JP7804756B2 - ウエハ加工装置、半導体チップの製造方法および半導体チップ - Google Patents

ウエハ加工装置、半導体チップの製造方法および半導体チップ

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Publication number
JP7804756B2
JP7804756B2 JP2024517702A JP2024517702A JP7804756B2 JP 7804756 B2 JP7804756 B2 JP 7804756B2 JP 2024517702 A JP2024517702 A JP 2024517702A JP 2024517702 A JP2024517702 A JP 2024517702A JP 7804756 B2 JP7804756 B2 JP 7804756B2
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Japan
Prior art keywords
wafer
unit
section
dicing
unloading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024517702A
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English (en)
Japanese (ja)
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JPWO2023209871A1 (https=
Inventor
芳邦 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of JPWO2023209871A1 publication Critical patent/JPWO2023209871A1/ja
Application granted granted Critical
Publication of JP7804756B2 publication Critical patent/JP7804756B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2024517702A 2022-04-27 2022-04-27 ウエハ加工装置、半導体チップの製造方法および半導体チップ Active JP7804756B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/019104 WO2023209871A1 (ja) 2022-04-27 2022-04-27 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Publications (2)

Publication Number Publication Date
JPWO2023209871A1 JPWO2023209871A1 (https=) 2023-11-02
JP7804756B2 true JP7804756B2 (ja) 2026-01-22

Family

ID=88518362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024517702A Active JP7804756B2 (ja) 2022-04-27 2022-04-27 ウエハ加工装置、半導体チップの製造方法および半導体チップ

Country Status (3)

Country Link
JP (1) JP7804756B2 (https=)
TW (1) TWI854607B (https=)
WO (1) WO2023209871A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323439A (ja) 1999-05-14 2000-11-24 Tokyo Seimitsu Co Ltd ダイシング装置
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2010125488A (ja) 2008-11-28 2010-06-10 Apic Yamada Corp 切断装置
JP2020061453A (ja) 2018-10-10 2020-04-16 株式会社ディスコ パッケージ基板の加工方法
JP2021153113A (ja) 2020-03-24 2021-09-30 株式会社ディスコ 拡張装置及びデバイスチップの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7498630B2 (ja) * 2020-09-11 2024-06-12 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323439A (ja) 1999-05-14 2000-11-24 Tokyo Seimitsu Co Ltd ダイシング装置
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2010125488A (ja) 2008-11-28 2010-06-10 Apic Yamada Corp 切断装置
JP2020061453A (ja) 2018-10-10 2020-04-16 株式会社ディスコ パッケージ基板の加工方法
JP2021153113A (ja) 2020-03-24 2021-09-30 株式会社ディスコ 拡張装置及びデバイスチップの製造方法

Also Published As

Publication number Publication date
WO2023209871A1 (ja) 2023-11-02
JPWO2023209871A1 (https=) 2023-11-02
TWI854607B (zh) 2024-09-01
TW202347483A (zh) 2023-12-01

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