW202347483A publication Critical patent/TW202347483A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW112114666A 2022-04-27 2023-04-20 晶圓加工裝置、半導體晶片之製造方法及半導體晶片 TWI854607B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/019104 2022-04-27
PCT/JP2022/019104 WO2023209871A1 (ja) 2022-04-27 2022-04-27 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Publications (2)

Publication Number Publication Date
TW202347483A TW202347483A (zh) 2023-12-01
TWI854607B true TWI854607B (zh) 2024-09-01

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ID=88518362

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Application Number Title Priority Date Filing Date
TW112114666A TWI854607B (zh) 2022-04-27 2023-04-20 晶圓加工裝置、半導體晶片之製造方法及半導體晶片

Country Status (3)

Country Link
JP (1) JP7804756B2 (https=)
TW (1) TWI854607B (https=)
WO (1) WO2023209871A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007235068A (ja) * 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2010125488A (ja) * 2008-11-28 2010-06-10 Apic Yamada Corp 切断装置
JP2021153113A (ja) * 2020-03-24 2021-09-30 株式会社ディスコ 拡張装置及びデバイスチップの製造方法
TW202215571A (zh) * 2020-09-11 2022-04-16 日商捷進科技有限公司 晶粒接合裝置及半導體裝置的製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3415069B2 (ja) * 1999-05-14 2003-06-09 株式会社東京精密 ダイシング装置
JP2020061453A (ja) * 2018-10-10 2020-04-16 株式会社ディスコ パッケージ基板の加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007235068A (ja) * 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2010125488A (ja) * 2008-11-28 2010-06-10 Apic Yamada Corp 切断装置
JP2021153113A (ja) * 2020-03-24 2021-09-30 株式会社ディスコ 拡張装置及びデバイスチップの製造方法
TW202215571A (zh) * 2020-09-11 2022-04-16 日商捷進科技有限公司 晶粒接合裝置及半導體裝置的製造方法

Also Published As

Publication number Publication date
WO2023209871A1 (ja) 2023-11-02
JPWO2023209871A1 (https=) 2023-11-02
TW202347483A (zh) 2023-12-01
JP7804756B2 (ja) 2026-01-22

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